WF1M32B-100G2TC3

White Electronic Designs 1Mx32 3.3V Flash Module FEATURES Access Times of 100, 120, 150ns ■ Packaging • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401) • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509) ■ ■ 1,000,000 Erase/Program Cycles Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode • Any combination of sectors can be concurrently erased. Also supports full chip erase ■ ■ ■ Organized as 1Mx32 Commercial, Industrial and Military Temperature Ranges 3.3 Volt for Read and Write Operations ■ ■ ■ ■ ■ ■ ■ WF1M32B-XXX3 Boot Code Sector Architecture (Bottom) Low Power CMOS, 1.0mA Standby Embedded Erase and Program Algorithms Built-in Decoupling Caps for Low Noise Operation Erase Suspend/Resume • Supports reading data from or programing data to a sector not being erased Low Current Consumption Typical values at 5MHz: • 40mA Active Read Current • 80mA Program/Erase Current Weight WF1M32B-XG2TX3 -8 grams typical WF1M32B-XHX3 -13 grams typical Note: For programming information refer to Flash Programming 8M3 Application Note. PIN CONFIGURATION FOR WF1M32B-XHX3 Top View 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 22 12 RESET# Pin Description I/O0-31 A0-19 Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Reset Power Supply Ground Not Connected 23 I/O15 I/O14 I/O13 I/O12 OE# A17 WE# I/O7 I/O6 I/O5 I/O4 33 I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O16 I/O17 I/O18 34 VCC CS4# NC I/O27 A4 A5 A6 NC CS3# GND I/O19 44 45 I/O31 I/O30 I/O29 I/O28 A1 A2 A3 I/O23 I/O22 I/O21 56 WE# CS1-4# OE# RESET# VCC GND NC CS2# GND I/O11 A10 A9 A15 VCC CS1# A19 I/O3 Block Diagram C S1# RESET# WE# OE# A0-19 1M x 8 1M x 8 C S2# C S3# C S4# 1M x 8 1M x 8 I/O20 55 66 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs Pin Configuration for WF1M32B-XG2TX3 Top View RESET# A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE1# A6 A7 A8 A9 A10 VCC WF1M32B-XXX3 Pin Description I/O0-31 A0-19 WE1-4 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Reset/Powerdown Power Supply Ground 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 60 11 59 12 58 13 57 14 56 15 55 16 54 17 53 18 52 19 51 20 50 21 49 22 48 23 47 24 46 25 45 26 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 WE2# WE3# WE4# A18 A19 NC I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 CS1-4 OE RESET VCC The White 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. GND Block Diagram W E1# CS1# RESET# OE# A0-19 WE2# CS2# WE3# CS3# WE4# CS4# 1M x 8 1M x 8 1M x 8 1M x 8 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature Supply Voltage Range (VCC) Signal Voltage Range Storage Temperature Range Lead Temperature (soldering, 10 seconds) Endurance (write/erase cycles) -55 to +125 -0.5 to +4.0 -0.5 to Vcc +0.5 -65 to +150 +300 1,000,000 min. Unit °C V V °C °C cycles WF1M32B-XXX3 CAPACITANCE TA = +25°C Symbol Parameter OE# capacitance COE WE#1-4 capacitance CWE CS1-4 capacitance CCS Data I/O capacitance CI/O Address input capacitance CAD Conditions VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz Max 50 20 20 20 50 Unit pF pF pF pF pF NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. This parameter is guaranteed by design but not tested. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Input High Voltage Input Low Voltage Operating Temp. (Mil.) Operating Temp. (Ind.) Symbol Min Max 3.0 3.6 VCC VIH 0.7 x VCC VCC + 0.3 VIL -0.5 +0.8 TA -55 +125 TA -40 +85 Unit V V V °C °C Parameter Minimum Pattern Data Retention Time DATA RETENTION Test Conditions 150°C 125°C Min 10 20 Unit Years Years DC CHARACTERISTICS – CMOS COMPATIBLE VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Input Leakage Current Output Leakage Current VCC Active Current for Read (1) VCC Active Current for Program or Erase (2) VCC Standby Current Output Low Voltage Output High Voltage Low VCC Lock-Out Voltage (4) Symbol ILI ILOx32 ICC1 ICC2 ICC3 VOL VOH1 VLKO Conditions VCC = 3.6, VIN = GND or VCC VCC = 3.6, VIN = GND or VCC CS# = VIL, OE# = VIH, f = 5MHz CS# = VIL, OE# = VIH VCC = 3.6, CS = VIH, f = 5MHz IOL = 5.8 mA, VCC = 3.0 IOH = -2.0 mA, VCC = 3.0 Min Max 10 10 120 140 200 0.45 2.5 Unit µA µA mA mA µA V V V 0.85 X VCC 2.3 NOTES: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 8 mA/MHz, with OE# at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V 4. Guaranteed by design, but not tested. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Write Cycle Time Write Enable Setup Time Chip Select Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Chip Select Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Time Read Recovery Time (2) Chip Programming Time 1. Typical value for tWHWH1 is 9µs. 2. Guaranteed by design, but not tested. WF1M32B-XXX3 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – CS# CONTROLLED Symbol tAVAV tWLEL tELEH tAVEL tDVEH tEHDX tELAX tEHEL tWHWH1 tWHWH2 tGHEL tWC tWS tCP tAS tDS tDH tAH tCPH Min 100 0 45 0 45 0 45 20 -100 Max Min 120 0 50 0 50 0 50 20 -120 Max Min 150 0 50 0 50 0 50 20 -150 Max ns ns ns ns ns ns ns ns µs sec µs sec Unit 300 15 0 50 0 300 15 0 50 300 15 50 AC TEST CIRCUIT Parameter I OL Current Source AC TEST CONDITIONS Typ VIL = 0, VIH = 2.5 5 1.5 1.5 Unit V ns V V Input Pulse Levels Input Rise and Fall Input and Output Reference Level D.U.T. C eff = 50 pf VZ ≈ 1.5V Output Timing Reference Level (Bipolar Supply) I OH Current Source NOTES: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Write Cycle Time Chip Select Setup Time Write Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Write Enable Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Read Recovery Time before Write (3) VCC Setup Time Chip Programming Time Output Enable Setup Time Output Enable Hold Time (2) 1. Typical value for tWHWH1 is 9µs. 2. For Toggle and Data Polling. 3. Guaranteed by design, but not tested. WF1M32B-XXX3 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – WE# CONTROLLED Symbol tAVAV tELWL tWLWH tAVWL tDVWH tWHDX tWLAX tWHWL tWHWH1 tWHWH2 tGHWL tVCS tWC tCS tWP tAS tDS tDH tAH tWPH Min 100 0 50 0 50 0 50 30 -100 Max Min 120 0 50 0 50 0 50 30 -120 Max Min 150 0 65 0 65 0 65 35 -150 Max ns ns ns ns ns ns ns ns µs sec µs µs sec ns ns Unit 300 15 0 50 50 tOES tOEH 0 10 0 10 0 50 300 15 0 50 50 0 10 300 15 50 AC CHARACTERISTICS – READ-ONLY OPERATIONS VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select High to Output High Z (1) Output Enable High to Output High Z (1) Output Hold from Addresses, CS# or OE# Change, whichever is First 1. Guaranteed by design, not tested. Symbol tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tRC tACC tCE tOE tDF tDF tOH Min 100 -100 Max 100 100 40 30 30 0 0 Min 120 -120 Max 120 120 50 30 30 0 Min 150 -150 Max 150 150 55 40 40 Unit ns ns ns ns ns ns ns White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs AC WAVEFORMS FOR READ OPERATIONS WF1M32B-XXX3 tDF tOH Addresses Stable tRC tOE tACC tCE Addresses WE# OE# CS# White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com Outputs High Z Output Valid H ig h Z White Electronic Designs WF1M32B-XXX3 WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED tOH tDF tRC tOE Data# Polling tAH tWHWH1 PA tAS tWPH tDH 5555H tGHWL tWC tWP tCS A0A0H PD D7 # PA DOUT NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. CS# OE# Addresses WE# tDS White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com 5.0 V Data tCE White Electronic Designs WF1M32B-XXX3 AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS SA 2AAAH 5555H 5555H 2AAAH 5555H tWP AAAAH tDS tWPH tAS tGHWL tCS tDH 5555H tAH 8080H AAAAH 5555H 1010H/3030H OE# WE# CS# NOTE: 1. SA is the sector address for Sector Erase. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com Addresses Data VCC tVCS White Electronic Designs WF1M32B-XXX3 AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS t DF t OH High Z I/O7 and I/O15 Valid Data I/O0-15 Valid Data tWHWH 1 or 2 Data I/O0-6 and I/O8-14 I/O0-6 and I/O8-14 Invalid t OE t OE t CH tOEH tCE White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com WE# OE# CS# I/O7 and I/O15 I/O7 # and I/O15 # White Electronic Designs WF1M32B-XXX3 ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS Data# Polling t AH tWHWH1 PA tAS tGHEL tCP tCPH tDH A0H 5555H tWC tWS PD WE# OE# CS# tDS Addresses D7 # PA DOUT NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com 5.0 V Data White Electronic Designs WF1M32B-XXX3 PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T) 25.15 (0.990) ± 0.26 (0.010) SQ 22.36 (0.880) ± 0.26 (0.010) SQ 4.57 (0.180) MAX 0.27 (0.011) ± 0.04 (0.002) Pin 1 0.25 (0.010) REF 24.03 (0.946) ± 0.26 (0.010) 1° / 7° 1.0 (0.040) ± 0.127 (0.005) R 0.25 (0.010) 0.19 (0.007) ± 0.06 (0.002) 23.87 (0.940) REF DETAIL A 1.27 (0.050) TYP 0.38 (0.015) ± 0.05 (0.002) 20.3 (0.800) REF SEE DETAIL "A" The WEDC 68 lead G2T CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. 0.940" ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 30.1 (1.185) ± 0.38 (0.015) SQ PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM 25.4 (1.0) TYP 3.81 (0.150) ± 0.1 (0.005) 2.54 (0.100) TYP 1.27 (0.050) ± 0.1 (0.005) 0.76 (0.030) ± 0.1 (0.005) 15.24 (0.600) TYP 1.27 (0.050) TYP DIA 0.46 (0.018) ± 0.05 (0.002) DIA 25.4 (1.0) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ORDERING INFORMATION WF1M32B-XXX3 W F 1M32 B - XXX X X 3 X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads PROGRAMMING VOLTAGE 3 = 3.3V DEVICE GRADE: M = Military Screened I = Industrial C = Commercial -55°C to +125°C -40°C to +85°C 0°C to +70°C PACKAGE TYPE: H = Ceramic Hex In line Package, HIP (Package 401) G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509) ACCESS TIME (ns) IMPROVEMENT MARK B = Boot Block (Bottom Sector) ORGANIZATION, 1M x 32 User configurable as 2M x 16 or 4M x 8 Flash WHITE ELECTRONIC DESIGNS CORP. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 5 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com