ISD1750XYR

PRELIMINARY ISD1700 Series Multi-Message Single-Chip Voice Record & Playback Devices Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES TABLE OF CONTENTS 1 2 3 4 5 6 GENERAL DESCRIPTION ..............................................................................................................3 FEATURES......................................................................................................................................4 BLOCK DIAGRAM...........................................................................................................................5 PINOUT CONFIGURATION............................................................................................................6 PIN DESCRIPTION .........................................................................................................................7 MODES OF OPERATIONS .............................................................................................................8 6.1 Standalone (Push-Button) Mode .............................................................................................8 6.2 SPI Mode .................................................................................................................................8 7 TIMING DIAGRAMS ........................................................................................................................8 7.1 Standalone Operation ..............................................................................................................8 7.2 SPI Operation.........................................................................................................................12 8 9 ABSOLUTE MAXIMUM RATINGS ................................................................................................13 8.1 Operating Conditions .............................................................................................................13 ELECTRICAL CHARACTERISTICS .............................................................................................14 9.1 DC Parameters ......................................................................................................................14 9.2 AC Parameters.......................................................................................................................15 10 11 TYPICAL APPLICATION CIRCUITS.............................................................................................16 10.1 Good Audio Design Practices ................................................................................................18 PACKAGING .................................................................................................................................19 11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19 11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20 11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21 11.4 Die Information.......................................................................................................................21 12 13 ORDERING INFORMATION .........................................................................................................22 VERSION HISTORY......................................................................................................................23 -2- ISD1700 SERIES 1 GENERAL DESCRIPTION The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multimessage voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications. The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, antialiasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output. The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as “Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc. Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction. Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a single-ended current or voltage output to drive an external amplifier. While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed. In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products. Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or Representatives to verify current or future specifications. Also refer to the website for any related application notes. -3- Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 2 FEATURES Integrated message management systems for single-chip, push-button applications o REC : level-trigger for recording o PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially o ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages o FWD : edge-trigger to advance to the next message or fast message scan during the playback o VOL : 8 levels output volume control o RDY INT : ready or busy status indication o RESET : return to the default state o Automatic power-down after each operation cycle Selectable sampling frequency controlled by an external oscillator resistor Sampling Frequency Rosc 12 kHz 53 kΩ 8 kHz 80 kΩ 6.4 kHz 100 kΩ 5.3 kHz 120 kΩ 4 kHz 160 kΩ Selectable message duration o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen Sample Freq. ISD1730 20 secs 12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz 30 secs 37 secs 45 secs 60 secs ISD1740 26 secs 40 secs 50 secs 60 secs 80 secs ISD1750 33 secs 50 secs 62 secs 75 secs 100 secs ISD1760 40 secs 60 secs 75 secs 90 secs 120 secs ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240 60 secs 80 secs 100 secs 120 secs 140 secs 160 secs 90 secs 112 secs 135 secs 180 secs 120 secs 150 secs 181 secs 240 secs 150 secs 187 secs 226 secs 300 secs 180 secs 225 secs 271 secs 360 secs 210 secs 262 secs 317 secs 420 secs 240 secs 300 secs 362 secs 480 secs Message and operation indicators o Four customizable Sound Effects (SEs) for audible indication o Optional vAlert (voiceAlert) to indicate the presence of new messages o LED: stay on during recording, blink during playback, forward and erase operations Dual operating modes o Standalone mode: Integrated message management techniques Automatic power-down after each operation cycle o SPI mode: Fully user selectable and controllable options via APC register and various SPI commands Two individual input channels o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through Dual output channels o Differential PWM Class D speaker outputs directly drives an 8 Ω speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier ChipCorder standard features o High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage o 100-year message retention (typical) o 100,000 record cycles (typical) -4- ISD1700 SERIES Temperature options: o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units) o Industrial: -40°C to +85°C (packaged units) Packaging types: available in die, PDIP, SOIC and TSOP Package option: Lead-free packaged units 3 BLOCK DIAGRAM ROSC Internal Clock Timing Sampling Clock AnaIn AnaIn Amp AntiAliasing Filter MUX Amp AUD / AUX Nonvolatile Multi-Level Storage Array Smoothing Filter Volume Control SP+ Amp SP- MIC+ MICAGC AGC Amp Automatic Gain Control Power Conditioning Device Control SPI Interface VCCA VSSA VCCP VSSP1 VSSP2 VSSD VCCD REC PLAY ERASE FWD FT RESET VOL INT/RDY LED SS SCLK MOSI MISO -5- Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 4 PINOUT CONFIGURATION Refer to Design Guide for details before performing any design or PCB layout. V CCD LED RESET MISO MOSI SCLK SS V SSA AnaIn MIC+ MICV SSP2 SPV CCP V SSD INT / RDY FWD ERASE REC PLAY ISD1700 FT V CCA R OSC VOL AGC AUD / AUX V SSP1 Sp+ SOIC / PDIP V SSA AnaIn MIC+ MICV SSP2 SPV CCP Sp+ V SSP1 AUD/AUX AGC VOL R OSC V CCA ISD1700 SS SCLK MOSI MISO RESET LED V CCD V SSD INT / RDY FWD ERASE REC PLAY FT T SOP -6- ISD1700 SERIES 5 PIN DESCRIPTION Refer to Design Guide for details before performing any design or PCB layout. PIN NAME VCCD LED RESET FUNCTIONS Digital Power Supply: Power supply for digital circuitry. LED: An LED output. RESET: When active, the device enters into a known state. Master In Slave Out: Data is shifted out on the falling edge of SCLK. When the SPI is inactive ( SS = high), it’s tri-state. Master Out Slave In: Data input of the SPI interface when ISD1700 is a slave. Data is latched into the device on the rising edge of SCLK. Serial Clock: Clock of the SPI interface. Slave Select: Selects as a slave device and enables the SPI interface. Analog Ground: Ground path for analog circuitry. AnaIn: Auxiliary analog input to the device for recording or feed-through. MIC+: Non-inverting input of the differential microphone signal. MIC-: Inverting input of the differential microphone signal. Ground: Ground path for negative PWM speaker drive. SP-: The negative Class D PWM speaker output. Power Supply for PWM Speaker Driver: Power for PWM speaker drive. SP+: The positive Class D PWM speaker output. Ground: Ground path for positive PWM speaker drive. Auxiliary Output: Either an AUD (current) or AUX (voltage) output. Automatic Gain Control (AGC): The AGC adjusts the gain of the microphone preamplifier circuitry. Volume: This control has 8 levels of volume adjustment. Oscillator Resistor: A resistor determines the sample frequency of the device, which sets the duration. Analog Power Supply. Power supply for analog circuitry. Feed-through: Enable the feed-through path for AnaIn signal to the outputs. Playback: Plays the recorded message individually, or plays messages sequential in a looping mode. Record: When active, starts recording message. Erase: When active, can erase individual message or do global erase. Forward: Advances to the next message from the current location. An open drain output. Can review ready or interrupt status. Digital Ground: Ground path for digital circuitry Publication Release Date: January 23, 2007 Revision 1.3-S2 MISO MOSI SCLK SS VSSA AnaIn MIC+ MICVSSP2 SPVCCP SP+ VSSP1 AUD/AUX AGC VOL ROSC VCCA FT PLAY REC ERASE FWD RDY INT VSSD -7- ISD1700 SERIES 6 MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode. 6.1 STANDALONE (PUSH-BUTTON) MODE One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a desired operation. As completed, the device automatically enters into the power-down state. 6.2 SPI MODE In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI commands. For technical details, please refer to the design guide. 7 TIMING DIAGRAMS The following estimated timing diagrams are not in proper scale. 7.1 BASIC OPERATION Tr Tf REC TDeb RDY TSc1 TRU TER TRD TSet1 LED Mic+/-, AnaIn Figure 12.1: Record Operation with No Sound Effect -8- ISD1700 SERIES Tr PLAY TDeb RDY > TDeb Tf TDeb TRDTSet1 TSc1 TSc2 TRU TLH LED TCyc Sp+, Sp- Figure 12.2: Start and Stop Playback Operation Tr ERASE TDeb RDY > TDeb Tf TRD TSc1 TSc2 TE LED TLS2 TSc2 Figure 12.3: Single Erase Operation with No Sound Effect -9- Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES Tr FWD TDeb RDY > T Deb Tf TRD TSc1 TSc2 LED TLS1 or T LS2 Figure 12.4: Forward Operation with No Sound Effect Tr ERASE TDeb RDY TSc1 TSc2 TGE1 or (TE + TLS2 or TSE2) 3x(T LS1 or TSE1) TGE2 LED TLS4 or TSE4 Tf TRD Sp+, SpNote: If SEs are recorded, then Sp+/- will have output. Figure 12.5: Global Erase Operation with or without Sound Effects - 10 - ISD1700 SERIES Tr RESET TReset RDY Tf TSet2 Device returns to Power Down state LED Figure 12.6: Reset Operation Tr PLAY TDeb RDY > T Deb Tf TRD TSc1 TSc2 TRU TLH LED TRU TCyc TRD AUD Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output - 11 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 7.2 SPI OPERATION T SSH TSSmin SS TSSS T SCKlow TSCKhi SCLK TDIS TDIH MOSI T PD (TRISTATE) LSB MSB TDF MISO LSB MSB Figure 12.8: SPI Operation PARAMETER SYMBOL MIN TYP MAX UNITS SS Setup Time TSSS TSSH TDIS TDIH TPD TDF TSSmin TSCKhi TSCKlow F0 500 500 200 200 500 500 1 400 400 1,000 50 nsec nsec nsec nsec nsec nsec µsec nsec nsec KHz msec SS Hold Time Data in Setup Time Data in Hold Time Output Delay Output Delay to HighZ SS HIGH SCLK High Time SCLK Low Time CLK Frequency Power-Up Delay Notes: [1] [1] TPUD The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for slower sampling frequency. - 12 - ISD1700 SERIES 8 ABSOLUTE MAXIMUM RATINGS ABSOLUTE MAXIMUM RATINGS (DIE) [1] CONDITIONS Junction temperature Storage temperature range Voltage Applied to any pads Power supply voltage to ground potential 0 VALUES 150 C -650C to +1500C (VSS - 0.3V) to (VCC + 0.3V) -0.3V to +7.0V ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) [1] CONDITIONS Junction temperature Storage temperature range Voltage Applied to any pins Voltage applied to any pin (Input current limited to +/-20 mA) Power supply voltage to ground potential [1] VALUES 150 C -650C to +1500C (VSS - 0.3V) to (VCC + 0.3V) (VSS – 1.0V) to (VCC + 1.0V) -0.3V to +7.0V 0 Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions. 8.1 OPERATING CONDITIONS OPERATING CONDITIONS (DIE) CONDITIONS Operating temperature range Supply voltage (VCC) [1] Ground voltage (VSS) [2] Input voltage (VCC) [1] Voltage applied to any pins VALUES 0°C to +50°C +2.4 V to +5.5 V 0V 0 V to 5.5 V (VSS –0.3 V) to (VCC +0.3 V) OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS Operating temperature range (Case temperature) Supply voltage (VDD) [1] Ground voltage (VSS) [2] Input voltage (VDD) [1] Voltage applied to any pins [1] [2] VALUES -40°C to +85°C +2.4V to +5.5V 0V 0V to 5.5V (VSS –0.3V) to (VDD +0.3V) VCC = VCCA = VCCD= VCCP VSS = VSSA = VSSD = VSSP1 VSSP2 - 13 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 9 ELECTRICAL CHARACTERISTICS 9.1 DC PARAMETERS PARAMETER Supply Voltage Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Record Current Playback Current Erase Current Standby Current Input Leakage Current Input Current Low Preamp Input Impedance AnaIn Input Impedance MIC Differential Input AnaIn Input Voltage Gain from MIC to SP+/Speaker Output Load AUX Output Load Speaker Output Power SYMBOL VDD VIL VIH VOL VOH IDD_Record IDD_Playback IDD_Erase ISB IILPD1 IILPD2 RMIC+,RMICRAnaIn VIN1 VIN2 AMSP RSPK RAux Pout MIN 2.4 VSS-0.3 0.7xVDD VSS-0.3 0.7xVDD TYP [1] MAX 5.5 0.3xVDD VDD 0.3xVDD VDD UNITS V V V V V mA mA mA µA µA µA kΩ kΩ mV V dB Ω kΩ mW mW mW mW V 1 1.2 -3.0 0 to -28 1 V V mA dB % CONDITIONS 20 20 20 1 -3 7 42 15 6 8 5 670 313 117 49 VDD IOL = 4.0 mA[2] IOH = -1.6 mA[2] VDD = 5.5 V, No load, Sampling freq = 12 kHz [3] [4] 10 ±1 -10 300 1 40 Speaker Output Voltage AUX Output Swing AUX Output DC Level AUD Volume Output Total Harmonic Distortion VOUT1 VOUT2 VOUT3 IAUD AVol THD Force VDD Force VSS , others at Vcc Power-up AGC When active Peak-to-Peak[5] Peak-to-Peak VIN = 15~300 mV, AGC = 4.7 µF, VCC = 2.4V~5.5V Across both Speaker pins When active VDD = 5.5 V 1Vp-p, VDD = 4.4 V 1 kHz sine wave at VDD= 3 V AnaIn. RSPK VDD= 2.4 V = 8 Ω. RSPK = 8Ω (Speaker), Typical buzzer Peak-to-Peak When active VDD =4.5 V, REXT= 390 Ω 8 steps of 4dB each reference to output 15 mV p-p 1 kHz sine wave, Cmessage weighted Notes: [1] [2] [3] [4] [5] Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25°C, unless otherwise stated. LED output during Record operation. VCCA, VCCD and VCCP are connected together. VSSA, VSSP1, VSSP2 and VSSD are connected together. REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at VCCD. Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or MIC- input is recommended no more than 150 mV p-p. - 14 - ISD1700 SERIES 9.2 AC PARAMETERS SYMBOL FS TDur Tr Tf TDeb TRU TRD TSc1 TSc2 TER TLH TLS1 TLS2 TLS3 TLS4 TSE1 TSE2 TSE3 TSE4 TE TGE1 TGE2 TReset TSet1 TSet2 TLErr TCyc MIN 4 TYP [1] Refer to duration table CHARACTERISTIC Sampling Frequency [2] Duration [3] Rising Time Falling Time Debounce Time Ramp Up Time Ramp Down Time Initial Scan Time after power is applied Initial Scan Time from PD state End Recording Time LED High Time LED Flash Time for SE1 LED Flash Time for SE2 LED Flash Time for SE3 LED Flash Time for SE4 SE1 Recorded Duration SE2 Recorded Duration SE3 Recorded Duration SE4 Recorded Duration Erase Time Global Erase Wait Time Global Erase Time RESET Pulse Settle Time Settle Time after Reset LED Error Time LED Cycle frequency Notes: [1] [2] MAX 12 UNITS kHz sec nsec nsec msec msec msec msec msec msec msec sec sec sec sec sec sec sec sec sec sec sec μsec msec msec msec Hz CONDITIONS [2] [4] [3] 100 100 192/FS 128/FS 128/FS DRN/8/FS DRN/16/FS 32/FS 0.5K/FS 3.5K/FS 7.5K/FS 11.5K/FS 15.5K/FS 4K/FS 4K/FS 4K/FS 4K/FS 10MRN/FS 20K/FS 34/FS 1 128/FS 64/FS 27.5K/FS 4 [4] DRN= device row# [4] After a PB operation is run [4] [4] [4] SE1 not recorded [5] SE2 not recorded [5] SE3 not recorded [5] SE4 not recorded [5] [4] [5] [4] [5] [4] [5] [4] [5] MRN=message row # [4] [5] [4] All Fs [4] [4] [4] [4] [5] 1 Pending upon FS Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25°C, unless otherwise stated. Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage ranges. [3] Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges. [4] Vcc=2.4 V~5.5V [5] K = 1024 - 15 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 10 TYPICAL APPLICATION CIRCUITS The following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each design has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc. The below notes apply to the following applications examples: * ** These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values. Please refer to the applications notes or consult Winbond for layout advice. It is important to have a separate path for each ground and power back to the related terminals to minimize the noise. Also, the power supplies should be decoupled as close to the device as possible. Example #1: Recording using microphone input via push-button controls 24 23 25 26 19 22 REC PLAY ERASE FWD VOL FT 3 Reset 0.1μ F vAlert ** VCCA VCCD VCCP VCCA 0.1μ F VCCP * 0.1 μ F * * RESET LED 2 1 KΩ D1 VCCD 1 VSSD 28 VCCA 21 VSSA 8 VCCD 0.1 μF * Vcc Gnd ** VCC 4.7 K Ω 4.7 μ F 4.7 K Ω 7 6 5 4 SS SCLK MOSI MISO MIC+ MIC AnaIn ROSC AGC ISD1700 VCCP 14 VSSP1 16 0.1μF VSSP2 12 SP+ SP- 13 AUD/AUX 17 15 10 0.1 μ F 0.1 μ F 4.7 K Ω Rosc *** 9 20 18 4.7 μ F *** At 8kHz sampling freq, Rosc = 80 K 11 Speaker or Buzzer VCC Speaker AUD VCCD 100 KΩ Optional 8050C 390 Ω AUX INT/RDY 27 0.1 μ F Optional: based upon the applications : Digital ground; : Analog ground; : Ground for SP+; : Ground for SP- - 16 - ISD1700 SERIES Example #2: Recording using AnaIn input via push-button controls 24 23 25 26 19 22 REC PLAY ERASE FWD VOL FT 3 Reset 0.1μ F 1 KΩ D1 vAlert RESET LED 2 VCCD 1 VSSD 28 VCCD 0.1 μF * VCCA 0.1μ F VCCP * 0.1 μ F * ** VCCA VCCD VCCP Vcc ** Gnd 7 6 5 4 SS SCLK MOSI MISO MIC+ MIC AnaIn ROSC AGC VCCA 21 VSSA 8 * ISD1700 VCCP 14 VSSP1 16 0.1μF VSSP2 12 SP+ SP15 13 10 11 0.1μ F Rosc *** 9 20 18 4.7 μ F *** At 8kHz sampling freq, Rosc = 80 K Speaker or Buzzer VCC Speaker AUD/AUX 17 AUD VCCD 100 K Ω Optional 8050C 390 Ω AUX INT/RDY 27 0.1 μ F Optional: based upon the applications : Digital ground; : Analog ground; : Ground for SP+; : Ground for SP- - 17 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES Example #3: Connecting the SPI Interface to a microcontroller 24 23 25 26 19 22 REC PLAY ERASE FWD VOL FT 3 Reset 0.1μ F RESET LED 2 1 KΩ D1 vAlert VCCD 1 VSSD 28 VCCA 21 VSSA 8 VCCD 0.1 μF * VCCA 0.1μ F VCCP * 0.1 μ F * ** VCCA VCCD VCCP Vcc ** Gnd 7 6 To uC SPI 5 4 SS SCLK MOSI MISO MIC+ MIC AnaIn ROSC AGC * ISD1700 VCCP 14 VSSP1 16 0.1μF VSSP2 12 SP+ SP- 13 AUD/AUX 17 15 10 11 0.1μ F Rosc *** 9 20 18 4.7 μ F *** At 8kHz sampling freq, Rosc = 80 K Speaker or Buzzer VCC Speaker AUD VCCD 8050C 390 Ω INT/RDY 27 100 K Ω Optional AUX 0.1 μ F Optional: based upon the applications : Digital ground; : Analog ground; : Ground for SP+; : Ground for SP- 10.1 GOOD AUDIO DESIGN PRACTICES To ensure the highest quality of voice reproduction, it is important to follow good audio design practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites. Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family.pdf Good Audio Design Practices http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf - 18 - ISD1700 SERIES 11 PACKAGING 11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC HD D c e E b θ L L1 A1 A2 A Y Dimension in Inches Dimension in mm Symbol Min. Nom. Max. Min. Nom. Max. 1.20 0.05 0.95 0.17 0.10 11.70 7.90 13.20 0.50 1.00 0.20 0.15 11.80 8.00 13.40 0.55 0.028 0.60 0.80 0.004 3 5 0.00 0 3 0.10 5 0.70 0.15 1.05 0.27 0.21 11.90 8.10 13.60 A A1 A2 b c D E HD e L L1 Y θ 0.047 0.002 0.035 0.007 0.004 0.461 0.311 0.520 0.040 0.008 0.006 0.465 0.315 0.528 0.022 0.020 0.000 0 0.024 0.031 0.006 0.041 0.011 0.008 0.469 0.319 0.536 - 19 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2345 6 7 8 9 10 11 12 13 14 A G C B D E F H Plastic Small Outline Integrated Circuit (SOIC) Dimensions INCHES Min A B C D E F G H Note: 0.400 0.024 0.701 0.097 0.292 0.005 0.014 Nom 0.706 0.101 0.296 0.009 0.016 0.050 0.406 0.032 0.410 0.040 10.16 0.61 Max 0.711 0.104 0.299 0.0115 0.019 Min 17.81 2.46 7.42 0.127 0.35 MILLIMETERS Nom 17.93 2.56 7.52 0.22 0.41 1.27 10.31 0.81 10.41 1.02 Max 18.06 2.64 7.59 0.29 0.48 Lead coplanarity to be within 0.004 inches. - 20 - ISD1700 SERIES 11.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP) Plastic Dual Inline Package (PDIP) (P) Dimensions INCHES Min 1.445 0.065 0.600 0.530 0.015 0.125 0.015 0.055 0.008 0.070 0° Nom 1.450 0.150 0.070 0.540 Max 1.455 0.075 0.625 0.550 0.19 0.135 0.022 0.065 0.012 0.080 15° Min 36.70 1.65 15.24 13.46 0.38 3.18 0.38 1.40 0.20 1.78 0° MILLIMETERS Nom 36.83 3.81 1.78 13.72 Max 36.96 1.91 15.88 13.97 4.83 3.43 0.56 1.65 0.30 2.03 15° A B1 B2 C1 C2 D D1 E F G H J S 0 0.018 0.060 0.100 0.010 0.075 0.46 1.52 2.54 0.25 1.91 11.4 DIE INFORMATION For die info, please contact the local Winbond Sales Representatives. - 21 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES 12 ORDERING INFORMATION Product Number Descriptor Key I17xxxxxxxxx Product Name: I = ISD Product Series: 17 = 1700 Duration: 30 40 50 60 90 : 20 – 60 secs : 26 – 80 secs : 33 – 100 secs : 40 – 120 secs : 60 – 180 secs Package Type: X = Die E = Thin Small Outline Package (TSOP) S= P= Small Outline Integrated Circuit (SOIC) Package Plastic Dual Inline Package (PDIP) Temperature: I = Industrial (-40°C to +85°C) Blank = Commercial • Die (0°C to +50°C) • Package (0°C to +70°C) Lead-Free: Y = Lead-Free Tape & Reel: Blank = None R = Tape & Reel Special Features Field: Blank = None 01 = vAlert 120 : 80 – 240 secs 150 : 100 – 300 secs 180 : 120 – 360 secs 210 : 140 – 420 secs 240 : 160 – 480 secs When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond Sales Representatives for any questions and the availability. For the latest product information, please contact the Winbond Sales/Rep or access Winbond’s worldwide web site at http://www.winbond-usa.com - 22 - ISD1700 SERIES 13 VERSION HISTORY VERSION 1.3-S 1.3-S1 1.3-S2 DATE Sep 2006 Nov 2006 Jan 2007 Initial version Revise Pinout Configuration & Pin Description sections Revise Rosc resistor value Revise Selectable Message Duration section Update standby current, sampling frequency & duration parameters DESCRIPTION - 23 - Publication Release Date: January 23, 2007 Revision 1.3-S2 ISD1700 SERIES Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Winbond has been advised of the possibility of such damages. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified. The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash®. This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder® product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice. Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners. - 24 -