VLMS3101-GS18

VLMS310. Vishay Semiconductors Standard SMD LED PLCC-2 FEATURES • Lead (Pb)-free product - RoHS compliant • SMD LED with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with infrared, vapor phase and wave solder processes according to CECC • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • preconditioning: acc. to JEDEC level 2a • ESD-withstand voltage: up to 1 kV according to JESD22-A114-B APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use 94 8553 DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60° PARTS TABLE PART VLMS3100-GS08 VLMS3100-GS18 VLMS3101-GS08 VLMS3101-GS18 COLOR, LUMINOUS INTENSITY Red, IV > 2.8 mcd Red, IV > 2.8 mcd Red, IV = (4.5 to 11.2) mcd Red, IV = (4.5 to 11.2) mcd TECHNOLOGY GaAsP on GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP Document Number 81214 Rev. 1.1, 30-Aug-07 www.vishay.com 1 VLMS310. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMS310. PARAMETER Reverse voltage2) DC Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient t≤5s mounted on PC board (pad size > 16 mm2) Tamb ≤ 60 °C tp ≤ 10 µs Tamb ≤ 60 °C TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg Tsd RthJA VALUE 6 30 0.5 100 100 - 40 to + 100 - 40 to + 100 260 400 UNIT V mA A mW °C °C °C °C K/W Note: 1) Tamb = 25 °C, unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMS310., RED PARAMETER Luminous intensity2) Dominant wavelength Peak wavelength Angle of half intensity Forward voltage Reverse voltage Junction capacitance Temperature coefficient of VF Temperature coefficient of λd Note: 1) T amb = 25 °C, unless otherwise specified 2) In one Packing Unit IVmax/IVmin ≤ 1.6 TEST CONDITION IF = 10 mA IF = 10 mA IF = 10 mA IF = 10 mA IF = 20 mA IR = 10 µA VR = 0, f = 1 MHz IF = 20 mA IF = 10 mA PART VLMS3100 VLMS3101 SYMBOL IV IV λd λp ϕ VF VR Cj TCVF TCλd 6 7 - 1.8 0.05 MIN 2.8 4.5 624 630 640 ± 60 2.0 2.6 TYP. 7.1 11.2 636 MAX UNIT mcd mcd nm nm deg V V pF mV/K nm/K LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD H J K L 1 2 1 2 1 2 1 2 LIGHT INTENSITY (MCD) OPTIONAL MIN 2.80 3.55 4.50 5.60 7.10 9.00 11.20 14.00 MAX 3.55 4.50 5.60 7.10 9.00 11.20 14.00 18.00 In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. CROSSING TABLE VISHAY VLMS3100 VLMS3101 OSRAM LST670-J1L2 LST670-J1K2 Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. www.vishay.com 2 Document Number 81214 Rev. 1.1, 30-Aug-07 VLMS310. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 60 100 Super-red I F - Forward Current (mA) IF - Forward Current (mA) 50 40 30 20 10 0 0 20 40 60 80 100 16634 10 1 0.1 0 1 2 3 4 5 95 10905 Tamb - Ambient Temperature (°C) VF - Forward Voltage (V) Figure 1. Forward Current vs. Ambient Temperature Figure 4. Forward Current vs. Forward Voltage 10000 t p /T = 0.005 2.0 IV rel - Relative Luminous Intensity Tamb < 60 °C 0.01 0.02 0.05 super red 1.6 1.2 0.8 0.4 0.0 I F - Forward Current (mA) 1000 100 0.2 0.5 DC 10 0.1 1 0.01 95 9985 0.1 1 10 100 16635 0 20 40 60 80 100 t p - Pulse Length (ms) Tamb - Ambient Temperature (°C) Figure 2. Forward Current vs. Pulse Length Figure 5. Rel. Luminous Intensity vs. Ambient Temperature 0° 10° 20° VF - Change of Forward Voltage (mV) IV rel - Relative Luminous Intensity 30° 200 150 100 50 0 - 50 - 100 - 150 - 200 - 250 - 300 0 20 40 60 80 100 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.2 0.4 0.6 95 10319 16636 Tamb - Ambient Temperature (°C) Figure 3. Rel. Luminous Intensity vs. Angular Displacement Figure 6. Change of Forward Voltage vs. Ambient Temperature Document Number 81214 Rev. 1.1, 30-Aug-07 www.vishay.com 3 VLMS310. Vishay Semiconductors 10 1.2 IV rel - Relative Luminous Intensity IVrel - Relative Luminous Intensity Super-red 1.0 0.8 0.6 0.4 0.2 0.0 550 super red 1 0.1 0.01 1 16638 10 IF - Forward Current (mA) 100 590 630 670 710 750 16639 - Wavelength (nm) Figure 7. Relative Luminous Intensity vs. Forward Current Figure 9. Relative Luminous Intensity vs. Wavelength - Change of Dom. Wavelength (nm) d 5 4 3 2 1 0 -1 -2 -3 0 20 40 60 80 100 16637 Tamb - Ambient Temperature (°C) Figure 8. Change of Dominant Wavelength vs. Ambient Temperartue PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 1.75 ± 0.10 technical drawings according to DIN specifications 0.9 Mounting Pad Layout Pin identification 1.2 area covered with solder resist 2.6 (2.8) + 0.15 2.2 C A 2.8 4 1.6 (1.9) ? 2.4 3 + 0.15 Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1 www.vishay.com 4 4 Document Number 81214 Rev. 1.1, 30-Aug-07 VLMS310. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertation. The blister tape is a plastic strip with impressed component cavaties, covered by a top tape. REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED 120° 10.4 8.4 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 Adhesive Tape Identification Blister Tape Label: Vishay Type Group Tape Code Production Code Quantity 321 329 14.4 max. 18857 Component Cavity 94 8670 Figure 12. Reel dimensions - GS18 TAPING OF VLM.3... 3.5 3.1 2.2 2.0 SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a 300 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 250 Temperature (°C) 255 °C 255°C 240 °C 217 °C max. 260 °C 245 °C 200 max. 30 s 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 150 max. 120 sec max. 100 sec 94 8668 100 max. Ramp Up 3 °C/sec max. Ramp Down 6 °C/sec Figure 10. Tape dimensions in mm for PLCC-2 50 REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) 120° 10.0 9.0 0 0 19470-2 50 100 150 Time (s) 200 250 300 max. 2 cycles allowed Figure 13. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) TTW Soldering 300 5s 235 °C...260 °C first wave ca. 200 K/s 100 °C...130 °C 100 50 2 K/s forced cooling 0 0 50 100 Time (s) 150 200 250 ca. 5 K/s second wave ca. 2 K/s (acc. to CECC00802) 948626-1 4.5 3.5 2.5 1.5 Lead Temperature full line: typical dotted line: process limits 13.00 12.75 63.5 60.5 250 Temperature (°C) 200 150 Identification Label: Vishay Type Group Tape Code Production Code Quantity 180 178 14.4 max. 94 8665 Figure 11. Reel dimensions - GS08 Figure 14. Double wave soldering of opto devices (all packages) Document Number 81214 Rev. 1.1, 30-Aug-07 www.vishay.com 5 VLMS310. Vishay Semiconductors BAR CODE PRODUCT LABEL RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. LEVEL This bag contains MOISTURE –SENSITIVE DEVICES 106 A H VISHAY 37 B C D E F G 19785 A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: R2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code CAUTION 2a 1. Shelf life in sealed bag 12 months at