W25B40A

厂商：
WINBOND(华邦)
封装：
描述：
W25B40A - 4M-BIT SERIAL FLASH MEMORY WITH BOOT AND PARAMETER SECTORS - Winbond

数据手册：

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数据手册
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W25B40A 数据手册

W25B40/W25B40A 4M-BIT SERIAL FLASH MEMORY WITH BOOT AND PARAMETER SECTORS Formally NexFlash NX25B40 The Winbond W25B40 / W25B40A is fully compatible with the previous NexFlash NX25B40 Serial Flash memory. -1- Publication Release Date: January 6, 2006 Revision M W25B40/W25B40A Table of Contents1. 2. 3. 4. GENERAL DESCRIPTION ......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION ............................................................................................................... 5 PIN DESCRIPTION..................................................................................................................... 5 4.1 4.2 4.3 4.4 4.5 4.6 4.7 5. 6. 7. Package Types ............................................................................................................... 5 Chip Select (/CS) ............................................................................................................ 5 Serial Data Output (DO) ................................................................................................. 6 Write Protect (/WP)......................................................................................................... 6 Hold (/HOLD) .................................................................................................................. 6 Serial Clock (CLK) .......................................................................................................... 6 Serial Data Input (DI) ...................................................................................................... 6 BLOCK DIAGRAM (BOTTOM BOOT) ........................................................................................ 7 BLOCK DIAGRAM (TOP BOOT-SPECIAL ORDER) ................................................................. 8 FUNCTIONAL DESCRIPTION ................................................................................................... 9 7.1 SPI OPERATIONS ......................................................................................................... 9 7.1.1 7.1.2 SPI Modes ........................................................................................................................9 Hold Function ...................................................................................................................9 Write Protect Features......................................................................................................9 Write Protection using Power-down instruction...............................................................10 7.2 WRITE PROTECTION.................................................................................................... 9 7.2.1 7.2.2 8. CONTROL AND STATUS REGISTERS................................................................................... 10 8.1 STATUS REGISTER .................................................................................................... 10 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.1.6 8.1.7 BUSY..............................................................................................................................10 Write Enable Latch (WEL) ..............................................................................................10 Block Protect Bits (BP2, BP1, BP0)................................................................................11 Reserved Bits .................................................................................................................11 Status Register Protect (SRP) ........................................................................................11 Write Protection Operation - Bottom Boot Sector Organization ......................................12 Write Protection Operation - Top Boot Sector Organization (Special Order) ..................12 Manufacturer and Device Identification...........................................................................13 Instruction Set (1).............................................................................................................13 Write Disable (04h).........................................................................................................14 Write Enable (06h)..........................................................................................................14 Read Status Register (05h) ............................................................................................15 Write Status Register (01h) ............................................................................................16 8.2 INSTRUCTIONS........................................................................................................... 12 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 8.2.6 -2- W25B40/W25B40A 8.2.7 8.2.8 8.2.9 8.2.10 8.2.11 8.2.12 8.2.13 8.2.14 Read Data (03h) .............................................................................................................17 Fast Read (0Bh) .............................................................................................................18 Page Program (02h) .......................................................................................................19 Sector Erase (D8h).......................................................................................................20 Chip Erase (C7h)..........................................................................................................21 Power-down (B9h) ........................................................................................................22 Release Power-down / Device ID (ABh) .......................................................................23 Read Manufacturer / Device ID (90h) ...........................................................................25 9. ELECTRICAL CHARACTERISTICS......................................................................................... 26 9.1 Absolute Maximum Ratings (1) .................................................................................... 26 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 9.10 Operating Ranges......................................................................................................... 26 Power-up Timing and Write Inhibit Threshold .............................................................. 27 DC Electrical Characteristics (Preliminary) (1) ............................................................. 28 AC Measurement Conditions........................................................................................ 29 AC Electrical Characteristics (Preliminary)................................................................... 30 AC Electrical Characteristics (Preliminary) cont’d ........................................................ 31 Serial Output Timing ..................................................................................................... 32 Input Timing .................................................................................................................. 32 Hold Timing................................................................................................................... 32 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 33 10. 11. 12. PACKAGE SPECIFICATION .................................................................................................... 33 10.1 ORDERING INFORMATION .................................................................................................... 34 REVISION HISTORY ................................................................................................................ 35 -3- Publication Release Date: January 6, 2006 Revision M W25B40/W25B40A 1. GENERAL DESCRIPTION The W25B40 / W25B40A is a 4Mb (512KB) Serial Flash Memory with erasable sectors that allows for boot code and parameter storage. The W25B40 / W25B40A is packaged in an 8-pin SOIC 150-mil and is compatible with the standard W25P40 specification with the following exceptions. • The W25B40 / W25B40A has twelve sectors instead of eight including: seven sectors of 64KB, one sector of 32KB, one sector of 16KB, one sector of 8KB and two sectors of 4KB. (see figure 2a and 2b) The W25B40 / W25B40A status register write protect bits (BP2, BP1, and BP0) can protect the boot and parameter sectors. Unlike other Serial Flash devices, that only protect large portions of the memory and typically from the top address down, the W25B40 / W25B40A can protect boot code stored in the small sectors for either bottom or top boot configurations. This feature makes the process of field updates more robust and reliable. (See Write Protection Operation table) The W25B40 / W25B40A Bottom Boot Device ID is 32h instead of 12h as with the 25P40. Optional Top Boot is 42h. • • The Winbond W25B40 / W25B40A is fully compatible with the previous NexFlash NX25B40 Serial Flash memory. 2. FEATURES • W25B40 / W25B40A 4M-bit Serial Flash – 4M-bit /512K-byte (524,288) – 256-bytes per programmable page Compatible with W25P40 with special features – Small Boot and Parameter Sectors – Write protection of Boot/Parameter area Variable Sector Sizes for Boot Code and Parameter Storage – Seven sectors of 64KB – One sector each of 32KB, 16Kb and 8KB – Two sectors of 4KB – Bottom Boot organization (standard) – Top Boot organization (special order) 4-pin SPI Serial Interface – Clock, Chip Select, Data In, Data Out – Easily interfaces to popular microcontrollers – Compatible with SPI Modes 0 and 3 – Optional Hold function for SPI flexibility Low Power Consumption, Wide Temperature Range – Single 2.7 to 3.6V supply – 5mA active current,

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W25B40A

1. 物料型号： - W25B40/W25B40A，这是一个4M-BIT的串行闪存，具有可擦除的扇区，适用于存储启动代码和参数。

2. 器件简介： - W25B40/W25B40A是Winbond公司生产的串行闪存，兼容之前的NexFlash NX25B40。该器件包含512KB的存储空间，分为12个扇区，包括7个64KB扇区、1个32KB扇区、1个16KB扇区、1个8KB扇区和2个4KB扇区。该器件支持底端启动和顶端启动配置，并且可以通过状态寄存器的写保护位保护启动和参数扇区。

3. 引脚分配： - 1. /CS（芯片选择输入） - 2. DO（数据输出） - 3. /WP（写保护输入） - 4. GND（地） - 5. DI（数据输入） - 6. CLK（串行时钟输入） - 7. /HOLD（保持输入） - 8. VCC（电源供电）

4. 参数特性： - 支持SPI模式0和3。 - 具有时钟频率高达40MHz的快速串行数据访问。 - 低功耗，活动电流为5mA，功耗下模式小于1µA。 - 工作温度范围为-40°C至+85°C。

5. 功能详解： - 提供了SPI操作、写保护、控制和状态寄存器、指令集等功能的详细描述。 - 支持页编程、扇区擦除和芯片擦除等操作。 - 具有软件和硬件写保护功能，可以通过/WP引脚和状态寄存器的保护位实现。

6. 应用信息： - 适用于系统有限的引脚、空间和电源的场景。 - 适用于微控制器系统中存储数据、文本或语音。

7. 封装信息： - 标准封装为8引脚塑料SOIC，150-mil体（Winbond封装代码SN）。

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