W25Q16VZPIG

W25Q16VZPIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q16VZPIG - 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q16VZPIG 数据手册
W25Q16V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: October 7, 2009 Revision E W25Q16V Table of Contents 1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ......................................................................................................... 5 FEATURES ................................................................................................................................. 5 PIN CONFIGURATION SOIC 208-MIL ....................................................................................... 6 PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6 PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM ........................................................ 6 PIN CONFIGURATION SOIC 300-MIL ....................................................................................... 7 PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7 7.1 7.2 7.3 7.4 7.5 7.6 8. 9. Package Types ............................................................................................................... 8 Chip Select (/CS) ............................................................................................................ 8 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8 Write Protect (/WP) ......................................................................................................... 8 HOLD (/HOLD) ............................................................................................................... 8 Serial Clock (CLK) .......................................................................................................... 8 BLOCK DIAGRAM ...................................................................................................................... 9 FUNCTIONAL DESCRIPTION ................................................................................................. 10 9.1 SPI OPERATIONS ....................................................................................................... 10 9.1.1 9.1.2 9.1.3 9.1.4 Standard SPI Instructions ...............................................................................................10 Dual SPI Instructions ......................................................................................................10 Quad SPI Instructions.....................................................................................................10 Hold Function .................................................................................................................10 Write Protect Features....................................................................................................11 9.2 10. WRITE PROTECTION.................................................................................................. 11 9.2.1 CONTROL AND STATUS REGISTERS ................................................................................... 12 10.1 STATUS REGISTER .................................................................................................... 12 10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 10.1.8 BUSY ............................................................................................................................12 Write Enable Latch (WEL) ............................................................................................12 Block Protect Bits (BP2, BP1, BP0) ..............................................................................12 Top/Bottom Block Protect (TB) .....................................................................................12 Sector/Block Protect (SEC) ..........................................................................................12 Status Register Protect (SRP1, SRP0) .........................................................................13 Quad Enable (QE) ........................................................................................................13 Status Register Memory Protection ..............................................................................15 Manufacturer and Device Identification.........................................................................16 Instruction Set Table 1 ..................................................................................................17 Instruction Set Table 2 (Read Instructions)...................................................................18 10.2 INSTRUCTIONS ........................................................................................................... 16 10.2.1 10.2.2 10.2.3 -2- W25Q16V 10.2.4 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 10.2.18 10.2.19 10.2.20 10.2.21 10.2.22 10.2.23 10.2.24 10.2.25 10.2.26 10.2.27 10.2.28 Write Enable (06h) ........................................................................................................19 Write Disable (04h) .......................................................................................................19 Read Status Register-1 (05h) and Read Status Register-2 (35h) .................................20 Write Status Register (01h) ..........................................................................................21 Read Data (03h) ...........................................................................................................22 Fast Read (0Bh) ...........................................................................................................23 Fast Read Dual Output (3Bh) .....................................................................................24 Fast Read Quad Output (6Bh) ....................................................................................25 Fast Read Dual I/O (BBh) ...........................................................................................26 Fast Read Quad I/O (EBh) .........................................................................................28 Octal Word Read Quad I/O (E3h) ...............................................................................30 Page Program (02h) ...................................................................................................32 Quad Input Page Program (32h) ................................................................................33 Sector Erase (20h) .....................................................................................................34 32KB Block Erase (52h) .............................................................................................35 64KB Block Erase (D8h) .............................................................................................36 Chip Erase (C7h / 60h) ...............................................................................................37 Erase Suspend (75h) ..................................................................................................38 Erase Resume (7Ah) ..................................................................................................38 Power-down (B9h) ......................................................................................................39 Release Power-down / Device ID (ABh) .....................................................................40 Read Manufacturer / Device ID (90h) .........................................................................42 Read Unique ID Number (4Bh) ...................................................................................43 JEDEC ID (9Fh)..........................................................................................................44 Continuous Read Mode Reset (FFh or FFFFh) ..........................................................45 11. ELECTRICAL CHARACTERISTICS ......................................................................................... 46 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 Absolute Maximum Ratings .......................................................................................... 46 Operating Ranges......................................................................................................... 46 Power-up Timing and Write Inhibit Threshold .............................................................. 47 DC Electrical Characteristics ........................................................................................ 48 AC Measurement Conditions ........................................................................................ 49 AC Electrical Characteristics ........................................................................................ 50 AC Electrical Characteristics (cont’d) ........................................................................... 51 Serial Output Timing ..................................................................................................... 52 Input Timing .................................................................................................................. 52 Hold Timing ................................................................................................................. 52 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 53 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 54 Publication Release Date: October 7, 2009 Revision E 12. PACKAGE SPECIFICATION .................................................................................................... 53 12.1 12.2 -3- W25Q16V 12.3 13. 14. 13.1 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 56 Valid Part Numbers and Top Side Marking .................................................................. 58 ORDERING INFORMATION .................................................................................................... 57 REVISION HISTORY ................................................................................................................ 59 -4- W25Q16V 1. GENERAL DESCRIPTION The W25Q16 (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q16 array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16 has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q16 supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing equivalent clock rates of 160MHz for Dual Output and 320MHz for Quad Output when using the Fast Read Dual/Quad Output instructions. These transfer rates can outperform standard Asyncronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (excute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES  Family of SpiFlash Memories – W25Q16: 16M-bit / 2M-byte (2,097,152) – 256-bytes per programmable page  Standard, Dual or Quad SPI – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO 0 , IO 1 , /WP, /Hold – Quad SPI: CLK, /CS, IO 0 , IO 1 , IO 2 , IO 3  Highest Performance Serial Flash – Up to 6X that of ordinary Serial Flash – 80MHz clock operation – 160MHz equivalent Dual SPI – 320MHz equivalent Quad SPI – 40MB/S continuous data transfer rate  Efficient “Continuous Read Mode” – Low Instruction overhead – As few as 8 clocks to address memory – Allows true XIP (excute in place) operation – Outperforms X16 Parallel Flash Note 1: Contact Winbond for details  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q16VZPIG
物料型号: - W25Q16V,由Winbond生产的16M-bit Serial Flash存储器,支持双通道和四通道SPI接口。

器件简介: - W25Q16V是适用于空间、引脚和功耗有限的系统的存储解决方案。25Q系列提供了超越普通串行闪存的灵活性和性能,适合于RAM代码阴影、直接从双/四SPI执行代码以及存储声音、文本和数据。该设备在2.7V至3.6V的单电源下工作,活动时电流消耗低至5mA,掉电模式下为1µA。所有设备都提供节省空间的封装。W25Q16阵列被组织成8,192个可编程页面,每个页面256字节。可以一次编程多达256字节。页面可以16个一组(扇区擦除)、128个一组(32KB块擦除)、256个一组(64KB块擦除)或整个芯片(芯片擦除)进行擦除。W25Q16具有512个可擦除扇区和32个可擦除块。小4KB扇区允许在需要数据和参数存储的应用中具有更大的灵活性。

引脚分配: - 提供了SOIC 208-MIL和SOIC 300-MIL的引脚配置图,以及WSON 6X5-MM的pad配置图。详细列出了各个引脚的功能,如芯片选择(/CS)、数据输入输出(DI, DO和IO0, IO1, IO2, IO3)、写保护(/WP)、保持(/HOLD)、时钟(CLK)和电源(VCC)。

参数特性: - 工作电压为2.7V至3.6V,活动电流为4mA,掉电电流小于1µA,工作温度范围为-40°C至+85°C。

功能详解: - 支持标准SPI、双SPI和四SPI操作。支持高达80MHz的SPI时钟频率,双输出和四输出时钟频率分别等效于160MHz和320MHz。连续读取模式允许高效的内存访问,只需8个时钟周期即可读取24位地址,允许真正的XIP操作。支持JEDEC标准制造商和设备识别,以及64位唯一序列号。

应用信息: - 适用于需要代码阴影、直接从SPI总线执行代码或存储数据的应用。
W25Q16VZPIG 价格&库存

很抱歉,暂时无法提供与“W25Q16VZPIG”相匹配的价格&库存,您可以联系我们找货

免费人工找货