0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
W25Q20EWSNIG

W25Q20EWSNIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

    SOICN-8_4.9X3.9MM

  • 描述:

    IC FLASH 2MBIT SPI 104MHZ 8SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q20EWSNIG 数据手册
W25Q20EW 1.8V 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI -1- Publication Release Date: August 22, 2017 -Revision I W25Q20EW Table of Contents 1. 2. 4. 5. 6. 7. GENERAL DESCRIPTION ......................................................................................................... 5 FEATURES ................................................................................................................................. 5 PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 4.1 Pin Configuration SOIC 150-mil and VSOP 150-mil....................................................... 6 4.2 PAD Configuration USON 2x3-mm/ USON 4x3-mm ...................................................... 6 4.3 Pin Description SOIC/ VSOP 150-mil, USON 2x3-mm/4x3-mm .................................... 6 4.4 Ball Configuration WLCSP .............................................................................................. 7 4.5 Ball Description WLCSP ................................................................................................. 7 PIN DESCRIPTIONS .................................................................................................................. 8 5.1 Chip Select (/CS) ............................................................................................................ 8 5.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)............................... 8 5.3 Write Protect (/WP) ......................................................................................................... 8 5.4 HOLD (/HOLD)................................................................................................................ 8 5.5 Serial Clock (CLK) .......................................................................................................... 8 BLOCK DIAGRAM ...................................................................................................................... 9 FUNCTIONAL DESCRIPTION.................................................................................................. 10 7.1 SPI OPERATIONS ....................................................................................................... 10 7.1.1 7.1.2 7.1.3 7.1.4 7.2 WRITE PROTECTION .................................................................................................. 11 7.2.1 8. Standard SPI Instructions ............................................................................................... 10 Dual SPI Instructions ...................................................................................................... 10 Quad SPI Instructions ..................................................................................................... 10 Hold Function .................................................................................................................. 10 Write Protect Features .................................................................................................... 11 CONTROL AND STATUS REGISTERS ................................................................................... 12 8.1 STATUS REGISTER .................................................................................................... 12 8.2 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.1.6 8.1.7 8.1.8 8.1.9 BUSY .............................................................................................................................. 12 Write Enable Latch (WEL) .............................................................................................. 12 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 12 Top/Bottom Block Protect (TB) ....................................................................................... 12 Sector/Block Protect (SEC) ............................................................................................. 12 Complement Protect (CMP) ............................................................................................ 12 Protection and Special One time Programming Setting .................................................. 13 Erase/Program Suspend Status (SUS) ........................................................................... 14 Security Register Lock Bits (LB[3:0]) – Volatile/Non-Volatile OTP Writable................. 14 8.1.1 8.1.2 8.1.3 Quad Enable (QE) .......................................................................................................... 14 Status Register Memory Protection (CMP = 0) ............................................................... 15 Status Register Memory Protection (CMP = 1) ............................................................... 16 INSTRUCTIONS ........................................................................................................... 17 8.2.1 8.2.2 8.2.3 8.3 Manufacturer and Device Identification ........................................................................... 17 Instruction Set Table 1 (Erase, Program Instructions)(1) ................................................. 18 Instruction Set Table 2 .................................................................................................... 18 Instruction Descriptions ................................................................................................ 20 8.3.1 Write Enable (06h) .......................................................................................................... 20 -2- Publication Release Date: August 22, 2017 -Revision I W25Q20EW 8.3.2 8.3.3 8.3.4 8.3.5 8.3.6 8.3.7 8.3.8 8.3.9 8.3.10 8.3.11 8.3.12 8.3.13 8.3.14 8.3.15 8.3.16 8.3.17 8.3.18 8.3.19 8.3.20 8.3.21 8.3.22 8.3.23 8.3.24 8.3.25 8.3.26 8.3.27 8.3.28 8.3.29 8.3.30 9. ELECTRICAL CHARACTERISTICS ......................................................................................... 49 9.1 Absolute Maximum Ratings (1)..................................................................................... 49 9.2 9.3 9.4 9.5 9.6 9.7 10. write Enable for Volatile Status Register (50h) ............................................................... 20 Write Disable (04h) ......................................................................................................... 21 Read Status Register-1 (05h) and Read Status Register-2 (35h) ................................... 21 Write Status Register (01h),Status Register-2 (31h) ....................................................... 22 Read Data (03h) ............................................................................................................. 23 Fast Read (0Bh).............................................................................................................. 24 Fast Read Dual Output (3Bh) ......................................................................................... 25 Fast Read Quad Output (6Bh) ........................................................................................ 26 Fast Read Dual I/O (BBh) ............................................................................................. 27 Fast Read Quad I/O (EBh)............................................................................................ 28 Set Burst with Wrap (77h) ............................................................................................. 29 Page Program (02h) ..................................................................................................... 30 Quad Input Page Program (32h) ................................................................................... 31 Sector Erase (20h) ........................................................................................................ 32 32KB Block Erase (52h)................................................................................................ 33 64KB Block Erase (D8h) ............................................................................................... 34 Chip Erase (C7h / 60h) ................................................................................................. 35 Erase / Program Suspend (75h) ................................................................................... 36 Erase / Program Resume (7Ah) .................................................................................... 37 Power-down (B9h) ........................................................................................................ 38 Release Power-down / Device ID (ABh) ....................................................................... 39 Read Manufacturer / Device ID (90h) ........................................................................... 41 Read Manufacturer / Device ID Dual I/O (92h) ............................................................. 42 Read Manufacturer / Device ID Quad I/O (94h) ............................................................ 43 Read Unique ID Number (4Bh) ..................................................................................... 44 Read JEDEC ID (9Fh) .................................................................................................. 45 Read SFDP Register (5Ah)........................................................................................... 46 Erase Security Registers (44h) ..................................................................................... 47 Program Security Registers (42h) ................................................................................. 48 Operating Ranges ......................................................................................................... 49 Power-up Timing and Write Inhibit Threshold .............................................................. 50 DC Electrical Characteristics: ....................................................................................... 51 AC Measurement Conditions ........................................................................................ 52 AC Electrical Characteristics: ....................................................................................... 53 AC Electrical Characteristics (cont’d) ........................................................................ 54 9.8 Serial Output Timing ..................................................................................................... 55 9.9 Serial Input Timing ........................................................................................................ 55 9.10 Hold Timing ................................................................................................................... 55 9.11 /WP Timing ................................................................................................................... 55 PACKAGE SPECIFICATION .................................................................................................... 56 10.1 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 56 10.2 8-Pin VSOP8 150-mil (Package Code SV) ................................................................... 57 10.3 8-Pad USON 2x3x0.6-mm^³ (Package Code UX) ....................................................... 58 -3- Publication Release Date: August 22, 2017 -Revision I W25Q20EW 11. 12. 10.4 8-Pad USON 4x3-mm (Package Code UU) ................................................................. 59 10.5 8-Ball WLCSP (Package Code BY) .............................................................................. 60 ORDERING INFORMATION..................................................................................................... 61 11.1 Valid Part Numbers and Top Side Marking .................................................................. 62 REVISION IISTORY.................................................................................................................. 63 -4- Publication Release Date: August 22, 2017 -Revision I W25Q20EW 1. GENERAL DESCRIPTION The W25Q20EW (2M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 1µA for power-down. All devices are offered in spacesaving packages. The W25Q20EW array are organized into 1,024 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. The W25Q20EW have 64 erasable sectors, 8 erasable 32KB blocks and 4 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q20EW support the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protect, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES  Family of SpiFlash Memories – 2M-bit/256K-byte (262,144) – 256-byte per programmable page – Uniform 4KB Sectors, 32KB & 64KB Blocks  Advanced Security Features – Power Supply Lock-Down – Speical OTP protection – Top/Bottom, Complement array protection – Discoverable Parameters (SFDP) Register – 3X256-Byte Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  SPI with Single / Dual Outputs / I/O – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3  Low Power, Wide Temperature Range – Single 1.65 to 1.95V supply – 1mA active current,
W25Q20EWSNIG
物料型号:W25Q20EW 器件简介:W25Q20EW是Winbond公司生产的2M位串行闪存,具有4KB扇区、双/四SPI接口,适用于空间、引脚和功率有限的系统。

引脚分配:W25Q20EW有多种封装类型,包括SOIC 150-mil、VSOP 150-mil、USON 2x3-mm、USON 4x3-mm和WLCSP。

每种封装类型的引脚功能可能有所不同,但通常包括电源VCC、地GND、片选/CS、时钟CLK、数据输入DI、数据输出DO以及用于双/四SPI的附加I/O引脚。

参数特性:该器件支持1.65V至1.95V的电源电压,具有低功耗特性,例如在掉电模式下电流消耗低至1µA。

它还支持高达104MHz的SPI时钟频率,以及双/四SPI输出和双/四SPI输入/输出模式,以提高数据传输速率。

功能详解:W25Q20EW支持多种操作模式,包括标准SPI、双SPI和四SPI,以及页编程、扇区擦除、块擦除和芯片擦除等。

此外,它还具有写保护功能、电源锁定、特殊的一次性编程保护和可发现参数(SFDP)寄存器。

应用信息:W25Q20EW适用于需要高速数据传输和灵活存储解决方案的应用,如代码阴影到RAM、直接从双/四SPI执行代码(XIP)以及存储声音、文本和数据。

封装信息:W25Q20EW提供多种封装选项,包括8引脚SOIC 150-mil、8引脚VSOP 150-mil、8引脚USON 2x3-mm、8引脚USON 4x3-mm和8球WLCSP。

这些封装类型在尺寸、形状和引脚配置上有所不同,以满足不同的应用和设计需求。
W25Q20EWSNIG 价格&库存

很抱歉,暂时无法提供与“W25Q20EWSNIG”相匹配的价格&库存,您可以联系我们找货

免费人工找货