W25Q32DWZEIP

W25Q32DWZEIP

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q32DWZEIP - 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q32DWZEIP 数据手册
W25Q32DW 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI -1- Publication Release Date: January 18, 2011 Preliminary - Revision C W25Q32DW Table of Contents 1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES ....................................................................................................................................... 5 PIN CONFIGURATION SOIC 208-MIL ............................................................................................ 6 PAD CONFIGURATION WSON 6X5-MM / 8X6-MM ....................................................................... 6 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM............................................................... 6 PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 7 PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 7 7.1 7.2 7.3 7.4 7.5 7.6 8. 9. Package Types ..................................................................................................................... 8 Chip Select (/CS) .................................................................................................................. 8 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8 Write Protect (/WP)............................................................................................................... 8 HOLD (/HOLD) ..................................................................................................................... 8 Serial Clock (CLK) ................................................................................................................ 8 BLOCK DIAGRAM ............................................................................................................................ 9 FUNCTIONAL DESCRIPTION ....................................................................................................... 10 9.1 SPI/QPI OPERATIONS ...................................................................................................... 10 9.1.1 9.1.2 9.1.3 9.1.4 9.1.5 Standard SPI Instructions ..................................................................................................... 10 Dual SPI Instructions ............................................................................................................ 10 Quad SPI Instructions ........................................................................................................... 11 QPI Instructions .................................................................................................................... 11 Hold Function ........................................................................................................................ 11 Write Protect Features .......................................................................................................... 12 9.2 10. WRITE PROTECTION ....................................................................................................... 12 9.2.1 CONTROL AND STATUS REGISTERS ........................................................................................ 13 10.1 STATUS REGISTER .......................................................................................................... 13 10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 10.1.8 10.1.9 10.1.10 10.1.11 BUSY .................................................................................................................................. 13 Write Enable Latch (WEL) .................................................................................................. 13 Block Protect Bits (BP2, BP1, BP0) .................................................................................... 13 Top/Bottom Block Protect (TB) ........................................................................................... 13 Sector/Block Protect (SEC) ................................................................................................. 13 Complement Protect (CMP) ................................................................................................ 14 Status Register Protect (SRP1, SRP0) ............................................................................... 14 Erase/Program Suspend Status (SUS) ............................................................................... 14 Security Register Lock Bits (LB3, LB2, LB1, LB0) .............................................................. 14 Quad Enable (QE) ............................................................................................................ 15 W25Q32DW Status Register Memory Protection (CMP = 0) ............................................ 16 -2- W25Q32DW 10.1.12 W25Q32DW Status Register Memory Protection (CMP = 1) ............................................ 17 Manufacturer and Device Identification ............................................................................... 18 Instruction Set Table 1 (Standard SPI Instructions) ............................................................ 19 Instruction Set Table 2 (Dual SPI Instructions) ................................................................... 20 Instruction Set Table 3 (Quad SPI Instructions) .................................................................. 20 Instruction Set Table 4 (QPI Instructions) ........................................................................... 21 Write Enable (06h) .............................................................................................................. 23 Write Enable for Volatile Status Register (50h) ................................................................... 23 Write Disable (04h) ............................................................................................................. 24 Read Status Register-1 (05h) and Read Status Register-2 (35h) ....................................... 24 Write Status Register (01h) ............................................................................................... 25 Read Data (03h) ............................................................................................................... 27 Fast Read (0Bh)................................................................................................................ 28 Fast Read Dual Output (3Bh) ........................................................................................... 30 Fast Read Quad Output (6Bh) .......................................................................................... 31 Fast Read Dual I/O (BBh) ................................................................................................. 32 Fast Read Quad I/O (EBh) ................................................................................................ 34 Word Read Quad I/O (E7h) .............................................................................................. 37 Octal Word Read Quad I/O (E3h) ..................................................................................... 39 Set Burst with Wrap (77h) ................................................................................................. 41 Page Program (02h) ......................................................................................................... 42 Quad Input Page Program (32h) ....................................................................................... 44 Sector Erase (20h) ............................................................................................................ 45 32KB Block Erase (52h) .................................................................................................... 46 64KB Block Erase (D8h) ................................................................................................... 47 Chip Erase (C7h / 60h) ..................................................................................................... 48 Erase / Program Suspend (75h) ....................................................................................... 49 Erase / Program Resume (7Ah) ........................................................................................ 51 Power-down (B9h) ............................................................................................................ 52 Release Power-down / Device ID (ABh) ........................................................................... 53 Read Manufacturer / Device ID (90h) ............................................................................... 55 Read Manufacturer / Device ID Dual I/O (92h) ................................................................. 56 Read Manufacturer / Device ID Quad I/O (94h) ................................................................ 57 Read Unique ID Number (4Bh) ......................................................................................... 58 Read JEDEC ID (9Fh) ...................................................................................................... 59 Erase Security Registers (44h) ......................................................................................... 60 Program Security Registers (42h) ..................................................................................... 61 Read Security Registers (48h) .......................................................................................... 62 Set Read Parameters (C0h) ............................................................................................. 63 Burst Read with Wrap (0Ch) ............................................................................................. 64 10.2 INSTRUCTIONS................................................................................................................. 18 10.2.1 10.2.2 10.2.3 10.2.4 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 10.2.18 10.2.19 10.2.20 10.2.21 10.2.22 10.2.23 10.2.24 10.2.25 10.2.26 10.2.27 10.2.28 10.2.29 10.2.30 10.2.31 10.2.32 10.2.33 10.2.34 10.2.35 10.2.36 10.2.37 10.2.38 10.2.39 -3- Publication Release Date: January 18, 2011 Preliminary - Revision C W25Q32DW 10.2.40 10.2.41 10.2.42 Enable QPI (38h) .............................................................................................................. 65 Disable QPI (FFh) ............................................................................................................. 66 Enable Reset (66h) and Reset (99h) ................................................................................ 67 11. ELECTRICAL CHARACTERISTICS .............................................................................................. 68 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 Absolute Maximum Ratings................................................................................................ 68 Operating Ranges .............................................................................................................. 68 Power-up Timing and Write Inhibit Threshold .................................................................... 69 DC Electrical Characteristics .............................................................................................. 70 AC Measurement Conditions ............................................................................................. 71 AC Electrical Characteristics .............................................................................................. 72 AC Electrical Characteristics (cont’d) ................................................................................. 73 Serial Output Timing ........................................................................................................... 74 Serial Input Timing.............................................................................................................. 74 Hold Timing ....................................................................................................................... 74 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 75 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 76 8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 78 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 79 Valid Part Numbers and Top Side Marking ........................................................................ 81 12. PACKAGE SPECIFICATION .......................................................................................................... 75 12.1 12.2 12.3 12.4 13. 14. ORDERING INFORMATION .......................................................................................................... 80 13.1 REVISION HISTORY ...................................................................................................................... 82 -4- W25Q32DW 1. GENERAL DESCRIPTION The W25Q32DW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.7V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages. The W25Q32DW array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32DW has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q32DW support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification, a 64-bit Unique Serial Number and four 256-bytes Security Registers. 2. FEATURES • Family of SpiFlash Memories – W25Q32DW: 32M-bit / 4M-byte (4,194,304) – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 104MHz Standard/Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/s continuous data transfer rate – More than 100,000 erase/program cycles – More than 20-year data retention • Efficient “Continuous Read” and QPI Mode – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Quad Peripheral Interface (QPI) reduces instruction overhead – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range – Single 1.7 to 1.95V supply – 4mA active current,
W25Q32DWZEIP
### 物料型号 - 型号:W25Q32DW - 制造商:Winbond - 类型:SPI Flash存储器,32M位

### 器件简介 W25Q32DW是一款由Winbond生产的1.8V 32M位串行闪存存储器,支持双/四线SPI和四线外围设备接口(QPI)。它适用于空间、引脚和功耗有限的系统,提供灵活性和性能,适用于代码阴影到RAM、直接从双/四SPI执行代码以及存储声音、文本和数据。该设备在1.7V至1.95V的单电源供电下工作,活动时电流消耗低至4mA,掉电模式下小于1µA。所有设备都提供节省空间的封装。

### 引脚分配 - SOIC 208-MIL:8引脚封装,包括芯片选择(/CS)、数据输入输出(IO0, IO1, IO2, IO3)、写保护(/WP)、保持(/HOLD)、时钟(CLK)、地(GND)和电源(VCC)。 - WSON 6X5-MM / 8X6-MM:8接触点封装,引脚配置与SOIC 208-MIL相似。

### 参数特性 - 存储容量:32M位(4M字节) - 电源电压:1.7V至1.95V - 操作电流:活动时4mA,掉电模式下小于1µA - 封装类型:8-pin SOIC 208-mil、8-contact 6x5mm WSON、8-contact 8x6mm WSON、16-pin SOIC 300-mil

### 功能详解 W25Q32DW支持标准SPI、双SPI、四SPI和QPI操作。它还支持连续读取模式,允许高效的内存访问,最少只需8个时钟周期即可读取24位地址,实现真正的XIP(原位执行)操作。此外,该设备还提供软件和硬件写保护、顶部/底部、4KB互补数组保护、电源供应锁定和一次性编程(OTP)保护。

### 应用信息 W25Q32DW适用于需要数据和参数存储的应用,如汽车电子、工业控制、医疗设备和物联网设备。

### 封装信息 W25Q32DW提供多种封装选项,包括8-pin SOIC 208-mil、8-contact 6x5mm WSON、8-contact 8x6mm WSON和16-pin SOIC 300-mil。这些封装选项有助于在设计中实现空间优化和性能需求。
W25Q32DWZEIP 价格&库存

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