W241024AI-15

W241024A 128K × 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W241024A is a high speed, low power CMOS static RAM organized as 131072 × 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES • • High speed access time: 12/15/20 nS (max.) Low power consumption: − Active: 600 mW (typ.) Single +5V power supply Fully static operation • • • All inputs and outputs directly TTL compatible Three-state outputs Available packages: 32-pin 300 mil SOJ, 400 mil SOJ, skinny DIP and standard type one TSOP (8 mm × 20 mm), and small type one TSOP (8 mm × 13.4 mm) • • PIN CONFIGURATIONS BLOCK DIAGRAM VDD VSS A0 . . A16 NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O 1 I/O 2 I/O 3 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDD A15 CS2 WE A13 A8 A9 A11 OE A1 0 CS1 I/O 8 I/O 7 I/O 6 I/O 5 I/O 4 DECODER CORE ARRAY CS2 CS1 OE WE CONTROL DATA I/O I/O1 . . I/O8 PIN DESCRIPTION SYMBOL A0−A16 I/O1−I/O8 CS1 , CS2 WE OE VDD VSS NC DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Inputs Write Enable Input Output Enable Input Power Supply Ground No Connection A11 A9 A8 A13 WE CS2 A15 VDD NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32-pin TSOP 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 V SS DQ3 DQ2 DQ1 A0 A1 A2 A3 -1- Publication Release Date: July 1998 Revision A9 W241024A TRUTH TABLE CS1 H X L L L CS2 X L H H H OE X X H L X WE X X H H L MODE Not Selected Not Selected Output Disable Read Write I/O1− I/O8 High Z High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 ISB, ISB1 IDD IDD IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W °C °C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C) PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current SYM. VIL VIH ILI ILO TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD CS1 = VIH (min.) or CS2 = VIL (max.) or OE = VIH (min.) or WE = VIL (max.) IOL = +8.0 mA IOH = -4.0 mA 12 CS1 = VIL (max.), and CS2 = VIH (min.) I/O = 0 mA, Cycle = min. Duty = 100% 15 20 MIN. -0.5 +2.2 -10 -10 TYP. - MAX. +0.8 VDD +0.5 +10 +10 UNIT V V µA µA Output Low Voltage Output High Voltage Operating Power Supply Current VOL VOH IDD 2.4 - - 0.4 200 200 170 30 10 V V mA mA mA mA mA Standby Power Supply Current ISB ISB1 CS1 = VIH (min.), or CS2 = VIL (max.) Cycle = min. CS1 ≥ VDD -0.2V or CS2 ≤ 0.2V Note: Typical characteristics are at VDD = 5V, TA = 25° C. -2- W241024A CAPACITANCE (VDD = 5V, TA = 25° C, f = 1 MHz) PARAMETER Input Capacitance Input/Output Capacitance SYM. CIN CI/O CONDITIONS VIN = 0V VOUT = 0V MAX. 8 10 UNIT pF pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS AC Test Loads and Waveform R1 480 ohm R1 480 ohm 5V OUTPUT OUTPUT 30 pF Including Jig and Scope R2 255 ohm 5pF Including Jig and Scope R2 255 ohm 5V (For T LZ1, TCLZ2, TOLZ, TCHZ1, TCHZ2, TOHZ, TWHZ, TOW ) C 3.0V 90% 10% 5 nS 10% 90% 0V 5 nS -3- Publication Release Date: July 1998 Revision A9 W241024A AC Characteristics, continued (VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C) Read Cycle PARAMETER Read Cycle Time Address Access Time Chip Select Access Time CS1 SYM. TRC TAA TACS1 TACS2 TAOE CS1 W241024A-12 W241024A-15 W241024A-20 UNIT nS nS nS nS nS nS nS nS nS nS nS nS MIN. 12 3 3 0 3 MAX. 12 12 12 6 6 6 6 - MIN. 15 3 3 0 3 MAX. 15 15 15 7 7 7 7 - MIN. 20 3 3 0 3 MAX. 20 20 20 10 10 10 10 - CS2 Output Enable to Output Valid Chip Selection to Output in Low Z TCLZ1* TCLZ2* TOLZ* TCHZ1* TCHZ2* TOHZ* TOH CS2 Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change CS1 CS2 * These parameters are sampled but not 100% tested. Write Cycle PARAMETER Write Cycle Time Chip Selection to End of Write CS1 SYM. TWC TCW1 TCW2 TAW TAS TWP CS1 , WE W241024A-12 W241024A-15 W241024A-20 UNIT nS nS nS nS nS nS nS nS nS nS nS nS nS MIN. 12 10 10 10 0 10 0 0 7 0 0 MAX. 7 7 - MIN. 15 13 13 13 0 10 0 0 9 0 0 MAX. 8 8 - MIN. 20 17 17 17 0 12 0 0 10 0 0 MAX. 10 10 - CS2 Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time TWR1 TWR2 TDW TDH TWHZ* TOHZ* TOW CS2 Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write * These parameters are sampled but not 100% tested. -4- W241024A TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TAA TOH TOH D OUT Read Cycle 2 (Chip Select Controlled) CS1 TACS1 CS2 TACS2 TCHZ2 TCHZ1 TCLZ1 DOUT TCLZ2 Read Cycle 3 (Output Enable Controlled) TRC Address TAA OE TAOE TOLZ CS1 TACS1 TCLZ1 CS2 T ACS2 TCLZ2 DOUT TCHZ2 TOHZ TCHZ1 TOH -5- Publication Release Date: July 1998 Revision A9 W241024A Timing Waveforms, continued Write Cycle 1 ( OE Clock) T WC Address TWR1 OE TCW1 CS1 CS2 TAW WE TAS TOHZ (1, 4) D OUT TCW2 TWR2 TWP TDW D IN TDH Write Cycle 2 ( OE = VIL Fixed) TWC Address T CW1 CS1 TWR1 CS2 TAW WE TAS TCW2 TWR2 T WP TWHZ (1, 4) TOH TOW TDH (2) (3) D OUT TDW D IN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. Dout provides the read data for the next address. 4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- W241024A ORDERING INFORMATION PART NO. ACCESS TIME (nS) 12 15 20 12 15 20 12 15 20 12 15 20 12 15 20 OPERATING CURRENT MAX. (mA) 200 200 170 200 200 170 200 200 170 200 200 170 200 200 170 STANDBY CURRENT MAX. (mA) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 PACKAGE W241024AI-12 W241024AI-15 W241024AI-20 W241024AJ-12 W241024AJ-15 W241024AJ-20 W241024AK-12 W241024AK-15 W241024AK-20 W241024AQ-12 W241024AQ-15 W241024AQ-20 W241024AT-12 W241024AT-15 W241024AT-20 400 mil SOJ 400 mil SOJ 400 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP Small type one TSOP Small type one TSOP Small type one TSOP Standard type one TSOP Standard type one TSOP Standard type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -7- Publication Release Date: July 1998 Revision A9 W241024A PACKAGE DIMENSIONS 32-pin P-DIP Skinny (300 mil) Dimension in Inches Dimension in mm Symbol Min. Nom. Max. 0.200 0.015 0.145 0.016 0.058 0.008 0.150 0.018 0.060 0.010 1.60 0.295 0.286 0.090 0.120 0 0.430 0.450 0.315 0.290 0.100 0.130 0.155 0.022 0.064 0.014 1.62 0.335 0.294 0.110 0.140 15 0.470 0.065 Min. Nom. Max. 5.08 0.38 3.68 0.41 1.47 0.20 3.81 0.46 1.52 0.25 40.64 7.49 7.26 2.29 3.05 0° 10.92 11.43 8.00 7.36 2.54 3.30 3.94 0.56 1.63 0.36 41.15 8.50 7.46 2.79 3.56 15° 11.94 1.65 D 32 17 E1 1 16 A A1 A2 B B1 c D E E1 e1 L a eA S Notes: S E Base Plane A A2 L B1 B e1 a A1 c Mounting Plane eA 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. 32-pin SOJ (300 mil) Dimension in Inches Dimension in mm 32 17 Symbol A A1 A2 E He Min. __ 0.020 0.095 0.026 0.016 0.008 0.815 0.295 0.044 Nom. __ __ 0.100 0.028 0.018 0.010 0.825 0.300 0.050 0.267 0.335 __ __ __ __ Max. 0.140 __ 0.105 0.032 0.022 0.014 0.835 0.305 0.056 0.287 0.345 __ 0.045 0.004 10 Min. __ 0.508 2.413 0.660 0.406 0.203 20.701 7.493 1.118 6.274 8.255 2.032 __ __ 0° Nom. __ __ 2.540 0.711 0.457 0.254 20.955 7.620 1.270 6.782 8.509 __ __ __ __ Max. 3.556 __ 2.667 0.813 0.559 0.356 21.209 7.747 1.422 7.290 8.763 __ 1.143 0.102 10° B b c D E e 1 16 e He 1 0.247 0.325 0.080 __ __ 0 L S Y θ D A2 A L c e1 S B b e A1 θ Y Seating Plane -8- W241024A Package Dimensions, continued 32-pin SOJ (400 mil) Dimension in inches Dimension in mm Min. 3.33 0.635 Nom. 3.51 Max. 3.68 Symbol 32 17 Min. Nom. Max. 0.145 E HE 1 16 D c A2 A s Seating Plane y b b1 e A1 L e1 A A1 A2 b1 b c D E e e1 HE L S y θ Notes: 0.131 0.138 0.025 0.105 0.110 0.026 0.028 0.016 0.018 0.006 0.008 0.820 0.825 0.395 0.400 0.115 0.032 0.020 0.011 0.830 0.405 0.056 0.380 0.445 2.67 0.66 0.41 0.15 20.83 10.03 1.12 9.15 11.05 2.08 2.79 0.71 0.46 0.20 2.91 0.81 0.51 0.28 20.96 21.08 10.16 10.29 1.27 9.40 11.18 1.42 9.65 11.31 0.044 0.050 0.360 0.37 0.435 0.082 0.440 0.045 0.004 -5 2 6 -5 2 1.14 0.10 6 1. Dimension D Max & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec. should be based on final visual inspection spec. 32-pin Standard Type One TSOP HD Symbol Dimension in Inches Min. Nom. Max. 0.047 0.006 0.041 0.009 0.007 Dimension in mm Min. Nom. Max. 1.20 0.15 1.05 0.23 0.17 18.50 8.10 20.20 D c A A1 A2 __ 0.002 0.037 0.007 __ __ 0.039 0.008 __ 0.05 0.95 0.17 0.12 __ __ 1.00 0.20 0.15 M e E b c D E HD e L L1 A A2 0.005 0.006 0.720 0.311 0.780 0.724 0.315 0.787 0.020 0.020 0.031 0.10(0.004) 0.728 18.30 18.40 0.319 7.90 8.00 20.00 0.50 0.50 0.80 b 0.795 19.80 __ 0.016 __ 0.024 __ 0.40 __ 0.60 __ 0.000 1 __ 0.004 5 __ 0.00 1 __ 0.10 5 Y __ 3 __ 3 θ L L1 A1 θ Y Note: Controlling dimension: Millimeter -9- Publication Release Date: July 1998 Revision A9 W241024A Package Dimensions, continued 32-pin Small Type One TSOP HD Symbol Dimension in Inches Min. Nom. Max. 0.049 0.002 0.006 Dimension in mm Min. Nom. Max. 1.25 0.05 0.95 0.17 1.00 0.20 0.15 0.15 1.05 0.27 0.16 D c 1 A A1 A2 b c D E HD e L L1 e E 0.037 0.039 0.041 0.007 0.008 0.009 0.0056 0.0059 0.0062 0.14 0.461 b 0.465 0.469 11.70 11.80 11.90 7.90 8.00 8.10 0.311 0.315 0.319 0.520 0.528 0.536 13.20 13.40 13.60 0.020 0.012 0.020 0.028 0.027 0.000 0 3 0.004 5 0.30 0.675 0.00 0 3 0.10 5 0.50 0.50 0.70 θ A A 2 Y Y L L1 A1 θ Controlling dimension: Millimeters - 10 - W241024A VERSION HISTORY VERSION A9 DATE Jul. 1998 PAGE 1, 7, 10 DESCRIPTION Add small type one TSOP (8 mm × 13.4 mm) package Headquarters No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006 Winbond Electronics (H.K.) Ltd. Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 Note: All data and specifications are subject to change without notice. - 11 - Publication Release Date: July 1998 Revision A9