W7MG21M32SVX120BNI

White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY* 8MB/4MB (2x1Mx32 / 1Mx32) MirrorBit™ 3.0V, Boot Sector Flash Memory Module DESCRIPTION The W7MG1M32SVx-BN and W7MG21M32SVx-BN are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs MirrorBit™ AM29LV160M - 1Mx16 or S29AL016M (optional) Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed microprocessors without wait states. Top boot block configurations • Bottom boot block optional. Contact WEDC. Embedded Erase Algorithms • Automatically preprograms and erases the chip or any combination of sectors Embedded Program Algorithms • Automatically programs and verifies data at specified address Data Polling and Toggle Bit feature for detection of program or erase cycle completion Low Power Dissipation • 30mA per Device Active Current • 10µA per Device CMOS Standby Current Single 3.3V ±10% Supply CMOS and TTL Compatible Inputs and Outputs Commercial and industrial operating temperature range • BNC = 0°C to 70°C Commercial • BNI = -40°C to 85°C Industrial Package • 80 Pin SIMM (JEDEC) Standard * This product is under development, is not qualified or characterized and is subject to change without notice. FEATURES 1Mx32 and 2x1Mx32 Densities Based on AMD - AM29LV160M Flash Device Spansion™ - S29AL016M (optional) High Performance • Access time as fast as 70ns • 0.7s typical sector erase time 3V for read, erase, and program operations Flexible, Sector Architecture • One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors. • Any combination of sectors can be erased • Also supports full chip erase FIG. 1 – BLOCK DIAGRAMS W7MG1M32SVx-BN: 1Mx32 80 PIN SIMM WE2# 1Mx16 WE# DQ0-15 CE# CE# Addr 0-19 W7MG21M32SVx-BN: 2x1Mx32 80 PIN SIMM WE2# 1Mx16 WE# DQ0-15 CE# CE# Addr 0-19 1Mx16 WE# DQ0-15 1Mx16 WE# CE# CE# Addr 0-19 DQ16-31 DQ16-31 WE0# 1Mx16 WE# DQ0-15 CE# CE# WE0# DQ0-15 CE# CE# DQ0-15 Addr 0-19 1Mx16 WE# DQ0-15 CE# CE# DQ0-15 Addr 0-19 CE0# CE0# CE1# OE# Addr 0-19 OE# Addr 0-19 Addr 0-19 May 2004 Rev. 2 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY. VCC 1 1 1 1 1 1 1 C1 .1 µF 2 C2 .1 µF 2 C3 .1 µF 2 C4 .1 µF 2 C5 .1 µF 2 C6 .1 µF 2 C7 .1 µF 2 C8 .1 µF 2 Notes: Unless otherwise specified. 1. Population Configuration for 1M x 32 Version Part Number Configuration W7MG1M32SVxxxBNX 1M x 32 2. Population Configuration for 2 x 1M x 32 Version Part Number Configuration W7MG21M32SVxxxBNX 2 x 1M x 32 xx = Speed: 70, 90, 120ns X = Temerature Range Please refer to part number matrix pg. 8 or 9 Component 1M x 8 Component 1M x 8 May 2004 Rev. 2 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com 1 White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY FIGURE 3 – W7MG1M32SVxxxBNX & W7MG21M32SVxxxBNX PIN CONFIGURATION Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol GND VCC NC OE# WE0# NC NC* DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 Pin 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Symbol CE3 CE2 CE1 CE0 GND DQ29 DQ30 DQ31 WE2# NC NC NC A19 A18 A17 A16 A15 A14 A13 A12 Pin 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Symbol A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 NC GND DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 Pin 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Symbol DQ9 DQ8 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 NC VCC PD1 PD2 PD3 PD4 PD5 PD6 PD7 GND Notes: Unless otherwise specified. 1. Population Configuration for 1M x 32 Version Part Number Configuration W7MG1M32SVxxxBNX 1M x 32 2. Population Configuration for 2 x 1M x 32 Version Part Number Configuration W7MG21M32SVxxxBNX 2 x 1M x 32 xx = Speed: 70, 90, 120ns X = Temerature Range Please refer to part number matrix pg. 8 or 9 PIN NAMES Component 1M x 8 Component 1M x 8 A0 - A19 DQ0 - DQ31 CE1#, CE2# WE0#, WE2# OE# VCC NC PD GND Address Data Input/Output Chip Enable Write Enable Output Enable Power Supply No Connection Presence Detect Ground NC* = Pin 7 can offer custom module options. For optional "Reset" or "Ready Busy." Contact WEDC. May 2004 Rev. 2 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY PRESENCE DETECT TRUTH TABLE Module Organization 1M x 32 2 x 1M x 32 PD1 1 0 PD2 0 1 PD3 1 0 PD4 0 0 MODULE SPEED IDENTIFICATION PRESENCE DETECT PIN Speed 70 ns 90 ns 120 ns PD5 0 1 0 PD6 0 1 1 PD7 1 0 0 LEGEND: 0 = Connected to GND 1 = Open circuit (no connection) CAPACITANCE f = 1.0MHZ, VIN = VCC or VSS 1Meg Parameter Address Lines Data lines Chip & Write Enable Lines Output Enable lines Symbol Max CA CDQ CC CG 35 15 15 35 Max 70 30 30 70 pF pF pF pF 2x1Meg Unit May 2004 Rev. 2 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages ................................. –65°C to +150°C Ambient Temperature with Power Applied ............................... –65°C to +125°C Voltage with Respect to Ground VCC (Note 1) ...................................... –0.5 V to +4.0 V A9, OE#, and RESET# (Note 2) ...... –0.5 V to +12.5 V All other pins (Note 1) .................. –0.5 V to VCC+0.5 V Output Short Circuit Current (Note 3) ................. 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 8. 2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#, and RESET# may overshoot VSS to –2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns. 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. OPERATING RANGES Commercial (C) Devices Ambient Temperature (TA) ........................ 0°C to +70°C Industrial (I) Devices Ambient Temperature (TA) .................... –40°C to +85°C VCC Supply Voltages VCC for all devices .................................... 2.7 V to 3.6 V Operating ranges define those limits between which the functionality of the device is guaranteed. May 2004 Rev. 2 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY ORDERING INFORMATION FOR W7MG1M32SVx COMMERCIAL Part Number W7MG1M32SVx70BNC W7MG1M32SVx90BNC W7MG1M32SVx120BNC Speed (ns) 70 90 120 Package 346 346 346 TA Commercial Range 0°C to +70°C 0°C to +70°C 0°C to +70°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") INDUSTRIAL Part Number W7MG1M32SVx70BNI W7MG1M32SVx90BNI W7MG1M32SVx120BNI Speed (ns) 70 90 120 Package 346 346 346 TA Industrial Range -40°C to +85°C -40°C to +85°C -40°C to +85°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") PACKAGE NO. 346: 80 PIN SIMM (JEDEC) 118.24 (4.655) MAX. 111.35 (4.384) 21.59 (0.850) MAX 3.05 (0.120) MAX R1 R3 J1 J3 153 6.35 (0.250) 1.27 (0.050) TYP 10.16 (0.400) 6.35 (0.250) 105.41 (4.150) 1.57 (0.062) R 55.68 (2.192) 3.18 (0.125) MIN 1.57 (0.062) R 57.02 (2.245) * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES) May 2004 Rev. 2 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY ORDERING INFORMATION FOR W7MG21M32SVx COMMERCIAL Part Number W7MG21M32SVx70BNC W7MG21M32SVx90BNC W7MG21M32SVx120BNC Speed (ns) 70 90 120 Package 361 361 361 TA Commercial Range 0°C to +70°C 0°C to +70°C 0°C to +70°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") INDUSTRIAL Part Number W7MG21M32SVx70BNI W7MG21M32SVx90BNI W7MG21M32SVx120BNI Speed (ns) 70 90 120 Package 361 361 361 TA Industrial Range -40°C to +85°C -40°C to +85°C -40°C to +85°C Height* 21.59 (0.850") 21.59 (0.850") 21.59 (0.850") PACKAGE NO. 361: 80 PIN SIMM (JEDEC) 118.24 (4.655) MAX. 111.35 (4.384) 21.59 (0.850) MAX 4.32 (0.170) MAX R1 R3 J1 J3 153 6.35 (0.250) 1.27 (0.050) TYP 10.16 (0.400) 3.18 5.72 (0.125) (0.225) MIN MIN 6.35 (0.250) 105.41 (4.150) 1.57 (0.062) R 55.68 (2.192) 1.57 (0.062) R 57.02 (2.245) * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES) May 2004 Rev. 2 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs FLASH PART NUMBER MATRIX W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY W 7 M G 1 M 32 S V X XX BN X White Electronics Design Flash MirrorBit™ FR4 with gold contacts Module Address depth: 1M Module Bus width: x32 Component width: x16 Voltage: 3.3V T = Top / B = Bottom Boot Block Speed: 70, 90, 120 Package: 80 Pin SIMM Temperature range: C = 0˚C to 70˚C Commercial I = -40˚C to 85˚C Industrial May 2004 Rev. 2 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs FLASH PART NUMBER MATRIX W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY W 7 M G 2 1 M 3 2 S V X XX BN X White Electronics Design Flash MirrorBit™ FR4 with gold contacts Bank Module Address depth: 1M Module Bus width: x32 Component width: x16 Voltage: 3.3V T = Top / B = Bottom Boot Block Speed: 70, 90, 120 Package: 80 Pin SIMM Temperature range: C = 0˚C to 70˚C Commercial I = -40˚C to 85˚C Industrial May 2004 Rev. 2 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs Document Title W7MG1M32SVx-BN W7MG21M32SVx-BN PRELIMINARY 8MB/4MB (2x1Mx32 / 1Mx32) CMOS, MirrorBit™ 3.0V, Boot Sector Flash Memory Revision History Rev # Rev 0 Rev 1 Rev. 2 History Created Added T/B (top or bottom boot block option) Changed status from advanced to preliminary Release Date 5-04 6-04 6-04 Status Advanced Advanced Preliminary May 2004 Rev. 2 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com