W25X32BVSFIG

W25X32BV 32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI The W25Q32BV is recommended for all new 32Mb designs. The W25X32BV is available for existing designs that require "25X" device ID for firmware compatibility. - 1- Publication Release Date: October 7, 2009 Preliminary -- Revision C W25X32BV Table of Contents 1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION SOIC 208-MIL ....................................................................................... 5 PAD CONFIGURATION WSON 6X5-MM / WSON 8X6-MM ..................................................... 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM .................................... 5 PIN CONFIGURATION SOIC 300-MIL ....................................................................................... 6 PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 6 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8. 9. Package Types ............................................................................................................... 7 Chip Select (/CS) ............................................................................................................ 7 Serial Data Output (DO) ................................................................................................. 7 Write Protect (/WP) ......................................................................................................... 7 HOLD (/HOLD) ............................................................................................................... 7 Serial Clock (CLK) .......................................................................................................... 7 Serial Data Input / Output (DIO) ..................................................................................... 7 BLOCK DIAGRAM ...................................................................................................................... 8 FUNCTIONAL DESCRIPTION ................................................................................................... 9 9.1 SPI OPERATIONS ......................................................................................................... 9 9.1.1 9.1.2 9.1.3 SPI Modes ........................................................................................................................9 Dual Output SPI................................................................................................................9 Hold Function ...................................................................................................................9 Write Protect Features....................................................................................................10 9.2 10. WRITE PROTECTION.................................................................................................. 10 9.2.1 CONTROL AND STATUS REGISTERS ................................................................................... 11 10.1 STATUS REGISTER .................................................................................................... 11 10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 BUSY ............................................................................................................................11 Write Enable Latch (WEL) ............................................................................................11 Block Protect Bits (BP2, BP1, BP0) ..............................................................................11 Top/Bottom Block Protect (TB) .....................................................................................11 Reserved Bits ...............................................................................................................11 Status Register Protect (SRP) ......................................................................................12 Status Register Memory Protection ..............................................................................12 Manufacturer and Device Identification.........................................................................13 Instruction Set...............................................................................................................14 Write Enable (06h) ........................................................................................................15 Write Disable (04h) .......................................................................................................15 Read Status Register (05h) ..........................................................................................16 10.2 INSTRUCTIONS ........................................................................................................... 13 10.2.1 10.2.2 10.2.3 10.2.4 10.2.5 -2- W25X32BV 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 10.2.18 Write Status Register (01h) ..........................................................................................17 Read Data (03h) ...........................................................................................................18 Fast Read (0Bh) ...........................................................................................................19 Fast Read Dual Output (3Bh) .......................................................................................20 Page Program (02h) ...................................................................................................21 Sector Erase (20h) .....................................................................................................22 32KB Block Erase (52h) .............................................................................................23 Block Erase (D8h) ......................................................................................................24 Chip Erase (C7h or 60h) .............................................................................................25 Power-down (B9h) ......................................................................................................26 Release Power-down / Device ID (ABh) .....................................................................27 Read Manufacturer / Device ID (90h) .........................................................................29 JEDEC ID (9Fh)..........................................................................................................30 11. ELECTRICAL CHARACTERISTICS ......................................................................................... 31 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 Absolute Maximum Ratings .......................................................................................... 31 Operating Ranges......................................................................................................... 31 Power-up Timing and Write Inhibit Threshold .............................................................. 32 DC Electrical Characteristics ........................................................................................ 33 AC Measurement Conditions ........................................................................................ 34 AC Electrical Characteristics ........................................................................................ 35 AC Electrical Characteristics (cont’d) ........................................................................... 36 Serial Output Timing ..................................................................................................... 37 Input Timing .................................................................................................................. 37 Hold Timing ................................................................................................................. 37 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 38 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 39 8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 41 16-Pin SOIC 300-mil (Package Code SF) .................................................................... 42 Valid Part Numbers and Top Side Marking .................................................................. 44 12. PACKAGE SPECIFICATION .................................................................................................... 38 12.1 12.2 12.3 12.4 13. 14. ORDERING INFORMATION .................................................................................................... 43 13.1 REVISION HISTORY ................................................................................................................ 45 -3- Publication Release Date: October 7, 2009 Preliminary -- Revision C W25X32BV 1. GENERAL DESCRIPTION The W25X32BV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X32BV array is organized into 16, 384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (block erase) or the entire chip (chip erase). The W25X32BV has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25X32BV supports the standard Serial Peripheral Interface (SPI), and a high performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial Data Out. SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification. 2. FEATURES  Family of Serial Flash Memories – W25X32BV: 32M-bit / 4M-byte (4,194,304) – 256-bytes per programmable page – Uniform 4K-byte Sectors / 64K-byte Blocks  SPI with Single or Dual Outputs – Clock, Chip Select, Data I/O, Data Out – Optional Hold function for SPI flexibility  Data Transfer up to 208M-bits / second – Clock operation to 104MHz – Fast Read Dual Output instruction – Auto-increment Read capability  Softw are and Hardware Write Protection – Write-Protect all or portion of memory – Enable/Disable protection with /WP pin – Top or bottom array protection  Flexible Architecture w ith 4KB sectors – Sector Erase (4K-bytes) – Block Erase (32K and 64K-byte) – Page program up to 256 bytes