WT-Z106P-4-14
Zener Diode Chips for ESD Protection
1. Feature:
1-1 Silicon Zener diode chips for electrostatic discharge(ESD) protection application 1-2 This specification applies to P-Type silicon Zener diode chipDevice NO:WT-Z106P-4-14
2. Structure:
2-1 Planar type: Silicon Diode 2-2 Electrodes: Top side:Aluminum Alloy(Anode). Back side:Gold Layer(Cathode).
3. Size:
3-1. *Chip size : 6.88 mils x 6.88 mils (175µm x 17.5µm ). 3-2. Chip thickness : 3.3 ± 0.6 mils (85 ± 15µm ). 3-3. Active area : 4.1 mils x 4.1 mils (105µm x 105µm). 3-4. Bonding pad : 4.5 mils x 4.5 mils (115µm x 115µm) . 3-5. Pattern drawing : Refer to the attached drawing.
* Including scribing line. The chip size is about 5.9mil(0.150mm) after dicing.
4. Electrical Characteristics (Ta=25ºC)
Parameter
Zener Voltage
Symbol
Condition
IZ=5mA
Min. 12.5 -
Typ. -
Max. 15.5 1.2
Unit V V nA
VZ
Vf
Forward Voltage Reverse Leakage Current Electrostatic Discharge
IF=20mA
IR
VR=10V HBM MIL-STD 883
-
-
100
ESD
8.0
-
-
KV
5. Drawing:
Bonding pad
P
Top side
N -sub
Back side
WEITRON TECHNOLOGY CO., LTD. TEL:886-2-29148158 FAX:886-2-29106796 Http://www.weitron.com.tw
25-Jan-07
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