W3E32M64S-200SBC

White Electronic Designs 32Mx64 DDR SDRAM FEATURES DDR SDRAM rate = 200, 250, 266, 333** Package: • 208 Plastic Ball Grid Array (PBGA), 13 x 22mm 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible) Differential clock inputs (CK and CK#) Commands entered on each positive CK edge Internal pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle Programmable Burst length: 2,4 or 8 Bidirectional data strobe (DQS) transmitted/ received with data, i.e., source-synchronous data capture (one per byte) DQS edge-aligned with data for READs; centeraligned with data for WRITEs DLL to align DQ and DQS transitions with CLK Four internal banks for concurrent operation Data mask (DM) pins for masking write data (one per byte) Programmable IOL/IOH option Auto precharge option Auto Refresh and Self Refresh Modes Commercial, Industrial and Military TemperatureRanges Organized as 32M x 64 • Can be user organized as 2x32Mx32 or 4x32Mx16 Weight: W3E32M64S-XSBX — 1.5 grams typical W3E32M64S-XSBX BENEFITS 73% Space Savings vs. FPBGA • 43% Space Savings vs TSOP Reduced part count 21% I/O reduction vs TSOP • 13% I/O reduction vs FPBGA Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Laminate interposer for optimum TCE match Upgradeable to 64M x 64 density (contact factory for information) GENERAL DESCRIPTION The 256MByte (2Gb) DDR SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 536,870,912 bits. Each chip is internally configured as a quad-bank DRAM. The 256MB DDR SDRAM uses a double data rate ar chi tec ture to achieve high-speed operation. The double data rate architecture is essentially a 2n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 256MB DDR SDRAM effectively consists of a single 2n-bit wide, one-clock-cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins. A bi-directional data strobe (DQS) is transmitted externally, along with data, for use in data capture at the receiver. strobe transmitted by the DDR SDRAM during READs and by the memory controller during WRITEs. DQS is edgealigned with data for READs and center-aligned with data for WRITEs. Each chip has two data strobes, one for the lower byte and one for the upper byte. The 256MB DDR SDRAM operates from a differential clock (CK and CK#); the crossing of CK going HIGH and CK going LOW will be referred to as the positive edge of CK. Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS, as well as to both edges of CK. * This product is subject to change without notice. ** For 333Mbs operation of Industrial temperature CL = 2.5, at Military temperature CL = 3. July 2006 Rev. 5 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs DENSITY COMPARISONS TSOP Approach (mm) 11.9 11.9 11.9 11.9 W3E32M64S-XSBX Actual Size W3E32M64S-XSBX 13 22 22.3 66 TSOP 66 TSOP 66 TSOP 66 TSOP S A V I N G S Area I/O Count 4 x 265mm2 = 1060mm2 4 x 66 pins = 264 pins CSP Approach (mm) 10.0 60 FBGA 10.0 60 FBGA 10.0 60 FBGA 10.0 60 FBGA 286mm2 208 Balls Actual Size W3E32M64S-XSBX 13 22 73% 21% S A V I N G S 12.5 Area I/O Count 4 x 125mm2 = 500mm2 4 x 60 balls = 240 balls 286mm2 208 Balls 43% 13% Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and the starting column location for the burst access. The DDR SDRAM provides for programmable READ or WRITE burst lengths of 2, 4, or 8 locations. An auto precharge function may be enabled to provide a selftimed row precharge that is initiated at the end of the burst access. The pipelined, multibank architecture of DDR SDRAMs allows for concurrent operation, thereby providing high effective bandwidth by hiding row precharge and activation time. An auto refresh mode is provided, along with a powersaving power-down mode. July 2006 Rev. 5 FUNCTIONAL DESCRIPTION Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0-12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation. 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs FIGURE 1 – PIN CONFIGURATION TOP VIEW W3E32M64S-XSBX 1 A B C D E F G H J K L M N P R T U V W VCCQ 2 VCC 3 VSS 4 VCCQ 5 VCCQ 6 VSS 7 VCCQ 8 VCCQ 9 VSS 10 11 VCC VSS VSS CS2# CS0# CKE2 CKE0 CAS2# RAS0# RAS2# VSS VCCQ VSS CK0# CK2# CK0 CK2 DQML0 DQML2 CAS0# WE0# WE2# VSS DQMH2 DQMH0 DQSH2 DQSH0 DQ8 DQ40 DQ5 DQ39 DQ7 DQSL2 DQSL0 DQ41 DQ9 DQ10 DQ42 DQ43 DQ12 DQ3 DQ36 DQ4 DQ38 DQ6 DQ44 DQ11 DQ13 DQ45 DQ14 DQ33 DQ1 DQ34 DQ2 DQ37 DQ35 NC NC DQ15 DQ47 DQ46 VSS DQ32 DQ0 NC NC NC DNU NC NC DNU NC VCC NC NC NC NC NC VCCQ A12 BA1 A0 VCC VSS VCCQ A7 A9 DNU* VCC VSS A10 A3 VCCQ VSS VREF VSS VCCQ A4 A11 VSS VCC A2 BA0 A1 VCCQ VSS VCC A6 A8 A5 VCCQ NC NC NC NC NC VCC NC NC NC NC DNU NC NC NC DQ16 DQ48 VSS DQ63 DQ31 DQ62 NC NC DQ22 DQ52 DQ18 DQ50 DQ17 DQ49 DQ30 DQ61 DQ29 DQ59 DQ27 DQ23 DQ54 DQ21 DQ19 DQ51 DQ60 DQ28 DQ58 DQ26 DQ57 DQ25 DQSL1 DQSL3 DQ55 DQ53 DQ20 DQ56 DQ24 DQMH3 DQMH1 DQSH1 DQSH3 VSS CAS3# WE3# WE1 DQML3 DQML1 CK1# CK3# CK1 CK3 VSS VCCQ VSS CAS1# RAS3# RAS1# CKE1 CKE3 CS1# CS3# VSS VCCQ VSS VCC VSS VCCQ VCCQ VSS VCCQ VCCQ VSS VCC VSS * pin J10 is reserved for signal A13 on future upgrades. NOTE: DNU = Do Not Use; to be left unconnected for future upgrades. NC = Not Connected Internally. July 2006 Rev. 5 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs FIGURE 2 FUNCTIONAL BLOCK DIAGRAM W3E32M64S-XSBX INITIALIZATION DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. Power must first be applied to VCC and VCCQ simultaneously, and then to VREF (and to the system VTT). VTT must be applied after VCCQ to avoid device latch-up, which may cause permanent damage to the device. VREF can be applied any time after VCCQ but is expected to be nominally coincident with VTT. Except for CKE, inputs are not recognized as valid until after VREF is applied. CKE is an SSTL_2 input but will detect an LVCMOS LOW level after VCC is applied. After CKE passes through VIH, it will transition to an SSTL_2 signal and remain as such until power is cycled. Maintaining an LVCMOS LOW level on CKE during powerup is required to ensure that the DQ and DQS outputs will be in the High-Z state, where they will remain until driven in normal operation (by a read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR SDRAM requires a 200µs delay prior to applying an executable command. Once the 200µs delay has been satisfied, a DESELECT or NOP command should be applied, and CKE should be brought HIGH. Following the NOP command, a PRECHARGE ALL command should be applied. Next a LOAD MODE REGISTER command should be issued for the extended mode register (BA1 LOW and BA0 HIGH) to enable the DLL, followed by another LOAD MODE REGISTER command to the mode register (BA0/BA1 both LOW) to reset the DLL and to program the operating parameters. Two-hundred clock cy cles are required between the DLL reset and any READ command. A PRECHARGE ALL command should then be applied, placing the device in the all banks idle state. Once in the idle state, two AUTO REFRESH cycles must be performed (tRFC must be satisfied.) Additionally, a LOAD MODE REGISTER command for the mode register with the reset DLL bit deactivated (i.e., to program operating pa ram e ters without resetting the DLL) is required. Following these requirements, the DDR SDRAM is ready for normal operation. WE0 RAS 0 CAS 0 WE RAS CAS VREF A0-12 CLK0 CLK0 CKE0 CS0 DQML0 DQMH0 DQSL0 DQSH0 BA0-1 CLK CLK CKE CS DQML DQMH DQSL DQSH WE1 RAS 1 CAS 1 WE RAS CAS VREF A0-12 CLK1 CLK1 CKE1 CS1 DQML1 DQMH1 DQSL1 DQSH1 BA0-1 CLK CLK CKE CS DQML DQMH DQSL DQSH WE2 RAS 2 CAS 2 WE RAS CAS VREF A0-12 CLK2 CLK2 CKE2 CS2 DQML2 DQMH2 DQSL2 DQSH2 BA0-1 CLK CLK CKE CS DQML DQMH DQSL DQSH DQ0 = Y = Y = Y = Y = Y = Y DQ15 DQ32 = Y = Y = Y = Y = Y = Y DQ47 DQ0 = Y = Y = Y = Y = Y = Y DQ15 DQ16 = Y = Y = Y = Y = Y = Y DQ31 DQ0 = Y = Y = Y = Y = Y = Y DQ15 DQ0 = Y = Y = Y = Y = Y = Y DQ15 VREF A0-12 BA0-1 U0 U1 U2 WE3 RAS 3 CAS 3 WE RAS CAS VREF A0-12 CLK3 CLK3 CKE3 CS3 DQML3 DQMH3 DQSL3 DQSH3 BA0-1 CLK CLK CKE CS DQML DQMH DQSL DQSH DQ0 = Y = Y = Y = Y = Y = Y DQ15 DQ48 = Y = Y = Y = Y = Y = Y DQ63 U3 July 2006 Rev. 5 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs REGISTER DEFINITION MODE REGISTER The Mode Register is used to define the specific mode of operation of the DDR SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, and an operating mode, as shown in Figure 3. The Mode Register is programmed via the MODE REGISTER SET command (with BA0 = 0 and BA1 = 0) and will retain the stored information until it is programmed again or the device loses power. (Except for bit A8 which is self clearing). Reprogramming the mode register will not alter the contents of the memory, provided it is performed correctly. The Mode Register must be loaded (reloaded) when all banks are idle and no bursts are in progress, and the controller must wait the specified time before initiating the subsequent operation. Violating either of these requirements will result in unspecified operation. Mode register bits A0-A2 specify the burst length, A3 specifies the type of burst (sequential or interleaved), A4-A6 specify the CAS latency, and A7-A12 specify the operating mode. W3E32M64S-XSBX BURST TYPE Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Table 1. READ LATENCY The READ latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first bit of output data. The latency can be set to 2 or 2.5 clocks. If a READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock edge n+m. Table 2 below indicates the operating frequencies at which each CAS latency setting can be used. Reserved states should not be used as unknown operation or incompatibility with future versions may result. OPERATING MODE The normal operating mode is selected by issuing a MODE REGISTER SET command with bits A7-A12 each set to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a MODE REGISTER SET command with bits A7 and A9-A12 each set to zero, bit A8 set to one, and bits A0-A6 set to the desired values. Although not required, JEDEC specifications recommend when a LOAD MODE REGISTER command is issued to reset the DLL, it should always be followed by a LOAD MODE REGISTER command to select normal operating mode. All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test modes and reserved states should not be used because unknown operation or incompatibility with future versions may result. BURST LENGTH Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable, as shown in Fig ure 3. The burst length determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 2, 4 or 8 locations are available for both the sequential and the interleaved burst types. Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by A1-Ai when the burst length is set to two; by A2-Ai when the burst length is set to four (where Ai is the most significant column address for a given configuration); and by A3-Ai when the burst length is set to eight. The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. The programmed burst length applies to both READ and WRITE bursts. EXTENDED MODE REGISTER The extended mode register controls functions beyond those controlled by the mode register; these additional functions are DLL enable/disable, output drive strength, and QFC. These functions are controlled via the bits shown in Figure 5. The extended mode register is programmed via the LOAD MODE REGISTER command to the mode register (with BA0 = 1 and BA1 = 0) and will retain the stored information until it is programmed again or the device loses power. The enabling of the DLL should always July 2006 Rev. 5 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs be followed by a LOAD MODE REGISTER command to the mode register (BA0/BA1 both LOW) to reset the DLL. W3E32M64S-XSBX NO OPERATION (NOP) The NO OPERATION (NOP) command is used to perform a NOP to the selected DDR SDRAM (CS# is LOW while RAS#, CAS#, and WE# are high). This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected. TABLE 2 – CAS LATENCY ALLOWABLE OPERATING FREQUENCY (MHz) SPEED -200 -250 -266 -333 (IND) -333 (MIL) CAS LATENCY = 2 CAS LATENCY = 2.5 CAS LATENCY = 3 ≤ 75 ≤ 100 — ≤ 100 ≤ 125 — ≤ 100 ≤ 133 — — ≤ 166 ≤ 166 — ≤ 133 ≤ 166 LOAD MODE REGISTER The Mode Registers are loaded via inputs A0-12. The LOAD MODE REGISTER command can only be issued when all banks are idle, and a subsequent executable command cannot be issued until tMRD is met. The extended mode register must be loaded when all banks are idle and no bursts are in progress, and the controller must wait the specified time before initiating any sub se quent operation. Violating either of these requirements could result in unspecified operation. ACTIVE The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-12 selects the row. This row remains active (or open) for accesses until a PRECHARGE com mand is issued to that bank. A PRECHARGE command must be issued before opening a different row in the same bank. OUTPUT DRIVE STRENGTH The normal full drive strength for all outputs are specified to be SSTL2, Class II. The DDR SDRAM supports an option for reduced drive. This option is intended for the support of the lighter load and/or point-to-point environments. The selection of the reduced drive strength will alter the DQs and DQSs from SSTL2, Class II drive strength to a reduced drive strength, which is approximately 54 percent of the SSTL2, Class II drive strength. READ The READ command is used to initiate a burst read access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-9 selects the starting column location. The value on input A10 determines whether or not AUTO PRECHARGE is used. If AUTO PRECHARGE is selected, the row being accessed will be precharged at the end of the READ burst; if AUTO PRECHARGE is not selected, the row will remain open for subsequent accesses. DLL ENABLE/DISABLE When the part is running without the DLL enabled, device functionality may be altered. The DLL must be enabled for normal operation. DLL enable is required during powerup initialization and upon returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. (When the device exits self refresh mode, the DLL is enabled automatically.) Any time the DLL is enabled, 200 clock cycles with CKE high must occur before a READ command can be issued. WRITE The WRITE command is used to initiate a burst write access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-9 selects the starting column location. The value on input A10 determines whether or not AUTO PRECHARGE is used. If AUTO PRECHARGE is selected, the row being accessed will be precharged at the end of the WRITE burst; if AUTO PRECHARGE is not selected, the row will remain open for subsequent accesses. Input data appearing on the D/Qs is written to the memory array subject to the DQM input logic level appearing coincident with the data. If a given DQM signal is registered LOW, the corresponding data will be written to memory; if the DQM signal is registered 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com COMMANDS The Truth Table provides a quick reference of available commands. This is followed by a written description of each command. DESELECT The DESELECT function (CS# High) prevents new commands from being executed by the DDR SDRAM. The SDRAM is effectively deselected. Operations already in progress are not affected. July 2006 Rev. 5 White Electronic Designs FIGURE 3 MODE REGISTER DEFINITION Burst Length W3E32M64S-XSBX TABLE 1 – BURST DEFINITION Starting Column Address A0 Order of Accesses Within a Burst Type = Sequential 0-1 1-0 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Type = Interleaved 0-1 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus Mode Register (Mx) 0* 0* Operating Mode CAS Latency BT Burst Length 2 A1 0 4 0 1 1 A2 0 0 0 8 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 1 A0 0 1 0 1 A0 0 1 0 1 0 1 0 1 * M14 and M13 (BA0 and BA1 must be "0, 0" to select the base mode register (vs. the extended mode register). Burst Length M2 M1 M0 0 0 0 0 1 1 1 1 00 01 10 11 00 01 10 11 M3 = 0 Reserved 2 4 8 Reserved Reserved Reserved Reserved M3 = 1 Reserved 2 4 8 Reserved Reserved Reserved Reserved M3 0 1 Burst Type Sequential Interleaved M6 M5 M4 0 0 0 0 1 1 1 1 00 01 10 11 00 01 10 11 CAS Latency Reserved Reserved 2 Reserved Reserved Reserved 2 .5 Reserved M12 0 0 - M11 0 0 - M10 0 0 - M9 0 0 - M8 0 1 - M7 0 0 - M6-M0 Valid Valid - Operating Mode Normal Operation Normal Operation/Reset DLL All other states reserved NOTES: 1. For a burst length of two, A1-Ai select two-data-element block; A0 selects the starting column within the block. 2. For a burst length of four, A2-Ai select four-data-element block; A0-1 select the starting column within the block. 3. For a burst length of eight, A3-Ai select eight-data-element block; A0-2 select the starting column within the block. 4. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block. HIGH, the corresponding data inputs will be ignored, and a WRITE will not be executed to that byte/column location. PRECHARGE The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the PRECHARGE command is issued. Except in the case of concurrent auto precharge, where a READ or WRITE command to a different bank is allowed as long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters. Input A10 determines whether one or all banks are to be precharged, and in the case where only July 2006 Rev. 5 one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as “Don’t Care.” Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank. A PRECHARGE command will be treated as a NOP if there is no open row in that bank (idle state), or if the previously open row is already in the process of precharging. AUTO PRECHARGE AUTO PRECHARGE is a feature which performs the same individual-bank PRECHARGE function described above, but without requiring an explicit command. This is accomplished by using A10 to enable AUTO PRECHARGE 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs FIGURE 4 – CAS LATENCY T0 CLK CLK COMMAND READ NOP CL = 2 DQS DQ NOP NOP 01 11 W3E32M64S-XSBX FIGURE 5 – EXTENDED MODE REGISTER DEFINITION T3n BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus T1 T2 T2n T3 Operating Mode DS DLL Extended Mode Register (Ex) E0 0 DLL Enable Disable Drive Strength Normal Reduced T0 CLK CLK COMMAND READ T1 T2 T2n T3 T3n E1 1 NOP CL = 2.5 NOP NOP 0 1 DQS DQ E12 E11 E10 E9 E8 0 E7 0 E6 0 E5 0 E4 0 E3 0 E2 0 E1, E0 Valid Operating Mode Reserved Reserved Burst Length = 4 in the cases shown Shown with nominal tAC and nominal tDSDQ DATA TRANSITIONING DATA DON'T CARE 0 - 0 - 0 - 0 - 1. E14 and E13 must be "0, 1" to select the Extended Mode Register (vs. the base Mode Register) 2. The QFC# function is not supported. in conjunction with a specific READ or WRITE command. A precharge of the bank/row that is addressed with the READ or WRITE command is automatically performed upon completion of the READ or WRITE burst. AUTO PRECHARGE is nonpersistent in that it is either enabled or disabled for each individual READ or WRITE command. The device supports concurrent auto precharge if the command to the other bank does not interrupt the data transfer to the current bank. AUTO PRECHARGE ensures that the precharge is initiated at the earliest valid stage within a burst. This “earliest valid stage” is determined as if an explicit precharge command was issued at the earliest possible time, without violating tRAS (MIN).The user must not issue another command to the same bank until the precharge time (tRP) is completed. AUTO REFRESH AUTO REFRESH is used during normal operation of the DDR SDRAM and is analogous to CAS-BEFORE-RAS (CBR) REFRESH in conventional DRAMs. This command is nonpersistent, so it must be issued each time a refresh is required. The addressing is generated by the internal refresh controller. This makes the address bits “Don’t Care” during an AUTO RE FRESH command. Each DDR SDRAM requires AUTO REFRESH cycles at an average interval of 7.8125µs (maximum). To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh interval is provided. A maximum of eight AUTO REFRESH commands can be posted to any given DDR SDRAM, meaning that the maximum absolute interval between any AUTO REFRESH command and the next AUTO REFRESH command is 9 x 7.8125µs (70.3µs). This maximum absolute interval is to allow future support for DLL updates internal to the DDR SDRAM to be restricted to AUTO REFRESH cycles, without allowing excessive drift in tAC between updates. BURST TERMINATE The BURST TERMINATE command is used to truncate READ bursts (with auto precharge disabled). The most recently registered READ command prior to the BURST TERMINATE command will be truncated. The open page which the READ burst was terminated from remains open. July 2006 Rev. 5 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs TRUTH TABLE – COMMANDS (NOTE 1) NAME (FUNCTION) DESELECT (NOP) (9) NO OPERATION (NOP) (9) ACTIVE (Select bank and activate row) ( 3) READ (Select bank and column, and start READ burst) (4) WRITE (Select bank and column, and start WRITE burst) (4) BURST TERMINATE (8) PRECHARGE (Deactivate row in bank or banks) ( 5) AUTO REFRESH or SELF REFRESH (Enter self refresh mode) (6, 7) LOAD MODE REGISTER (2) CS# H L L L L L L L L RAS# X H L H H H L L L W3E32M64S-XSBX CAS# X H H L L H H L L WE# X H H H L L L H L ADDR X X Bank/Row Bank/Col Bank/Col X Code X Op-Code TRUTH TABLE – DM OPERATION NAME (FUNCTION) WRITE ENABLE (10) WRITE INHIBIT (10) NOTES: 1. CKE is HIGH for all commands shown except SELF REFRESH. 2. A0-12 define the op-code to be written to the selected Mode Register. BA0, BA1 select either the mode register (0, 0) or the extended mode register (1, 0). 3. A0-12 provide row address, and BA0, BA1 provide bank address. 4. A0-9 provide column address; A10 HIGH enables the auto precharge feature (non persistent), while A10 LOW disables the auto precharge feature; BA0, BA1 provide bank address. 5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are “Don’t Care.” DM L H 6. DQs Valid X This command is AUTO REFRESH if CKE is HIGH; SELF REFRESH if CKE is LOW. 7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE. 8. Applies only to read bursts with auto precharge disabled; this command is undefined (and should not be used) for READ bursts with auto precharge enabled and for WRITE bursts. 9. DESELECT and NOP are functionally interchangeable. 10. Used to mask write data; provided coincident with the corresponding data. Although not a JEDEC requirement, to provide for future functionality features, CKE must be active (High) during the AUTO REFRESH period. The AUTO REFRESH period begins when the AUTO REFRESH command is registered and ends tRFC later. The procedure for exiting self refresh requires a sequence of commands. First, CK and CK# must be stable prior to CKE going back HIGH. Once CKE is HIGH, the DDR SDRAM must have NOP commands issued for tXSNR, because time is required for the completion of any internal refresh in progress. A simple algorithm for meeting both refresh and DLL requirements is to apply NOPs for tXSNR time, then a DLL Reset and NOPs for 200 additional clock cycles before applying any other command. * Self refresh available in commercial and industrial temperatures only. SELF REFRESH* The SELF REFRESH command can be used to retain data in the DDR SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the DDR SDRAM retains data without external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH command except CKE is disabled (LOW). The DLL is automatically disabled upon entering SELF REFRESH and is automatically enabled upon exiting SELF REFRESH (200 clock cycles must then occur before a READ command can be issued). Input signals except CKE are “Don’t Care” during SELF REFRESH. VREF voltage is also required for the full duration of SELF REFRESH. July 2006 Rev. 5 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Voltage on VCC, VCCQ Supply relative to Vss Voltage on I/O pins relative to Vss Operating Temperature TA (Mil) Operating Temperature TA (Ind) Storage Temperature, Plastic -1 to 3.6 -1 to 3.6 -55 to +125 -40 to +85 -55 to +125 W3E32M64S-XSBX Unit V V °C °C °C NOTE: Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. CAPACITANCE (NOTE 13) Parameter Input Capacitance: CK/CK# Addresses, BA0-1 Input Capacitance Input Capacitance: All other input-only pins Input/Output Capacitance: I/Os Symbol CI1 CA CI2 CIO Max 6 20 6 9 Unit pF pF pF pF BGA THERMAL RESISTANCE Description Junction to Ambient (No Airflow) Junction to Ball Junction to Case (Top) Symbol Theta JA Theta JB Theta JC Typical 15.7 13.8 2.8 Units °C/W °C/W °C/W Notes 1 1 1 Refer to "PBGA Thermal Resistance Correlation" (Application Note) at www.wedc.com in the application notes section for modeling conditions. DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS (NOTES 1-5, 16, 52) VCC, VCCQ = +2.5V ± 0.2V; -55°C ≤ TA ≤ +125°C Parameter/Condition Supply Voltage (36, 41) I/O Supply Voltage (36, 41, 44, 52) Input Leakage Current: Any input 0V ≤ VIN ≤ VCC (All other pins not under test = 0V) Input Leakage Address Current (All other pins not under test = 0V) Output Leakage Current: I/Os are disabled; 0V ≤ VOUT ≤ VCCQ Output Levels: Full drive option (37, 39) High Current (VOUT = VCCQ - 0.373V, minimum VREF, minimum VTT) Low Current (VOUT = 0.373V, maximum VREF, maximum VTT) Output Levels: Reduced drive option (38, 39) High Current (VOUT = VCCQ - 0.763V, minimum VREF, minimum VTT) Low Current (VOUT = 0.763V, maximum VREF, maximum VTT) I/O Reference Voltage (6,44) I/O Termination Voltage (7, 44) July 2006 Rev. 5 Symbol VCC VCCQ II II IOZ IOH IOL IOHR IOLR VREF VTT Min 2.3 2.3 -2 -8 -5 -12 12 -9 9 0.49 x VCCQ VREF - 0.04 Max 2.7 2.7 2 8 5 0.51 x VCCQ VREF + 0.04 Units V V µA µA µA mA mA mA mA V V 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs AC INPUT OPERATING CONDITIONS VCC, VCCQ = +2.5V ± 0.2V; -55°C ≤ TA ≤ 125°C Parameter/Condition Input High (Logic 1) Voltage Input Low (Logic 0) Voltage Symbol VIH VIL W3E32M64S-XSBX Min VREF + 0.5 - Max VREF - 0.5 Units V V ICC SPECIFICATIONS AND CONDITIONS (NOTES 1-5, 10, 12, 14, 46) VCC, VCCQ = +2.5V ± 0.2V; -55°C ≤ TA ≤ +125°C MAX Parameter/Condition OPERATING CURRENT: One bank; Active-Precharge; tRC = tRC (MIN); tCK = tCK (MIN); DQ, DM, and DQS inputs changing once per clock cyle; Address and control inputs changing once every two clock cycles; (22, 47) OPERATING CURRENT: One bank; Active-Read-Precharge; Burst = 4; tRC = tRC (MIN); tCK = tCK (MIN); IOUT = 0mA; Address and control inputs changing once per clock cycle (22, 47) PRECHARGE POWER-DOWN STANDBY CURRENT: All banks idle; Power-down mode; tCK = tCK (MIN); CKE = LOW; (23, 32, 49) IDLE STANDBY CURRENT: CS = HIGH; All banks idle; tCK = tCK (MIN); CKE = HIGH; Address and other control inputs changing once per clock cycle. VIN = VREF for DQ, DQS, and DM (50) ACTIVE POWER-DOWN STANDBY CURRENT: One bank active; Power-down mode; tCK = tCK (MIN); CKE = LOW (23, 32, 49) ACTIVE STANDBY CURRENT: CS = HIGH; CKE = HIGH; One bank; Active-Precharge; tRC = tRAS (MAX); tCK = tCK (MIN); DQ, DM, and DQS inputs changing twice per clock cycle; Address and other control inputs changing once per clock cycle (22) OPERATING CURRENT: Burst = 2; Reads; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK = tCK (MIN); IOUT = 0mA (22, 47) OPERATING CURRENT: Burst = 2; Writes; Continuous burst; One bank active; Address and control inputs changing once per clock cycle; tCK = tCK (MIN); DQ, DM, and DQS inputs changing twice per clock cycle (22) AUTO REFRESH CURRENT SELF REFRESH CURRENT: CKE 0.2V tREFC = tRFC (MIN) (49) tREFC = 7.8125µs (27, 49) Standard (11) Symbol 333Mbs 520 640 20 180 140 250Mbs 200Mbs Units 266Mbs 520 640 20 180 140 460 580 20 160 120 ICC0 ICC1 ICC2P ICC2F ICC3P ICC3N ICC4R ICC4W ICC5 ICC5A ICC6 ICC7 mA mA mA mA mA mA mA mA mA mA mA mA 200 200 180 660 780 1,160 40 20 1,620 660 640 1,160 40 20 1,600 580 540 1,120 40 20 1,400 OPERATING CURRENT: Four bank interleaving READs (BL=4) with auto precharge, tRC =tRC (MIN); tCK = tCK (MIN); Address and control inputs change only during Active READ or WRITE commands. (22, 48) July 2006 Rev. 5 11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs (Notes 1-5, 14-17, 33) 333 Mbs CL 3 (53) 266 Mbs CL2.5 Parameter Access window of DQs from CLK/CLK# CLK high-level width (30) CLK low-level width (30) CL = 3 (45, 51, 53) CL = 2.5 (45, 51) CL = 2 (45, 51) DQ and DM input hold time relative to DQS (26, 31) DQ and DM input setup time relative to DQS (26, 31) DQ and DM input pulse width (for each input) (31) Access window of DQS from CLK/CLK# DQS input high pulse width DQS input low pulse width DQS-DQ skew, DQS to last DQ valid, per group, per access (25, 26) Write command to first DQS latching transition DQS falling edge to CLK rising - setup time DQS falling edge from CLK rising - hold time Half clock period (34) Data-out high-impedance window from CLK/CLK# (18, 42) Data-out low-impedance window from CLK/CLK# (18, 42) Address and control input hold time (fast slew rate) Address and control input setup time (fast slew rate) Address and control input hold time (slow slew rate) (14) Address and control input setup time (slow slew rate) (14) LOAD MODE REGISTER command cycle time DQ-DQS hold, DQS to first DQ to go non-valid, per access (25, 26) Data hold skew factor ACTIVE to PRECHARGE command (35) ACTIVE to READ with Auto precharge command (46) ACTIVE to ACTIVE/AUTO REFRESH command period AUTO REFRESH command period (49) ACTIVE to READ or WRITE delay PRECHARGE command period DQS read preamble (43) DQS read postamble (43) ACTIVE bank a to ACTIVE bank b command DQS write preamble DQS write preamble setup time (20, 21) DQS write postamble (19) Write recovery time Internal WRITE to READ command delay Data valid output window (25) REFRESH to REFRESH command interval (23) (commercial and Industrial) REFRESH to REFRESH command interval (Military temperature) Average periodic refresh interval (23) (commercial and Industrial) Average periodic refresh interval (Military temperature) Terminating voltage delay to VDD Exit SELF REFRESH to non-READ command Exit SELF REFRESH to READ command Clock cycle time Symbol tAC tCH tCL tCK (3) tCK (2.5) tCK (2) tDH tDS tDIPW tDQSCK tDQSH tDQSL tDQSQ tDQSS tDSS tDSH tHP tHZ tLZ tIHF tISF tIHS tISS tMRD tQH tQHS tRAS tRAP tRC tRFC tRCD tRP tRPRE tRPST tRRD tWPRE tWPRES tWPST tWR tWTR NA tREFC tREFC tREFI tREFI tVTD tXSNR tXSRD Min -0.70 0.45 0.45 6 7.5 10 0.45 0.45 1.75 -0.6 0.35 0.35 0.75 0.2 0.2 tCH,tCL Max +0.70 0.55 0.55 13 13 13 266 Mbs CL 2.5 200 Mbs CL2 Min -0.75 0.45 0.45 7.5 10 0.5 0.5 1.75 -0.75 0.35 0.35 0.75 0.2 0.2 tCH,tCL -0.75 0.90 0.90 1 1 15 tHP-tQHS 0.75 40 120,000 20 65 75 20 20 0.9 1.1 0.4 0.6 15 0.25 0 0.4 0.6 15 1 tQH - tDQSQ 70.3 35 7.8 3.9 0 75 200 Max +0.75 0.55 0.55 13 13 W3E32M64S-XSBX ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CHARACTERISTICS 250 Mbs CL2.5 200 Mbs CL2 Min -0.8 0.45 0.45 8 10 0.6 0.6 2 -0.8 0.35 0.35 0.75 0.2 0.2 tCH,tCL -0.8 1.1 1.1 1.1 1.1 16 tHP-tQHS 1 40 120,000 20 70 80 20 20 0.9 1.1 0.4 0.6 15 0.25 0 0.4 0.6 15 1 tQH - tDQSQ 70.3 35 7.8 3.9 0 80 200 0 80 200 Max +0.8 0.55 0.55 13 13 200 Mbs CL2.5 150 Mbs CL2 Min -0.8 0.45 0.45 10 13 0.6 0.6 2 -0.8 0.35 0.35 0.75 0.2 0.2 tCH,tCL -0.8 1.1 1.1 1.1 1.1 16 tHP-tQHS 1 40 120,000 20 70 80 20 20 0.9 1.1 0.4 0.6 15 0.25 0 0.4 0.6 15 1 tQH - tDQSQ 70.3 35 7.8 3.9 Max +0.8 0.55 0.55 13 15 Units ns tCK tCK ns ns ns ns ns ns ns tCK tCK ns tCK tCK tCK ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns tCK tCK ns tCK ns tCK ns tCK ns µs µs µs µs ns ns tCK +0.6 +0.75 +0.8 +0.8 0.45 1.25 0.5 1.25 0.6 1.25 0.6 1.25 +0.70 -0.70 0.75 0.75 0.8 0.8 12 tHP-tQHS 0.55 42 70,000 15 60 72 15 15 0.9 1.1 0.4 0.6 12 0.25 0 0.4 0.6 15 1 tQH - tDQSQ 70.3 35 7.8 3.9 0 75 200 +0.75 +0.8 +0.8 July 2006 Rev. 5 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs NOTES: 1. All voltages referenced to VSS. 2. Tests for AC timing, ICC, and electrical AC and DC characteristics may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. 3. Outputs measured with equivalent load: Output (VOUT) 50Ω VTT W3E32M64S-XSBX 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. AC timing and ICC tests may use a VIL-to-VIH swing of up to 1.5V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK/CK#), and parameter specifications are guaranteed for the specified AC input levels under normal use conditions. The minimum slew rate for the input signals used to test the device is 1V/ns in the range between VIL (AC) and VIH (AC). The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e., the receiver will effectively switch as a result of the signal crossing the AC input level, and will remain in that state as long as the signal does not ring back above [below] the DC input LOW [HIGH] level). VREF is expected to equal VCCQ/2 of the transmitting device and to track variations in the DC level of the same. Peak-to-peak noise (noncommon mode) on VREF may not exceed ±2 percent of the DC value. Thus, from VCCQ/2, VREF is allowed ±25mV for DC error and an additional ±25mV for AC noise. This measurement is to be taken at the nearest VREF by-pass capacitor. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF and must track variations in the DC level of VREF. VID is the magnitude of the difference between the input level on CK and the input level on CK#. The value of VIX and VMP are expected to equal VCCQ/2 of the transmitting device and must track variations in the DC level of the same. ICC is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time with the outputs open. Enables on-chip refresh and address counters. ICC specifications are tested after the device is properly initialized, and is averaged at the defined cycle rate. This parameter is not tested but guaranteed by design. tA = 25°C, f = 1 MHz For slew rates less than 1V/ns and greater than or equal to 0.5 V.ns. If the slew rate is less than 0.5V/ns, timing must be derated: tIS has an additional 50 ps per each 100mV/ns reduction in slew rate from the 500mV/ns. tIH has 0ps added, that is, it remains constant. If the slew rate exceeds 4.5V/ns, functionality is uncertain. The CK/CK# input reference level (for timing referenced to CK/CK#) is the point at which CK and CK# cross; the input reference level for signals other than CK/CK# is VREF. 16. Inputs are not recognized as valid until VREF stabilizes once initialized, including SELF REFRESH mode, VREF must be powered within specified range. Exception: during the period before VREF stabilizes, CKE ≤ 0.3 x VCCQ is recognized as LOW. 17. The output timing reference level, as measured at the timing reference point indicated in Note 3, is VTT. 18. tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referenced to a specific voltage level, but specify when the device output is no longer driving (HZ) or begins driving (LZ). 19. The intent of the Don't Care state after completion of the postamble is the DQSdriven signal should either be high, low, or high-Z and that any signal transition within the input switching region must follow valid input requirements. That is, if DQS transitions high (above VIHDC (MIN) then it must not transition low (below VIHDC) prior to tDQSH (MIN). 20. This is not a device limit. The device will operate with a negative value, but system performance could be degraded due to bus turnaround. 21. It is recommended that DQS be valid (HIGH or LOW) on or before the WRITE command. The case shown (DQS going from High-Z to logic LOW) applies when no WRITEs were previously in progress on the bus. If a previous WRITE was in progress, DQS could be HIGH during this time, depending on tDQSS. 22. MIN (tRC or tRFC) for ICC measurements is the smallest multiple of tCK that meets the minimum absolute value for the respective parameter. tRAS (MAX) for ICC measurements is the largest multiple of tCK that meets the maximum absolute value for tRAS. 23. The refresh period 64ms. This equates to an average refresh rate of 7.8125µs. However, an AUTO REFRESH command must be asserted at least once every 70.3µs; burst refreshing or posting by the DRAM controller greater than eight refresh cycles is not allowed. 24. The I/O capacitance per DQS and DQ byte/group will not differ by more than this maximum amount for any given device. 25. The valid data window is derived by achieving other specifications - tHP (tCK/2), tDQSQ, and tQH (tQH = tHP - tQHS). The data valid window derates directly porportional with the clock duty cycle and a practical data valid window can be derived. The clock is allowed a maximum duty cycle variation of 45/55. Functionality is uncertain when operating beyond a 45/55 ratio. The data valid window derating curves are provided below for duty cycles ranging between 50/50 and 45/55. 26. Referenced to each output group: LDQS with DQ0-DQ7; and UDQS with DQ8DQ15 of each chip. 27. This limit is actually a nominal value and does not result in a fail value. CKE is HIGH during REFRESH command period (tRFC [MIN]) else CKE is LOW (i.e., during standby). FIGURE A – PULL-DOWN CHARACTERISTICS 160 140 FIGURE B – PULL-UP CHARACTERISTICS 0 -20 -40 Maximum Minimum Nominal low 120 Nominal high 100 -60 -80 -100 -120 -140 -160 IOUT (mA) 80 Nominal low 60 IOUT (mA) Nominal high Minimum 40 20 -180 -200 Maximum 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 2.0 2.5 VOUT (V) VCCQ - VOUT (V) July 2006 Rev. 5 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs 28. To maintain a valid level, the transitioning edge of the input must: a) Sustain a constant slew rate from the current AC level through to the target AC level, VIL (AC) or VIH (AC). b) Reach at least the target AC level. c) After the AC target level is reached, continue to maintain at least the target DC level, VIL (DC) or VIH (DC). 29. The Input capacitance per pin group will not differ by more than this maximum amount for any given device. 30. CK and CK input slew rate must be ≥ 1V/ns (≥ 2V/ns differentially). 31. DQ and DM# input slew rates must not deviate from DQS by more than 10%. If the DQ/DM/DQS slew rate is less than 0.5V/ns, timing must be derated: 50ps must be added to tDS and tDH for each 100mV/ns reduction in slew rate. If slew rate exceeds 4V/ns, functionality is uncertain. 32. VCC must not vary more than 4% if CKE is not active while any bank is active. 33. The clock is allowed up to ±150ps of jitter. Each timing parameter is allowed to vary by the same amount. 34. tHP min is the lesser of tCL minimum and tCH minimum actually applied to the device CK and CK# inputs, collectively during bank active. 35. READs and WRITEs with auto precharge are not allowed to be issued until tRAS (MIN) can be satisfied prior to the internal precharge command being issued. 36. Any positive glitch must be less than 1/3 of the clock and not more than +400mV or 2.9 volts, whichever is less. Any negative glitch must be less than 1/3 of the clock cycle and not exceed either -300mV or 2.2 volts, whichever is more positive. The average cannot be below the 2.5V minimum. 37. Normal Output Drive Curves: a) The full variation in driver pull-down current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve of Figure A. b) The variation in driver pull-down current within nominal limits of voltage and temperature is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve of Figure A. c) The full variation in driver pull-up current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve of Figure B. d) The variation in driver pull-up current within nominal limits of voltage and temperature is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve of Figure B. e) The full variation in the ratio of the maximum to minimum pull-up and pull-down current should be between .71 and 1.4, for device drain-to-source voltages from 0.1V to 1.0 Volt, and at the same voltage and temperature. f) The full variation in the ratio of the nominal pull-up to pull-down current should be unity ±10%, for device drain-to-source voltages from 0.1V to 1.0 Volt. W3E32M64S-XSBX 38. Reduced Output Drive Curves: a) The full variation in driver pull-down current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve of Figure C. b) The variation in driver pull-down current within nominal limits of voltage and temperature is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve of Figure C. c) The full variation in driver pull-up current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve of Figure D. d) The variation in driver pull-up current within nominal limits of voltage and temperature is expected, but not guaranteed, to lie within the inner bounding lines of the V-I curve of Figure D. e) The full variation in the ratio of the maximum to minimum pull-up and pull-down current should be between .71 and 1.4, for device drain-to-source voltages from 0.1V to 1.0 V, and at the same voltage and temperature. f) The full variation in the ratio of the nominal pull-up to pull-down current should be unity ±10%, for device drain-to-source voltages from 0.1V to 1.0 V. 39. The voltage levels used are derived from a minimum VCC level and the referenced test load. In practice, the voltage levels obtained from a properly terminated bus will provide significantly different voltage values. 40. VIH overshoot: VIH (MAX) = VCCQ+1.5V for a pulse width ≤ 3ns and the pulse width can not be greater than 1/3 of the cycle rate. VIL undershoot: VIL (MIN) = -1.5V for a pulse width ≤ 3ns and the pulse width cannot be greater than 1/3 of the cycle rate. 41. VCC and VCCQ must track each other. 42. tHZ (MAX) will prevail over tDQSCK (MAX) + tRPST (MAX) condition. tLZ (MIN) will prevail over tDQSCK (MIN) + tRPRE (MAX) condition. 43. tRPST end point and tRPRE bigin point are not referenced to a specific voltage level but specify when the device output is no longer driving (tRPST), or begins driving (tRPRE). 44. During initialization, VCCQ, VTT, and VREF must be equal to or less than VCC + 0.3V. Alternatively, VTT may be 1.35V maximum during power up, even if VCC/VCCQ are 0 volts, provided a minimum of 42 ohms of series resistance is used between the VTT supply and the input pin. 45. The current part operates below the slowest JEDEC operating frequency of 83 MHz. As such, future die may not reflect this option. 46. When an input signal is HIGH or LOW, it is defined as a steady state logic HIGH or LOW. 47. Random addressing changing 50% of data changing at every transfer. 48. Random addressing changing 100% of data changing at every transfer. 49. CKE must be active (high) during the entire time a refresh command is executed. FIGURE C – PULL-DOWN CHARACTERISTICS 80 FIGURE D – PULL-UP CHARACTERISTICS 0 -10 Maximum 70 60 Nominal high -20 Minimum Nominal low 50 -30 IOUT (mA) IOUT (mA) 40 Nominal low -40 30 -50 Minimum 20 -60 Nominal high 10 -70 Maximum -80 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 2.0 2.5 VOUT (V) VCCQ - VOUT (V) July 2006 Rev. 5 14 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs That is, from the time the AUTO REFRESH command is registered, CKE must be active at each rising clock edge, until tRFC has been satisfied. 50. ICC2N specifies the DQ, DQS, and DM to be driven to a valid high or low logic level. ICC2Q is similar to ICC2F except ICC2Q specifies the address and control inputs to remain stable. Although ICC2F, ICC2N, and ICC2Q are similar, ICC2F is “worst case.” 51. Whenever the operating frequency is altered, not including jitter, the DLL is required W3E32M64S-XSBX to be reset. This is followed by 200 clock cycles before any READ command. 52. This is the DC voltage supplied at the DRAM and is inclusive of all noise up to 20 MHz. Any noise above 20 MHz at the DRAM generated from any source other than that of the DRAM itself may not exceed the DC coltage range of 2.6V ± 100mV. 53. For 333Mbs operation of commercial and Industrial temperature CL = 2.5, at Military temperature CL = 3. PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA) Bottom View 208 x Ø 0.6 (0.024) NOM 11 10 9 8 7 6 5 4 3 2 1 A B C D E F 22.10 (0.870) MAX 18.0 (0.709) NOM G H J K L 1.0 (0.039) NOM M N P R T U V W 1.0 (0.039)NOM 0.5 (0.020) NOM 10.0 (0.394) NOM 13.10 (0.516) MAX 2.56 (0.101) MAX Note: This package utilizes solder balls which contain lead: Sn63Pb37 If you require lead free solder ball packages, please contact WEDC for information. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES July 2006 Rev. 5 15 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W3E32M64S-XSBX ORDERING INFORMATION W 3E 32M 64 S - XXX SB X WHITE ELECTRONIC DESIGNS CORP. DDR SDRAM CONFIGURATION, 32M x 64 2.5V Power Supply DATA RATE (Mbs) 200 = 200Mbs 250 = 250Mbs 266 = 266Mbs 333 = 333Mbs PACKAGE: SB = 208 Plastic Ball Grid Array (PBGA) DEVICE GRADE: M = Military I = Industrial C = Commercial -55°C to +125°C -40°C to +85°C 0°C to +70°C July 2006 Rev. 5 16 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs Document Title 32M x 64 DDR SDRAM Multi-Chip Package W3E32M64S-XSBX Revision History Rev # Rev 0 Rev 1 History Initial Release Changes (Pg. 1, 6, 10, 11, 12, 15, 16, 17) 1.1 Change status to Preliminary 1.2 Change maximum storage temperature to 125°C 1.3 Add 333Mbs/166MHz speed grade 1.4 Change typical weight to 1.5g 1.5 Add thermal resistance values 1.6 PCN04019 — Change maximum package body thickness to 2.56mm Changes (Pg. 1 - 17) 2.1 Change status to Final 2.2 Change 333Mbs CAS latency to 133/166 for Military Temperature and 166/166 for Industrial Temerature. 2.3 ICC1 Burst Length change from 2 to 4 2.4 ICCS; TREFC = TRFC (Min) correction 2.5 Refresh to refresh command interval at Military temperature tREFC = 35µs, tREFI = 3.9µs 2.6 Added AC Input Operating Conditions Table 2.7 Note number updates page 11, 12, 15 2.8 Data rate corrected form MHz to Mbs 2.9 Note 48 removed (Duplicate) Release Date January 2004 June 2005 Status Advanced Preliminary Rev. 2 September 2005 Final Rev 3 Changes (Pg. 3) 3.1 Correction to pin out June 2006 Final Rev 4 Changes (Pg. 1, 11, 15) 4.1 Correction of ViL Min 4.2 Added note on solder ball metallurgy June 2006 Final Rev 5 Changes (Pg. 1, 10, 17) 5.1 Update thermal resistance values to typical July 2006 Final July 2006 Rev. 5 17 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com