W25Q80, W25Q16, W25Q32
8M-BIT, 16M-BIT AND 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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Publication Release Date: September 26, 2007 Preliminary - Revision B
W25Q80, W25Q16, W25Q32
Table of Contents
1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ......................................................................................................... 5 FEATURES ................................................................................................................................. 5 PIN CONFIGURATION SOIC 208-MIL....................................................................................... 6 PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6 PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM........................................................ 6 PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7 PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7 7.1 7.2 7.3 7.4 7.5 7.6 8. 9. Package Types ............................................................................................................... 8 Chip Select (/CS) ............................................................................................................ 8 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8 Write Protect (/WP)......................................................................................................... 8 HOLD (/HOLD) ............................................................................................................... 8 Serial Clock (CLK) .......................................................................................................... 8
BLOCK DIAGRAM ...................................................................................................................... 9 FUNCTIONAL DESCRIPTION ................................................................................................. 10 9.1 SPI OPERATIONS ....................................................................................................... 10
9.1.1 9.1.2 9.1.3 9.1.4 Standard SPI Instructions............................................................................................... 10 Dual SPI Instructions ...................................................................................................... 10 Quad SPI Instructions..................................................................................................... 10 Hold Function ................................................................................................................. 10 Write Protect Features.................................................................................................... 11
9.2 10.
WRITE PROTECTION.................................................................................................. 11
9.2.1
CONTROL AND STATUS REGISTERS................................................................................... 12 10.1 STATUS REGISTER .................................................................................................... 12
10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 10.1.8 BUSY............................................................................................................................ 12 Write Enable Latch (WEL) ............................................................................................ 12 Block Protect Bits (BP2, BP1, BP0).............................................................................. 12 Top/Bottom Block Protect (TB)..................................................................................... 12 Sector/Block Protect (SEC) .......................................................................................... 12 Status Register Protect (SRP1, SRP0)......................................................................... 13 Quad Enable (QE) ........................................................................................................ 13 Status Register Memory Protection .............................................................................. 15 Manufacturer and Device Identification ........................................................................ 18 Instruction Set Table 1.................................................................................................. 19 Instruction Set Table 2 (Read Instructions) .................................................................. 20
10.2
INSTRUCTIONS........................................................................................................... 18
10.2.1 10.2.2 10.2.3
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W25Q80, W25Q16, W25Q32
10.2.4 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 10.2.18 10.2.19 10.2.20 10.2.21 10.2.22 10.2.23 10.2.24 10.2.25 10.2.26 10.2.27 10.2.28 Write Enable (06h)........................................................................................................ 21 Write Disable (04h)....................................................................................................... 21 Read Status Register-1 (05h) and Read Status Register-2 (35h)................................. 22 Write Status Register (01h) .......................................................................................... 23 Read Data (03h) ........................................................................................................... 24 Fast Read (0Bh) ........................................................................................................... 25 Fast Read Dual Output (3Bh) ..................................................................................... 26 Fast Read Quad Output (6Bh).................................................................................... 27 Fast Read Dual I/O (BBh)........................................................................................... 28 Fast Read Quad I/O (EBh) ......................................................................................... 30 Page Program (02h) ................................................................................................... 32 Quad Input Page Program (32h) ................................................................................ 33 Sector Erase (20h) ..................................................................................................... 34 32KB Block Erase (52h) ............................................................................................. 35 64KB Block Erase (D8h)............................................................................................. 36 Chip Erase (C7h / 60h)............................................................................................... 37 Erase Suspend (75h).................................................................................................. 38 Erase Resume (7Ah) .................................................................................................. 38 Power-down (B9h) ...................................................................................................... 39 High Performance Mode (A3h) ................................................................................... 40 Release Power-down or High Performance Mode / Device ID (ABh) ......................... 40 Read Manufacturer / Device ID (90h) ......................................................................... 42 Read Unique ID Number ............................................................................................ 43 JEDEC ID (9Fh) ......................................................................................................... 44 Mode Bit Reset (FFh or FFFFh) ................................................................................. 45
11.
ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 46 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 11.11 Absolute Maximum Ratings .......................................................................................... 46 Operating Ranges......................................................................................................... 46 Endurance and Data Retention .................................................................................... 47 Power-up Timing and Write Inhibit Threshold .............................................................. 47 DC Electrical Characteristics ........................................................................................ 48 AC Measurement Conditions........................................................................................ 49 AC Electrical Characteristics ........................................................................................ 50 AC Electrical Characteristics (cont’d) ........................................................................... 51 Serial Output Timing ..................................................................................................... 52 Input Timing................................................................................................................. 52 Hold Timing ................................................................................................................. 52
12.
PACKAGE SPECIFICATION .................................................................................................... 53
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Publication Release Date: September 26, 2007 Preliminary - Revision B
W25Q80, W25Q16, W25Q32
12.1 12.2 12.3 12.4 12.5 13. 14. 13.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 53 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 54 8-contact 6x5 WSON (Package Code ZP) ................................................................... 55 8-contact 6x5 WSON Cont’d. ....................................................................................... 56 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 57 Valid Part Numbers and Top Side Marking .................................................................. 59
ORDERING INFORMATION .................................................................................................... 58 REVISION HISTORY ................................................................................................................ 60
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W25Q80, W25Q16, W25Q32
1. GENERAL DESCRIPTION
The W25Q80 (8M-bit), W25Q16 (16M-bit), and W25Q32 (32M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q80/16/32 array is organized into 4,096/8,192/16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instructions. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q80/16/32 has 256/512/1024 erasable sectors and 16/32/64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q80/16/32 supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI using SPI pins: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing equivalent clock rates of 160MHz for Dual Output and 320MHz for Quad Output when using the Fast Read Dual/Quad Output instructions. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number.
2. FEATURES
• Family of SpiFlash Memories – W25Q80: 8M-bit / 1M -byte (1,048,576) – W25Q16: 16M-bit / 2M-byte (2,097,152) – W25Q32: 32M-bit / 4M-byte (4,194,304) – 256-bytes per programmable page • Standard, Dual or Quad SPI – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – Up to 6X that of ordinary Serial Flash – 80MHz clock operation – 160MHz equivalent Dual SPI – 320MHz equivalent Quad SPI – 40MB/S continuous data transfer rate – 30MB/S random access (32-byte fetch) – Comparable to X16 Parallel Flash • Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
