VSMY2850RG_11

VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology VSMY2850RGX01 VSMY2850GX01 FEATURES • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • Peak wavelength: p = 850 nm • High reliability 21725-5 21725-5 • High radiant power • Very high radiant intensity • Angle of half intensity:  = ± 10° • Suitable for high pulse current operation • Terminal configurations: gullwing or reverse gullwing • Package matches with detector VEMD2500X01 series • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according to IEC 61249-2-21 definition Note ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 DESCRIPTION VSMY2850 series are infrared, 850 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). APPLICATIONS • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors • IR touch panels • IR illumination PRODUCT SUMMARY COMPONENT VSMY2850RG VSMY2850G Ie (mW/sr) 100 100  (deg) ± 10 ± 10 P (nm) 850 850 tr (ns) 10 10 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE VSMY2850RG VSMY2850G Note • MOQ: minimum order quantity PACKAGING Tape and reel Tape and reel REMARKS MOQ: 6000 pcs, 6000 pcs/reel MOQ: 6000 pcs, 6000 pcs/reel PACKAGE FORM Reverse gullwing Gullwing Rev. 1.2, 04-Aug-11 1 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83398 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com Vishay Semiconductors TEST CONDITION SYMBOL VR IF tp/T = 0.5, tp  100 μs tp = 100 μs IFM IFSM PV Tj Tamb Tstg acc. figure 7, J-STD-020 J-STD-051, soldered on PCB Tsd RthJA 120 100 80 60 RthJA = 250 K/W 40 20 0 ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER Reverse voltage Forward current Peak forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient VALUE 5 100 200 1 190 100 - 40 to + 85 - 40 to + 100 260 250 UNIT V mA mA A mW °C °C °C °C K/W 200 180 PV - Power Dissipation (mW) 160 140 120 100 80 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 RthJA = 250 K/W IF - Forward Current (mA) 0 21891 10 20 30 40 50 60 70 80 90 100 21890 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of radiant power Angle of half intensity Peak wavelength Spectral bandwidth Temperature coefficient of p Rise time Fall time Virtual source diameter IF = 100 mA IF = 30 mA IF = 30 mA IF = 100 mA, 20 % to 80 % IF = 100 mA, 20 % to 80 % VR = 0 V, f = 1 MHz, E = 0 mW/cm2 IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs IF = 100 mA, tp = 20 ms IF = 100 mA TEST CONDITION IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs I F = 1 mA IF = 10 mA SYMBOL VF VF TKVF TKVF IR CJ Ie Ie e TKe  p  TKp tr tf d 840 50 MIN. TYP. 1.65 2.9 - 1.45 - 1.3 not designed for reverse operation 125 100 850 55 - 0.35 ± 10 850 30 0.25 10 10 1.5 870 150 MAX. 1.9 UNIT V V mV/K mV/K μA pF mW/sr mW/sr mW %/K deg nm nm nm/K ns ns mm Rev. 1.2, 04-Aug-11 2 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83398 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Vishay Semiconductors 10 1 Φe, rel - Relative Radiant Power tp = 100 µs IF = 30 mA 0.75 IF - Forward Current (A) 1 0.1 0.5 0.01 0.25 0.001 0 22097 0.5 1 1.5 2 2.5 3 3.5 21776-1 0 650 750 850 950 VF - Forward Voltage (V) λ - Wavelength (nm) Fig. 3 - Forward Current vs. Forward Voltage Fig. 5 - Relative Radiant Power vs. Wavelength 0° 1000 10° 20° 30° ϕ - Angular Displacement Ie rel - Relative Radiant Intensity Ie - Radiant Intensity (mW/sr) tp = 100 µs 100 40° 1.0 50° 0.9 60° 0.8 70° 80° 0.7 0.6 0.4 0.2 0 10 1 0.001 22098 0.01 0.1 1 21111 IF - Forward Current (A) Fig. 4 - Radiant Intensity vs. Forward Current Fig. 6 - Relative Radiant Intensity vs. Angular Displacement SOLDER PROFILE 300 250 255 °C 240 °C 217 °C max. 260 °C 245 °C DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Temperature (°C) 200 max. 30 s 150 max. 120 s 100 50 0 0 50 100 150 200 250 300 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. DRYING 19841 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Rev. 1.2, 04-Aug-11 3 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83398 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com PACKAGE DIMENSIONS in millimeters: VSMY2850RG Ø 1.8 ± 0.1 0.4 0.05 ± 0.1 Vishay Semiconductors Z 2.77 ± 0.2 1.6 2.2 5.8 ± 0.2 2.2 Z 20:1 1.1 ± 0.1 Exposed copper 2.3 ± 0.2 2.3 ± 0.2 0.4 0.3 Anode Pin ID Cathode 1.7 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.03-4 Issue: 1; 18.03.10 22100 Rev. 1.2, 04-Aug-11 4 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83398 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 0.254 0.19 0.5 VSMY2850RG, VSMY2850G www.vishay.com PACKAGE DIMENSIONS in millimeters: VSMY2850G Vishay Semiconductors Ø 1.8 0.4 2.77 ± 0.2 X 1.6 0.05 0.19 2.2 4.2 ± 0.2 2.2 Exposed copper X 20:1 2.3 ± 0.2 0.4 0.3 2.3 ± 0.2 0.5 0.6 Anode Pin ID Cathode 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.03-4 Issue: 1; 18.03.10 22099 Rev. 1.2, 04-Aug-11 0.254 5 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83398 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com TAPING AND REEL DIMENSIONS in millimeters: VSMY2850RG Reel Unreel direction X Vishay Semiconductors Ø 62 ± 0.5 2. 0.5 5± Tape position coming out from reel 6000 pcs/reel Ø 330 ± 1 Ø 13 ± 0.5 Label posted here 12.4 ± 1.5 Technical drawings according to DIN specifications Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Empty (400 mm min.) 1.75 ± 0.1 5.5 ± 0.05 4 ± 0.1 12 ± 0.3 Terminal position in tape Devicce VEMT2000 VEMT2500 VEMD2000 VEMD2500 Cathode VSMB2000 VSMG2000 VSMY2850RG Anode Cathode Anode Collector Emitter Ø 1.55 ± 0.05 I X 2:1 4 ± 0.1 2 ± 0.05 Lead I Lead II 3.05 ± 0.1 II Drawing-No.: 9.800-5100.01-4 Issue: 2; 18.03.10 21572 Rev. 1.2, 04-Aug-11 6 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83398 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2850RG, VSMY2850G www.vishay.com TAPING AND REEL DIMENSIONS in millimeters: VSMY2850G Reel Unreel direction X Vishay Semiconductors 2. Ø 62 ± 0.5 5± 0.5 Tape position coming out from reel 6000 pcs/reel Ø 330 ± 1 Ø 13 ± 0.5 Label posted here 12.4 ± 1.5 technical drawings according to DIN specifications Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Empty (400 mm min.) Terminal position in tape Ø 1.55 ± 0.05 Devicce VEMT2020 VEMT2520 VSMB2020 VSMG2020 VEMD2020 VEMD2520 VSMY2850G Anode Cathode Cathode Anode Collector Emitter 4 ± 0.1 2 ± 0.05 Lead I Lead II I X 2:1 1.75 ± 0.1 Document Number: 83398 3.05 ± 0.1 II 4 ± 0.1 Drawing-No.: 9.800-5091.01-4 Issue: 3; 18.03.10 21571 Rev. 1.2, 04-Aug-11 7 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 5.5 ± 0.05 12 ± 0.3 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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