W25Q80BVSNIP

W25Q80BVSNIP

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25Q80BVSNIP - 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI - Winbond

  • 详情介绍
  • 数据手册
  • 价格&库存
W25Q80BVSNIP 数据手册
W25Q80BV 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI -1- Publication Release Date: October 06, 2010 Revision D W25Q80BV Table of Contents 1. 2. 3. 4. 5. 6. GENERAL DESCRIPTION ............................................................................................................... 5 FEATURES....................................................................................................................................... 5 PIN CONFIGURATION SOIC 150 / 208-MIL ................................................................................... 6 PAD CONFIGURATION WSON 6X5-MM ........................................................................................ 6 PIN CONFIGURATION PDIP 300-MIL............................................................................................. 7 PIN DESCRIPTION SOIC 150/208-MIL, WSON 6X5-MM, AND PDIP 300-MIL.............................. 7 6.1 6.2 6.3 6.4 6.5 6.6 7. 8. Package Types..................................................................................................................... 8 Chip Select (/CS).................................................................................................................. 8 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8 Write Protect (/WP)............................................................................................................... 8 HOLD (/HOLD) ..................................................................................................................... 8 Serial Clock (CLK) ................................................................................................................ 8 BLOCK DIAGRAM............................................................................................................................ 9 FUNCTIONAL DESCRIPTION ....................................................................................................... 10 8.1 SPI OPERATIONS ............................................................................................................. 10 8.1.1 8.1.2 8.1.3 8.1.4 Standard SPI Instructions.....................................................................................................10 Dual SPI Instructions ............................................................................................................10 Quad SPI Instructions...........................................................................................................10 Hold Function .......................................................................................................................10 Write Protect Features..........................................................................................................11 8.2 9. WRITE PROTECTION ....................................................................................................... 11 8.2.1 CONTROL AND STATUS REGISTERS ........................................................................................ 12 9.1 STATUS REGISTER .......................................................................................................... 12 9.1.1 9.1.2 9.1.3 9.1.4 9.1.5 9.1.6 9.1.7 9.1.8 9.1.9 9.1.10 9.1.11 9.1.12 BUSY....................................................................................................................................12 Write Enable Latch (WEL) ....................................................................................................12 Block Protect Bits (BP2, BP1, BP0)......................................................................................12 Top/Bottom Block Protect (TB).............................................................................................12 Sector/Block Protect (SEC) ..................................................................................................12 Complement Protect (CMP) .................................................................................................13 Status Register Protect (SRP1, SRP0).................................................................................13 Erase/Program Suspend Status (SUS) ................................................................................13 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................13 Quad Enable (QE) ..............................................................................................................14 Status Register Memory Protection (CMP = 0)...................................................................15 Status Register Memory Protection (CMP = 1)...................................................................16 9.2 INSTRUCTIONS................................................................................................................. 17 -2- W25Q80BV 9.2.1 9.2.2 9.2.3 9.2.4 9.2.5 9.2.6 9.2.7 9.2.8 9.2.9 9.2.10 9.2.11 9.2.12 9.2.13 9.2.14 9.2.15 9.2.16 9.2.17 9.2.18 9.2.19 9.2.20 9.2.21 9.2.22 9.2.23 9.2.24 9.2.25 9.2.26 9.2.27 9.2.28 9.2.29 9.2.30 9.2.31 9.2.32 9.2.33 9.2.34 9.2.35 9.2.36 9.2.37 9.2.38 9.2.39 Manufacturer and Device Identification ................................................................................17 Instruction Set Table 1 (Erase, Program Instructions) ..........................................................18 Instruction Set Table 2 (Read Instructions) ..........................................................................19 Instruction Set Table 3 (ID, Security Instructions).................................................................20 Write Enable (06h)................................................................................................................21 Write Enable for Volatile Status Register (50h) ....................................................................21 Write Disable (04h)...............................................................................................................22 Read Status Register-1 (05h) and Read Status Register-2 (35h).........................................23 Write Status Register (01h) ..................................................................................................23 Read Data (03h) .................................................................................................................25 Fast Read (0Bh) .................................................................................................................26 Fast Read Dual Output (3Bh) .............................................................................................27 Fast Read Quad Output (6Bh)............................................................................................28 Fast Read Dual I/O (BBh)...................................................................................................29 Fast Read Quad I/O (EBh) .................................................................................................31 Word Read Quad I/O (E7h) ................................................................................................33 Octal Word Read Quad I/O (E3h).......................................................................................35 Set Burst with Wrap (77h) ..................................................................................................37 Continuous Read Mode Bits (M7-0) ...................................................................................38 Continuous Read Mode Reset (FFh or FFFFh) ..................................................................38 Page Program (02h) ...........................................................................................................39 Quad Input Page Program (32h) ........................................................................................40 Sector Erase (20h) .............................................................................................................41 32KB Block Erase (52h) .....................................................................................................42 64KB Block Erase (D8h).....................................................................................................43 Chip Erase (C7h / 60h).......................................................................................................44 Erase / Program Suspend (75h) .........................................................................................45 Erase / Program Resume (7Ah) .........................................................................................46 Power-down (B9h) ..............................................................................................................47 Release Power-down / Device ID (ABh) .............................................................................48 Read Manufacturer / Device ID (90h) .................................................................................50 Read Manufacturer / Device ID Dual I/O (92h) ...................................................................51 Read Manufacturer / Device ID Quad I/O (94h)..................................................................52 Read Unique ID Number (4Bh)...........................................................................................53 Read JEDEC ID (9Fh) ........................................................................................................54 Read SFDP Register (5Ah) ................................................................................................55 Erase Security Registers (44h)...........................................................................................58 Program Security Registers (42h) ......................................................................................59 Read Security Registers (48h)............................................................................................60 10. ELECTRICAL CHARACTERISTICS .............................................................................................. 61 -3- Publication Release Date: October 06, 2010 Revision D W25Q80BV 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 10.10 10.11 11. 11.1 11.2 11.3 11.4 12. 13. 12.1 Absolute Maximum Ratings................................................................................................ 61 Operating Ranges .............................................................................................................. 61 Power-up Timing and Write Inhibit Threshold .................................................................... 62 DC Electrical Characteristics.............................................................................................. 63 AC Measurement Conditions ............................................................................................. 64 AC Electrical Characteristics .............................................................................................. 65 AC Electrical Characteristics (cont’d)................................................................................. 66 Serial Output Timing........................................................................................................... 67 Serial Input Timing.............................................................................................................. 67 /HOLD Timing ................................................................................................................... 67 /WP Timing........................................................................................................................ 67 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 68 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 69 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 71 Valid Part Numbers and Top Side Marking........................................................................ 74 PACKAGE SPECIFICATION.......................................................................................................... 68 ORDERING INFORMATION .......................................................................................................... 73 REVISION HISTORY...................................................................................................................... 75 -4- W25Q80BV 1. GENERAL DESCRIPTION The W25Q80BV (8M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. The W25Q80BV array is organized into 4,096 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q80BV has 256 erasable sectors and 16 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q80BV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protection, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES • Family of SpiFlash Memories – W25Q80BV: 8M-bit/1M-byte (1,048,576) – 256-byte per programmable page – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 • Highest Performance Serial Flash – 104MHz Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/S continuous data transfer rate – Up to 8X that of ordinary Serial Flash – More than 100,000 erase/program cycles(1) – More than 20-year data retention • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash • Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – 4mA active current,
W25Q80BVSNIP
1. 物料型号: - 型号为W25Q80BV,是Winbond公司生产的8M位SPI闪存芯片。

2. 器件简介: - W25Q80BV是一款8M位的串行闪存芯片,适用于空间、引脚和功耗有限的系统。它支持标准SPI、双SPI和四SPI操作,适用于代码阴影到RAM、直接从双/四SPI执行代码以及存储声音、文本和数据。该设备在2.7V至3.6V的单电源供电下工作,活动时电流消耗低至4mA,掉电模式下仅为1µA。

3. 引脚分配: - 芯片选择(/CS):输入引脚,用于使能和禁用设备操作。 - 数据输出(DO)/数据输入输出1(IO1):用于数据输出和双/四SPI指令中的数据输入输出。 - 写保护(/WP)/数据输入输出2(IO2):用于防止状态寄被写入和双/四SPI指令中的数据输入输出。 - 地(GND):接地引脚。 - 数据输入(DI)/数据输入输出0(IO0):用于标准SPI指令中的数据输入和双/四SPI指令中的数据输入输出。 - 串行时钟(CLK):输入引脚,为串行输入输出操作提供时钟信号。 - 保持(/HOLD)/数据输入输出3(IO3):允许设备在活跃选中状态下暂停操作。 - 电源(VCC):供电引脚。

4. 参数特性: - 支持高达104MHz的SPI时钟频率,双I/O和四I/O时钟频率等效为208MHz和416MHz。 - 连续读模式下,数据传输率可达50MB/S,超越标准异步8位和16位并行闪存。 - 低功耗、宽温范围(-40°C至+85°C)。

5. 功能详解: - 支持标准SPI指令、双SPI指令和四SPI指令。 - 支持写保护功能,包括软件和硬件写保护。 - 提供灵活的架构,包括4KB扇区擦除和32KB/64KB块擦除。 - 支持JEDEC标准制造商和设备识别,具有64位唯一序列号。

6. 应用信息: - 适用于代码阴影、直接执行代码(XIP)和数据存储等应用。

7. 封装信息: - 提供8引脚SOIC 150-mil(SN)、8引脚SOIC 208-mil(SS)、8引脚PDIP 300-mil(DA)和8-pad WSON 6x5mm(ZP)封装选项。
W25Q80BVSNIP 价格&库存

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