VLMG31K1L2-GS08

VLMG31.. Vishay Semiconductors Standard SMD LED in PLCC-2 FEATURES • Lead (Pb)-free product-RoHS compliant • SMD LEDs with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Preconditioning: acc. to JEDEC level 2a • ESD-withstand voltage: up to 2 kV according to JESD22-A114-B APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use 94 8553 DESCRIPTION These devices have been designed to meet the increasing demand for surface mounting technology. The package of the VLMG31-series is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60° PARTS TABLE PART VLMG31K1L2-GS08 VLMG31K1L2-GS18 VLMG31K1M2-GS08 VLMG31K1M2-GS18 VLMG31L1M2-GS08 VLMG31L1M2-GS18 COLOR, LUMINOUS INTENSITY Green, IV = (7.1 to 18) mcd Green, IV = (7.1 to 18) mcd Green, IV = (7.1 to 28) mcd Green, IV = (7.1 to 28) mcd Green, IV = (11.2 to 28) mcd Green, IV = (11.2 to 28) mcd TECHNOLOGY GaP on GaP GaP on GaP GaP on GaP GaP on GaP GaP on GaP GaP on GaP Document Number 81323 Rev. 1.1, 06-Sep-07 www.vishay.com 1 VLMG31.. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMG31.. PARAMETER Reverse voltage2) Tamb ≤ 60 °C tp ≤ 10 µs DC forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Thermal resistance junction/ ambient mounted on PC board (pad size > 16 mm2) TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg RthJA VALUE 6 30 0.5 100 100 - 40 to + 100 - 40 to + 100 400 UNIT V mA A mW °C °C °C K/W Note: 1) Tamb = 25 °C, unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application. OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMG31.., GREEN PARAMETER Luminous intensity 2) TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 µA VR = 0, f = 1 MHz PART VLMG31K1L2 VLMG31K1M2 VLMG31L1M2 SYMBOL IV IV IV λd λp ϕ VF VR Cj MIN 7.1 7.1 11.2 562 TYP. MAX 18 28 28 575 UNIT mcd mcd mcd nm nm deg Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Note: 1) 2) 565 ± 60 2.2 6 15 15 2.8 V V pF Tamb = 25 °C, unless otherwise specified in one packing unit IVmax/IVmin ≤ 1.6 LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD K L M Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. 1 2 1 2 1 2 LIGHT INTENSITY (MCD) OPTIONAL MIN 7.1 9 11.2 14.0 18.0 22.4 MAX 9 11.2 14.0 18.0 22.4 28.0 COLOR CLASSIFICATION GROUP MIN. 3 4 5 6 7 8 Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm. 562 564 566 568 570 572 GREEN DOM. WAVELENGTH (NM) MAX. 565 567 569 571 573 575 CROSSING TABLE VISHAY VLMG31K1L2 VLMG31K1M2 VLMG31L1M2 OSRAM LGT670-K1L2 LGT670-K1M2 LGT670-L1M2 www.vishay.com 2 Document Number 81323 Rev. 1.1, 06-Sep-07 VLMG31.. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 60 1.2 IF - Forward Current (mA) 50 40 30 20 10 0 0 20 40 60 80 100 IVrel - Relative Luminous Intensity green 1.0 0.8 0.6 0.4 0.2 0 520 540 560 580 600 620 95 10905 Tamb - Ambient Temperature (°C) 95 10038 λ - Wavelength (nm) Figure 1. Forward Current vs. Ambient Temperature Figure 4. Relative Intensity vs. Wavelength 10000 0.01 0.02 0.05 100 I F - Forward Current (mA) 1000 I F - Forward Current (mA) t p /T = 0.005 Tamb < 60 °C green 10 100 0.2 0.5 DC 1 10 0.1 1 0.01 95 9985 0.1 1 10 100 0.1 0 95 9986 1 2 3 4 5 t p - Pulse Length (ms) V F - Forward Voltage (V) Figure 2. Pulse Forward Current vs. Pulse Duration Figure 5. Forward Current vs. Forward Voltage 0° 10° 20° 30° 2.4 IV rel - Relative Luminous Intensity I v rel - Specific Luminous Intensity green 2.0 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6 1.6 1.2 0.8 0.4 0 95 10319 10 95 10263 20 0.5 50 0.2 100 0.1 200 0.05 500 0.02 IF (mA) t p /T 1 Figure 3. Rel. Luminous Intensity vs. Angular Displacement Figure 6. Specific Luminous Intensity vs. Forward Current Document Number 81323 Rev. 1.1, 06-Sep-07 www.vishay.com 3 VLMG31.. Vishay Semiconductors 2.0 I v rel - Relative Luminous Intensity green 1.6 1.2 0.8 0.4 0 0 95 10320 20 40 60 80 100 T amb - Ambient Temperature (°C) Figure 7. Rel. Luminous Intensity vs. Ambient Temperature PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 1.75 ± 0.10 technical drawings according to DIN specifications 0.9 Mounting Pad Layout Pin identification 1.2 area covered with solder resist 2.6 (2.8) + 0.15 2.2 C A 2.8 4 1.6 (1.9) ? 2.4 3 + 0.15 Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1 www.vishay.com 4 4 Document Number 81323 Rev. 1.1, 06-Sep-07 VLMG31.. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. Identification Label: Vishay Type Group Tape Code Production Code Quantity REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED 120° 10.4 8.4 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Adhesive Tape 321 329 14.4 max. 18857 Blister Tape Figure 10. Reel Dimensions - GS18 SOLDERING PROFILE IR Reflow Soldering Profile for Lead (Pb)-free Soldering Component Cavity 94 8670 Preconditioning acc. to JEDEC Level 2a 300 TAPING OF VLM.3.. 3.5 3.1 2.2 2.0 250 Temperature (°C) 200 255 °C 240 °C 217 °C max. 30 s max. 260 °C 245 °C 150 max. 120 s 100 50 0 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 0 19885 50 100 150 Time (s) 200 250 300 max. 2 cycles allowed 94 8668 Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) Figure 8. Tape Dimensions in mm for PLCC-2 REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) Temperature (°C) 120° 10.0 9.0 TTW Soldering 300 250 200 150 100 50 0 0 50 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 5s (acc. to CECC00802) 948626-1 Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 2 K/s forced cooling 100 Time (s) 150 ca. 5 K/s Identification Label: Vishay Type Group Tape Code Production Code Quantity 200 250 180 178 14.4 max. 94 8665 Figure 12. Double Wave Soldering of Opto Devices (all Packages) Figure 9. Reel Dimensions - GS08 Document Number 81323 Rev. 1.1, 06-Sep-07 www.vishay.com 5 VLMG31.. Vishay Semiconductors BAR CODE PRODUCT LABEL EXAMPLE: 106 A H VISHAY 37 B C D E F G 19788 A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: K1 = code for luminous intensity group 4 = code for color group D)Date code year/week E) Day code (e.g. 2: Tuesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE –SENSITIVE DEVICES CAUTION 2a 1. Shelf life in sealed bag 12 months at