0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
W25Q128FVBJQ

W25Q128FVBJQ

  • 厂商:

    WINBOND(华邦)

  • 封装:

    TBGA24

  • 描述:

    IC FLSH 128MBIT SPI/QUAD 24TFBGA

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q128FVBJQ 数据手册
W25Q128FV 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: May 13, 2016 Revision M W25Q128FV Table of Contents 1. GENERAL DESCRIPTIONS...................................................................................................................... 5 2. FEATURES................................................................................................................................................ 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ................................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm .................................................................................. 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................................ 7 3.5 Pin Description SOIC 300-mil ........................................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .............................................................. 8 3.7 Ball Description TFBGA 8x6-mm ...................................................................................................... 8 3.8 Pin Configuration PDIP 300-mil ........................................................................................................ 9 3.9 Pin Description PDIP 300-mil ............................................................................................................ 9 4. PIN DESCRIPTIONS ............................................................................................................................... 10 4.1 Chip Select (/CS) ............................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................................... 10 4.3 Write Protect (/WP) ......................................................................................................................... 10 4.4 HOLD (/HOLD)................................................................................................................................ 10 4.5 Serial Clock (CLK) .......................................................................................................................... 10 4.6 Reset (/RESET) .............................................................................................................................. 10 5. BLOCK DIAGRAM ................................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS.............................................................................................................. 12 6.1 SPI / QPI Operations ...................................................................................................................... 12 6.1.1 Standard SPI Instructions ............................................................................................................................... 12 6.1.2 Dual SPI Instructions ...................................................................................................................................... 12 6.1.3 Quad SPI Instructions..................................................................................................................................... 13 6.1.4 QPI Instructions .............................................................................................................................................. 13 6.1.5 Hold Function ................................................................................................................................................. 13 6.1.6 Software Reset & Hardware /RESET pin ....................................................................................................... 14 6.2 Write Protection .............................................................................................................................. 15 6.2.1 Write Protect Features ................................................................................................................................... 15 7. STATUS AND CONFIGURATION REGISTERS ..................................................................................... 16 7.1 Status Registers .............................................................................................................................. 16 7.1.1 Erase/Write In Progress (BUSY) – Status Only.............................................................................................. 16 7.1.2 Write Enable Latch (WEL) – Status Only ....................................................................................................... 16 7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ............................................................. 16 -1- W25Q128FV 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable .................................................................... 17 7.1.5 Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable .................................................................... 17 7.1.6 Complement Protect (CMP) – Volatile/Non-Volatile Writable ......................................................................... 17 7.1.7 Status Register Protect (SRP1, SRP0) – Volatile/Non-Volatile Writable ........................................................ 17 7.1.8 Erase/Program Suspend Status (SUS) – Status Only .................................................................................... 18 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ....................................... 18 7.1.10 Quad Enable (QE) – Volatile/Non-Volatile Writable .......................................................................... 18 7.1.11 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ....................................................... 19 7.1.12 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ........................................... 19 7.1.13 HOLD or /RESET Pin Function (HOLD/RST) – Volatile/Non-Volatile Writable ................................. 19 7.1.14 Reserved Bits – Non Functional ....................................................................................................... 20 7.1.15 W25Q128FV Status Register Memory Protection (WPS = 0, CMP = 0) ........................................... 21 7.1.16 W25Q128FV Status Register Memory Protection (WPS = 0, CMP = 1) ........................................... 22 7.1.17 W25Q128FV Individual Block Memory Protection (WPS=1) ............................................................ 23 8. INSTRUCTIONS ...................................................................................................................................... 24 8.1 Device ID and Instruction Set Tables .............................................................................................. 24 8.1.1 Manufacturer and Device Identification .......................................................................................................... 24 8.1.2 Instruction Set Table 1 (Standard/Dual/Quad SPI Instructions)(1) .................................................................. 25 8.1.3 Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions) (1) .................................................................. 26 8.1.4 Instruction Set Table 3 (QPI Instructions)(14) .................................................................................................. 27 8.2 Instruction Descriptions ................................................................................................................... 29 8.2.1 Write Enable (06h) ......................................................................................................................................... 29 8.2.2 Write Enable for Volatile Status Register (50h) .............................................................................................. 29 8.2.3 Write Disable (04h)......................................................................................................................................... 30 8.2.4 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) ........................................ 30 8.2.5 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) ........................................ 31 8.2.6 Read Data (03h) ............................................................................................................................................. 34 8.2.7 Fast Read (0Bh) ............................................................................................................................................. 35 8.2.8 Fast Read Dual Output (3Bh) ......................................................................................................................... 37 8.2.9 Fast Read Quad Output (6Bh) ........................................................................................................................ 38 8.2.10 Fast Read Dual I/O (BBh) ................................................................................................................. 39 8.2.11 Fast Read Quad I/O (EBh) ................................................................................................................ 41 8.2.12 Word Read Quad I/O (E7h) .............................................................................................................. 44 8.2.13 Octal Word Read Quad I/O (E3h) ..................................................................................................... 46 8.2.14 Set Burst with Wrap (77h) ................................................................................................................. 48 8.2.15 Page Program (02h) ......................................................................................................................... 49 8.2.16 Quad Input Page Program (32h) ....................................................................................................... 51 8.2.17 Sector Erase (20h) ............................................................................................................................ 52 8.2.18 32KB Block Erase (52h) .................................................................................................................... 53 8.2.19 64KB Block Erase (D8h) ................................................................................................................... 54 8.2.20 Chip Erase (C7h / 60h) ..................................................................................................................... 55 -2- Publication Release Date: May 13, 2016 Revision M W25Q128FV 8.2.21 Erase / Program Suspend (75h) ....................................................................................................... 56 8.2.22 Erase / Program Resume (7Ah) ........................................................................................................ 58 8.2.23 Power-down (B9h) ............................................................................................................................ 59 8.2.24 Release Power-down / Device ID (ABh) ........................................................................................... 60 8.2.25 Read Manufacturer / Device ID (90h) ............................................................................................... 62 8.2.26 Read Manufacturer / Device ID Dual I/O (92h) ................................................................................. 63 8.2.27 Read Manufacturer / Device ID Quad I/O (94h) ................................................................................ 64 8.2.28 Read Unique ID Number (4Bh) ......................................................................................................... 65 8.2.29 Read JEDEC ID (9Fh)....................................................................................................................... 66 8.2.30 Read SFDP Register (5Ah) ............................................................................................................... 67 8.2.31 Erase Security Registers (44h) ......................................................................................................... 68 8.2.32 Program Security Registers (42h) ..................................................................................................... 69 8.2.33 Read Security Registers (48h) .......................................................................................................... 70 8.2.34 Set Read Parameters (C0h) ............................................................................................................. 71 8.2.35 Burst Read with Wrap (0Ch) ............................................................................................................. 72 8.2.36 Enter QPI Mode (38h) ....................................................................................................................... 73 8.2.37 Exit QPI Mode (FFh) ......................................................................................................................... 74 8.2.38 Individual Block/Sector Lock (36h) .................................................................................................... 75 8.2.39 Individual Block/Sector Unlock (39h) ................................................................................................ 76 8.2.40 Read Block/Sector Lock (3Dh) .......................................................................................................... 77 8.2.41 Global Block/Sector Lock (7Eh) ........................................................................................................ 78 8.2.42 Global Block/Sector Unlock (98h) ..................................................................................................... 78 8.2.43 Enable Reset (66h) and Reset Device (99h) .................................................................................... 79 9. ELECTRICAL CHARACTERISTICS ....................................................................................................... 80 9.1 Absolute Maximum Ratings (1)(2) .................................................................................................. 80 9.2 9.3 9.4 Operating Ranges ........................................................................................................................... 80 Power-Up Power-Down Timing and Requirements(1) .................................................................... 81 9.5 DC Electrical Characteristics .......................................................................................................... 82 AC Measurement Conditions(1)...................................................................................................... 83 9.6 AC Electrical Characteristics(6) ........................................................................................................ 84 9.7 Serial Output Timing ....................................................................................................................... 86 9.8 Serial Input Timing .......................................................................................................................... 86 9.9 HOLD Timing .................................................................................................................................. 86 9.10 WP Timing ...................................................................................................................................... 86 10. PACKAGE SPECIFICATIONS ........................................................................................................ 87 10.1 8-Pin SOIC 208-mil (Package Code S)........................................................................................... 87 10.2 8-Pin VSOP 208-mil (Package Code T) ......................................................................................... 88 10.3 8-Pin PDIP 300-mil (Package Code A) ........................................................................................... 89 10.4 8-Pad WSON 6x5-mm (Package Code P) ..................................................................................... 90 -3- W25Q128FV 10.5 8-Pad WSON 8x6-mm (Package Code E) ..................................................................................... 91 10.6 16-Pin SOIC 300-mil (Package Code F) ......................................................................................... 92 10.7 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 ball array) ........................................................ 93 10.8 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 ball array) ........................................................... 94 11. ORDERING INFORMATION .......................................................................................................... 95 11.1 Valid Part Numbers and Top Side Marking..................................................................................... 96 12. REVISION HISTORY ...................................................................................................................... 97 -4- Publication Release Date: May 13, 2016 Revision M W25Q128FV 1. GENERAL DESCRIPTIONS The W25Q128FV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages. The W25Q128FV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128FV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128FV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2-clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-bit Unique Serial Number and three 256-bytes Security Registers. 2. FEATURES  New Family of SpiFlash Memories – W25Q128FV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset  Highest Performance Serial Flash – 104MHz Single, Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/S continuous data transfer rate – More than 100,000 erase/program cycles – More than 20-year data retention  Efficient “Continuous Read” and QPI Mode – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Quad Peripheral Interface (QPI) reduces instruction overhead – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q128FVBJQ
物料型号:W25Q128FV

器件简介: W25Q128FV是Winbond公司生产的128M-bit Serial Flash存储器,适用于空间、引脚和功耗有限的系统。该系列提供超越普通串行闪存的灵活性和性能,非常适合于RAM中代码阴影、直接从Dual/Quad SPI执行代码以及存储声音、文本和数据。设备在2.7V至3.6V的单电源供电下工作,活动时电流消耗低至4mA,掉电模式下仅为1µA。所有设备都提供节省空间的封装。

引脚分配: - SOIC / VSOP 208-mil、WSON 6x5-mm / 8x6-mm、SOIC 300-mil、TFBGA 8x6-mm (5x5或6x4球阵列)、PDIP 300-mil等封装类型的引脚分配和描述。

参数特性: - 支持标准SPI、Dual/Quad I/O SPI以及2个时钟指令周期的Quad Peripheral Interface (QPI)。 - SPI时钟频率高达104MHz,Dual I/O和Quad I/O的等效时钟频率分别为208MHz和416MHz。 - 连续读取模式下,仅需8个时钟即可寻址内存,实现真正的XIP操作。 - 提供软件和硬件写保护功能,包括电源锁定和OTP保护。

功能详解: - 支持页编程、扇区擦除、块擦除和芯片擦除等操作。 - 具有硬件重置和软件重置功能。 - 提供了多种指令集,包括标准SPI、Dual SPI、Quad SPI和QPI指令。

应用信息: - 适用于需要数据和参数存储的应用,如系统代码存储、用户数据存储等。

封装信息: - 提供多种封装选项,包括8-pin SOIC / VSOP 208-mil、8-pin PDIP 300-mil、8-pad WSON 6x5-mm / 8x6-mm、16-pin SOIC 300-mil和24-ball TFBGA 8x6-mm等。
W25Q128FVBJQ 价格&库存

很抱歉,暂时无法提供与“W25Q128FVBJQ”相匹配的价格&库存,您可以联系我们找货

免费人工找货