W25Q128BVFIP

W25Q128BVFIP

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q128BVFIP - 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q128BVFIP 数据手册
W25Q128BV 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: April 01, 2011 Revision E W25Q128BV Table of Contents 1. 2. 3. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES ....................................................................................................................................... 5 PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pad Configuration WSON 8x6-mm ...................................................................................... 6 Pad Description WSON 8x6-mm .......................................................................................... 6 Pin Configuration SOIC 300-mil ........................................................................................... 7 Pin Description SOIC 300-mil ............................................................................................... 7 Ball Configuration TFBGA 8x6-mm ...................................................................................... 8 Ball Description TFBGA 8x6-mm ......................................................................................... 8 Chip Select (/CS) .................................................................................................................. 9 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 W rite Protect (/WP) .............................................................................................................. 9 HOLD (/HOLD) ..................................................................................................................... 9 Serial Clock (CLK) ................................................................................................................ 9 PIN DESCRIPTIONS ........................................................................................................................ 9 BLOCK DIAGRAM .......................................................................................................................... 10 FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI OPERATIONS ............................................................................................................. 11 6.1.1 6.1.2 6.1.3 6.1.4 Standard SPI Instructions ..................................................................................................... 11 Dual SPI Instructions ............................................................................................................ 11 Quad SPI Instructions ........................................................................................................... 11 Hold Function ....................................................................................................................... 11 W rite Protect Features ......................................................................................................... 12 6.2 7. W RITE PROTECTION ....................................................................................................... 12 6.2.1 STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 13 7.1 STATUS REGISTERS........................................................................................................ 13 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 7.1.7 7.1.8 7.1.9 7.1.10 7.1.11 BUSY Status (BUSY) ............................................................................................................ 13 W rite Enable Latch Status (WEL) ........................................................................................ 13 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 13 Top/Bottom Block Protect Bit (TB) ........................................................................................ 13 Sector/Block Protect Bit (SEC) ............................................................................................. 13 Complement Protect Bit (CMP) ............................................................................................ 14 Status Register Protect Bits (SRP1, SRP0).......................................................................... 14 Erase/Program Suspend Status (SUS) ................................................................................ 14 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 14 Quad Enable Bit (QE) ......................................................................................................... 15 Status Register Memory Protection (CMP = 0) ................................................................... 16 -2- W25Q128BV 7.1.12 Status Register Memory Protection (CMP = 1) ................................................................... 17 Manufacturer and Device Identification ................................................................................ 18 Instruction Set Table 1 (Erase, Program Instructions) .......................................................... 19 Instruction Set Table 2 (Read Instructions) .......................................................................... 20 Instruction Set Table 3 (ID, Security Instructions) ................................................................ 21 W rite Enable (06h) ............................................................................................................... 22 W rite Enable for Volatile Status Register (50h) .................................................................... 22 W rite Disable (04h)............................................................................................................... 23 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 24 W rite Status Register (01h) .................................................................................................. 24 Read Data (03h) ................................................................................................................. 26 Fast Read (0Bh) ................................................................................................................. 27 Fast Read Dual Output (3Bh) ............................................................................................. 28 Fast Read Quad Output (6Bh) ............................................................................................ 29 Fast Read Dual I/O (BBh) ................................................................................................... 30 Fast Read Quad I/O (EBh) ................................................................................................. 32 W ord Read Quad I/O (E7h) ................................................................................................ 34 Octal Word Read Quad I/O (E3h)....................................................................................... 36 Set Burst with Wrap (77h) .................................................................................................. 38 Continuous Read Mode Bits (M7-0) ................................................................................... 39 Continuous Read Mode Reset (FFh or FFFFh) .................................................................. 39 Page Program (02h) ........................................................................................................... 40 Quad Input Page Program (32h) ........................................................................................ 41 Sector Erase (20h) ............................................................................................................. 42 32KB Block Erase (52h) ..................................................................................................... 43 64KB Block Erase (D8h) ..................................................................................................... 44 Chip Erase (C7h / 60h) ....................................................................................................... 45 Erase / Program Suspend (75h) ......................................................................................... 46 Erase / Program Resume (7Ah) ......................................................................................... 47 Power-down (B9h) .............................................................................................................. 48 Release Power-down / Device ID (ABh) ............................................................................. 49 Read Manufacturer / Device ID (90h) ................................................................................. 51 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 52 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 53 Read Unique ID Number (4Bh)........................................................................................... 54 Read JEDEC ID (9Fh) ........................................................................................................ 55 Read SFDP Register (5Ah) ................................................................................................ 56 Erase Security Registers (44h) ........................................................................................... 59 Program Security Registers (42h) ...................................................................................... 60 Read Security Registers (48h) ........................................................................................... 61 7.2 INSTRUCTIONS................................................................................................................. 18 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 7.2.8 7.2.9 7.2.10 7.2.11 7.2.12 7.2.13 7.2.14 7.2.15 7.2.16 7.2.17 7.2.18 7.2.19 7.2.20 7.2.21 7.2.22 7.2.23 7.2.24 7.2.25 7.2.26 7.2.27 7.2.28 7.2.29 7.2.30 7.2.31 7.2.32 7.2.33 7.2.34 7.2.35 7.2.36 7.2.37 7.2.38 7.2.39 -3- Publication Release Date: April 01, 2011 Revision E W25Q128BV 8. ELECTRICAL CHARACTERISTICS ............................................................................................... 62 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 9. 9.1 9.2 9.3 10. 11. 10.1 Absolute Maximum Ratings ................................................................................................ 62 Operating Ranges............................................................................................................... 62 Power-up Timing and Write Inhibit Threshold .................................................................... 63 DC Electrical Characteristics .............................................................................................. 64 AC Measurement Conditions .............................................................................................. 65 AC Electrical Characteristics .............................................................................................. 66 AC Electrical Characteristics (cont’d) ................................................................................. 67 Serial Output Timing ........................................................................................................... 68 Serial Input Timing .............................................................................................................. 68 HOLD Timing ...................................................................................................................... 68 W P Timing .......................................................................................................................... 68 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 69 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 70 24-Ball TFBGA 8x6-mm (Package Code C)....................................................................... 71 Valid Part Numbers and Top Side Marking ........................................................................ 73 PACKAGE SPECIFICATION .......................................................................................................... 69 ORDERING INFORMATION .......................................................................................................... 72 REVISION HISTORY ...................................................................................................................... 74 -4- W25Q128BV 1. GENERAL DESCRIPTION The W25Q128BV (8M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. The W25Q128BV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128BV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128BV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual Output and 280MHz (70MHz x 4) for Quad SPI when using the Fast Read Quad SPI instructions. These transfer rates can out perform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W 25Q128BV: 128M-bit/16M-byte – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 104/70MHz Dual Output/Quad SPI clocks – 208/280MHz equivalent Dual /Quad SPI – 35MB/S continuous data transfer rate – Up to 5X that of ordinary Serial Flash (1) – More than 100,000 erase/program cycles – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q128BVFIP
### 物料型号 - 型号:W25Q128BV - 制造商:Winbond

### 器件简介 W25Q128BV是一款由Winbond生产的3V 128M-BIT SERIAL FLASH MEMORY,支持DUAL和QUAD SPI接口。该器件适用于空间、引脚和功耗有限的系统,提供灵活性和性能,非常适合于RAM中代码阴影、直接从Dual/Quad SPI(XIP)执行代码以及存储语音、文本和数据。该设备在2.7V至3.6V的单电源供电下工作,活动时电流消耗低至4mA,掉电模式下小于1µA。

### 引脚分配 - WSON 8x6-mm:共8个pad,包括Chip Select(/CS)、Data Output(DO)、Write Protect(/WP)、Hold(/HOLD)等。 - SOIC 300-mil:共16个pin,包括/HOLD、VCC、GND、DI、CLK等。 - TFBGA 8x6-mm:共24个ball,配置与WSON类似。

### 参数特性 - 供电电压:2.7V至3.6V - 电流消耗:活动时4mA,掉电模式下小于1µA - 存储阵列:65,536个可编程页面,每个页面256字节 - 擦除功能:支持4KB扇区擦除、32KB块擦除、64KB块擦除和整个芯片擦除 - SPI接口:支持标准SPI、Dual SPI和Quad SPI操作

### 功能详解 W25Q128BV支持多种SPI操作,包括标准SPI指令、Dual SPI指令和Quad SPI指令。此外,还支持写保护功能,包括软件和硬件写保护、电源锁定和一次性编程(OTP)写保护。该设备还具备连续读取模式,以最少的指令开销实现高效内存访问。

### 应用信息 W25Q128BV适用于需要数据和参数存储的应用,如工业和汽车温度范围内的超过100,000次擦除/编程周期,以及超过20年的数据保留。

### 封装信息 W25Q128BV提供8-pad WSON 8x6-mm、16-pin SOIC 300-mil和24-ball TFBGA 8x6-mm三种封装类型。
W25Q128BVFIP 价格&库存

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