WF8M32-100G4DM5

White Electronic Designs 8Mx32 5V FLASH MODULE FEATURES Access Time of 100, 120, 150ns Packaging: • 68 Lead, 40 mm (1.560") square hermetic CQFP, 5.2 mm (0.205") high (Package 503) Sector Architecture • 32 equal size sectors of 64KBytes per each 2Mx8 chip • Any combination of sectors can be erased. Also supports full chip erase. 100,000 Write/Erase Cycles Minimum Organized as 8Mx32 Commercial, Industrial, and Military Temperature Ranges 5 Volt Read and Write. 5V ± 10% Supply. Low Power CMOS WF8M32-XG4DX5 ADVANCED* Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. Supports reading or programming data to a sector not being erased. RESET# pin resets internal state machine to the read mode. (Not available in HIP package for WF2M32-XHX5) Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation, Seperate Power and Ground Planes to improve noise immunity. Built in Buffering. * This product is under development, is not qualified or characterized and is subject to change or cancellation without notice. Note: For programming information refer to Flash Programming 16M5 Application Note. FIGURE 1 – PIN CONFIGURATIONFOR WF8M32-XG4DX5 Top View NC A0 A1 A2 A3 A4 A5 CS1# GND CS3# WE# A6 A7 A8 A9 A10 VCC PIN DESCRIPTION I/O0-31 A0-22 WE CS1-4 OE VCC RESET GND NC Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Power Supply Reset Ground Not Connected 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 BLOCK DIAGRAM RESET# CS1-4# WE# OE# A0-22 1 1 Interface 4 1 1 23 4 1 1 23 CS1# 2M x 8 2M x 8 2M x 8 2M x 8 I/O0-7 8 32 CS2# 2M x 8 2M x 8 2M x 8 2M x 8 I/O8-15 8 CS3# 2M x 8 2M x 8 2M x 8 2M x 8 I/O16-23 8 CS4# 2M x 8 2M x 8 2M x 8 2M x 8 I/O24-31 8 VCC A11 A12 A13 A14 A15 A16 CS2# OE# CS4# A17 A18 A19 A20 A21 RESET# A22 I/O0-31 CS1# selects I/O0-7, CS2# selects I/O8-15, CS3# selects I/O16-23, CS4# selects I/O24-31 White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Voltage on Any Pin Relative to VSS Power Dissipation Storage Temperature Short Circuit Output Current Endurance - Write/Erase Cycles (Mil Temp) Data Retention (Mil Temp) Symbol VT PT TSTG IOS Ratings -2.0 to +7.0 8 -65 to +125 100 100,000 min 20 Unit V W °C mA cycles years WF8M32-XG4DX5 ADVANCED CAPACITANCE TA = +25°C Symbol Parameter OE# capacitance COE WE# capacitance CWE CS1-4# capacitance CCS Data I/O capacitance CI/O Address input capacitance CAD RESET# capacitance CRST Conditions VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz Max 20 20 20 60 20 20 Unit pF pF pF pF pF pF This parameter is guaranteed by design but not tested. RECOMMENDED DC OPERATING CONDITIONS Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Operating Temperature (Mil.) Operating Temperature (Ind.) Symbol VCC VSS VIH VIL TA TA Min 4.5 0 2.0 -0.5 -55 -40 Typ 5.0 0 — — — — Max 5.5 0 VCC + 0.5 +0.8 +125 +85 Unit V V V V °C °C DC CHARACTERISTICS – CMOS COMPATIBLE VCC = 5.0V, GND = 0V, -55°C ≤ TA ≤ +125°C Parameter Input Leakage Current Output Leakage Current VCC Active Current for Read (1) VCC Active Current for Program or Erase (2) VCC Standby Current Output Low Voltage Output High Voltage Low VCC Lock-Out Voltage Symbol ILI ILOx32 ICC1 ICC2 ICC3 VOL VOH VLKO Conditions VCC = 5.5, VIN = GND to VCC VCC = 5.5, VIN = GND to VCC CS# = VIL, OE# = VIH, f = 5MHz CS# = VIL, OE# = VIH VCC = 5.5, CS# = VIH, f = 5MHz, RESET# = VCC ± 0.3V IOL = 12.0 mA, VCC = 4.5 IOH = -2.5 mA, VCC = 4.5 Min Max 10 10 640 960 160 0.45 4.2 Unit µA µA mA mA mA V V V 0.85 x VCC 3.2 Notes: 1. The Icc current listed includes both the DC operating current and the frequency dependent component (@ 5MHz). The frequency component typically is less than 2mA/MHz, with OE# at VIH. 2. ICC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions VIL = 0.3V, VIH = VCC - 0.3V White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs VCC = 5.0V, -55°C ≤ TA ≤ +125°C Parameter Write Cycle Time Chip Select Setup Time Write Enable Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Write Enable Pulse Width High Duration of Byte Programming Operation (1) Sector Erase (2) Read Recovery Time before Write VCC Setup Time Chip Programming Time Chip Erase Time (3) Output Enable Hold Time (4) RESET# Pulse Width NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase Time is 32sec. 4. For Toggle and Data Polling. WF8M32-XG4DX5 ADVANCED AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – WE# CONTROLLED Symbol tAVAV tELWL tWLWH tAVWL tDVWH tWHDX tWLAX tWHWL tWHWH1 tWHWH2 tGHWL tVCS tWC tCS tWP tAS tDS tDH tAH tWPH Min 100 0 50 0 50 0 50 20 -100 Max Min 120 0 50 0 50 0 50 20 -120 Max Min 150 0 50 0 50 0 50 20 -150 Max ns ns ns ns ns ns ns ns µs sec µs µs sec ns ns ns Unit 300 15 0 50 44 256 tOEH tRP 10 500 10 500 0 50 300 15 0 50 44 256 10 500 300 15 44 256 AC CHARACTERISTICS – READ-ONLY OPERATIONS VCC = 5.0V, -55°C ≤ TA ≤ +125°C Parameter Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select High to Output High Z (1) Output Enable High to Output High Z (1) Output Hold from Addresses, CS# or OE# Change, whichever is First RST Low to Read Mode (1) 1. Guaranteed by design, not tested. Symbol tAVAV tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tRC tACC tCE tOE tDF tDF tOH tReady -100 Min 100 Max 100 100 50 30 30 0 20 0 Min 120 -120 Max 120 120 50 30 30 0 20 Min 150 -150 Max 150 150 55 35 35 Unit ns ns ns ns ns ns ns µs 20 White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Write Cycle Time Write Enable Setup Time Chip Select Pulse Width Address Setup Time Data Setup Time Data Hold Time Address Hold Time Chip Select Pulse Width High Duration of Byte Programming Operation (1) Sector Erase Time (2) Read Recovery Time (2) Chip Programming Time Chip Erase Time (3) Output Enable Hold Time (4) NOTES: 1. Typical value for tWHWH1 is 7µs. 2. Typical value for tWHWH2 is 1sec. 3. Typical value for Chip Erase Time is 32sec. 4. For Toggle and Data Polling. WF8M32-XG4DX5 ADVANCED AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – CS# CONTROLLED Symbol tAVAV tWLEL tELEH tAVEL tDVEH tEHDX tELAX tEHEL tWHWH1 tWHWH2 tGHEL tWC tWS tCP tAS tDS tDH tAH tCPH Min 100 0 50 0 50 0 50 20 -100 Max Min 120 0 50 0 50 0 50 20 -120 Max Min 150 0 50 0 50 0 50 20 -150 Max ns ns ns ns ns ns ns ns µs sec µs sec sec ns Unit 300 15 0 100 480 tOEH 10 10 0 300 15 0 100 480 10 300 15 100 480 FIGURE 2 – AC TEST CIRCUIT Parameter I OL Current Source AC TEST CONDITIONS Typ VIL = 0, VIH = 3.0 5 1.5 1.5 Unit V ns V V Input Pulse Levels Input Rise and Fall Input and Output Reference Level D.U.T. C eff = 50 pf VZ ≈ 1.5V Output Timing Reference Level (Bipolar Supply) I OH Current Source NOTES: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. FIGURE 3 – RESET TIMING DIAGRAM RESET# tRP tReady White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF8M32-XG4DX5 ADVANCED FIGURE 4 – AC WAVEFORMS FOR READ OPERATIONS tDF tOH Addresses Stable tRC tOE tACC tCE Addresses WE# OE# CS# White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com Outputs High Z Output Valid H ig h Z White Electronic Designs WF8M32-XG4DX5 ADVANCED WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED tOH tDF tRC tOE Data# Polling tAH tWHWH1 PA tAS tWPH tDH 5555H tGHWL tWC tWP tCS A0A0H PD D7 # PA DOUT NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. CS# OE# Addresses WE# tDS White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com 5.0 V Data tCE White Electronic Designs WF8M32-XG4DX5 ADVANCED AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS SA 2AAAH 5555H 5555H 2AAAH 5555H tWP AAAAH tDS tWPH tAS tGHWL tCS tDH 5555H tAH 8080H AAAAH 5555H 1010H/3030H OE# WE# CS# NOTE: 1. SA is the sector address for Sector Erase. White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com Addresses Data VCC tVCS White Electronic Designs WF8M32-XG4DX5 ADVANCED AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS t DF t OH High Z I/O7 and I/O15 Valid Data I/O0-15 Valid Data tWHWH 1 or 2 Data I/O0-6 and I/O8-14 I/O0-6 and I/O8-14 Invalid t OE t OE t CH tOEH tCE White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com WE# OE# CS# I/O7 and I/O15 I/O7 # and I/O15 # White Electronic Designs WF8M32-XG4DX5 ADVANCED ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS Data# Polling t AH tWHWH1 PA tAS tGHEL tCP tCPH tDH A0H 5555H tWC tWS PD WE# OE# CS# tDS Addresses D7 # PA DOUT NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com 5.0 V Data White Electronic Designs WF8M32-XG4DX5 ADVANCED PACKAGE 503: 68 LEAD, CERAMIC QUAD FLAT PACK DUAL CAVITY, CQFP (G4D) 39.6 (1.56) ± 0.38 (0.015) SQ 5.2 (0.205) MAX 1.27 (0.050) ± 0.1 (0.005) PIN 1 IDENTIFIER Pin 1 12.7 (0.500) ± 0.5 (0.020) 4 PLACES 5.1 (0.200) ± 0.25 (0.010) 4 PLACES + 0.002 0.010 - 0.001 1.27 (0.050) TYP 38 (1.50) TYP 4 PLACES 0.38 (0.015) ± 0.08 (0.003) 68 PLACES ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES ORDERING INFORMATION W F 8M32 - XXX G4D X 5 VPP PROGRAMMING VOLTAGE 5=5V DEVICE GRADE: M = Military Screened I = Industrial C = Commercial PACKAGE TYPE: G4D = 40mm CQFP (Package 503) ACCESS TIME (ns) ORGANIZATION, 8M x 32 User configurable as 16M x 16 or 32M x 8 Flash WHITE ELECTRONIC DESIGNS CORP. White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 1999 Rev. 3 10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com -55°C to +125°C -40°C to +85°C 0°C to +70°C