SLVU2.8

SLVU2.8 Ultralow Capacitance TVS Diodes Array for ESD Protection P b Lead(Pb)-Free TRANSIENT VOLTAGE SUPPRESSORS 400 WATTS 2.8 VOLTS 3 1 2 FEATURES: * 400 W Peak Pulse Power per Line (tp=8/20 uS) * One Device Protects one Unidirectional Line. * Low Capacitance. * Low Leakage Current. * Low operating and Clamping Voltages. * Transient Protection for High Speed Data Lines.to * IEC61000-4-2(ESD) ±15kV(air), ±8kV(Contact) * IEC61000-4-4(EFT) 40A(5/50ns) * IEC61000-4-5(lightning) 24A(8/20µs) SOT-23 Eqivalent Circuit Diagram: APPLICATIONS: * Ethernet 10/100/1000 Base T * WAN/LAN Equipment * Desktop,Services,Notebooks & Handhelds * Laser Diode Protection Absolute Maximum Ratings Parameter Peak Pulse Power(tp = 8/20 s) - See Fig.1 Peak Pulse Current(tp = 8/20 s) Storage Temperature Range Operating Junction Temperature Range Symbol PPK IPP TSTG Tj Value 400 24 -55 to 150 -55 to 150 Units W A °C °C WEITRON http://www.weitron.com.tw 1/7 19-Apr-07 SLVU2.8 Electrical Characteristics Parameter Reverse Stand-Off Voltage Pin 3 to 1 or Pin 2 to 1 Punch-Through Voltage IPT = 2µA, Pin 3 to 1 Snap-Back Voltage ISB = 50mA, Pin 3 to 1 Reverse Leakage Current VRWM = 2.8V, T = 25°C Pin 3 to 1 or Pin 2 to 1 Clamping Voltage IPP =2A, tP=8/20µs, Pin 3 to 1 IPP =5A, tP=8/20µs, Pin 3 to 1 IPP =24A, tP=8/20µs, Pin 3 to 1 IPP =5A, tP=8/20µs, Pin 2 to 1 IPP =24A, tP=8/20µs, Pin 2 to 1 Junction Capacitance VR =0V, f =1MHz, Pin 3 to 1 and 2 (Pin 1 and 2 tied together) VR =0V, f =1MHz, Pin 2 to 1 (Pin 3 N.C.) Symbol VRWM VPT VSB IR Min 3.0 2.8 - Typ - Max 2.8 1 Units V V V µA VC - - 3.9 7 12.5 8.5 15 100 5 V Cj - 70 3.5 pF Steering Diode Characteristics Parameter Reverse Breakdown Voltage IT =10µA, Pin 3 to 2 Reverse Leakage Current VRWM = 2.8V, T =25°C, Pin 3 to 2 Forward Voltage IF =1A, Pin 2 to 3 Symbol VBRR IBRR VF Min 40 Typ - Max - Units V - - 1 2 µA V WEITRON http://www.weitron.com.tw 2/7 19-Apr-07 SLVU2.8 Fig.1 Peak Pulse Power VS Pulse Time Electrical Parameter Symbol IPP VC VRWM IR VSB ISB VPT IPT VBRR IBRR Parameter Peak Pulse Current Clamping Voltage @ IPP Reverse Stand-Off Voltage Reverse Leakage Current @ VRWM Snap-Back Voltage @ ISB Snap-Back Current Punch-Through Voltage Punch-Through Current Reverse Breakdown Voltage @ IBRR Reverse Breakdown Current Fig.2 SLVU2.8 IV Characteristic Curve Typical Characteristics Fig.3 Pulse Waveform Fig.4 Power Derating Curve 19-Apr-07 WEITRON http://www.weitron.com.tw 3/7 SLVU2.8 Fig.5 Clamping Voltage vs Peak Pulse Current Fig.6 Forward Voltage vs Forward Current Fig.7 Reverse Voltage vs Capacitance Fig.8 Insertion Loss S21 WEITRON http://www.weitron.com.tw 4/7 19-Apr-07 SLVU2.8 Application Note The SLVU2.8 is ideal for providing protection for electronic equipment that is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT) and tertiary lightning effects. This product is offered in a unidirectional configuration and provides both commonmode or differential-mode protection. Unidirectional Common-Mode Protection (Fig.9) The SLVU2.8 provides one line of unidirectional protection in a common-mode configuration as depicted in figure 9. Circuit connectivity is as follows: Line 1 is connected to Pin 3 Pins 1 and 2 are connected to ground Fig.9 Bidirectional Common-Mode Protection (Fig.10) Two SLVU2.8 devices provide one line of bidirectional protection in a common-mode configuration as depicted in fig.10 Circuit connectivity is as follows: * Line 1 is connected to Pin1 of Device 1 & Pin 2 of Device 2 * Pin 2 of Device 1 and Pin 1 of Device 2 are connected to ground * Pin 3 of both devices is not connected Fig.10 Bidirectional Differential-Mode Protection (Fig.11) Two SLVU2.8 devices provide up to two lines of bidrectional protection in a differenitalmode configuration as depicted in fig.11 Circuit connectivity is as follows: * Line 1 is connected to Pin1 of Device 1 & Pin 2 of Device 2 * Line 2 is connected to Pin 2 of Device 1 & Pin 1 of Device 2 Fig.11 Circuit Board Layout Protection Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: * The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. * The path length between the TVS device and the protected line should be minimized. * All conductive loops including power and ground loops should be minimized. * The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. * Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. WEITRON http://www.weitron.com.tw 5/7 19-Apr-07 SLVU2.8 Typical Applications SLVU2.8 SLVU2.8 Fig12. 10/100 Ethernet Protection Circuit SLVU2.8 SLVU2.8 Fig13. 10/100 Ethernet “Enhanced” Lightning Protection Circuit WEITRON http://www.weitron.com.tw 6/7 19-Apr-07 SLVU2.8 SOT-23 Outline Dimensions A Unit:mm TOP V I EW B C E G H D K J L M Dim A B C D E G H J K L M Min 0 .3 5 1 .1 9 2 .1 0 0 .8 5 0 .4 6 1 .7 0 2 .7 0 0 .0 1 0 .8 9 0 .3 0 0 . 0 76 Max 0 .5 1 1 .4 0 3 .0 0 1 .0 5 1 .0 0 2 .1 0 3 .1 0 0 .1 3 1 .1 0 0 .6 1 0 .2 5 WEITRON http://www.weitron.com.tw 7/7 19-Apr-07