W25Q32BVTCAG

W25Q32BVTCAG

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q32BVTCAG - 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q32BVTCAG 数据手册
W25Q32BV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: April 01, 2011 Revision F W25Q32BV Table of Contents 1. 2. 3. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES ....................................................................................................................................... 5 PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC 208-mil ........................................................................................... 6 Pad Configuration WSON 6x5-mm / 8X6-mm ..................................................................... 6 Pin Configuration PDIP 300-mil ............................................................................................ 7 Pin Description SOIC 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil ............................... 7 Pin Configuration SOIC 300-mil ........................................................................................... 8 Pin Description SOIC 300-mil ............................................................................................... 8 Ball Configuration TFBGA 8x6-mm ...................................................................................... 9 Ball Description TFBGA 8x6-mm ......................................................................................... 9 Chip Select (/CS) ................................................................................................................ 10 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 10 W rite Protect (/WP) ............................................................................................................ 10 HOLD (/HOLD) ................................................................................................................... 10 Serial Clock (CLK) .............................................................................................................. 10 PIN DESCRIPTIONS ...................................................................................................................... 10 BLOCK DIAGRAM .......................................................................................................................... 11 FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 SPI OPERATIONS ............................................................................................................. 12 6.1.1 6.1.2 6.1.3 6.1.4 Standard SPI Instructions..................................................................................................... 12 Dual SPI Instructions ............................................................................................................ 12 Quad SPI Instructions .......................................................................................................... 12 Hold Function ....................................................................................................................... 12 W rite Protect Features ......................................................................................................... 13 6.2 7. W RITE PROTECTION ....................................................................................................... 13 6.2.1 STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14 7.1 STATUS REGISTERS........................................................................................................ 14 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 7.1.7 7.1.8 7.1.9 BUSY Status (BUSY) ........................................................................................................... 14 W rite Enable Latch Status (WEL) ........................................................................................ 14 Block Protect Bits (BP2, BP1, BP0) ..................................................................................... 14 Top/Bottom Block Protect Bit (TB) ....................................................................................... 14 Sector/Block Protect Bit (SEC) ............................................................................................. 14 Complement Protect Bit (CMP) ............................................................................................ 15 Status Register Protect Bits (SRP1, SRP0) ......................................................................... 15 Erase/Program Suspend Status (SUS) ................................................................................ 15 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 15 -2- W25Q32BV 7.1.10 7.1.11 7.1.12 Quad Enable Bit (QE)......................................................................................................... 16 Status Register Memory Protection (CMP = 0) .................................................................. 17 Status Register Memory Protection (CMP = 1) .................................................................. 18 Manufacturer and Device Identification ................................................................................ 19 Instruction Set Table 1 (Erase, Program Instructions) ......................................................... 20 Instruction Set Table 2 (Read Instructions) .......................................................................... 21 Instruction Set Table 3 (ID, Security Instructions) ................................................................ 22 W rite Enable (06h) ............................................................................................................... 23 W rite Enable for Volatile Status Register (50h).................................................................... 23 W rite Disable (04h) .............................................................................................................. 24 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 25 W rite Status Register (01h) .................................................................................................. 25 Read Data (03h) ................................................................................................................. 27 Fast Read (0Bh) ................................................................................................................. 28 Fast Read Dual Output (3Bh) ............................................................................................. 29 Fast Read Quad Output (6Bh) ........................................................................................... 30 Fast Read Dual I/O (BBh) .................................................................................................. 31 Fast Read Quad I/O (EBh) ................................................................................................. 33 W ord Read Quad I/O (E7h) ................................................................................................ 35 Octal Word Read Quad I/O (E3h) ...................................................................................... 37 Set Burst with Wrap (77h) .................................................................................................. 39 Continuous Read Mode Bits (M7-0) ................................................................................... 40 Continuous Read Mode Reset (FFh or FFFFh).................................................................. 40 Page Program (02h) ........................................................................................................... 41 Quad Input Page Program (32h) ........................................................................................ 42 Sector Erase (20h) ............................................................................................................. 43 32KB Block Erase (52h) ..................................................................................................... 44 64KB Block Erase (D8h) .................................................................................................... 45 Chip Erase (C7h / 60h)....................................................................................................... 46 Erase / Program Suspend (75h)......................................................................................... 47 Erase / Program Resume (7Ah) ......................................................................................... 48 Power-down (B9h) .............................................................................................................. 49 Release Power-down / Device ID (ABh)............................................................................. 50 Read Manufacturer / Device ID (90h) ................................................................................. 52 Read Manufacturer / Device ID Dual I/O (92h)................................................................... 53 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 54 Read Unique ID Number (4Bh) .......................................................................................... 55 Read JEDEC ID (9Fh) ........................................................................................................ 56 Read SFDP Register (5Ah) ................................................................................................ 57 Erase Security Registers (44h) .......................................................................................... 60 7.2 INSTRUCTIONS................................................................................................................. 19 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 7.2.8 7.2.9 7.2.10 7.2.11 7.2.12 7.2.13 7.2.14 7.2.15 7.2.16 7.2.17 7.2.18 7.2.19 7.2.20 7.2.21 7.2.22 7.2.23 7.2.24 7.2.25 7.2.26 7.2.27 7.2.28 7.2.29 7.2.30 7.2.31 7.2.32 7.2.33 7.2.34 7.2.35 7.2.36 7.2.37 -3- Publication Release Date: April 01, 2011 Revision F W25Q32BV 7.2.38 7.2.39 Program Security Registers (42h) ...................................................................................... 61 Read Security Registers (48h) ........................................................................................... 62 8. ELECTRICAL CHARACTERISTICS ............................................................................................... 63 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 Absolute Maximum Ratings ................................................................................................ 63 Operating Ranges............................................................................................................... 63 Power-up Timing and Write Inhibit Threshold .................................................................... 64 DC Electrical Characteristics .............................................................................................. 65 AC Measurement Conditions .............................................................................................. 66 AC Electrical Characteristics .............................................................................................. 67 AC Electrical Characteristics (cont’d) ................................................................................. 68 Serial Output Timing ........................................................................................................... 69 Serial Input Timing .............................................................................................................. 69 /HOLD Timing ..................................................................................................................... 69 /WP Timing ......................................................................................................................... 69 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 70 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72 8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75 24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76 Valid Part Numbers and Top Side Marking ........................................................................ 78 9. PACKAGE SPECIFICATION .......................................................................................................... 70 9.1 9.2 9.3 9.4 9.5 9.6 10. 11. ORDERING INFORMATION .......................................................................................................... 77 10.1 REVISION HISTORY ...................................................................................................................... 79 -4- W25Q32BV 1. GENERAL DESCRIPTION The W25Q32BV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. The W25Q32BV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32BV has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q32BV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W 25Q32BV: 32M-bit / 4M-byte (4,194,304) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 104MHz Dual SPI / 80MHz Quad SPI clocks – 208/320MHz equivalent Dual/Quad SPI – 40MB/S continuous data transfer rate – Up to 8X that of ordinary Serial Flash (1) – More than 100,000 erase/program cycles – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q32BVTCAG
### 物料型号 - 型号:W25Q32BV - 制造商:Winbond - 类型:SPI Flash 存储器,具有 4KB 扇区和双/四线 I/O 接口 - 容量:32M-bit

### 器件简介 W25Q32BV 是一款由Winbond生产的SPI Flash存储器,具有32M位的存储容量。它支持双线和四线SPI接口,适用于需要有限空间、引脚和功耗的系统。25Q系列提供了超越普通SPI Flash设备的灵活性和性能,非常适合于RAM中代码阴影、直接从双/四SPI(XIP)执行代码以及存储声音、文本和数据。

### 引脚分配 - SOIC 208-mil:8引脚封装 - WSON 6x5-mm / 8x6-mm:8焊盘封装 - PDIP 300-mil:8引脚双列直插封装 - TFBGA 8x6-mm:24球网格阵列封装

### 参数特性 - 供电电压:2.7V 至 3.6V - 工作电流:活动时低至4mA,掉电模式下小于1µA - 存储组织:16,384个可编程页面,每个页面256字节 - 擦除选项:可以以16个页面(4KB扇区擦除)、128个页面(32KB块擦除)、256个页面(64KB块擦除)或整个芯片(芯片擦除)为单位进行擦除

### 功能详解 W25Q32BV支持标准SPI、双SPI和四SPI操作。它还支持连续读取模式,以最少的时钟周期读取24位地址,实现真正的XIP操作。此外,该设备还具有硬件写保护、顶部/底部数组控制、电源锁定和OTP保护等高级安全功能。

### 应用信息 W25Q32BV适用于需要高速数据传输和存储的应用,如代码存储、数据记录和参数存储。它的低功耗特性使其适合电池供电的应用。

### 封装信息 W25Q32BV提供多种封装选项,包括SOIC、WSON、PDIP和TFBGA封装,以满足不同的应用和空间要求。
W25Q32BVTCAG 价格&库存

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