VSMF9700-GS18

VSMF9700X01 Vishay Semiconductors High Speed Infrared Emitting Diode, 890 nm FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 890 nm • High reliability • High radiant power • High radiant intensity 94 8553 • Angle of half sensitivity: ϕ = ± 60° • Low forward voltage • Suitable for high pulse current operation • Floor life: 168 h, MSL 3, acc. J-STD-020 DESCRIPTION VSMF9700X01 is a high speed infrared emitting diode in GaAlAs double hetero (DH) technology in a miniature PLCC-2 package. VSMF9700X01 is dedicated to emitter operation and detector operation. • Lead (Pb)-free reflow soldering • AEC-Q101 qualified • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Find out more about Vishay’s Automotive Grade Product requirements at: www.vishay.com/applications APPLICATIONS • Automotive sensors • Rain sensor • Infrared high speed remote control and free air data transmission systems PRODUCT SUMMARY COMPONENT VSMF9700 Note Test condition see table “Basic Characteristics” Ie (mW/sr) 8 ϕ (deg) ± 60 λp (nm) 890 tr (ns) 50 ORDERING INFORMATION ORDERING CODE VSMF9700-GS08 VSMF9700-GS18 Note MOQ: minimum order quantity PACKAGING Tape and reel Tape and reel REMARKS MOQ: 7500 pcs, 1500 pcs/reel MOQ: 8000 pcs, 8000 pcs/reel PACKAGE FORM PLCC-2 PLCC-2 ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 Document Number: 81475 Rev. 1.5, 03-Nov-09 For technical questions, contact: emittertechsupport@vishay.com www.vishay.com 1 VSMF9700X01 Vishay Semiconductors High Speed Infrared Emitting Diode, 890 nm ABSOLUTE MAXIMUM RATINGS PARAMETER Reverse voltage Forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient Note Tamb = 25 °C, unless otherwise specified Acc. figure 8, J-STD-020 tp = 100 μs TEST CONDITION SYMBOL VR IF IFSM PV Tj Tamb Tstg Tsd RthJA VALUE 5 100 200 170 110 - 40 to + 95 - 40 to + 100 260 400 UNIT V mA mA mW °C °C °C °C K/W 180 120 100 R thJA = 400 K/W 80 60 40 20 0 0 21593 PV - Power Dissipation (mW) 160 140 120 100 80 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 10 20 30 40 50 60 70 80 90 100 21592 Tamb - Ambient Temperature (°C) IF - Forward Current (mA) R thJA = 400 K/W Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of φe Angle of half intensity Peak wavelength Spectral bandwidth Temperature coefficient of λp Rise time Fall time Note Tamb = 25 °C, unless otherwise specified IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA TEST CONDITION IF = 100 mA, tp = 20 ms IF = 200 mA, tp = 100 μs IF = 100 mA VR = 5 V VR = 0 V, f = 1 MHz, E = 0 IF = 100 mA, tp = 20 ms IF = 100 mA, tp = 20 ms IF = 100 mA SYMBOL VF VF TKVF IR Cj Ie φe TKφe ϕ λp Δλ½ TKλp tr tf 5 160 8 40 - 0.35 ± 60 890 50 0.25 50 50 MIN. TYP. 1.6 1.8 - 2.1 10 MAX. 1.8 2.1 UNIT V V mV/K μA pF mW/sr mW %/K deg nm nm nm/K ns ns www.vishay.com 2 For technical questions, contact: emittertechsupport@vishay.com Document Number: 81475 Rev. 1.5, 03-Nov-09 VSMF9700X01 High Speed Infrared Emitting Diode, Vishay Semiconductors 890 nm BASIC CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 10 4 IF - Forward Current (mA) - Radiant Power (mW) e 1000 10 3 100 10 2 10 10 1 1 10 0 0 96 12169 0.1 1 2 3 4 16694 10 0 V F - Forward Voltage (V) 10 1 10 2 10 3 I F - Forward Current (mA) 10 4 Fig. 3 - Forward Current vs. Forward Voltage Fig. 6 - Radiant Power vs. Forward Current 1.2 VF rel - Relative Forward Voltage (V) 1.6 1.4 1.1 IF = 10 mA c rel 1.2 1.0 0.8 0.6 0.4 0.2 1.0 0.9 0.8 0.7 0 20 40 60 80 100 I c rel / 0.0 0 16695 20 40 60 80 100 120 140 94 7990 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Intensity/Power vs. Ambient Temperature 1000 I e - Radiant Intensity (mW/sr) Φe rel - Relative Radiant Power 1.25 1.0 100 0.75 10 0.5 1 0.25 0.1 10 0 16693 10 1 10 2 10 3 I F - Forward Current (mA) 10 4 20082 0 800 900 1000 λ - Wavelength (nm) Fig. 5 - Radiant Intensity vs. Forward Current Fig. 8 - Relative Radiant Power vs. Wavelength Document Number: 81475 Rev. 1.5, 03-Nov-09 For technical questions, contact: emittertechsupport@vishay.com www.vishay.com 3 VSMF9700X01 Vishay Semiconductors High Speed Infrared Emitting Diode, 890 nm 1.25 0° 10° 20° 30° S( λ ) rel - Relative Spectral Sensitivity Ie, rel - Relative Radiant Intensity 1 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.75 0.5 0.25 0 800 820 840 860 880 900 920 940 960 980 1000 94 8013 20420 λ - Wavelength (nm) Fig. 9 - Relative Spectral Sensitivity vs. Wavelength Fig. 10 - Relative Radiant Intensity vs. Angular Displacement PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 1.75 ± 0.1 technical drawings according to DIN specifications 0.9 Pin identification Mounting Pad Layout 1.2 area covered with solder resist 2.8 ± 0.15 A C 2.6 (2.8) 2.2 4 Ø 2.4 1.6 (1.9) 3 + 0.15 Drawing-No.: 6.541-5067.02-4 Issue: 2; 30.07.07 20767 REFLOW SOLDER PROFILE 300 250 255 °C 240 °C 217 °C max. 260 °C 245 °C DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE max. 30 s Temperature (°C) 200 150 max. 120 s 100 50 0 0 50 100 150 200 250 300 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 81475 Rev. 1.5, 03-Nov-09 19841 Time (s) Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 www.vishay.com 4 For technical questions, contact: emittertechsupport@vishay.com 4 ϕ - Angular Displacement VSMF9700X01 High Speed Infrared Emitting Diode, Vishay Semiconductors 890 nm TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. 4.5 3.5 Adhesive tape 120° 10.0 9.0 2.5 1.5 Identification Label: Vishay type group tape code production code quantity 94 8670 13.00 12.75 63.5 60.5 Blister tape 180 178 14.4 max. 94 8665 Component cavity Fig. 12 - Blister Tape 3.5 3.1 2.2 2.0 Fig. 15 - Dimensions of Reel-GS08 10.4 8.4 120° 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 4.5 3.5 2.5 1.5 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 62.5 60.0 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 94 8668 Fig. 13 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. De-reeling direction 321 329 14.4 max. 18857 Fig. 16 - Dimensions of Reel-GS18 COVER TAPE REMOVAL FORCE The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. 94 8158 > 160 mm 40 empty compartments min. 75 empty compartments Tape leader Carrier leader Carrier trailer Fig. 14 - Beginning and End of Reel The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartements. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartements and sealed with cover tape. Document Number: 81475 Rev. 1.5, 03-Nov-09 For technical questions, contact: emittertechsupport@vishay.com www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1