W25Q64FWBYIG

W25Q64FW 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: May 18, 2017 Revision N W25Q64FW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 4. 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............................................ 6 3.3 Pin Description SOIC/VSOP 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm............... 6 3.4 Ball Configuration WLCSP ................................................................................................... 7 3.5 Ball Description WLCSP ....................................................................................................... 7 PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 4.6 Reset (/RESET) .................................................................................................................... 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 6.2 SPI / QPI Operations .......................................................................................................... 10 6.1.1 Standard SPI Instructions ..................................................................................................... 10 6.1.2 Dual SPI Instructions ............................................................................................................ 10 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 QPI Instructions .................................................................................................................... 11 6.1.5 Hold Function ....................................................................................................................... 11 6.1.6 Software Reset & Hardware /RESET pin .............................................................................. 11 Write Protection .................................................................................................................. 13 6.2.1 7. Write Protect Features ......................................................................................................... 13 STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) – Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) – Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ................................ 14 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ....................................... 15 7.1.6 Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................ 15 7.1.7 Status Register Protect (SRP1, SRP0) – Volatile/Non-Volatile Writable ........................... 15 7.1.8 Erase/Program Suspend Status (SUS) – Status Only....................................................... 16 -1- W25Q64FW 8. 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) – Volatile/Non-Volatile OTP Writable .......... 16 7.1.10 Quad Enable (QE) – Volatile/Non-Volatile Writable ........................................................ 16 7.1.11 Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ..................................... 17 7.1.12 Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ......................... 17 7.1.13 /HOLD or /RESET Pin Function (HOLD/RST) – Volatile/Non-Volatile Writable .............. 17 7.1.14 Reserved Bits – Non Functional ...................................................................................... 17 7.1.15 W25Q64FW Status Register Memory Protection (WPS = 0, CMP = 0) ............................. 18 7.1.16 W25Q64FW Status Register Memory Protection (WPS = 0, CMP = 1) ............................. 19 7.1.17 W25Q64FW Individual Block Memory Protection (WPS=1) ............................................... 20 INSTRUCTIONS ............................................................................................................................. 21 8.1 8.2 Device ID and Instruction Set Tables ................................................................................. 21 8.1.1 Manufacturer and Device Identification ................................................................................ 21 8.1.2 Instruction Set Table 1 (Standard/Dual/Quad SPI Instructions) (1) ........................................ 22 8.1.3 Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions) (1) ........................................ 23 8.1.4 Instruction Set Table 3 (QPI Instructions)(14) ........................................................................ 24 Instruction Descriptions ...................................................................................................... 26 8.2.1 Write Enable (06h) ............................................................................................................... 26 8.2.2 Write Enable for Volatile Status Register (50h) .................................................................... 26 8.2.3 Write Disable (04h) ............................................................................................................... 27 8.2.4 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 27 8.2.5 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 28 8.2.6 Read Data (03h) ................................................................................................................... 31 8.2.7 Fast Read (0Bh) ................................................................................................................... 32 8.2.8 Fast Read Dual Output (3Bh) ............................................................................................... 34 8.2.9 Fast Read Quad Output (6Bh) .............................................................................................. 35 8.2.10 Fast Read Dual I/O (BBh) ................................................................................................... 36 8.2.11 Fast Read Quad I/O (EBh) ................................................................................................. 38 8.2.12 Word Read Quad I/O (E7h) ................................................................................................ 41 8.2.13 Octal Word Read Quad I/O (E3h) ....................................................................................... 43 8.2.14 Set Burst with Wrap (77h) .................................................................................................. 45 8.2.15 Page Program (02h) ........................................................................................................... 46 8.2.16 Quad Input Page Program (32h) ........................................................................................ 48 8.2.17 Sector Erase (20h) ............................................................................................................. 49 8.2.18 32KB Block Erase (52h) ..................................................................................................... 50 8.2.19 64KB Block Erase (D8h) ..................................................................................................... 51 8.2.20 Chip Erase (C7h / 60h) ....................................................................................................... 52 8.2.21 Erase / Program Suspend (75h) ......................................................................................... 53 8.2.22 Erase / Program Resume (7Ah) ......................................................................................... 55 8.2.23 Power-down (B9h) .............................................................................................................. 56 8.2.24 Release Power-down / Device ID (ABh) ............................................................................. 57 -2- Publication Release Date: May 18, 2017 Revision N W25Q64FW 9. 10. 11. 8.2.25 Read Manufacturer / Device ID (90h) ................................................................................. 59 8.2.26 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 60 8.2.27 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 61 8.2.28 Read Unique ID Number (4Bh)........................................................................................... 62 8.2.29 Read JEDEC ID (9Fh) ........................................................................................................ 63 8.2.30 Read SFDP Register (5Ah) ................................................................................................ 64 8.2.31 Erase Security Registers (44h) ........................................................................................... 65 8.2.32 Program Security Registers (42h) ...................................................................................... 66 8.2.33 Read Security Registers (48h) ........................................................................................... 67 8.2.34 Set Read Parameters (C0h) ............................................................................................... 68 8.2.35 Burst Read with Wrap (0Ch)............................................................................................... 69 8.2.36 Enter QPI Mode (38h)......................................................................................................... 70 8.2.37 Exit QPI Mode (FFh) ........................................................................................................... 71 8.2.38 Individual Block/Sector Lock (36h) ..................................................................................... 72 8.2.39 Individual Block/Sector Unlock (39h) .................................................................................. 73 8.2.40 Read Block/Sector Lock (3Dh) ........................................................................................... 74 8.2.41 Global Block/Sector Lock (7Eh) .......................................................................................... 75 8.2.42 Global Block/Sector Unlock (98h) ....................................................................................... 75 8.2.43 Enable Reset (66h) and Reset Device (99h) ...................................................................... 76 ELECTRICAL CHARACTERISTICS ............................................................................................... 77 9.1 Absolute Maximum Ratings (1)(2) ...................................................................................... 77 9.2 Operating Ranges............................................................................................................... 77 9.3 Power-up Power-down Timing and Requirements ............................................................. 78 9.4 DC Electrical Characteristics .............................................................................................. 79 9.5 AC Measurement Conditions .............................................................................................. 80 9.6 AC Electrical Characteristics(6,7) ......................................................................................... 81 9.7 AC Electrical Characteristics (cont’d) .............................................................................. 82 9.8 Serial Output Timing ........................................................................................................... 83 9.9 Serial Input Timing .............................................................................................................. 83 9.10 /HOLD Timing ..................................................................................................................... 83 9.11 /WP Timing ......................................................................................................................... 83 PACKAGE SPECIFICATIONS ........................................................................................................ 84 10.1 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 84 10.2 8-Pin VSOP 208-mil (Package Code ST) ........................................................................... 85 10.3 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 86 10.4 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 87 10.5 Pad XSON 4x4x0.45-mm (Package Code XG) .................................................................. 88 10.6 16-Ball WLCSP (Package Code BY) .................................................................................. 89 ORDERING INFORMATION .......................................................................................................... 90 -3- W25Q64FW 11.1 12. Valid Part Numbers and Top Side Marking ........................................................................ 91 REVISION IISTORY ....................................................................................................................... 92 -4- Publication Release Date: May 18, 2017 Revision N W25Q64FW 1. GENERAL DESCRIPTIONS The W25Q64FW (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25Q64FW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64FW has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q64FW support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID, a 64-bit Unique Serial Number and three 256-bytes Security Registers. 2. FEATURES  New Family of SpiFlash Memories – W25Q64FW: 64M-bit / 8M-byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset  Highest Performance Serial Flash – 104MHz Single, Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/S continuous data transfer rate – More than 100,000 erase/program cycles – More than 20-year data retention  Efficient “Continuous Read” and QPI Mode – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Quad Peripheral Interface (QPI) reduces instruction overhead – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash  Low Power, Wide Temperature Range – Single 1.65 to 1.95V supply – 4mA active current,