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W25Q40BLSNIG

W25Q40BLSNIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q40BLSNIG - 2.5V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q40BLSNIG 数据手册
W25Q40BL 2.5V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: July 08, 2010 Preliminary - Revision B W25Q40BL Table of Contents 1. 2. 3. 4. 5. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES....................................................................................................................................... 5 PIN CONFIGURATION SOIC 150 / 208-MIL ................................................................................... 6 PAD CONFIGURATION WSON 6X5-MM ........................................................................................ 6 PIN DESCRIPTION SOIC 150/208-MIL, AND WSON 6X5-MM ...................................................... 6 5.1 5.2 5.3 5.4 5.5 5.6 6. 7. Package Types..................................................................................................................... 7 Chip Select (/CS).................................................................................................................. 7 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 7 Write Protect (/WP)............................................................................................................... 7 HOLD (/HOLD) ..................................................................................................................... 7 Serial Clock (CLK) ................................................................................................................ 7 BLOCK DIAGRAM............................................................................................................................ 8 FUNCTIONAL DESCRIPTION ......................................................................................................... 9 7.1 SPI OPERATIONS ............................................................................................................... 9 7.1.1 7.1.2 7.1.3 7.1.4 Standard SPI Instructions.......................................................................................................9 Dual SPI Instructions ..............................................................................................................9 Quad SPI Instructions.............................................................................................................9 Hold Function .........................................................................................................................9 Write Protect Features..........................................................................................................10 7.2 8. WRITE PROTECTION ....................................................................................................... 10 7.2.1 CONTROL AND STATUS REGISTERS ........................................................................................ 11 8.1 STATUS REGISTER .......................................................................................................... 11 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.1.6 8.1.7 8.1.8 8.1.9 8.1.10 8.1.11 8.1.12 BUSY....................................................................................................................................11 Write Enable Latch (WEL) ....................................................................................................11 Block Protect Bits (BP2, BP1, BP0)......................................................................................11 Top/Bottom Block Protect (TB).............................................................................................11 Sector/Block Protect (SEC) ..................................................................................................11 Complement Protect (CMP) .................................................................................................12 Status Register Protect (SRP1, SRP0).................................................................................12 Erase/Program Suspend Status (SUS) ................................................................................12 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................12 Quad Enable (QE) ..............................................................................................................13 Status Register Memory Protection (CMP = 0)...................................................................14 Status Register Memory Protection (CMP = 1)...................................................................15 Manufacturer and Device Identification ................................................................................16 Instruction Set Table 1 (Erase, Program Instructions) ..........................................................17 8.2 INSTRUCTIONS................................................................................................................. 16 8.2.1 8.2.2 -2- W25Q40BL 8.2.3 8.2.4 8.2.5 8.2.6 8.2.7 8.2.8 8.2.9 8.2.10 8.2.11 8.2.12 8.2.13 8.2.14 8.2.15 8.2.16 8.2.17 8.2.18 8.2.19 8.2.20 8.2.21 8.2.22 8.2.23 8.2.24 8.2.25 8.2.26 8.2.27 8.2.28 8.2.29 8.2.30 8.2.31 8.2.32 8.2.33 8.2.34 8.2.35 8.2.36 8.2.37 8.2.38 8.2.39 Instruction Set Table 2 (Read Instructions) ..........................................................................18 Instruction Set Table 3 (ID, Security Instructions).................................................................19 Write Enable (06h)................................................................................................................20 Write Enable for Volatile Status Register (50h) ....................................................................20 Write Disable (04h)...............................................................................................................21 Read Status Register-1 (05h) and Read Status Register-2 (35h).........................................22 Write Status Register (01h) ..................................................................................................22 Read Data (03h) .................................................................................................................24 Fast Read (0Bh) .................................................................................................................25 Fast Read Dual Output (3Bh) .............................................................................................26 Fast Read Quad Output (6Bh)............................................................................................27 Fast Read Dual I/O (BBh)...................................................................................................28 Fast Read Quad I/O (EBh) .................................................................................................30 Word Read Quad I/O (E7h) ................................................................................................32 Octal Word Read Quad I/O (E3h).......................................................................................34 Set Burst with Wrap (77h) ..................................................................................................36 Continuous Read Mode Bits (M7-0) ...................................................................................37 Continuous Read Mode Reset (FFh or FFFFh) ..................................................................37 Page Program (02h) ...........................................................................................................38 Quad Input Page Program (32h) ........................................................................................39 Sector Erase (20h) .............................................................................................................40 32KB Block Erase (52h) .....................................................................................................41 64KB Block Erase (D8h).....................................................................................................42 Chip Erase (C7h / 60h).......................................................................................................43 Erase / Program Suspend (75h) .........................................................................................44 Erase / Program Resume (7Ah) .........................................................................................45 Power-down (B9h) ..............................................................................................................46 Release Power-down / Device ID (ABh) .............................................................................47 Read Manufacturer / Device ID (90h) .................................................................................49 Read Manufacturer / Device ID Dual I/O (92h) ...................................................................50 Read Manufacturer / Device ID Quad I/O (94h)..................................................................51 Read Unique ID Number (4Bh)...........................................................................................52 Read JEDEC ID (9Fh) ........................................................................................................53 Read SFDP Register (5Ah) ................................................................................................54 Erase Security Registers (44h)...........................................................................................57 Program Security Registers (42h) ......................................................................................58 Read Security Registers (48h)............................................................................................59 9. ELECTRICAL CHARACTERISTICS .............................................................................................. 60 9.1 9.2 Absolute Maximum Ratings................................................................................................ 60 Operating Ranges .............................................................................................................. 60 -3- Publication Release Date: July 08, 2010 Preliminary - Revision B W25Q40BL 9.3 9.4 9.5 9.6 9.7 9.8 9.9 9.10 10. 10.1 10.2 10.3 11. 12. 11.1 Power-up Timing and Write Inhibit Threshold .................................................................... 61 DC Electrical Characteristics.............................................................................................. 62 AC Measurement Conditions ............................................................................................. 63 AC Electrical Characteristics .............................................................................................. 64 AC Electrical Characteristics (cont’d)................................................................................. 65 Serial Output Timing........................................................................................................... 66 Serial Input Timing.............................................................................................................. 66 Hold Timing ........................................................................................................................ 66 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 67 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 69 Valid Part Numbers and Top Side Marking........................................................................ 72 PACKAGE SPECIFICATION.......................................................................................................... 67 ORDERING INFORMATION .......................................................................................................... 71 REVISION HISTORY...................................................................................................................... 73 -4- W25Q40BL 1. GENERAL DESCRIPTION The W25Q40BL (4M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.3V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q40BL array is organized into 2,048 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q40BL has 128 erasable sectors and 8 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q40BL supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 50MHz are supported allowing equivalent clock rates of 100MHz (104MHz x 2) for Dual I/O and 200MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W25Q40BL: 4M-bit/512K-byte (524,288) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 50MHz Dual/Quad SPI clocks – 100/200MHz equivalent Dual/Quad SPI – 25MB/S continuous data transfer rate – Up to 4X that of ordinary Serial Flash – More than 100,000 erase/program cycles – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range – Single 2.3 to 3.6V supply – 4mA active current,
W25Q40BLSNIG
1. 物料型号: - 型号为W25Q40BL,是Winbond公司生产的SPI闪存芯片。

2. 器件简介: - W25Q40BL是一款4M位的串行闪存,提供有限空间、引脚和功耗的存储解决方案。适用于代码阴影到RAM、直接从双/四SPI(XIP)执行代码以及存储声音、文本和数据。工作电压为2.3V至3.6V,活动时电流消耗低至4mA,掉电模式下小于1µA。所有设备都提供节省空间的封装。

3. 引脚分配: - 8-pin SOIC 150/208-mil和8-pad WSON 6x5-mm封装类型。具体引脚功能如下: - /CS(芯片选择输入) - DO(IO1)(数据输出/数据输入输出1) - /WP(IO2)(写保护输入/数据输入输出2) - GND(地) - DI(IO0)(数据输入/数据输入输出0) - CLK(串行时钟输入) - /HOLD(IO3)(保持输入/数据输入输出3) - VCC(电源供电)

4. 参数特性: - 支持标准SPI、双SPI和四SPI操作。 - 时钟频率高达50MHz,双I/O和四I/O SPI等效频率高达100MHz和200MHz。 - 连续读取模式下,最少仅需8个时钟周期即可读取24位地址,实现真正的XIP操作。 - 低功耗、宽温度范围(-40°C至+85°C)。

5. 功能详解: - 提供了SPI操作、写保护、连续读取模式、暂停和恢复擦除/编程等功能。 - 支持多种擦除和编程指令,包括扇区擦除、块擦除和芯片擦除。 - 具备软件和硬件写保护功能,包括顶部/底部、4KB互补数组保护等。

6. 应用信息: - 适用于需要数据和参数存储的应用程序,提供灵活的架构和高效的“连续读取模式”。

7. 封装信息: - 提供8-pin SOIC 150/208-mil和8-pad WSON 6x5-mm封装选项。 - 详细封装尺寸和规格在文档的第10部分提供。
W25Q40BLSNIG 价格&库存

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