VLMG31..
Vishay Semiconductors
Standard SMD LED in PLCC-2
FEATURES • Lead (Pb)-free product-RoHS compliant • SMD LEDs with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Preconditioning: acc. to JEDEC level 2a • ESD-withstand voltage: up to 2 kV according to JESD22-A114-B APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use
94 8553
DESCRIPTION These devices have been designed to meet the increasing demand for surface mounting technology. The package of the VLMG31-series is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60°
PARTS TABLE
PART VLMG31K1L2-GS08 VLMG31K1L2-GS18 VLMG31K1M2-GS08 VLMG31K1M2-GS18 VLMG31L1M2-GS08 VLMG31L1M2-GS18 COLOR, LUMINOUS INTENSITY Green, IV = (7.1 to 18) mcd Green, IV = (7.1 to 18) mcd Green, IV = (7.1 to 28) mcd Green, IV = (7.1 to 28) mcd Green, IV = (11.2 to 28) mcd Green, IV = (11.2 to 28) mcd TECHNOLOGY GaP on GaP GaP on GaP GaP on GaP GaP on GaP GaP on GaP GaP on GaP
Document Number 81323 Rev. 1.1, 06-Sep-07
www.vishay.com 1
VLMG31..
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS1) VLMG31..
PARAMETER Reverse voltage2) Tamb ≤ 60 °C tp ≤ 10 µs DC forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Thermal resistance junction/ ambient mounted on PC board (pad size > 16 mm2) TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg RthJA VALUE 6 30 0.5 100 100 - 40 to + 100 - 40 to + 100 400 UNIT V mA A mW °C °C °C K/W
Note: 1) Tamb = 25 °C, unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application.
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMG31.., GREEN
PARAMETER Luminous intensity
2)
TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 µA VR = 0, f = 1 MHz
PART VLMG31K1L2 VLMG31K1M2 VLMG31L1M2
SYMBOL IV IV IV λd λp ϕ VF VR Cj
MIN 7.1 7.1 11.2 562
TYP.
MAX 18 28 28 575
UNIT mcd mcd mcd nm nm deg
Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Note:
1) 2)
565 ± 60 2.2 6 15 15 2.8
V V pF
Tamb = 25 °C, unless otherwise specified in one packing unit IVmax/IVmin ≤ 1.6
LUMINOUS INTENSITY CLASSIFICATION
GROUP STANDARD K L M Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. 1 2 1 2 1 2 LIGHT INTENSITY (MCD) OPTIONAL MIN 7.1 9 11.2 14.0 18.0 22.4 MAX 9 11.2 14.0 18.0 22.4 28.0
COLOR CLASSIFICATION
GROUP MIN. 3 4 5 6 7 8 Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm. 562 564 566 568 570 572 GREEN DOM. WAVELENGTH (NM) MAX. 565 567 569 571 573 575
CROSSING TABLE
VISHAY VLMG31K1L2 VLMG31K1M2 VLMG31L1M2 OSRAM LGT670-K1L2 LGT670-K1M2 LGT670-L1M2
www.vishay.com 2
Document Number 81323 Rev. 1.1, 06-Sep-07
VLMG31..
Vishay Semiconductors
TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified
60 1.2
IF - Forward Current (mA)
50 40 30 20 10 0 0 20 40 60 80 100
IVrel - Relative Luminous Intensity
green 1.0 0.8 0.6 0.4 0.2 0 520
540
560
580
600
620
95 10905
Tamb - Ambient Temperature (°C)
95 10038
λ - Wavelength (nm)
Figure 1. Forward Current vs. Ambient Temperature
Figure 4. Relative Intensity vs. Wavelength
10000
0.01 0.02 0.05
100
I F - Forward Current (mA)
1000
I F - Forward Current (mA)
t p /T = 0.005
Tamb < 60 °C
green
10
100
0.2 0.5 DC
1
10
0.1
1 0.01
95 9985
0.1
1
10
100
0.1 0
95 9986
1
2
3
4
5
t p - Pulse Length (ms)
V F - Forward Voltage (V)
Figure 2. Pulse Forward Current vs. Pulse Duration
Figure 5. Forward Current vs. Forward Voltage
0°
10°
20° 30°
2.4
IV rel - Relative Luminous Intensity
I v rel - Specific Luminous Intensity
green 2.0
40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6
1.6 1.2 0.8 0.4 0
95 10319
10
95 10263
20
0.5
50
0.2
100
0.1
200
0.05
500 0.02
IF (mA)
t p /T
1
Figure 3. Rel. Luminous Intensity vs. Angular Displacement
Figure 6. Specific Luminous Intensity vs. Forward Current
Document Number 81323 Rev. 1.1, 06-Sep-07
www.vishay.com 3
VLMG31..
Vishay Semiconductors
2.0
I v rel - Relative Luminous Intensity
green 1.6
1.2
0.8
0.4
0 0
95 10320
20
40
60
80
100
T amb - Ambient Temperature (°C)
Figure 7. Rel. Luminous Intensity vs. Ambient Temperature
PACKAGE DIMENSIONS in millimeters
3.5 ± 0.2
1.75 ± 0.10
technical drawings according to DIN specifications
0.9
Mounting Pad Layout Pin identification 1.2 area covered with solder resist
2.6 (2.8)
+ 0.15
2.2
C
A
2.8
4 1.6 (1.9)
?
2.4
3
+ 0.15
Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05
95 11314-1
www.vishay.com 4
4
Document Number 81323 Rev. 1.1, 06-Sep-07
VLMG31..
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape.
Identification Label: Vishay Type Group Tape Code Production Code Quantity
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED
120° 10.4 8.4
4.5 3.5 2.5 1.5
13.00 12.75 62.5 60.0
Adhesive Tape
321 329
14.4 max.
18857
Blister Tape
Figure 10. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Component Cavity
94 8670
Preconditioning acc. to JEDEC Level 2a
300
TAPING OF VLM.3..
3.5 3.1 2.2 2.0
250 Temperature (°C) 200
255 °C 240 °C 217 °C max. 30 s
max. 260 °C 245 °C
150 max. 120 s 100 50 0 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s
5.75 5.25 3.6 3.4
1.85 1.65
4.0 3.6 8.3 7.7
1.6 1.4
4.1 3.9
2.05 1.95
4.1 3.9
0.25
0
19885
50
100
150 Time (s)
200
250
300
max. 2 cycles allowed
94 8668
Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C)
Figure 8. Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.)
Temperature (°C)
120° 10.0 9.0
TTW Soldering 300 250 200 150 100 50 0 0 50 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 5s
(acc. to CECC00802)
948626-1
Lead Temperature second wave ca. 2 K/s full line: typical dotted line: process limits
4.5 3.5 2.5 1.5
13.00 12.75 63.5 60.5
2 K/s forced cooling 100 Time (s) 150
ca. 5 K/s
Identification Label: Vishay Type Group Tape Code Production Code Quantity
200
250
180 178
14.4 max.
94 8665
Figure 12. Double Wave Soldering of Opto Devices (all Packages)
Figure 9. Reel Dimensions - GS08 Document Number 81323 Rev. 1.1, 06-Sep-07 www.vishay.com 5
VLMG31..
Vishay Semiconductors
BAR CODE PRODUCT LABEL EXAMPLE:
106
A H VISHAY
37
B
C
D
E
F
G
19788
A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: K1 = code for luminous intensity group 4 = code for color group D)Date code year/week E) Day code (e.g. 2: Tuesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags.
LEVEL This bag contains MOISTURE –SENSITIVE DEVICES
CAUTION
2a
1. Shelf life in sealed bag 12 months at
很抱歉,暂时无法提供与“VLMG31L1M2-GS18”相匹配的价格&库存,您可以联系我们找货
免费人工找货