2795110000

    Data sheet IE-PCB-SPM-P-180-SMD Weidmüller Interface GmbH & Co. KG Klingenbergstraße 26 D-32758 Detmold Germany   www.weidmueller.com     Single Pair Ethernet PCB sockets Single pair Ethernet is a technology that only requires one pair of wires to transmit data and power. The resulting benefits will make SPE the preferred network at the field level and beyond. Advantages of Single Pair Ethernet: • Consistent: Single Pair Ethernet enables uniform Ethernet-based communication from the sensor to the cloud • Future-proof: key technology for Industry 4.0 and IIoT • Flexible: ranges of up to 1000 m and transmission properties of up to 1 Gbps enable use across applications • Innovative: lighter, less space required, and reduced installation effort General ordering data   Version Order No. Type GTIN (EAN) Qty.   Built-in plugs, M8 PCB insert, IP67 with housing, SMD solder connection, 180°, Number of poles: 2 2795110000 IE-PCB-SPM-P-180-SMD 4064675119166 100 pc(s). Creation date March 11, 2022 7:21:33 PM CET   Catalogue status 11.02.2022 / We reserve the right to make technical changes. 1     Data sheet IE-PCB-SPM-P-180-SMD   Weidmüller Interface GmbH & Co. KG Klingenbergstraße 26 D-32758 Detmold Germany   www.weidmueller.com Technical data Dimensions and weights   Depth Height Width Net weight   14.5 mm 22.1 mm 10.1 mm 5.14 g         Depth (inches) Height (inches) Width (inches)   -40 °C...85 °C     T1-B 2 T1-B Industrial Ethernet Reflow soldering, Manual soldering           Mounting onto the PCB Outgoing elbow Plugging cycles Protection degree   SMD solder connection 180° ≥ 100 IP67 with housing ≥ 500 MΩ 72 V     Rated current   4A IEC 63171-5     LCP RAL 9011 1 Copper alloy -40 °C           Colour Insulation strength UL 94 flammability rating Contact surface Operating temperature, max. black ≥ 500 MΩ V-0 Ni/Au 85 °C 330 mm 330 mm     VPE width   50.4 mm EC002637 EC002637 27-44-04-02 27-46-02-01         ETIM 7.0 ECLASS 9.0 ECLASS 10.0   EC002637 27-44-04-02 27-44-04-02 0.571 inch 0.87 inch 0.398 inch Temperatures   Operating temperature   System specifications   Category Number of poles Performance-Category Product family Soldering process   Electrical properties   Insulation strength Rated voltage   Standards   Connector standard   Material data   Insulating material Colour chart (similar) Moisture Level (MSL) Contact material Operating temperature, min.   Packing   VPE length VPE height   Classifications   ETIM 6.0 ETIM 8.0 ECLASS 9.1 ECLASS 11.0   Approvals   ROHS   Conform Creation date March 11, 2022 7:21:33 PM CET   Catalogue status 11.02.2022 / We reserve the right to make technical changes. 2     Data sheet IE-PCB-SPM-P-180-SMD   Technical data Weidmüller Interface GmbH & Co. KG Klingenbergstraße 26 D-32758 Detmold Germany   www.weidmueller.com Downloads   Technical Documentation Catalogues   IE-PCB-SPM-P-180-SMD Catalogues in PDF-format Creation date March 11, 2022 7:21:33 PM CET   Catalogue status 11.02.2022 / We reserve the right to make technical changes. 3 Reflow Solder Profile   Recommended reflow soldering profile Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com     300 254 °C Temperature [°C] 250 217 200 235 °C Melting point lead-free solder paste 245 °C 190 °C approx. 60 s > 217 °C 180 °C 150 preheating Cooling rate: < 6 °K/s 100 Heating rate: < 3 °K/s 50 Continuous line: Typical process Dotted line: Process limits 0 0 50 100 150 200 250 300 350 Time [sec] Reflow soldering profile The perfect soldering profile for SMT Surface Mount Technology is one the most exiting question in SMT production. But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of solder paste and to maximum load of components. We have to consider the following parameters: • Time for pre heating • Maximum temperature • Time above melting point • Time for cooling • Maximum heating rate • Maximum cooling rate We recommend a typical solder profile with associated process limits. With preheating components and board are prepared smoothly for the solder phase. Heating rate is typically ≤ +3K/s. In parallel the solder paste is ‚activated’. The time above melting point of 217°C the paste gets liquid and components and boards begin to connect. The maximum temperature of 245°C to 254°C should stay between 10 and 40 seconds. In the cooling phase at ≥ -6K/s solder is cured. Board and components cool down while avoiding cold cracks.   We reserve the right to make technical changes.