WED7F2325ZXEBSN70C

WED7F2325ZXEBSN70C

  • 厂商:

    WEDC

  • 封装:

  • 描述:

    WED7F2325ZXEBSN70C - 2, 4, and 8MB, STmicro, 5.0V 4Mb Based, Uniform Sector FLASH Module Family - Wh...

  • 详情介绍
  • 数据手册
  • 价格&库存
WED7F2325ZXEBSN70C 数据手册
White Electronic Designs WED7Fx325ZXEBSNyyC 2, 4, and 8MB, STmicro, 5.0V 4Mb Based, Uniform Sector FLASH Module Family FEATURES 2, 4, and 8MB Density FLASH Modules Organized as; 512K x 32, 2 x 512K x 32, and 4 x 512K x 32 Based on STmicro's M29F040B 5.0V FLASH Device Base Component DEVICE ID = E2h Base Component MANUFACTURERS ID = 20h Uniform Sector Architecture Sector Erase Sector Protection Embedded Erase Algorithm Embedded Program Algorithm (AMD Compatible) Data Polling and Toggle Bit for Detection 100,000 Program/Erase Cycles per Block 20 Year Data Retention PIN CONFIGURATION PIN# PIN Name PIN# PIN Name PIN# PIN Name PIN# PIN Name 1 VSS 21 (Note 1) 41 A11 61 DQ9 2 VCC 22 (Note 1) 42 A10 62 DQ8 3 NC 23 (Note 1) 43 A9 63 DQ7 4 G# 24 (Note 1) 44 A8 64 DQ6 5 W0# 25 VSS 45 A7 65 DQ5 6 W1# 26 DQ29 46 A6 66 DQ4 7 NC 27 DQ30 47 A5 67 DQ3 8 DQ16 28 DQ31 48 A4 68 DQ2 9 DQ17 29 W2# 49 A3 69 DQ1 10 DQ18 30 NC 50 A2 70 DQ0 11 DQ19 31 NC 51 A1 71 NC 12 DQ20 32 NC 52 A0 72 VCC 13 DQ21 33 NC 53 W3# 73 PD1 14 DQ22 34 A18 54 VSS 74 PD2 15 DQ23 35 A17 55 DQ15 75 PD3 16 DQ24 36 A16 56 DQ14 76 PD4 17 DQ25 37 A15 57 DQ13 77 PD5 18 DQ26 38 A14 58 DQ12 78 PD6 19 DQ27 39 A13 59 DQ11 79 PD7 20 DQ28 40 A12 60 DQ10 80 VSS Note 1: Bank Enable DESCRIPTION The WED7F325ZXEBSN, WED7F2325ZXEBSN, and WED7F4325ZXEBSN are organized as 512K x 32, 2 x 512K x 32 and 4 x 512K x 32 respectively. The modules are based on 4Mb TSOP components from STmicro which are mounted onto an FR4 substrate. The Modules are offered in Access Speeds from 70 to 150ns with an Operation Voltage Requirement of 5.0V ±10%. PRESENCE DETECT PINS; MODULE DENSITY SIMM Density 512K x 32 2 x 512K x 32 4 x 512K x 32 Presence Select Pin PD1 VSS Open VSS PD2 VSS Open Open PD3 VSS Open Open PD4 Open VSS VSS SIMM Density 512K x 32 2 x 512K x 32 4 x 512K x 32 Pin 24 E0 E0 E0 Pin 23 NC E1 E1 Pin 22 NC NC E2 Pin 21 NC NC E3 PIN NAME, DEFINITION A0-19 DQ0-31 Address Inputs Common Data Input/Output Byte Write Enables Bank Enable Output Enable Presence Detect No Connect Power 5V ± 10% Ground PIN CAPACITANCE Parameter Sym Pins Input Capacitance CIN Address Input Capacitance CIN G# Output Capacitance CIO Input/Output Data Bus Input Capacitance CIN E0-3# Input Capacitance CIN W0-3# March 2000 Rev. 0 W0-3# E0-3# 2MB Value 20pF 20pF 5pF 20pF 5pF 4MB Value 40pF 40pF 10pF 20pF 10pF 8MB Value 80pF 80pF 20pF 20pF 20pF 1 G# PD0-7 NC VCC VSS White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ORDERING INFORMATION 2MB, 512K X 32 Part Number WED7F325ZXEBSN70C WED7F325ZXEBSN90C WED7F325ZXEBSN12C WED7F325ZXEBSN15C Density 2MB 2MB 2MB 2MB Speed 70ns 90ns 120ns 150ns Package 366 366 366 366 WED7Fx325ZXEBSNyyC 8MB, 4 X 512K X 32 Part Number WED7F4325ZXEBSN90C WED7F4325ZXEBSN12C WED7F4325ZXEBSN15C Density 8MB 8MB 8MB Speed 90ns 120ns 150ns Package 368 368 368 4MB, 2 X 512K X 32 Part Number WED7F2325ZXEBSN70C WED7F2325ZXEBSN90C WED7F2325ZXEBSN12C WED7F2325ZXEBSN15C Density 4MB 4MB 4MB 4MB Speed 70ns 90ns 120ns 150ns Package 367 367 367 367 FIGURE 1 – FUNCTIONAL BLOCK DIAGRAM 2MB; 512K X 32 FIGURE 2 – FUNCTIONAL BLOCK DIAGRAM 4MB; 2 X 512K X 32 A0-18 E0# G# 512K x 8 M29F040 A0-18 G# E0# 512K x 8 512K x 8 M29F040 DQ0-7 DQ0-7 W0# M29F040 W0# 512K x 8 512K x 8 M29F040 DQ8-15 512K x 8 M29F040 DQ8-15 M29F040 W1# W1# 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 DQ16-23 DQ16-23 W2# 512K x 8 M29F040 512K x 8 M29F040 DQ24-31 W2# W3# 512K x 8 M29F040 DQ24-31 E1# W3# March 2000 Rev. 0 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WED7Fx325ZXEBSNyyC FIGURE 3 – FUNCTIONAL BLOCK DIAGRAM 8MB; 4 X 512K X 32 A0-18 G# E0# 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 DQ0-7 W0# 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 DQ8-15 W1# 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 DQ16-23 W2# 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 512K x 8 M29F040 DQ24-31 W3# E1# E2# E3# FIG. 4 – MECHANICAL; PACKAGE - 366 4.655 MAX 4.384 0.705 MAX 0.250 0.120 MAX P1 R4 0.400 0.050 TYP 0.062 R 2.245 0.250 4.150 0.062 R 2.192 0.125 MIN March 2000 Rev. 0 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WED7Fx325ZXEBSNyyC FIGURE 5 – MECHANICAL; PACKAGE - 367 4.655 MAX 4.384 0.125 DIA (2x) R1 R3 0.170 MAX 0.705 0.400 MAX 0.125 MIN 0.225 MIN REV. # R2 R4 0.250 P1 0.050 TYP 0.250 4.150 FIGURE 6 – MECHANICAL; PACKAGE - 368 4.655 MAX 4.384 0.200 MAX J1 J2 J3 J4 J5 J6 J7 1.135 0.400 P1 0.050 TYP 0.062 R (2x) 0.250 0.125 DIA (2x) 4.150 2.192 0.125 MIN 2.245 March 2000 Rev. 0 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WED7F2325ZXEBSN70C
1. 物料型号:型号为STM32F103C8T6,是一款基于ARM Cortex-M3内核的32位微控制器。

2. 器件简介:该器件是意法半导体生产的高性能微控制器,具有多种通信接口和外设,适用于多种嵌入式应用。

3. 引脚分配:文档详细列出了该微控制器的所有引脚及其功能,包括电源引脚、地引脚、I/O引脚等。

4. 参数特性:包括工作电压、工作频率、内存大小等关键参数。

5. 功能详解:详细介绍了微控制器的各个功能模块,如GPIO、ADC、定时器等。

6. 应用信息:提供了该微控制器在不同领域的应用案例,如工业控制、医疗设备等。

7. 封装信息:介绍了该微控制器的封装类型,包括LQFP48封装。
WED7F2325ZXEBSN70C 价格&库存

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