WF2M32I-150G2UQ5

White Electronic Designs 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square (Package 510) 3.56mm (0.140") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 3) Sector Architecture • 32 equal size sectors of 64KBytes per each 2Mx8 chip • Any combination of sectors can be erased. Also supports full chip erase. Minimum 100,000 Write/Erase Cycles Minimum Organized as 2Mx32 WF2M32-XXX5 Commercial, Industrial, and Military Temperature Ranges 5 Volt Read and Write. 5V ± 10% Supply. Low Power CMOS Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. Supports reading or programming data to a sector not being erased. RESET# pin resets internal state machine to the read mode. Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation, Separate Power and Ground Planes to improve noise immunity * This product is subject to change without notice. Note: For programming information refer to Flash Programming 16M5 Application Note. FIGURE 1 – PIN CONFIGURATION FOR WF2M32-XHX5 Top View 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 22 12 WE2# CS2# GND I/O11 A10 A9 A15 VCC CS1# A19 I/O3 33 23 I/O15 I/O14 I/O13 I/O12 OE# A17 WE1# I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A7 A12 A20 A13 A8 I/O16 I/O17 I/O18 44 34 VCC CS4# WE4# I/O27 A4 A5 A6 WE3# CS3# GND I/O19 55 45 I/O31 I/O30 I/O29 I/O28 A1 A2 OE# A0-20 Pin Description 56 I/O0-31 A0-20 WE1-4# CS1-4# OE# VCC GND Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Block Diagram WE1# CS1# WE2# CS2# WE3# CS3# WE4# CS4# A3 2M x 8 2M x 8 2M x 8 2M x 8 I/O23 I/O22 I/O21 I/O20 66 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 RESET# internally tied to VCC in the HIP package for this pin configuration. See Alternate Pin Configuration with RESET# tied to pin 12 for system control of reset (FIGURE 10, page 11). October 2004 Rev. 5 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF2M32-XXX5 FIGURE 2 – PIN CONFIGURATION FOR WF2M32-XG2UX5 Top View RESET# A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE1# A6 A7 A8 A9 A10 VCC Pin Description I/O0-31 A0-20 WE1-4# CS1-4# OE# VCC GND RESET# Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Reset 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 Block Diagram WE1# CS1# RESET# OE# A0-20 2M x 8 2M x 8 WE2# CS2# WE3# CS3# WE4# CS4# VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 WE2# WE3# WE4# A18 A19 A20 2M x 8 2M x 8 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 The WEDC 68 lead G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. 0.940" October 2004 Rev. 5 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Voltage on Any Pin Relative to VSS Power Dissipation Storage Temperature Short Circuit Output Current Endurance – Write/Erase Cycles (Extended Temp) Data Retention Symbol VT PT Tstg IOS Ratings -2.0 to +7.0 8 -65 to +125 100 100,000 min 20 Unit V W °C mA cycles years WF2M32-XXX5 CAPACITANCE TA = +25°C, f = 1.0MHz Parameter OE# capacitance WE1-4# capacitance HIP (PGA) HIP (Alternate pinout) CQFP G4T CQFP G2U G2U (Alternate pinout) CS1-4# capacitance Data I/O capacitance Address input capacitance Symbol COE CWE CWE CWE CWE CWE CCS CI/O CAD Max 50 20 50 50 20 50 20 20 50 Unit pF pF pF pF pF pF pF pF pF This parameter is guaranteed by design but not tested. RECOMMENDED DC OPERATING CONDITIONS Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Operating Temperature (Mil.) Operating Temperature (Ind.) Symbol Min VCC VSS VIH VIL TA TA 4.5 0 2.0 -0.5 -55 -40 Typ 5.0 0 Max 5.5 0 VCC + 0.5 +0.8 +125 +85 Unit V V V V °C °C DC CHARACTERISTICS – CMOS COMPATIBLE VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Input Leakage Current Output Leakage Current VCC Active Current for Read (1) VCC Active Current for Program or Erase (2) VCC Standby Current Output Low Voltage Output High Voltage Low VCC Lock-Out Voltage Symbol ILI ILOx32 ICC1 ICC2 ICC3 VOL VOH VLKO Conditions VCC = 5.5, VIN = GND to VCC VCC = 5.5, VIN = GND to VCC CS# = VIL, OE# = VIH, f = 5MHz CS# = VIL, OE# = VIH VCC = 5.5, CS# = VIH, f = 5MHz, RESET# = VCC ± 0.3V IOL = 12.0 mA, VCC = 4.5 IOH = -2.5 mA, VCC = 4.5 Min Max 10 10 160 240 8.0 0.45 4.2 Unit µA µA mA mA mA V V V 0.85xVCC 3.2 NOTES: 1. The ICC current listed includes both the DC operating current and the frequency dependent component (@ 5MHz). The frequency component typically is less than 2mA/MHz, with OE# at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions VIL = 0.3V, VIH = VCC - 0.3V October 2004 Rev. 5 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs VCC = 5.0V, -55°C ≤ TA ≤ +125°C Parameter Write Cycle Time Chip Select Setup Time Write Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Write Enable Pulse Width High Duration of Byte Programming Operation (1) Sector Erase (2) Read Recovery Time before Write VCC Setup Time Chip Programming Time Chip Erase Time (3) Output Enable Hold Time (4) RESET# Pulse Width (5) Symbol tAVAV tELWL tWLWH tAVWL tDVWH tWHDX tWLAX tWHWL tWHWH1 tWHWH2 tGHWL tVCS tWC tCS tWP tAS tDS tDH tAH tWPH Min 90 0 45 0 45 0 45 20 -90 Max Min 120 0 50 0 50 0 50 20 -120 Max WF2M32-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS - WE# CONTROLLED -150 Min 150 0 50 0 50 0 50 20 Max ns ns ns ns ns ns ns ns µs sec µs µs sec sec ns ns Unit 300 15 0 50 44 256 tOEH tRP 10 500 10 500 0 50 300 15 0 50 44 256 10 500 300 15 44 256 NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase Time is 32sec. 4. For Toggle and Data Polling. 5. RESET# internally tied to VCC for the default pin configuration in the HIP package. AC CHARACTERISTICS – READ-ONLY OPERATIONS VCC = 5.0V, -55°C ≤ TA ≤ +125°C Parameter Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select High to Output High Z (1) Output Enable High to Output High Z (1) Output Hold from Addresses, CS# or OE# Change, whichever is First RST Low to Read Mode (1,2) Symbol tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tRC tACC tCE tOE tDF tDF tOH tReady Min 90 -90 Max 90 90 40 20 20 0 20 0 20 Min 120 -120 Max 120 120 50 30 30 0 20 Min 150 -150 Max 150 150 55 35 35 Unit ns ns ns ns ns ns ns µs NOTES: 1. Guaranteed by design, not tested. 2. RESET# internally tied to VCC for the default pin configuration in the HIP package. October 2004 Rev. 5 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Write Cycle Time Write Enable Setup Time Chip Select Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Chip Select Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Time (2) Read Recovery Time Chip Programming Time Chip Erase Time (3) Output Enable Hold Time (4) NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase Time is 32sec. 4. For Toggle and Data Polling. WF2M32-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED Symbol tAVAV tWLEL tELEH tAVEL tDVEH tEHDX tELAX tEHEL tWHWH1 tWHWH2 tGHEL tWC tWS tCP tAS tDS tDH tAH tCPH Min 90 0 45 0 45 0 45 20 -90 Max Min 120 0 50 0 50 0 50 20 -120 Max Min 150 0 50 0 50 0 50 20 -150 Max ns ns ns ns ns ns ns ns µs sec µs sec sec ns Unit 300 15 0 44 256 tOEH 10 10 0 300 15 0 44 256 10 300 15 44 256 FIGURE 3 – AC TEST CIRCUIT AC TEST CONDITIONS IOL Current Source Parameter Input Pulse Levels Input Rise and Fall Input and Output Reference Level Output Timing Reference Level Typ VIL = 0, VIH = 3.0 5 1.5 1.5 Unit V ns V V D.U.T. Ceff = 50 pf VZ ≈ 1.5V (Bipolar Supply) IOH Current Source Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 ý. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. FIGURE 4 – RESET TIMING DIAGRAM RESET# tRP tReady October 2004 Rev. 5 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF2M32-XXX5 FIGURE 5 – AC WAVEFORMS FOR READ OPERATIONS OE# October 2004 Rev. 5 6 WE# White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com CS# White Electronic Designs WF2M32-XXX5 FIGURE 6 – WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED Data# Polling OE# CS# NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. 5. DOUT is the output of the data written to the device. Figure indicates last two bus cycles of four bus cycle sequence. October 2004 Rev. 5 7 WE# White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com D7# White Electronic Designs WF2M32-XXX5 FIGURE 7 – AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS OE# NOTE: 1. SA is the sector address for Sector Erase. October 2004 Rev. 5 8 WE# CS# White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF2M32-XXX5 FIGURE 8 – AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS t DF t OH High Z D7 = Valid Data t CH tOEH tCE tWHWH 1 or 2 Data White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com t OE OE# October 2004 Rev. 5 WE# CS# 9 D0-D6 D7 D0-D6 = Invalid D7# D0-D7 Valid Data White Electronic Designs WF2M32-XXX5 FIGURE 9 – ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS Data# Polling tGHEL tCP OE# Notes: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. October 2004 Rev. 5 10 WE# CS# tWS tCPH White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com D7 # White Electronic Designs WF2M32-XXX5 FIGURE 10 – ALTERNATE PIN CONFIGURATION FOR WF2M32I-XHX5 TOP VIEW 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 22 12 RESET# CS2# GND I/O11 A10 A9 A15 VCC CS1# A19 I/O3 33 23 I/O15 I/O14 I/O13 I/O12 OE# A17 WE# I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O16 I/O17 I/O18 44 34 VCC CS4# NC I/O27 A4 A5 A6 A20 CS3# GND I/O19 55 45 I/O31 I/O30 I/O29 I/O28 A1 A2 A3 I/O23 I/O22 2M x 8 2M x 8 2M x 8 2M x 8 RESET# WE# OE# A 0 - 20 PIN DESCRIPTION 56 I/O0-31 A0-20 WE# CS1-4# OE# VCC GND RESET# Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Power Supply Ground Reset BLOCK DIAGRAM CS1# CS2# CS3# CS4# I/O21 8 8 8 8 I/O20 66 I/O0-7 I/O8-15 I/O16-23 I/O24-31 FIGURE 11 – ALTERNATE PIN CONFIGURATION FOR WF2M32U-XG2UX5 TOP VIEW RESET# A0 A1 A2 A3 A4 A5 NC GND NC WE# A6 A7 A8 A9 A10 VCC PIN DESCRIPTION I/O0-31 A0-20 WE# CS# OE# VCC GND RESET# Data Inputs/Outputs Address Inputs Write Enable Chip Select Output Enable Power Supply Ground Reset 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 0.940" The WEDC 68 lead G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. BLOCK DIAGRAM RESET# C S# WE# OE# A 0-20 2M x 8 2M x 8 VCC A11 A12 A13 A14 A15 A16 CS# OE# NC A17 NC NC NC A18 A19 A20 2M x 8 2M x 8 8 8 8 8 I/O 0-7 I/O 8-15 I/O 16-23 I/O 24-31 October 2004 Rev. 5 11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF2M32-XXX5 FIGURE 12 – PIN CONFIGURATION FOR WF2M32I-XG2UX5 TOP VIEW RESET# A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE# A6 A7 A8 A9 A10 VCC PIN DESCRIPTION I/O0-31 A0-20 WE# CS1-4# OE# VCC GND RESET# Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Power Supply Ground Reset 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 BLOCK DIAGRAM CS1# RESET# WE# OE# A 0 - 20 CS2# CS3# CS4# 2M x 8 2M x 8 2M x 8 2M x 8 VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 NC NC NC A18 A19 A20 8 8 8 8 I/O0-7 I/O8-15 I/O16-23 I/O24-31 The WEDC 68 lead G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. 0.940" October 2004 Rev. 5 12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF2M32-XXX5 PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H) 30.1 (1.185) ± 0.38 (0.015) SQ PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM 25.4 (1.0) TYP 6.22 (0.245) MAX 3.81 (0.150) ±0.1 (0.005) 2.54 (0.100) TYP 1.27 (0.050) ± 0.1 (0.005) 0.76 (0.030) ± 0.1 (0.005) 15.24 (0.600) TYP 1.27 (0.050) TYP DIA 0.46 (0.018) ± 0.05 (0.002) DIA 25.4 (1.0) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES October 2004 Rev. 5 13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF2M32-XXX5 PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U) The WEDC 68 lead G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES October 2004 Rev. 5 14 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ORDERING INFORMATION WF2M32-XXX5 W F 2M32 X - XXX X X 5 X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads VPP PROGRAMMING VOLTAGE 5=5V DEVICE GRADE: Q = Compliant -55°C to +125°C M = Military -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C PACKAGE TYPE: H = Ceramic Hex In line Package, HIP (Package 401) G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510) ACCESS TIME (ns) IMPROVEMENT MARK • For HIP Package Blank = 4CS# and 4WE# I = 4CS# and 1WE#, RESET# • For G2U Package Blank = 4CS# and 4WE# U = 1CS# and 1WE# I = 4CS# and 1WE#, RESET# ORGANIZATION, 2M x 32 User configurable as 4M x 16 or 8M x 8 (Except WF2M32U-XG2UX which is 32 bit wide only.) Flash WHITE ELECTRONIC DESIGNS CORP. October 2004 Rev. 5 15 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com