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W25Q32VZEIG

W25Q32VZEIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q32VZEIG - 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q32VZEIG 数据手册
W25Q32V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: August 19, 2009 Preliminary - Revision E W25Q32V Table of Contents 1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES ....................................................................................................................................... 5 PIN CONFIGURATION SOIC 208-MIL ............................................................................................ 6 PAD CONFIGURATION WSON 6X5-MM / 8X6-MM ....................................................................... 6 PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM ............................................................. 6 PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 7 PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 7 7.1 7.2 7.3 7.4 7.5 7.6 8. 9. Package Types ..................................................................................................................... 8 Chip Select (/CS) .................................................................................................................. 8 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8 Write Protect (/WP)............................................................................................................... 8 HOLD (/HOLD) ..................................................................................................................... 8 Serial Clock (CLK) ................................................................................................................ 8 BLOCK DIAGRAM ............................................................................................................................ 9 FUNCTIONAL DESCRIPTION ....................................................................................................... 10 9.1 SPI OPERATIONS ............................................................................................................. 10 9.1.1 9.1.2 9.1.3 9.1.4 Standard SPI Instructions .....................................................................................................10 Dual SPI Instructions ............................................................................................................10 Quad SPI Instructions...........................................................................................................10 Hold Function .......................................................................................................................10 Write Protect Features..........................................................................................................11 9.2 10. WRITE PROTECTION ....................................................................................................... 11 9.2.1 CONTROL AND STATUS REGISTERS ........................................................................................ 12 10.1 STATUS REGISTER .......................................................................................................... 12 10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 10.1.8 10.1.9 BUSY..................................................................................................................................12 Write Enable Latch (WEL) ..................................................................................................12 Block Protect Bits (BP2, BP1, BP0) ....................................................................................12 Top/Bottom Block Protect (TB) ...........................................................................................12 Sector/Block Protect (SEC) ................................................................................................12 Status Register Protect (SRP1, SRP0)...............................................................................13 Quad Enable (QE) ..............................................................................................................13 Erase Suspend Status (SUS) .............................................................................................13 Status Register Memory Protection ....................................................................................15 Manufacturer and Device Identification ..............................................................................16 Instruction Set Table 1........................................................................................................17 10.2 INSTRUCTIONS................................................................................................................. 16 10.2.1 10.2.2 -2- W25Q32V 10.2.3 10.2.4 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 10.2.18 10.2.19 10.2.20 10.2.21 10.2.22 10.2.23 10.2.24 10.2.25 10.2.26 10.2.27 10.2.28 Instruction Set Table 2 (Read Instructions) ........................................................................18 Write Enable (06h)..............................................................................................................19 Write Disable (04h) .............................................................................................................19 Read Status Register-1 (05h) and Read Status Register-2 (35h) .......................................20 Write Status Register (01h) ................................................................................................21 Read Data (03h) .................................................................................................................22 Fast Read (0Bh) .................................................................................................................23 Fast Read Dual Output (3Bh) ...........................................................................................24 Fast Read Quad Output (6Bh) ..........................................................................................25 Fast Read Dual I/O (BBh).................................................................................................26 Fast Read Quad I/O (EBh) ...............................................................................................28 Octal Word Read Quad I/O (E3h) .....................................................................................30 Page Program (02h) .........................................................................................................32 Quad Input Page Program (32h) ......................................................................................33 Sector Erase (20h) ...........................................................................................................34 32KB Block Erase (52h) ...................................................................................................35 64KB Block Erase (D8h) ...................................................................................................36 Chip Erase (C7h / 60h) .....................................................................................................37 Erase Suspend (75h) ........................................................................................................38 Erase Resume (7Ah) ........................................................................................................39 Power-down (B9h) ............................................................................................................40 Release Power-down / Device ID (ABh) ...........................................................................40 Read Manufacturer / Device ID (90h) ...............................................................................42 Read Unique ID Number (4Bh).........................................................................................43 JEDEC ID (9Fh)................................................................................................................44 Continuous Read Mode Reset (FFh or FFFFh) ................................................................45 11. ELECTRICAL CHARACTERISTICS (PRELIMINARY) .................................................................. 46 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 Absolute Maximum Ratings ................................................................................................ 46 Operating Ranges .............................................................................................................. 46 Power-up Timing and Write Inhibit Threshold .................................................................... 47 DC Electrical Characteristics .............................................................................................. 48 AC Measurement Conditions ............................................................................................. 49 AC Electrical Characteristics .............................................................................................. 50 AC Electrical Characteristics (cont’d) ................................................................................. 51 Serial Output Timing ........................................................................................................... 52 Input Timing ........................................................................................................................ 52 Hold Timing ....................................................................................................................... 52 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 53 Publication Release Date: August 19, 2009 Preliminary - Revision E 12. PACKAGE SPECIFICATION .......................................................................................................... 53 12.1 -3- W25Q32V 12.2 12.3 12.4 13. 14. 13.1 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 54 8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 56 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 57 Valid Part Numbers and Top Side Marking ........................................................................ 59 ORDERING INFORMATION .......................................................................................................... 58 REVISION HISTORY ...................................................................................................................... 60 REVISION HISTORY (CONT) .................................................................................................................... 61 -4- W25Q32V 1. GENERAL DESCRIPTION The W25Q32V (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q32V array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32V has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q32V supports the standard Serial Peripheral Interface (SPI), and a Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are supported allowing equivalent clock rates of 160MHz for Dual Output and 320MHz for Quad Output when using the Fast Read Dual/Quad Output instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instructionoverhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES  Family of SpiFlash Memories – W25Q32: 32M-bit / 4M-byte (4,194,304) – 256-bytes per programmable page  Standard, Dual or Quad SPI – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO 0 , IO 1 , /WP, /Hold – Quad SPI: CLK, /CS, IO 0 , IO 1 , IO 2 , IO 3  Highest Performance Serial Flash – Up to 6X that of ordinary Serial Flash – 80MHz clock operation – 160MHz equivalent Dual SPI – 320MHz equivalent Quad SPI – 40MB/S continuous data transfer rate  Efficient “Continuous Read Mode” – Low Instruction overhead – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q32VZEIG
1. 物料型号: - W25Q32V:Winbond生产的SPI闪存,容量为32M位。

2. 器件简介: - W25Q32V是一款32M位(4MB)的串行闪存,提供灵活性和性能,适用于代码阴影到RAM、直接从双/四SPI(XIP)执行代码以及存储声音、文本和数据。该设备在2.7V至3.6V的单电源下工作,活动时电流消耗低至4mA,掉电模式下小于1µA。所有设备都提供节省空间的封装。

3. 引脚分配: - SOIC 208-MIL:8引脚封装,包括Chip Select(/CS),数据输入输出(DI, DO和IO0, IO1, IO2, IO3),写保护(/WP)和保持(/HOLD)。 - WSON 6X5-MM / 8X6-MM:8接触点封装,配置与SOIC类似,但尺寸不同。

4. 参数特性: - 支持标准SPI、双SPI和四SPI操作,SPI时钟频率高达80MHz,双输出等效160MHz,四输出等效320MHz。 - 连续读取模式下,最少只需8个时钟周期即可读取24位地址,实现真正的XIP操作。 - 低功耗、宽温度范围(-40°C至+85°C)。

5. 功能详解: - 提供多种SPI操作指令,包括标准SPI指令、双SPI指令和四SPI指令。 - 提供写保护功能,包括软件和硬件写保护、块保护等。 - 提供多个擦除选项,包括扇区擦除、32KB块擦除、64KB块擦除和芯片擦除。

6. 应用信息: - 适用于需要数据和参数存储的应用程序,提供灵活的架构和高级安全功能。

7. 封装信息: - 提供8引脚SOIC 208-mil封装、8接触点WSON 6x5-mm和8x6-mm封装以及16引脚SOIC 300-mil封装。
W25Q32VZEIG 价格&库存

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