2795100000

    Data sheet IE-PCB-SPM-P-90-THR Weidmüller Interface GmbH & Co. KG Klingenbergstraße 26 D-32758 Detmold Germany   www.weidmueller.com     Single Pair Ethernet PCB sockets Single pair Ethernet is a technology that only requires one pair of wires to transmit data and power. The resulting benefits will make SPE the preferred network at the field level and beyond. Advantages of Single Pair Ethernet: • Consistent: Single Pair Ethernet enables uniform Ethernet-based communication from the sensor to the cloud • Future-proof: key technology for Industry 4.0 and IIoT • Flexible: ranges of up to 1000 m and transmission properties of up to 1 Gbps enable use across applications • Innovative: lighter, less space required, and reduced installation effort General ordering data   Version Order No. Type GTIN (EAN) Qty.   Built-in plugs, M8 PCB insert, Solder connection, Male contact, IP67 with housing, THT/THR solder connection, 90°, Number of poles: 2 2795100000 IE-PCB-SPM-P-90-THR 4064675119159 100 pc(s). Creation date March 11, 2022 7:21:01 PM CET   Catalogue status 11.02.2022 / We reserve the right to make technical changes. 1     Data sheet IE-PCB-SPM-P-90-THR   Weidmüller Interface GmbH & Co. KG Klingenbergstraße 26 D-32758 Detmold Germany   www.weidmueller.com Technical data Dimensions and weights   Depth Height Width Net weight   31.6 mm 14.5 mm 15.2 mm 8.14 g         Depth (inches) Height (inches) Width (inches)   -40 °C...85 °C       Mounting onto the PCB         Outgoing elbow Plugging cycles Protection degree Type of connection 1000 V DC ≥ 500 MΩ 72 V       Dielectric strength, contact / shield Rated current   IEC 63171-5     LCP RAL 7001, RAL 9011 1 Copper alloy -40 °C           Colour Insulation strength UL 94 flammability rating Contact surface Operating temperature, max. silver, black ≥ 500 MΩ V-0 Ni/Au 85 °C 330 mm 50 mm     VPE width   330 mm EC002637 EC002637 27-44-04-02 27-46-02-01         ETIM 7.0 ECLASS 9.0 ECLASS 10.0   EC002637 27-44-04-02 27-44-04-02 1.244 inch 0.571 inch 0.598 inch Temperatures   Operating temperature   System specifications   Category Number of poles Performance-Category Product family Soldering process   T1-B 2 T1-B Industrial Ethernet Reflow soldering, Manual soldering, Wave soldering THT/THR solder connection 90° ≥ 100 IP67 with housing Solder connection, Male contact Electrical properties   Dielectric strength, contact / contact Insulation strength Rated voltage   2250 V DC 4A Standards   Connector standard   Material data   Insulating material Colour chart (similar) Moisture Level (MSL) Contact material Operating temperature, min.   Packing   VPE length VPE height   Classifications   ETIM 6.0 ETIM 8.0 ECLASS 9.1 ECLASS 11.0   Approvals   ROHS   Conform Creation date March 11, 2022 7:21:01 PM CET   Catalogue status 11.02.2022 / We reserve the right to make technical changes. 2     Data sheet IE-PCB-SPM-P-90-THR   Weidmüller Interface GmbH & Co. KG Klingenbergstraße 26 D-32758 Detmold Germany   www.weidmueller.com Technical data Downloads   Technical Documentation Catalogues   IE-PCB-SPM-P-90-THR Catalogues in PDF-format Creation date March 11, 2022 7:21:01 PM CET   Catalogue status 11.02.2022 / We reserve the right to make technical changes. 3 Wave Solder Profile   Recommended wave solderding profiles Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com   Single Wave:   260 Contact time appr. 3 sec. 260 °C 255 °C 250 °C 240 220 200 Temperature [°C] 180 160 140 appr. 150 °C Preheating 120 100 Cooling rate < 6 °K/s 80 60 Typical process Prozess limits Temperature on board 40 Heating rate < 3 °K/s 20 0 0 20 40 60 80 100 120 time [s] 140 160 180 200 220 240 Double Wave: 255 °C Total contact time max. 10 sec. 260 240 260 °C 250 °C 220 200 Temperature [°C] 180 160 140 appr. 150°C Preheating 120 100 Cooling rate < 6 °K/s 80 60 Typical process Process limits Temperature on board 40 Heating rate < 3 °K/s 20 0 0 20 40 60 Wave soldering profiles 80 100 120 time [s] 140 160 180 200 220 240 Wired connection elements should be processed in accordance with the DIN EN 61760-1 standard. We have included two recommendations for practical wave soldering profiles, with which Weidmüller PCB terminals and connectors are qualified. When choosing a suitable profile for your application, the following factors also need to be considered: - PCB thickness - Proportion of Cu in the layers - Single/double-sided assembly - Product range - Heating and cooling rates The single and double wave profiles each indicate the recommended operating range, including the maximum soldering temperature of 260°C. In practice, the maximum soldering temperature is quite often well below the above maximum profile.   We reserve the right to make technical changes.   Reflow Solder Profile   Recommended reflow soldering profile Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com     300 254 °C Temperature [°C] 250 217 200 235 °C Melting point lead-free solder paste 245 °C 190 °C approx. 60 s > 217 °C 180 °C 150 preheating Cooling rate: < 6 °K/s 100 Heating rate: < 3 °K/s 50 Continuous line: Typical process Dotted line: Process limits 0 0 50 100 150 200 250 300 350 Time [sec] Reflow soldering profile The perfect soldering profile for SMT Surface Mount Technology is one the most exiting question in SMT production. But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of solder paste and to maximum load of components. We have to consider the following parameters: • Time for pre heating • Maximum temperature • Time above melting point • Time for cooling • Maximum heating rate • Maximum cooling rate We recommend a typical solder profile with associated process limits. With preheating components and board are prepared smoothly for the solder phase. Heating rate is typically ≤ +3K/s. In parallel the solder paste is ‚activated’. The time above melting point of 217°C the paste gets liquid and components and boards begin to connect. The maximum temperature of 245°C to 254°C should stay between 10 and 40 seconds. In the cooling phase at ≥ -6K/s solder is cured. Board and components cool down while avoiding cold cracks.   We reserve the right to make technical changes.