W25Q20BWSNIP

W25Q20BWSNIP

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q20BWSNIP - 1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q20BWSNIP 数据手册
W25Q20BW 1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: January 25, 2011 Preliminary - Revision B W25Q20BW Table of Contents 1. 2. 3. 4. 5. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES ....................................................................................................................................... 5 PIN CONFIGURATION SOIC 150-MIL ............................................................................................ 6 PAD CONFIGURATION WSON 6X5-MM, USON 2X3-MM ............................................................. 6 PIN DESCRIPTION SOIC 150-MIL, WSON 6X5-MM & USON 2X3-MM ........................................ 6 5.1 5.2 5.3 5.4 5.5 5.6 6. 7. Package Types ..................................................................................................................... 7 Chip Select (/CS) .................................................................................................................. 7 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 7 Write Protect (/WP)............................................................................................................... 7 HOLD (/HOLD) ..................................................................................................................... 7 Serial Clock (CLK) ................................................................................................................ 7 BLOCK DIAGRAM ............................................................................................................................ 8 FUNCTIONAL DESCRIPTION ......................................................................................................... 9 7.1 SPI OPERATIONS ............................................................................................................... 9 7.1.1 7.1.2 7.1.3 7.1.4 Standard SPI Instructions ....................................................................................................... 9 Dual SPI Instructions .............................................................................................................. 9 Quad SPI Instructions............................................................................................................. 9 Hold Function ......................................................................................................................... 9 Write Protect Features.......................................................................................................... 10 7.2 8. WRITE PROTECTION ....................................................................................................... 10 7.2.1 CONTROL AND STATUS REGISTERS ........................................................................................ 11 8.1 STATUS REGISTER .......................................................................................................... 11 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.1.6 8.1.7 8.1.8 8.1.9 8.1.10 8.1.11 8.1.12 BUSY.................................................................................................................................... 11 Write Enable Latch (WEL) .................................................................................................... 11 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 11 Top/Bottom Block Protect (TB) ............................................................................................. 11 Sector/Block Protect (SEC) .................................................................................................. 11 Complement Protect (CMP) ................................................................................................. 12 Status Register Protect (SRP1, SRP0)................................................................................. 12 Erase/Program Suspend Status (SUS) ................................................................................ 12 Security Register Lock Bits (LB3, LB2, LB1, LB0) ................................................................ 12 Quad Enable (QE) .............................................................................................................. 13 Status Register Memory Protection (CMP = 0)................................................................... 14 Status Register Memory Protection (CMP = 1)................................................................... 15 Manufacturer and Device Identification ................................................................................ 16 Instruction Set Table 1 (Erase, Program Instructions) .......................................................... 17 8.2 INSTRUCTIONS................................................................................................................. 16 8.2.1 8.2.2 -2- W25Q20BW 8.2.3 8.2.4 8.2.5 8.2.6 8.2.7 8.2.8 8.2.9 8.2.10 8.2.11 8.2.12 8.2.13 8.2.14 8.2.15 8.2.16 8.2.17 8.2.18 8.2.19 8.2.20 8.2.21 8.2.22 8.2.23 8.2.24 8.2.25 8.2.26 8.2.27 8.2.28 8.2.29 8.2.30 8.2.31 8.2.32 8.2.33 8.2.34 8.2.35 8.2.36 8.2.37 8.2.38 Instruction Set Table 2 (Read Instructions) .......................................................................... 18 Instruction Set Table 3 (ID, Security Instructions)................................................................. 19 Write Enable (06h)................................................................................................................ 20 Write Enable for Volatile Status Register (50h) .................................................................... 20 Write Disable (04h) ............................................................................................................... 21 Read Status Register-1 (05h) and Read Status Register-2 (35h)......................................... 22 Write Status Register (01h) .................................................................................................. 22 Read Data (03h) ................................................................................................................. 24 Fast Read (0Bh) ................................................................................................................. 25 Fast Read Dual Output (3Bh) ............................................................................................. 26 Fast Read Quad Output (6Bh) ............................................................................................ 27 Fast Read Dual I/O (BBh)................................................................................................... 28 Fast Read Quad I/O (EBh) ................................................................................................. 30 Word Read Quad I/O (E7h) ................................................................................................ 32 Octal Word Read Quad I/O (E3h) ....................................................................................... 34 Set Burst with Wrap (77h) .................................................................................................. 36 Continuous Read Mode Bits (M7-0) ................................................................................... 37 Continuous Read Mode Reset (FFh or FFFFh) .................................................................. 37 Page Program (02h) ........................................................................................................... 38 Quad Input Page Program (32h) ........................................................................................ 39 Sector Erase (20h) ............................................................................................................. 40 32KB Block Erase (52h) ..................................................................................................... 41 64KB Block Erase (D8h) ..................................................................................................... 42 Chip Erase (C7h / 60h) ....................................................................................................... 43 Erase / Program Suspend (75h) ......................................................................................... 44 Erase / Program Resume (7Ah) ......................................................................................... 45 Power-down (B9h) .............................................................................................................. 46 Release Power-down / Device ID (ABh) ............................................................................. 47 Read Manufacturer / Device ID (90h) ................................................................................. 49 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 50 Read Manufacturer / Device ID Quad I/O (94h).................................................................. 51 Read Unique ID Number (4Bh)........................................................................................... 52 Read JEDEC ID (9Fh) ........................................................................................................ 53 Erase Security Registers (44h) ........................................................................................... 54 Program Security Registers (42h) ...................................................................................... 55 Read Security Registers (48h)............................................................................................ 56 9. ELECTRICAL CHARACTERISTICS .............................................................................................. 57 9.1 9.2 9.3 Absolute Maximum Ratings ................................................................................................ 57 Operating Ranges .............................................................................................................. 57 Power-up Timing and Write Inhibit Threshold .................................................................... 58 Publication Release Date: January 25, 2011 Preliminary - Revision B -3- W25Q20BW 9.4 9.5 9.6 9.7 9.8 9.9 9.10 10. 10.1 10.2 10.3 11. 12. 11.1 DC Electrical Characteristics .............................................................................................. 59 AC Measurement Conditions ............................................................................................. 60 AC Electrical Characteristics .............................................................................................. 61 AC Electrical Characteristics (cont’d) ................................................................................. 62 Serial Output Timing ........................................................................................................... 63 Serial Input Timing.............................................................................................................. 63 Hold Timing ........................................................................................................................ 63 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 64 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 65 8-Pad USON 2x3-mm (Package Code UX) ....................................................................... 67 Valid Part Numbers and Top Side Marking ........................................................................ 69 PACKAGE SPECIFICATION .......................................................................................................... 64 ORDERING INFORMATION .......................................................................................................... 68 REVISION HISTORY ...................................................................................................................... 70 -4- W25Q20BW 1. GENERAL DESCRIPTION The W25Q20BW (2M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages. The W25Q20BW array is organized into 1,024 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q20BW has 64 erasable sectors and 4 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q20BW supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing equivalent clock rates of 160MHz (80MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W25Q20BW: 2M-bit/256K-byte (262,144) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO 0 , IO 1 , /WP, /Hold – Quad SPI: CLK, /CS, IO 0 , IO 1 , IO 2 , IO 3 • Highest Performance Serial Flash – 80MHz Dual/Quad SPI clocks – 160/320MHz equivalent Dual/Quad SPI – 40MB/S continuous data transfer rate – Up to 6X that of ordinary Serial Flash – More than 100,000 erase/program cycles – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash Note 1: Contact Winbond for details • Low Power, Wide Temperature Range – Single 1.65 to 1.95V supply – 4mA active current,
W25Q20BWSNIP
### 物料型号 - 型号:W25Q20BW - 制造商:Winbond - 类型:1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

### 器件简介 W25Q20BW是一款2M位的串行闪存,适用于空间、引脚和功率有限的系统。25Q系列提供了超越普通串行闪存的灵活性和性能,适合于RAM代码阴影、直接从双/四SPI(XIP)执行代码以及存储声音、文本和数据。该设备在1.65V至1.95V的单电源供电下工作,活动时电流消耗低至4mA,掉电模式下小于1µA。所有设备都提供节省空间的封装。

### 引脚分配 - SOIC 150-MIL:8引脚封装,包括Chip Select(/CS)、数据输入输出(DI、DO和IO0、IO1、IO2、IO3)、写保护(/WP)、保持(/HOLD)和时钟(CLK)。 - WSON 6X5-MM, USON 2X3-MM:8-pad封装,引脚配置与SOIC类似,但尺寸更小。

### 参数特性 - 电源电压:1.65V至1.95V - 活动电流:4mA - 掉电电流:小于1µA - 操作温度范围:-40°C至+85°C

### 功能详解 W25Q20BW支持标准SPI、双SPI和四SPI操作。它支持高达80MHz的SPI时钟频率,双I/O和四I/O时钟频率分别相当于160MHz和320MHz。连续读取模式允许高效内存访问,最少只需8个时钟周期即可读取24位地址,实现真正的XIP操作。此外,该设备还支持JEDEC标准制造商和设备识别,以及64位唯一序列号。

### 应用信息 W25Q20BW适用于需要数据和参数存储的应用,如代码阴影到RAM、直接从双/四SPI执行代码以及存储声音、文本和数据。

### 封装信息 W25Q20BW提供8引脚塑料150-mil宽度SOIC(封装代码SN)、6x5-mm WSON(封装代码ZP)和2x3-mm USON(封装代码UX)。
W25Q20BWSNIP 价格&库存

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