W25P10

厂商：
WINBOND(华邦)
封装：
描述：
W25P10 - 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI - Winbond

数据手册：

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数据手册
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W25P10 数据手册

W25P10, W25P20 AND W25P40 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI Formally NexFlash NX25P10, NX25P20 and NX25P40 The Winbond W25P10/20/40 are fully compatible with the previous NexFlash NX25P10/20/40 Serial Flash memories. -1- Publication Release Date: November 28, 2005 Revision M W25P10, W25P20 AND W25P40 Table of Contents1. 2. 3. 4. GENERAL DESCRIPTION ......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION ............................................................................................................... 5 PIN DESCRIPTION..................................................................................................................... 5 4.1 4.2 4.3 4.4 4.5 4.6 4.7 5. 6. Package Types ............................................................................................................... 5 Chip Select (/CS) ............................................................................................................ 5 Serial Data Output (DO) ................................................................................................. 6 Write Protect (/WP)......................................................................................................... 6 HOLD (/HOLD) ............................................................................................................... 6 Serial Clock (CLK) .......................................................................................................... 6 Serial Data Input (DI) ...................................................................................................... 6 BLOCK DIAGRAM ...................................................................................................................... 7 FUNCTIONAL DESCRIPTION ................................................................................................... 8 6.1 SPI OPERATIONS ......................................................................................................... 8 6.1.1 6.1.2 SPI Modes........................................................................................................................8 Hold Function ...................................................................................................................8 Write Protect Features......................................................................................................8 6.2 7. WRITE PROTECTION.................................................................................................... 8 6.2.1 CONTROL AND STATUS REGISTERS..................................................................................... 9 7.1 STATUS REGISTER ...................................................................................................... 9 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 BUSY................................................................................................................................9 Write Enable Latch (WEL) ................................................................................................9 Block Protect Bits (BP2, BP1, BP0)................................................................................10 Reserved Bits .................................................................................................................10 Status Register Protect (SRP) ........................................................................................10 Status Register Memory Protection ................................................................................11 Manufacturer and Device Identification...........................................................................12 Instruction Set (1).............................................................................................................12 Write Disable (04h).........................................................................................................13 Write Enable (06h)..........................................................................................................13 Read Status Register (05h) ............................................................................................14 Write Status Register (01h) ............................................................................................15 Read Data (03h) .............................................................................................................16 Fast Read (0Bh) .............................................................................................................17 Page Program (02h) .......................................................................................................18 Sector Erase (D8h).......................................................................................................19 7.2 INSTRUCTIONS........................................................................................................... 11 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 7.2.8 7.2.9 7.2.10 -2- W25P10, W25P20 AND W25P40 7.2.11 7.2.12 7.2.13 7.2.14 Chip Erase (C7h)..........................................................................................................20 Power-down (B9h) ........................................................................................................21 Release Power-down / Device ID (ABh) .......................................................................22 Read Manufacturer / Device ID (90h) ...........................................................................24 8. ELECTRICAL CHARACTERISTICS......................................................................................... 25 8.1 Absolute Maximum Ratings (1) .................................................................................... 25 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 Operating Ranges......................................................................................................... 25 Power-up Timing and Write Inhibit Threshold .............................................................. 26 DC Electrical Characteristics (Preliminary)(1) .............................................................. 27 AC Measurement Conditions........................................................................................ 28 AC Electrical Characteristics ........................................................................................ 29 AC Electrical Characteristics (cont’d) ........................................................................... 30 Serial Output Timing ..................................................................................................... 31 Input Timing .................................................................................................................. 31 Hold Timing................................................................................................................... 31 8-Pin SOIC 150-mil (Winbond Package Code SN) (NexFlash Package Code N) ....... 32 9. 10. 11. PACKAGE SPECIFICATION .................................................................................................... 32 9.1 ORDERING INFORMATION .................................................................................................... 33 REVISION HISTORY ................................................................................................................ 34 -3- Publication Release Date: November 28, 2005 Revision M W25P10, W25P20 AND W25P40 1. GENERAL DESCRIPTION The W25P10 (1M-bit), W25P20 (2M-bit) and W25P40 (4M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving 8-pin SOIC type packages as shown below. Contact Winbond for availability of alternate packages. As part of a family of Serial Flash products, Winbond also provides a compatible migration path to 8M/16M/32M-bit densities. The W25P10/20/40 array is organized into 512/1024/2048 programmable pages of 256-bytes each. A single byte or, up to 256 bytes, can be programmed at a time using the Page Program instruction. Pages are grouped into 2/4/8 erasable sectors of 256 pages (64K-byte) each as shown in figure 2. Both Sector Erase and Chip (full chip) Erase instructions are supported. The Serial Peripheral Interface (SPI) consists of four pins (Serial Clock, Chip Select, Serial Data In and Serial Data Out) that support high speed serial data transfers up to 40MHz. A Hold pin, Write Protect pin and programmable write protect features provide further control flexibility. Additionally, the device can be queried for manufacturer and device ID. Special customer ID (for copy authentication) and factory programming is available, contact Winbond for more information. The Winbond W25P10/20/40 are fully compatible with the previous NexFlash NX25P10/20/40 Serial Flash memories. 2. FEATURES • 1M / 2M / 4M-bit Serial Flash Memories • Family of Serial Flash Memories – W25P10: 1M-bit/128K-byte (131,072) – W25P20: 2M-bit/256K-byte (262,144) – W25P40: 4M-bit/512K-byte (524,288) – 256-bytes per programmable page – Migration path to 8M/16M/32M-bit • 4-pin SPI Serial Interface – Clock, Chip Select, Data In, Data Out – Easily interfaces to popular microcontrollers – Compatible with SPI Modes 0 and 3 – Bottom Boot organization (standard) – Optional Hold function for SPI flexibility • Low Power Consumption, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current, 1µA Power-down (typ) – -40° to +85°C operating range • Fast and Flexible Serial Data Access – 40MHz Fast Read, 33MHz Standard Read – Byte-addressable Read and Program – Auto-increment Read capability – Manufacturer and Device ID • Programming Features – Page program up to 256 bytes

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W25P10

### 物料型号 - W25P10: 1M-bit SPI Flash内存 - W25P20: 2M-bit SPI Flash内存 - W25P40: 4M-bit SPI Flash内存

### 器件简介 W25P10 (1M-bit), W25P20 (2M-bit) 和 W25P40 (4M-bit) 是适用于空间、引脚和功率有限系统的串行Flash存储解决方案。它们适用于代码下载应用以及存储语音、文本和数据。这些设备在2.7V至3.6V的单电源供电下工作，活动时电流消耗低至4mA，掉电模式下为1µA。所有设备均提供节省空间的8引脚SOIC封装。

### 引脚分配 - 1: /CS (Chip Select Input) - 2: DO (Data Output) - 3: /WP (Write Protect Input) - 4: GND (Ground) - 5: DI (Data Input) - 6: CLK (Serial Clock Input) - 7: /HOLD (Hold Input) - 8: VCC (Power Supply)

### 参数特性 - 存储容量：1M-bit、2M-bit、4M-bit - 编程特性：页面编程最多256字节<2ms，扇区擦除(64K-byte)2秒，芯片擦除：3秒(25P10/20)、5秒(25P40) - 数据保持：20年 - 电源电压：2.7V至3.6V - 活动电流：4mA，掉电电流：1µA（典型值） - 工作温度范围：-40°C至+85°C

### 功能详解 - SPI操作：支持SPI模式0和模式3，提供高速串行数据传输，最高40MHz。 - 写保护：软件和硬件写保护，可保护全部或部分内存。 - 低功耗消耗：活动时4mA电流，掉电模式下1µA（典型值）。 - 灵活的串行数据访问：支持40MHz快速读取，33MHz标准读取。 - 封装信息：提供8引脚SOIC 150mil封装。

### 应用信息 适用于需要有限引脚、空间和功率的系统，如基于控制器的串行代码下载、微控制器系统存储数据、文本或语音，以及电池供电和便携式产品。

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