White Electronic Designs
W3H32M64E-XSBX
ADVANCED*
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
FEATURES
Data rate = 667*, 533, 400 Package: • 208 Plastic Ball Grid Array (PBGA), 16 x 20mm • 1.0mm pitch DDR2 Data Rate = 667*, 533, 400 Supply Voltage = 1.8V ± 0.1V Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data – output drive strength Programmable CAS latency: 3, 4 or 5 Posted CAS additive latency: 0, 1, 2, 3 or 4
* This product is under development, is not qualified or characterized and is subject to change or cancellation without notice.
Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature Ranges Organized as 32M x 64, user configurable as 2 x 32M x 32 Weight: W3H32M64E-XSBX - 2.5 grams typical
BENEFITS
62% SPACE SAVINGS vs. FPBGA Reduced part count 42% I/O reduction vs FPBGA Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Upgradeable to 64M x 64 density (contact factory for information)
FIGURE 1 – DENSITY COMPARISONS Actual Size W3H32M64E-XSBX
11.0
White Electronic Designs W3H32M64E-XSBX
CSP Approach (mm)
11.0 11.0 11.0
19.0
90 FBGA
90 FBGA
90 FBGA
90 FBGA
20
16
S A V I N G S
62% 42%
Area I/O Count
4 x 209mm2 = 836mm2 4 x 90 balls = 360 balls
320mm2 208 Balls
White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W3H32M64E-XSBX
ADVANCED
FIGURE 2 – FUNCTIONAL BLOCK DIAGRAM
WEA# RASA# CASA# CSA#
WE# RAS# CAS# CS#
ODT A0-12 BA0-1 CK0 CK0# CKEA LDM0 UDM0 LDQS0 LDQS0# UDQS0 UDQS0#
CDT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS#
IC1
DQ0 ¥ ¥ ¥ ¥ ¥ ¥ DQ15
DQ0 ¥ ¥ ¥ ¥ ¥ ¥ DQ15
WE# RAS# CAS# CS#
CK1 CK1# LDM1 UDM1 LDQS1 LDQS1# UDQS1 UDQS1#
ODT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS#
IC2
DQ0 ¥ ¥ ¥ ¥ ¥ ¥ DQ15
DQ16 ¥ ¥ ¥ ¥ ¥ ¥ DQ31
WEB# RASB# CASB# CSB#
WE# RAS# CAS# CS#
CK2 CK2# CKEB LDM2 UDM2 LDQS2 LDQS2# UDQS2 UDQS2#
ODT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS#
IC3
DQ0 ¥ ¥ ¥ ¥ ¥ ¥ DQ15
DQ32 ¥ ¥ ¥ ¥ ¥ ¥ DQ47
WE# RAS# CAS# CS#
CK3 CK3# LDM3 UDM3 LDQS3 LDQS3# UDQS3 UDQS3#
ODT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS#
IC4
DQ0 ¥ ¥ ¥ ¥ ¥ ¥ DQ15
DQ48 ¥ ¥ ¥ ¥ ¥ ¥ DQ63
White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
FIGURE 1 - PIN CONFIGURATION TOP VIEW
W3H32M64E-XSBX
ADVANCED
1
A B C D E F G H J K L M N P R T U V W
VCC
2
VCC
3
VSS
4
VCC
5
VCC
6
VSS
7
VCC
8
VCC
9
VSS
10 11
VCC VSS
VSS
NC
NC
NC
NC
CSB#
NC
NC
VSS
VCC
VSS
NC
NC
NC
NC
CASB#
RASB#
DQ34
CK3
CK3#
VSS
DQ35
DQ51
WEB#
CKEB
NC
NC
DQ50
DQ53
DQ37
CK2#
CK2
DQ52
DQ36
DQ33
NC
DNU
DNU
DQ39
LDQS2
LDQS3
DQ48
DQ32
LDM3
LDM2
DQ49
DQ43
DQ59
DNU
DQ55
DQ58
DQ42
LDQS2#
LDQS3#
DQ38
DQ54
DQ60
DQ57
UMD2
VSS
DQ63
DQ56
DQ40
DQ61
DQ45
UMD3
DQ44
DQ41
DQ46
DQ62
VCC
UDQS2#
DQ47
UDQS2
UDQS3
UDQS3#
VCC
A6
A10
A9
VCC
VSS
VCC
A3
A12
DNU*
VCC
VSS
A0
A11
VCC
VSS
VREF
VSS
VCC
A1
BA1
VSS
VCC
A2
A4
A8
VCC
VSS
VCC
BA0
A5
A7
VCC
UDQS1#
UDQS1
UDQS0
DQ15
UDQS0#
VCC
DQ30
DQ14
DQ9
DQ12
UMD1
DQ13
DQ29
DQ8
DQ24
DQ31
VSS
UDM0
DQ25
DQ28
DQ22
DQ6
LDQS1#
LDQS0#
DQ10
DQ26
DQ23
ODT
DQ27
DQ11
DQ17
LDM0
LDM1
DQ0
DQ16
LDQS1
LDQS0
DQ7
NC
NC
NC
DQ1
DQ4
DQ20
CK0
CK0#
DQ5
DQ21
DQ18
NC
NC
CKEA
WEA#
DQ19
DQ3
VSS
CK1#
CK1
DQ2
RASA#
CASA#
NC
NC
NC
NC
VSS
VCC
VSS
NC
NC
CSA#
NC
NC
NC
NC
VSS
VCC
VSS
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VCC
VSS
* Pin J10 is reserved for signal A13 on future upgrades.
White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
W3H32M64E-XSBX
ADVANCED
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA) BOTTOM VIEW
208 x Ø 0.60 (0.024) NOM 11 10 9 8 7 6 5 4 3 2 1
A B C D E F G
20.15 (0.793) MAX
18.0 (0.709) NOM
H J K L M
1.0 (0.039) NOM
N P R T U V W
1.0 (0.039)NOM 0.50 (0.020) NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
2.56 (0.100) MAX
All linear dimensions are millimeters and parenthetically in inches
White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ORDERING INFORMATION
W3H32M64E-XSBX
ADVANCED
W 3H 32M 64 E - XXX SB X
WHITE ELECTRONIC DESIGNS CORP. DDR2 SDRAM CONFIGURATION, 32M x 64 1.8V Power Supply DATA RATE (Mbs) 400 = 400Mbs 533 = 533Mbs 667 = 667Mbs Blank = No datarate specified for ES product (1) PACKAGE: ES = Non Qualified Product (1) SB = 208 Plastic Ball Grid Array (PBGA) DEVICE GRADE: M = Military -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C Blank = No temperature specified for ES product (1)
Note 1: W3H32M64E-ESSB is the only available product until completion of qualification.
White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
Document Title
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-XSBX
ADVANCED
Revision History Rev #
Rev 0 Rev 1
History
Initial Release Changes (Pg. 1, 3, 5) 1.1 Change max package width to 16mm
Release Date
June 2005 August 2005
Status
Advanced Advanced
Rev 2
Changes (pg. 1, 3, 6) 2.1 Pinout added
October 2005
Advanced
Rev 3
Changes (Pg. 1, 3, 6) 3.1 Change all VCCQ to VCC
October 2005
Advanced
White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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