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W25Q32FVSSIQ

W25Q32FVSSIQ

  • 厂商:

    WINBOND(华邦)

  • 封装:

    SOIC-8_5.275X5.275MM

  • 描述:

    IC FLASH 32MBIT SPI/QUAD 8SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q32FVSSIQ 数据手册
W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: June 03, 2016 Revision J W25Q32FV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 4. 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil.................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm ...................................... 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil ............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 3.8 Pin Configuration PDIP 300-mil ............................................................................................ 9 3.9 Pin Description PDIP 300-mil ............................................................................................... 9 PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 10 4.3 Write Protect (/WP) ............................................................................................................ 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 4.6 Reset (/RESET) .................................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 6.2 SPI / QPI Operations .......................................................................................................... 12 6.1.1 Standard SPI Instructions .................................................................................................... 12 6.1.2 Dual SPI Instructions ............................................................................................................ 12 6.1.3 Quad SPI Instructions .......................................................................................................... 13 6.1.4 QPI Instructions .................................................................................................................... 13 6.1.5 Hold Function ....................................................................................................................... 13 6.1.6 Software Reset & Hardware /RESET pin ............................................................................. 14 Write Protection .................................................................................................................. 15 6.2.1 7. Write Protect Features ......................................................................................................... 15 STATUS AND CONFIGURATION REGISTERS ............................................................................ 16 7.1 Status Registers ................................................................................................................. 16 7.1.1 Erase/Write In Progress (BUSY) – Status Only ................................................................... 16 7.1.2 Write Enable Latch (WEL) – Status Only ............................................................................. 16 7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ................................... 16 -1- W25Q32FV 8. 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable .......................................... 17 7.1.5 Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable .......................................... 17 7.1.6 Complement Protect (CMP) – Volatile/Non-Volatile Writable............................................... 17 7.1.7 Status Register Protect (SRP1, SRP0) – Volatile/Non-Volatile Writable.............................. 17 7.1.8 Erase/Program Suspend Status (SUS) – Status Only ......................................................... 18 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable ............. 18 7.1.10 Quad Enable (QE) – Volatile/Non-Volatile Writable ........................................................... 18 7.1.11 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ........................................ 19 7.1.12 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ............................ 19 7.1.13 HOLD or /RESET Pin Function (HOLD/RST) – Volatile/Non-Volatile Writable .................. 19 7.1.14 Reserved Bits – Non Functional ......................................................................................... 20 7.1.15 W25Q32FV Status Register Memory Protection (WPS = 0, CMP = 0) .............................. 21 7.1.16 W25Q32FV Status Register Memory Protection (WPS = 0, CMP = 1) .............................. 22 7.1.17 W25Q32FV Individual Block Memory Protection (WPS=1) ............................................... 23 INSTRUCTIONS ............................................................................................................................. 24 8.1 8.2 Device ID and Instruction Set Tables ................................................................................. 24 8.1.1 Manufacturer and Device Identification ................................................................................ 24 8.1.2 Instruction Set Table 1 (Standard/Dual/Quad SPI Instructions)(1) ........................................ 25 8.1.3 Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions) (1) ........................................ 26 8.1.4 Instruction Set Table 3 (QPI Instructions)(14) ........................................................................ 27 Instruction Descriptions ...................................................................................................... 29 8.2.1 Write Enable (06h) ............................................................................................................... 29 8.2.2 Write Enable for Volatile Status Register (50h) ................................................................... 29 8.2.3 Write Disable (04h) .............................................................................................................. 30 8.2.4 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 30 8.2.5 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 31 8.2.6 Read Data (03h) ................................................................................................................... 34 8.2.7 Fast Read (0Bh) ................................................................................................................... 35 8.2.8 Fast Read Dual Output (3Bh) ............................................................................................... 37 8.2.9 Fast Read Quad Output (6Bh) ............................................................................................. 38 8.2.10 Fast Read Dual I/O (BBh) .................................................................................................. 39 8.2.11 Fast Read Quad I/O (EBh) ................................................................................................. 41 8.2.12 Word Read Quad I/O (E7h)................................................................................................ 44 8.2.13 Octal Word Read Quad I/O (E3h) ...................................................................................... 46 8.2.14 Set Burst with Wrap (77h) .................................................................................................. 48 8.2.15 Page Program (02h) ........................................................................................................... 49 8.2.16 Quad Input Page Program (32h) ........................................................................................ 51 8.2.17 Sector Erase (20h) ............................................................................................................. 52 8.2.18 32KB Block Erase (52h) ..................................................................................................... 53 8.2.19 64KB Block Erase (D8h) .................................................................................................... 54 8.2.20 Chip Erase (C7h / 60h) ...................................................................................................... 55 -2- Publication Release Date: June 03, 2016 Revision J W25Q32FV 9. Erase / Program Suspend (75h) ........................................................................................ 56 8.2.22 Erase / Program Resume (7Ah) ......................................................................................... 58 8.2.23 Power-down (B9h) .............................................................................................................. 59 8.2.24 Release Power-down / Device ID (ABh)............................................................................. 60 8.2.25 Read Manufacturer / Device ID (90h) ................................................................................. 62 8.2.26 Read Manufacturer / Device ID Dual I/O (92h) .................................................................. 63 8.2.27 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 64 8.2.28 Read Unique ID Number (4Bh) .......................................................................................... 65 8.2.29 Read JEDEC ID (9Fh) ........................................................................................................ 66 8.2.30 Read SFDP Register (5Ah) ................................................................................................ 67 8.2.31 Erase Security Registers (44h) .......................................................................................... 68 8.2.32 Program Security Registers (42h) ...................................................................................... 69 8.2.33 Read Security Registers (48h) ........................................................................................... 70 8.2.34 Set Read Parameters (C0h) ............................................................................................... 71 8.2.35 Burst Read with Wrap (0Ch) .............................................................................................. 72 8.2.36 Enter QPI Mode (38h) ........................................................................................................ 73 8.2.37 Exit QPI Mode (FFh) .......................................................................................................... 74 8.2.38 Individual Block/Sector Lock (36h) ..................................................................................... 75 8.2.39 Individual Block/Sector Unlock (39h) ................................................................................. 76 8.2.40 Read Block/Sector Lock (3Dh) ........................................................................................... 77 8.2.41 Global Block/Sector Lock (7Eh) ......................................................................................... 78 8.2.42 Global Block/Sector Unlock (98h) ...................................................................................... 78 8.2.43 Enable Reset (66h) and Reset Device (99h)...................................................................... 79 ELECTRICAL CHARACTERISTICS ............................................................................................... 80 9.1 Absolute Maximum Ratings (1)(2) ................................................................................... 80 9.2 9.3 Operating Ranges............................................................................................................... 80 Power-Up Power-Down Timing and Requirements(1) ....................................................... 81 9.5 DC Electrical Characteristics(1).......................................................................................... 82 AC Measurement Conditions(1) ......................................................................................... 83 9.6 AC Electrical Characteristics(6) ........................................................................................... 84 9.7 Serial Output Timing ........................................................................................................... 86 9.8 Serial Input Timing .............................................................................................................. 86 9.9 HOLD Timing ...................................................................................................................... 86 9.10 WP Timing .......................................................................................................................... 86 9.4 10. 8.2.21 PACKAGE SPECIFICATIONS ........................................................................................................ 87 10.1 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 87 10.2 8-Pin VSOP 208-mil (Package Code ST) ........................................................................... 88 10.3 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 89 10.4 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 90 -3- W25Q32FV 11. 10.5 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 91 10.6 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 92 10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) .......................................... 93 10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................. 94 ORDERING INFORMATION .......................................................................................................... 95 11.1 12. Valid Part Numbers and Top Side Marking ........................................................................ 96 REVISION HISTORY ...................................................................................................................... 97 -4- Publication Release Date: June 03, 2016 Revision J W25Q32FV 1. GENERAL DESCRIPTIONS The W25Q32FV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q32FV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32FV has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q32FV support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-bit Unique Serial Number and three 256-bytes Security Registers. 2. FEATURES  New Family of SpiFlash Memories – W25Q32FV: 32M-bit / 4M-byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset  Highest Performance Serial Flash – 104MHz Single, Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/S continuous data transfer rate – More than 100,000 erase/program cycles – More than 20-year data retention  Efficient “Continuous Read” and QPI Mode – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Quad Peripheral Interface (QPI) reduces instruction overhead – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q32FVSSIQ
物料型号:W25Q32FV

器件简介: W25Q32FV是一款由Winbond生产的SPI Flash存储器,具有32M位(4M字节)的存储容量。它为有限空间、引脚和功率的系统提供存储解决方案。该系列提供超越普通SPI Flash设备的灵活性和性能,非常适合于RAM中代码阴影、直接从Dual/Quad SPI执行代码以及存储声音、文本和数据。

引脚分配: - SOIC 208-mil / VSOP 208-mil:8个引脚,包括VCC、/HOLD或/RESET (IO3)、DO (IO1)、/WP (IO2)、CLK、DI (IO0)、GND等。 - WSON 6x5-mm / 8x6-mm:8个焊盘,功能与SOIC/VSOP类似,但封装不同。 - SOIC 300-mil:16个引脚,增加了/RESET引脚,其他功能类似但引脚数量不同。

参数特性: - 操作电压:2.7V至3.6V - 存储阵列分为16,384个可编程页面,每个页面256字节 - 页面可以4KB、32KB、64KB或整个芯片擦除 - 支持标准SPI、Dual/Quad SPI以及QPI操作 - SPI时钟频率高达104MHz,Dual I/O和Quad I/O等效频率分别为208MHz和416MHz

功能详解: - 支持连续读取模式和QPI模式,减少指令开销 - 支持硬件和软件写保护 - 提供JEDEC标准制造商和设备ID,以及SFDP寄存器 - 支持64位唯一序列号和三个256字节的安全寄存器

应用信息: 适用于需要数据存储和代码执行的应用,如工业控制、消费电子、汽车电子等领域。

封装信息: 提供多种封装类型,包括SOIC、VSOP、WSON、PDIP和TFBGA等,以适应不同的应用需求和空间限制。
W25Q32FVSSIQ 价格&库存

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