VSMY3850_11

VSMY3850 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology FEATURES • Package type: surface mount • • • • • • • • • • • Package form: PLCC-2 Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 Peak wavelength: p = 850 nm High reliability High radiant power High radiant intensity Angle of half intensity:  = ± 60° Designed for high pulse current operation Floor life: 168 h, MSL 3, acc. J-STD-020 Lead (Pb)-free reflow soldering Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC 94 8553 DESCRIPTION VSMY3850 is an infrared, 850 nm emitting diode based on surface emitter technology with high radiant intensity, high optical power and high speed, molded in a PLCC-2 package for surface mounting (SMD). Note ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 RELEASED FOR APPLICATIONS • IR remote control • 3D TV PRODUCT SUMMARY COMPONENT VSMY3850 Ie (mW/sr) 17  (deg) ± 60 P (nm) 850 tr (ns) 10 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE VSMY3850-GS08 VSMY3850-GS18 Note • MOQ: minimum order quantity PACKAGING Tape and reel Tape and reel REMARKS MOQ: 7500 pcs, 1500 pcs/reel MOQ: 8000 pcs, 8000 pcs/reel PACKAGE FORM PLCC-2 PLCC-2 ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER Reverse voltage Forward current Pulse peak forward current Surge forward current Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction/ambient Rev. 1.1, 31-May-11 acc. figure 7, J-STD-020 J-STD-051, soldered on PCB 1 For technical questions, contact: emittertechsupport@vishay.com TEST CONDITION SYMBOL VR IF VALUE 5 not designed for DC operation 800 1 200 100 - 40 to + 85 - 40 to + 100 260 250 UNIT V mA mA A mW °C °C °C °C K/W Document Number: 83399 tp/T = 0.1, tp  100 μs tp = 100 μs IFM IFSM PV Tj Tamb Tstg Tsd RthJA THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3850 www.vishay.com Vishay Semiconductors 120 100 80 60 40 20 250 PV - Power Dissipation (mW) 200 150 100 50 RthJA = 250 K/W 0 0 20 40 60 80 100 IF - Forward Current (mA) RthJA = 250 K/W 0 0 22542 20 40 60 80 100 22541 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of e Angle of half intensity Peak wavelength Spectral bandwidth Temperature coefficient of p Rise time Fall time Virtual source diameter IF = 100 mA IF = 30 mA IF = 100 mA IF = 100 mA IF = 100 mA VR = 0 V, f = 1 MHz, E = 0 IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs IF = 100 mA, tp = 20 ms IF = 100 mA TEST CONDITION IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 μs I F = 1 mA IF = 10 mA SYMBOL VF VF TKVF TKVF IR Cj Ie Ie e TKe  p  TKp tr tf d 840 12 MIN. TYP. 1.6 2.9 - 1.45 - 1.2 not designed for reverse operation 125 17 150 55 - 0.35 ± 60 850 30 0.25 10 10 0.44 870 25 MAX. 2.0 UNIT V V mV/K mV/K μA pF mW/sr mW/sr mW %/K deg nm nm nm/K ns ns mm Rev. 1.1, 31-May-11 2 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83399 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3850 www.vishay.com BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Vishay Semiconductors 0° 10 10° 20° 30° Ie, rel - Relative Radiant Intensity tp = 100 µs 1 40° 1.0 0.9 0.8 0.7 50° 60° 70° 80° 0.6 0.4 0.2 0 0.1 0.01 0.001 0 21892 0.5 1 1.5 2 2.5 3 94 8013 VF - Forward Voltage (V) Fig. 3 - Forward Current vs. Forward Voltage Fig. 6 - Relative Radiant Intensity vs. Angular Displacement 1000 tp = 100 µs Ie - Radiant Intensity (mW/sr) 100 10 1 0.1 0.001 21893 0.01 0.1 1 IF - Forward Pulse Current (A) Fig. 4 - Radiant Intensity vs. Forward Current 1 Φe, rel - Relative Radiant Power IF = 30 mA 0.75 0.5 0.25 0 650 21776-1 750 850 950 λ - Wavelength (nm) Fig. 5 - Relative Radiant Power vs. Wavelength Rev. 1.1, 31-May-11 3 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83399 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ϕ - Angular Displacement IF - Forward Current (A) VSMY3850 www.vishay.com PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 Vishay Semiconductors 1.75 ± 0.1 technical drawings according to DIN specifications 0.9 Pin identification Mounting Pad Layout 1.2 area covered with solder resist 2.8 ± 0.15 A C 2.6 (2.8) 2.2 4 Ø 2.4 1.6 (1.9) 3 + 0.15 Drawing-No.: 6.541-5067.02-4 Issue: 4; 19.07.10 20767 SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 300 250 255 °C 240 °C 217 °C max. 260 °C 245 °C FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. Temperature (°C) 200 max. 30 s 150 max. 120 s 100 50 0 0 50 100 150 200 250 300 max. ramp up 3 °C/s max. ramp down 6 °C/s max. 100 s DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. 19841 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. Rev. 1.1, 31-May-11 4 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83399 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 4 VSMY3850 www.vishay.com Vishay Semiconductors Adhesive tape 120° 10.0 9.0 Blister tape 4.5 3.5 2.5 1.5 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 63.5 60.5 Component cavity 94 8670 Fig. 8 - Blister Tape 3.5 3.1 2.2 2.0 180 178 14.4 max. 94 8665 Fig. 11 - Dimensions of Reel-GS08 5.75 5.25 3.6 3.4 1.85 1.65 4.0 3.6 8.3 7.7 120° 10.4 8.4 1.6 1.4 4.1 3.9 2.05 1.95 4.1 3.9 0.25 4.5 3.5 2.5 1.5 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 62.5 60.0 94 8668 Fig. 9 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. De-reeling direction 321 329 14.4 max. 18857 Fig. 12 - Dimensions of Reel-GS18 94 8158 COVER TAPE REMOVAL FORCE The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. > 160 mm 40 empty compartments min. 75 empty compartments Tape leader Carrier leader Carrier trailer Fig. 10 - Beginning and End of Reel The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. Rev. 1.1, 31-May-11 5 For technical questions, contact: emittertechsupport@vishay.com Document Number: 83399 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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