White Electronic Designs
256Kx16 MONOLITHIC SRAM, SMD 5962-96795
FEATURES
256Kx16 bit CMOS Static Random Access Memory • Access Times of 17, 20, 25, 35ns • Data Retention Function (LPA version) • TTL Compatible Inputs and Outputs • Fully Static, No Clocks 44 lead JEDEC Approved Revolutionary Pinout • Ceramic SOJ (Package 322) • Ceramic Flatpack (Package 323) Single +5V (±10%) Supply Operation
EDI816256CA
The EDI816256CA is a 4 megabit Monolithic CMOS Static RAM. The EDI816256CA uses 16 common input and output lines and has an output enable pin which operates faster than address access time at read cycle. The device allows upper and lower byte access by use of the data byte control pins (LB#, UB#). The devices are available in a fully hermetic 44 lead ceramic SOJ and a 44 lead Ceramic Flatpack. The Ceramic SOJ is pin for pin compatible with the commercially available plastic SOJ. This allows the user the luxury of designing a board that can be used for both the commercial and military market. A Low Power version with Data Retention (EDI816256LPA) is also available for battery backed applications. Military product is available compliant to Appendix A of MIL-PRF38535.
PIN CONFIGURATION TOP VIEW
A0 A1 A2 A3 A4 CS# I/O1 I/O2 I/O3 I/O4 VCC VSS I/O5 I/O6 I/O7 I/O8 WE# A5 A6 A7 A8 A9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A17 A16 A15 OE# UB# LB# I/O16 I/O15 I/O14 I/O13 VSS VCC I/O12 I/O11 I/O10 I/O9 NC A14 A13 A12 A11 A10
PIN DESCRIPTION
A0-17 LB# (I/O1-8) UB# (I/O9-16) I/O1-16 CS# OE# WE# VCC VSS NC Address Inputs Lower-Byte Control (I/O1-8) Upper-Byte Control (I/O9-16) Data Input/Output Chip Select Output Enable Write Enable +5.0V Power Ground No Connection
August 2004 Rev. 8
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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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ABSOLUTE MAXIMUM RATINGS
Parameter Voltage on any pin relative to VSS Operating Temperature TA (Ambient) Commercial Industrial Military Storage Temperature, Plastic Power Dissipation Output Current Junction Temperature, TJ -0.5 to 7.0 0 to +70 -40 to +85 -55 to +125 -65 to +125 1.5 20 175 Unit V °C °C °C °C W mA °C CS# WE# OE# LB# UB# H L L L X H X H X H X L X X H L H L L H L X X H H L L H L L Mode Not Select Output Disable Read
EDI816256CA
TRUTH TABLE
Data I/O I/O1-8 High Z I/O9-16 High Z Supply Current ICC2, ICC3
L
L
X
Write
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Data Out High Z Data Out Data In High Z Data In
High Z Data Out Data Out High Z Data In Data In
ICC1
ICC1
RECOMMENDED OPERATING CONDITIONS CAPACITANCE
TA = +25°C Parameter Address Lines Data Lines Symbol Condition CI VIN = Vcc or Vss, f = 1.0MHz CD/Q VIN = Vcc or Vss, f = 1.0MHz Max 12 14 Unit pF pF Parameter Supply Voltage Supply Voltage Input High Voltage Input Low Voltage Sym VCC VSS VIH VIL Min 4.5 0 2.2 -0.3 Typ 5.0 0 — — Max Units 5.5 V 0 V Vcc +0.5 V 0.8 V
These parameters are sampled, not 100% tested.
DC CHARACTERISTICS
VCC = 5V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Input Leakage Current Output Leakage Current Operating Power Supply Current Standby (TTL) Power Supply Current Full Standby Power Supply Current Output Low Voltage Output High Voltage
NOTE: DC test conditions: VIL = 0.3V, VIH = Vcc -0.3V
Symbol ILI ILO ICC1 ICC2 ICC3 VOL VOH
Conditions VIN = 0V to VCC VI/O = 0V to VCC WE#, CS# = VIL, II/O = OmA, Min Cycle CS# ≥ VIH, VIN ≤ VIL, VIN ≥ VIH CS# ≥ VCC -0.2V VIN ≥ VCC -0.2V or VIN ≤ 0.2V IOL = 6.0mA IOH = -4.0mA
Min
CA LPA
— — 2.4
Max 10 10 300 60 25 16 0.4
Units µA µA mA mA mA mA V V
AC TEST CONDITIONS
Figure 1
Vcc
Figure 2
Vcc
Input Pulse Levels
480Ω 480Ω
VSS to 3.0V 5ns 1.5V
Input Rise and Fall Times Input and Output Timing Levels
Q
255Ω 30pF
Q
255Ω 5pF
Output Load
Figure 1
NOTE: For tEHQZ, tGHQZ and tWLQZ, CL = 5pF (Figure 2)
August 2004 Rev. 8
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AC CHARACTERISTICS – READ CYCLE
VCC = 5V, VSS = 0V, -55°C ≤ TA ≤ +125°C Symbol Parameter Read Cycle Time Address Access Time Chip Enable Access Time Chip Enable to Output in Low Z (1) Chip Disable to Output in High Z (1) Output Hold from Address Change Output Enable to Output Valid Output Enable to Output in Low Z (1) Output Disable to Output in High Z(1) LB#, UB# Access Time LB#, UB# Enable to Low Z Output LB#, UB# Disable to High Z Output
NOTE: 1. This parameter is guaranteed by design but not tested.
EDI816256CA
17ns Alt. tRC tAA tACS tCLZ tCHZ tOH tOE tOLZ tOHZ tBA tBLZ tBHZ Min 17 Max 17 17 2 0 0 0 0 7 10 7 10 0 7 0 0 0 5 0 0 Min 20
20ns Max 20 20 7 10 7 10 0 7 0 0 0 5 0 0 Min 25
25ns Max 25 25 8 12 8 12 0 8 0 0 0 5 0 0 Min 35
35ns Max 35 35 10 15 10 15 0 10 Units ns ns ns ns ns ns ns ns ns ns ns ns
JEDEC tAVAV tAVQV tELQV tELQX tEHQZ tAVQX tGLQV tGLQX tGHQZ tUBLQV tLBLQV tUBLQX tLBLQX tUBHQZ tLBHQZ
0 0
AC CHARACTERISTICS – WRITE CYCLE
VCC = 5V, VSS = 0V, -55°C ≤ TA ≤ +125°C Symbol Parameter Write Cycle Time Chip Enable to End of Write Address Setup Time JEDEC tAVAV tELWH tELEH tAVWL tAVEL tAVUBL tAVWH tAVEH tAVUBH tWLWH tWLEH tWHAX tEHAX tWHDX tEHDX tWLQZ tDVWH tDVEH tWHQX tLBLLBH tUBLUBH Alt. tWC tCW tCW tAS tAS tAS tAW tAW tAW tWP tWP tWR tWR tDH tDH tWHZ tDW tDW tWLZ tBW Min 17 14 14 0 0 0 14 14 14 14 14 0 0 0 0 0 10 10 0 14 17ns Max Min 20 15 15 0 0 0 15 15 15 14 14 0 0 0 0 0 10 10 0 16 20ns Max Min 25 17 17 0 0 0 17 17 17 15 15 0 0 0 0 0 12 12 0 18 25ns Max Min 35 20 20 0 0 0 20 20 20 17 17 0 0 0 0 0 15 15 0 20 35ns Max Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Address Valid to End of Write
Write Pulse Width Write Recovery Time Data Hold Time Write to Output in High Z (1) Data to Write Time Output Active from End of Write (1) LB, UB Valid to End of Write
NOTE: 1. This parameter is guaranteed by design but not tested.
August 2004 Rev. 8
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TIMING WAVEFORM – READ CYCLE
tAVAV
ADDRESS
EDI816256CA
tAVQV
CS#
tAVAV
ADDRESS
OE#
ADDRESS 1 ADDRESS 2
tELQV tELQX tGLQV tGLQX
DATA I/O
tEHQZ
tGHQZ tLBHQZ tUBHQZ
tAVQV
DATA I/O
tAVQX
DATA 1 DATA 2
LB#, UB#
tLBLQX tUBLQX tLBLQV tUBLQV
READ CYCLE 2 (WE# HIGH)
READ CYCLE 1 (WE# HIGH; OE#, CS# LOW)
WRITE CYCLE – WE# CONTROLLED
tAVAV
ADDRESS
tAVWH tELWH
CS#
tWHAX
LB#, UB#
tLBLLBH tUBLUBH tAVWL tWLWH tDVWH tWHDX
WE#
DATA IN
DATA VALID
tWLQZ
DATA OUT
HIGH
tWHQX
WRITE CYCLE 1, WE# CONTROLLED
WRITE CYCLE - CS# CONTROLLED
tAVAV
ADDRESS
WRITE CYCLE - LB#, UB# CONTROLLED
tAVAV
ADDRESS
tAVEH tELEH
CS#
tEHAX
CS#
tAVEL
WE#
tAVUBL
tWLEH tDVEH tEHDX
tAVUBH tUBLUBH tAVWH
tUBHAV tWHAV
LB#, UB#
WE#
tWLWH tDVWH tWHDX
DATA IN DATA OUT
LB#, UB#
HIGH
DATA VALID
DATA IN
DATA VALID
tLBLLBH tUBLUBH
WRITE CYCLE 2, CS# CONTROLLED
tWLQX
DATA OUT
HIGH Z
DATA UNDEFINED
HIGH Z
WRITE CYCLE 3, LB#, UB# CONTROLLED
August 2004 Rev. 8
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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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-55°C ≤ TA ≤ +125°C Characteristic Low Power Version only Data Retention Voltage Data Retention Quiescent Current Chip Disable to Data Retention Time (1) Operation Recovery Time (1)
NOTE: 1. This parameter is guaranteed by design but not tested. * Read Cycle Time
EDI816256CA
DATA RETENTION CHARACTERISTICS (EDI816256LPA ONLY)
Sym VCC ICCDR TCDR TR Conditions VCC = 2.0V CS# ≥ VCC -0.2V VIN ≥ VCC -0.2V or VIN ≤ 0.2V Min 2 – 0 TAVAV Typ – – – – Max – 2.2 – – Units V mA ns ns
DATA RETENTION – CS# CONTROLLED
DATA RETENTION MODE VCC tCDR CS# CS# = VCC -0.2V 4.5V VCC
WS32K32-XHX
4.5V tR
DATA RETENTION, CS# CONTROLLED
August 2004 Rev. 8
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PACKAGE 322: 44 LEAD, CERAMIC SOJ
EDI816256CA
0.050 Typ
0.445 0.435
1.130 1.110 0.155 0.120
DIMENSIONS ARE IN INCHES
PACKAGE 323: 44 PIN, CERAMIC FLATPACK
1.130 1.110 0.007 0.003 0.370 0.250
0.515 0.505
0.395 0.385
1.00 Ref
Pin 1
0.038 0.032 0.019 0.015
0.045 0.015
0.050 Typ
0.115 Max.
DIMENSIONS ARE IN INCHES
August 2004 Rev. 8
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ORDERING INFORMATION
EDI816256CA
EDI 8 16256 CA X X X
WHITE ELECTRONIC DESIGNS SRAM ORGANIZATION, 256Kx16 TECHNOLOGY: CA = CMOS Standard Power LPA = Low Power ACCESS TIME (ns) PACKAGE TYPE: F44 = 44 pin Ceramic Flatpack (Package 323) N44 = 44 lead Ceramic SOJ (Package 322) DEVICE GRADE: B = MIL-STD-883 Compliant M = Military Screened I = Industrial C = Commercial -55°C to +125°C -40°C to +85°C 0°C to +70°C
August 2004 Rev. 8
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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