W25X10BLZPIG

W25X10BLZPIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25X10BLZPIG - 1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI ...

  • 详情介绍
  • 数据手册
  • 价格&库存
W25X10BLZPIG 数据手册
W25X10BL/20BL/40BL 1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI - 1- Publication Release Date: October 14, 2009 Preliminary -- Revision A W25X10BL/20BL/40BL Table of Contents 1. 2. 3. 4. 5. 6. GENERAL DESCRIPTION.......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION SOIC 150-MIL / 208-MIL ....................................................................... 5 PAD CONFIGURATION WSON 6X5-MM................................................................................... 5 PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM ............................... 6 6.1 6.2 6.3 6.4 6.5 6.6 7. 8. Package Types ............................................................................................................... 7 Chip Select (/CS) ............................................................................................................ 7 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) ............................................... 7 W rite Protect (/WP)......................................................................................................... 7 HOLD (/HOLD)................................................................................................................ 7 Serial Clock (CLK) .......................................................................................................... 7 BLOCK DIAGRAM ...................................................................................................................... 8 FUNCTIONAL DESCRIPTION.................................................................................................... 9 8.1 SPI OPERATIONS.......................................................................................................... 9 8.1.1 8.1.2 8.1.3 Standard SPI Instructions ................................................................................................ 9 Dual SPI Instructions ........................................................................................................ 9 Hold Function ................................................................................................................... 9 W rite Protect Features ................................................................................................... 10 8.2 9. W RITE PROTECTION ................................................................................................. 10 8.2.1 CONTROL AND STATUS REGISTERS ................................................................................... 11 9.1 STATUS REGISTER .................................................................................................... 11 9.1.1 9.1.2 9.1.3 9.1.4 9.1.5 9.1.6 9.1.7 BUSY.............................................................................................................................. 11 W rite Enable Latch (WEL) ............................................................................................. 11 Block Protect Bits (BP2, BP1, BP0) ............................................................................... 11 Top/Bottom Block Protect (TB)....................................................................................... 11 Reserved Bits ................................................................................................................. 11 Status Register Protect (SRP)........................................................................................ 12 Status Register Memory Protection ................................................................................ 13 Manufacturer and Device Identification .......................................................................... 14 Instruction Set ................................................................................................................ 15 W rite Enable (06h) ......................................................................................................... 16 W rite Disable (04h) ........................................................................................................ 16 Read Status Register (05h) ............................................................................................ 18 W rite Status Register (01h) ............................................................................................ 19 Read Data (03h) ............................................................................................................. 21 Fast Read (0Bh) ............................................................................................................. 22 9.2 INSTRUCTIONS ........................................................................................................... 14 9.2.1 9.2.2 9.2.3 9.2.4 9.2.5 9.2.6 9.2.7 9.2.8 -2- W25X10BL/20BL/40BL 9.2.9 9.2.10 9.2.11 9.2.12 9.2.13 9.2.14 9.2.15 9.2.16 9.2.17 9.2.18 9.2.19 9.2.20 9.2.21 9.2.22 9.2.23 Fast Read Dual Output (3Bh) ......................................................................................... 23 Fast Read Dual I/O (BBh) ............................................................................................ 24 Continuous Read Mode Bits (M7-0) ............................................................................. 26 Continuous Read Mode Reset (FFFFh) ....................................................................... 26 Page Program (02h) ..................................................................................................... 27 Sector Erase (20h) ....................................................................................................... 28 32KB Block Erase (52h) ............................................................................................... 29 Block Erase (D8h) ........................................................................................................ 30 Chip Erase (C7h or 60h) .............................................................................................. 31 Power-down (B9h) ........................................................................................................ 32 Release Power-down / Device ID (ABh)....................................................................... 33 Read Manufacturer / Device ID (90h) ........................................................................... 35 Read Manufacturer / Device ID Dual I/O (92h)............................................................. 36 Read Unique ID Number (4Bh) .................................................................................... 37 JEDEC ID (9Fh) ........................................................................................................... 38 10. ELECTRICAL CHARACTERISTICS ......................................................................................... 39 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 10.10 Absolute Maximum Ratings .......................................................................................... 39 Operating Ranges ......................................................................................................... 39 Power-up Timing and Write Inhibit Threshold............................................................... 40 DC Electrical Characteristics ........................................................................................ 41 AC Measurement Conditions ........................................................................................ 42 AC Electrical Characteristics......................................................................................... 43 AC Electrical Characteristics (cont’d)............................................................................ 44 Serial Output Timing ..................................................................................................... 45 Input Timing .................................................................................................................. 45 Hold Timing ................................................................................................................. 45 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 46 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 47 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 48 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 49 Valid Part Numbers and Top Side Marking .................................................................. 52 11. PACKAGE SPECIFICATION .................................................................................................... 46 11.1 11.2 11.3 11.4 12. 13. ORDERING INFORMATION..................................................................................................... 51 12.1 REVISION HISTORY ................................................................................................................ 53 -3- Publication Release Date: October 14, 2009 Preliminary -- Revision A W25X10BL/20BL/40BL 1. GENERAL DESCRIPTION The W25X10BL (1M-bit), W25X20BL (2M-bit) and the W25X40BL (4M-bit) Serial Flash memories provides a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.3V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X10BL/20BL/40BL arrays are organized into 512/1,024/2,048 programmable pages of 256bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (block erase) or the entire chip (chip erase). The W25X10BL/20BL/40BL has 32/64/128 erasable sectors and 2/4/8 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25X10BL/20BL/40BL supports the standard Serial Peripheral Interface (SPI), and a high performance dual output as well as Dual I/O SPI: Serial Clock, Chip Select, Serial Data DI (I/O0), DO (I/O1). SPI clock frequencies of up to 50MHz are supported allowing equivalent clock rates of 100MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification. 2. FEATURES • Family of Serial Flash Memories – W 25X10BL: 1M-bit/128K-byte (131,072) – W25X20BL: 2M-bit/256K-byte (262,144) – W25X40BL: 4M-bit/512K-byte (524,288) – 256-bytes per programmable page – Uniform 4KB Sectors, 32KB & 64KB Blocks • SPI with Single / Dual Outputs / Dual I/O – Clock, Chip Select, Data I/O, Data Out – Optional Hold function for SPI flexibility • Data Transfer up to 100M-bits / second – Clock operation to 50MHz – Fast Read Dual Output instruction – Auto-increment Read capability • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation • Software and Hardware Write Protection – W rite-Protect all or portion of memory – Enable/Disable protection with /WP pin – Top or bottom array protection – Volatile & Non-volatile Status Register Bits • Flexible Architecture with 4KB sectors – Sector Erase (4K-bytes) – Block Erase (32K and 64K-byte) – Page program up to 256 bytes
W25X10BLZPIG
1. 物料型号: - W25X10BL:1M-bit/128K-byte - W25X20BL:2M-bit/256K-byte - W25X40BL:4M-bit/512K-byte

2. 器件简介: - W25X系列提供灵活和性能,适用于空间、引脚和功率有限的系统。它们适用于代码下载应用以及存储语音、文本和数据。设备在2.3V至3.6V的单电源下工作,活动时电流消耗低至4mA,掉电模式下为1µA。所有设备都提供节省空间的封装。

3. 引脚分配: - SOIC 150/208-MIL:共8个引脚,包括Chip Select(/CS)、Data Input/Output(DI/DO)、Write Protect(/WP)、HOLD(/HOLD)、Serial Clock(CLK)等。 - WSON 6X5-MM:8个触点的封装,引脚配置与SOIC类似。

4. 参数特性: - 支持标准SPI和双输出以及双I/O SPI。 - 支持高达50MHz的SPI时钟频率,使用快速读取双输出指令时等效于100MHz的时钟频率。 - 有32/64/128个可擦除扇区和2/4/8个可擦除的64KB块。

5. 功能详解: - 支持SPI操作,包括标准SPI指令和双SPI指令。 - 支持写保护功能,包括软件和硬件写保护。 - 提供数据保护功能,包括设备重置、写禁用延迟、写使能/禁用指令、自动写禁用等。

6. 应用信息: - 适用于需要数据和参数存储的应用,提供灵活的架构和低功耗消耗。

7. 封装信息: - 提供8引脚SOIC 150-mil、8引脚SOIC 208-mil、8-pad WSON 6x5-mm和8引脚PDIP 300-mil封装。
W25X10BLZPIG 价格&库存

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