W25Q16CLSSIG

W25Q16CLSSIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

    SOIC8

  • 描述:

    IC FLASH 16MBIT SPI/QUAD 8SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q16CLSSIG 数据手册
W25Q16CL 2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: July 08, 2010 Preliminary - Revision A W25Q16CL Table of Contents 1. 2. 3. 4. 5. 6. 7. 8. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES....................................................................................................................................... 5 PIN CONFIGURATION SOIC 150 / 208-MIL ................................................................................... 6 PAD CONFIGURATION WSON 6X5-MM ........................................................................................ 6 PIN CONFIGURATION PDIP 300-MIL............................................................................................. 7 PIN DESCRIPTION SOIC 150/208-MIL, PDIP 300-MIL AND WSON 6X5-MM............................... 7 PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 8 PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 8 8.1 8.2 8.3 8.4 8.5 8.6 9. 10. Package Types..................................................................................................................... 9 Chip Select (/CS).................................................................................................................. 9 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 Write Protect (/WP)............................................................................................................... 9 HOLD (/HOLD) ..................................................................................................................... 9 Serial Clock (CLK) ................................................................................................................ 9 BLOCK DIAGRAM.......................................................................................................................... 10 FUNCTIONAL DESCRIPTION ....................................................................................................... 11 10.1 SPI OPERATIONS ............................................................................................................. 11 10.1.1 10.1.2 10.1.3 10.1.4 Standard SPI Instructions...................................................................................................11 Dual SPI Instructions ..........................................................................................................11 Quad SPI Instructions.........................................................................................................11 Hold Function .....................................................................................................................11 Write Protect Features........................................................................................................12 10.2 11. WRITE PROTECTION ....................................................................................................... 12 10.2.1 CONTROL AND STATUS REGISTERS ........................................................................................ 13 11.1 STATUS REGISTER .......................................................................................................... 13 11.1.1 11.1.2 11.1.3 11.1.4 11.1.5 11.1.6 11.1.7 11.1.8 11.1.9 11.1.10 11.1.11 BUSY..................................................................................................................................13 Write Enable Latch (WEL) ..................................................................................................13 Block Protect Bits (BP2, BP1, BP0)....................................................................................13 Top/Bottom Block Protect (TB)...........................................................................................13 Sector/Block Protect (SEC) ................................................................................................13 Complement Protect (CMP) ...............................................................................................14 Status Register Protect (SRP1, SRP0)...............................................................................14 Erase/Program Suspend Status (SUS) ..............................................................................14 Security Register Lock Bits (LB3, LB2, LB1) ......................................................................14 Quad Enable (QE) ............................................................................................................15 Status Register Memory Protection (CMP = 0).................................................................16 -2- W25Q16CL 11.1.12 Status Register Memory Protection (CMP = 1).................................................................17 Manufacturer and Device Identification ..............................................................................18 Instruction Set Table 1 (Erase, Program Instructions) ........................................................19 Instruction Set Table 2 (Read Instructions) ........................................................................20 Instruction Set Table 3 (ID, Security Instructions)...............................................................21 Write Enable (06h)..............................................................................................................22 Write Enable for Volatile Status Register (50h) ..................................................................22 Write Disable (04h).............................................................................................................23 Read Status Register-1 (05h) and Read Status Register-2 (35h).......................................24 Write Status Register (01h) ................................................................................................24 Read Data (03h) ...............................................................................................................26 Fast Read (0Bh) ...............................................................................................................27 Fast Read Dual Output (3Bh) ...........................................................................................28 Fast Read Quad Output (6Bh)..........................................................................................29 Fast Read Dual I/O (BBh).................................................................................................30 Fast Read Quad I/O (EBh) ...............................................................................................32 Word Read Quad I/O (E7h) ..............................................................................................34 Octal Word Read Quad I/O (E3h).....................................................................................36 Set Burst with Wrap (77h).................................................................................................38 Continuous Read Mode Bits (M7-0) .................................................................................39 Continuous Read Mode Reset (FFh or FFFFh) ................................................................39 Page Program (02h) .........................................................................................................40 Quad Input Page Program (32h) ......................................................................................41 Sector Erase (20h) ...........................................................................................................42 32KB Block Erase (52h) ...................................................................................................43 64KB Block Erase (D8h)...................................................................................................44 Chip Erase (C7h / 60h).....................................................................................................45 Erase / Program Suspend (75h) .......................................................................................46 Erase / Program Resume (7Ah) .......................................................................................47 Power-down (B9h) ............................................................................................................48 Release Power-down / Device ID (ABh) ...........................................................................49 Read Manufacturer / Device ID (90h) ...............................................................................51 Read Manufacturer / Device ID Dual I/O (92h) .................................................................52 Read Manufacturer / Device ID Quad I/O (94h)................................................................53 Read Unique ID Number (4Bh).........................................................................................54 Read JEDEC ID (9Fh) ......................................................................................................55 Read SFDP Register (5Ah) ..............................................................................................56 Erase Security Registers (44h).........................................................................................59 Program Security Registers (42h) ....................................................................................60 Read Security Registers (48h)..........................................................................................61 11.2 INSTRUCTIONS................................................................................................................. 18 11.2.1 11.2.2 11.2.3 11.2.4 11.2.5 11.2.6 11.2.7 11.2.8 11.2.9 11.2.10 11.2.11 11.2.12 11.2.13 11.2.14 11.2.15 11.2.16 11.2.17 11.2.18 11.2.19 11.2.20 11.2.21 11.2.22 11.2.23 11.2.24 11.2.25 11.2.26 11.2.27 11.2.28 11.2.29 11.2.30 11.2.31 11.2.32 11.2.33 11.2.34 11.2.35 11.2.36 11.2.37 11.2.38 11.2.39 -3- Publication Release Date: July 08, 2010 Preliminary - Revision A W25Q16CL 12. ELECTRICAL CHARACTERISTICS .............................................................................................. 62 12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 12.9 12.10 13. 13.1 13.2 13.3 13.4 13.5 14. 15. 14.1 Absolute Maximum Ratings................................................................................................ 62 Operating Ranges .............................................................................................................. 62 Power-up Timing and Write Inhibit Threshold .................................................................... 63 DC Electrical Characteristics.............................................................................................. 64 AC Measurement Conditions ............................................................................................. 65 AC Electrical Characteristics .............................................................................................. 66 AC Electrical Characteristics (cont’d)................................................................................. 67 Serial Output Timing........................................................................................................... 68 Serial Input Timing.............................................................................................................. 68 Hold Timing ....................................................................................................................... 68 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 69 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 70 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 71 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 74 Valid Part Numbers and Top Side Marking........................................................................ 76 PACKAGE SPECIFICATION.......................................................................................................... 69 ORDERING INFORMATION .......................................................................................................... 75 REVISION HISTORY...................................................................................................................... 77 -4- W25Q16CL 1. GENERAL DESCRIPTION The W25Q16CL (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.3V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. The W25Q16CL array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16CL has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q16CL supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 50MHz are supported allowing equivalent clock rates of 100MHz (50MHz x 2) for Dual I/O and 200MHz (50MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W25Q16CL: 16M-bit / 2M-byte (2,097,152) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 50MHz Dual SPI / Quad SPI clocks – 100/200MHz equivalent Dual/Quad SPI – 25MB/S continuous data transfer rate – Up to 4X that of ordinary Serial Flash – More than 100,000 erase/program cycles – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range – Single 2.3 to 3.6V supply – 4mA active current,
W25Q16CLSSIG
### 物料型号 - 型号:W25Q16CL - 制造商:Winbond(华邦电子)

### 器件简介 W25Q16CL是一款由Winbond生产的2.5V 16M位串行闪存存储器,支持双通道和四通道SPI接口。它适用于空间、引脚和功耗有限的系统,提供灵活性和性能,非常适合代码阴影到RAM、直接从双/四SPI执行代码(XIP)以及存储声音、文本和数据。该设备在2.3V至3.6V的单电源供电下工作,活动时电流消耗低至4mA,掉电模式下小于1µA。

### 引脚分配 - SOIC 150/208-MIL:共8个引脚,包括芯片选择(/CS)、数据输入输出(DI、DO和IO0, IO1, IO2, IO3)、写保护(/WP)、保持(/HOLD)和时钟(CLK)。 - WSON 6X5-MM:8个触点,配置与SOIC相似。 - PDIP 300-MIL:8个引脚,配置与SOIC相似。

### 参数特性 - 供电电压:2.3V至3.6V - 阵列组织:8,192个可编程页面,每个页面256字节 - 擦除功能:可以以4KB扇区、32KB块、64KB块或整个芯片(芯片擦除)为单位进行擦除 - SPI操作:支持标准SPI、双SPI和四SPI操作 - 时钟频率:最高支持50MHz,双I/O和四I/O SPI时钟频率等效于100MHz和200MHz - 连续读取模式:允许高效内存访问,最少只需8个时钟周期的指令开销即可读取24位地址

### 功能详解 W25Q16CL支持多种SPI操作指令,包括标准SPI指令、双SPI指令和四SPI指令。它还具有硬件写保护功能,可通过状态寄存器的块保护位和硬件写保护(/WP)引脚来保护内存数组的特定部分。此外,该设备还支持JEDEC标准制造商和设备识别,以及具有64位唯一序列号。

### 应用信息 W25Q16CL适用于需要数据和参数存储的应用,例如代码存储、声音、文本和数据存储等。它的小4KB扇区提供了更大的灵活性。

### 封装信息 W25Q16CL提供多种封装选项,包括8引脚SOIC 150-mil和208-mil、8引脚PDIP 300-mil、8触点WSON 6x5mm以及16引脚SOIC 300-mil。这些封装选项在数据手册的第13部分有详细描述。
W25Q16CLSSIG 价格&库存

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