WTN9575
Surface Mount P-Channel Enhancement Mode Power MOSFET
P b Lead(Pb)-Free
2,4 DRAIN
DRAIN CURRENT -4.0 AMPERES DRAIN SOURCE VOLTAGE -60 VOLTAGE
1 GATE
Features:
* Super high dense cell design for low RDS(ON) RDS(ON) < 90m @ VGS = -10V * Simple Drive Requirement * Lower On-Resistance * Fast Switching
3 SOURCE
1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
4 1
2
3
SOT-223
Maximum Ratings (TA=25°C Unless Otherwise Specified)
Rating Drain-Source Voltage Gate-Source Voltage Continuous Drain Current3 ,VGS@10V(TA=25°C) ,VGS@10V(TA=70°C) Pulsed Drain Current 1 Total Power Dissipation(T A=25°C) Maximum Junction-ambient 3 Operating Junction Temperature Range Storage Temperature Range Symbol VDS VGS ID IDM PD RθJA TJ Tstg Value -60 ±25 -4.0 -3.2 -20 3.0 45 +150 -55 ~ +150 Unit V V A A W °C/W °C °C
Device Marking
WTN9575 = 9575
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Electrical Characteristics (TA = 25°C Unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Static
Drain-Source Breakdown Voltage VGS = 0, ID = -250µA Gate-Source Threshold Voltage VDS = VGS, ID = -250µA Gate-Source Leakage Current VGS = ± 25V Drain-Source Leakage Current(Tj=25°C) VDS = -60A, VGS = 0 Drain-Source Leakage Current(Tj=70°C) VDS = -48V, VGS = 0 Drain-Source On-Resistance2 VGS = -10A, ID = -4.0A VDS = -4.5A, ID = -3.0A Forward Transconductance VDS = -10A, ID = -4.0A V(BR)DSS VGS(Th) IGSS -60 -1.0 RDS(ON) gfs 7 -3.0 ±100 -1 -25 90 120 m S V V nA
IDSS
A
Dynamic
Input Capacitance VGS = 0V, VDS = -25V, f = 1.0MHz Output Capacitance VGS = 0V, VDS = -25V, f = 1.0MHz Reverse Transfer Capacitance VGS = 0V, VDS = -25V, f = 1.0MHz Ciss Coss Crss 1745 165 125 2790 pF
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Switching
Turn-on Delay Time2 VDS=-30V,VGS=-10V,ID=-1A,R D=30 ,RG=3.3 Rise Time VDS=-30V,VGS=-10V,ID=-1A,R D=30 ,RG=3.3 Turn-o Delay Time VDS=-30V,VGS=-10V,ID=-1A,R D=30 ,RG=3.3 Fall Time VDS=-30V,VGS=-10V,ID=-1A,R D=30 ,RG=3.3 Total Gate Charge2 VDS=-48V,VGS=-4.5V,ID=-4.0A Gate-Source Charge VDS=-48V,VGS=-4.5V,ID=-4.0A Gate-Drain Change VDS=-48V,VGS=-4.5V,ID=-4.0A td(on) 12 5 68 32 18 5.0 7.0 ns 28 nC
tr
td(o )
tf
Qg Qgs Qgd
Source-Drain Diode Characteristics
Forward On Voltage2 VGS=0V, IS=-2.0A Reverse Recovery Time VGS=0V, IS=-4.0A, dl/dt=100A/ s Reverse Recovery Charge VGS=0V, IS=-4.0A, dl/dt=100A/ s VSD Trr Qrr 56 146 -1.2 V ns nC
Note: 1. Pulse width limited by max, junction temperature. 2. Pulse width ≤ 300 s, duty cycle ≤ 2%. 3. Surface mounted on 1 in2 copper pad of FR4 board; 125°C/W when mounted on Min, copper pad.
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Characteristics Curve
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Duty factor = 0.5 0.2
0.1
0.05 0.02 0.01
PDM
t T
Single pulse
Duty factor = t / T Peak Tj=P DM x R θ ju + Tu Rθ ja =135°C / W
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SOT-223 Outline Dimensions
unit:mm
A F
DIM
4
S
1
2
3
B
L
D G C H M K J
A B C D F G H J K L M S
MILLIMETERS MIN MAX
6.30 3.30 1.50 0.60 2.90 2.20 0.020 0.24 1.50 0.85 0 6.70
6.70 3.70 1.75 0.89 3.20 2.40 0.100 0.35 2.00 1.05 10 7.30
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