W25X40BL

W25X40BL

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25X40BL - 1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI - Wi...

  • 详情介绍
  • 数据手册
  • 价格&库存
W25X40BL 数据手册
W25X10BL/20BL/40BL 1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI - 1- Publication Release Date: October 14, 2009 Preliminary -- Revision A W25X10BL/20BL/40BL Table of Contents 1. 2. 3. 4. 5. 6. GENERAL DESCRIPTION.......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION SOIC 150-MIL / 208-MIL ....................................................................... 5 PAD CONFIGURATION WSON 6X5-MM................................................................................... 5 PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM ............................... 6 6.1 6.2 6.3 6.4 6.5 6.6 7. 8. Package Types ............................................................................................................... 7 Chip Select (/CS) ............................................................................................................ 7 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) ............................................... 7 W rite Protect (/WP)......................................................................................................... 7 HOLD (/HOLD)................................................................................................................ 7 Serial Clock (CLK) .......................................................................................................... 7 BLOCK DIAGRAM ...................................................................................................................... 8 FUNCTIONAL DESCRIPTION.................................................................................................... 9 8.1 SPI OPERATIONS.......................................................................................................... 9 8.1.1 8.1.2 8.1.3 Standard SPI Instructions ................................................................................................ 9 Dual SPI Instructions ........................................................................................................ 9 Hold Function ................................................................................................................... 9 W rite Protect Features ................................................................................................... 10 8.2 9. W RITE PROTECTION ................................................................................................. 10 8.2.1 CONTROL AND STATUS REGISTERS ................................................................................... 11 9.1 STATUS REGISTER .................................................................................................... 11 9.1.1 9.1.2 9.1.3 9.1.4 9.1.5 9.1.6 9.1.7 BUSY.............................................................................................................................. 11 W rite Enable Latch (WEL) ............................................................................................. 11 Block Protect Bits (BP2, BP1, BP0) ............................................................................... 11 Top/Bottom Block Protect (TB)....................................................................................... 11 Reserved Bits ................................................................................................................. 11 Status Register Protect (SRP)........................................................................................ 12 Status Register Memory Protection ................................................................................ 13 Manufacturer and Device Identification .......................................................................... 14 Instruction Set ................................................................................................................ 15 W rite Enable (06h) ......................................................................................................... 16 W rite Disable (04h) ........................................................................................................ 16 Read Status Register (05h) ............................................................................................ 18 W rite Status Register (01h) ............................................................................................ 19 Read Data (03h) ............................................................................................................. 21 Fast Read (0Bh) ............................................................................................................. 22 9.2 INSTRUCTIONS ........................................................................................................... 14 9.2.1 9.2.2 9.2.3 9.2.4 9.2.5 9.2.6 9.2.7 9.2.8 -2- W25X10BL/20BL/40BL 9.2.9 9.2.10 9.2.11 9.2.12 9.2.13 9.2.14 9.2.15 9.2.16 9.2.17 9.2.18 9.2.19 9.2.20 9.2.21 9.2.22 9.2.23 Fast Read Dual Output (3Bh) ......................................................................................... 23 Fast Read Dual I/O (BBh) ............................................................................................ 24 Continuous Read Mode Bits (M7-0) ............................................................................. 26 Continuous Read Mode Reset (FFFFh) ....................................................................... 26 Page Program (02h) ..................................................................................................... 27 Sector Erase (20h) ....................................................................................................... 28 32KB Block Erase (52h) ............................................................................................... 29 Block Erase (D8h) ........................................................................................................ 30 Chip Erase (C7h or 60h) .............................................................................................. 31 Power-down (B9h) ........................................................................................................ 32 Release Power-down / Device ID (ABh)....................................................................... 33 Read Manufacturer / Device ID (90h) ........................................................................... 35 Read Manufacturer / Device ID Dual I/O (92h)............................................................. 36 Read Unique ID Number (4Bh) .................................................................................... 37 JEDEC ID (9Fh) ........................................................................................................... 38 10. ELECTRICAL CHARACTERISTICS ......................................................................................... 39 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 10.10 Absolute Maximum Ratings .......................................................................................... 39 Operating Ranges ......................................................................................................... 39 Power-up Timing and Write Inhibit Threshold............................................................... 40 DC Electrical Characteristics ........................................................................................ 41 AC Measurement Conditions ........................................................................................ 42 AC Electrical Characteristics......................................................................................... 43 AC Electrical Characteristics (cont’d)............................................................................ 44 Serial Output Timing ..................................................................................................... 45 Input Timing .................................................................................................................. 45 Hold Timing ................................................................................................................. 45 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 46 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 47 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 48 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 49 Valid Part Numbers and Top Side Marking .................................................................. 52 11. PACKAGE SPECIFICATION .................................................................................................... 46 11.1 11.2 11.3 11.4 12. 13. ORDERING INFORMATION..................................................................................................... 51 12.1 REVISION HISTORY ................................................................................................................ 53 -3- Publication Release Date: October 14, 2009 Preliminary -- Revision A W25X10BL/20BL/40BL 1. GENERAL DESCRIPTION The W25X10BL (1M-bit), W25X20BL (2M-bit) and the W25X40BL (4M-bit) Serial Flash memories provides a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.3V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X10BL/20BL/40BL arrays are organized into 512/1,024/2,048 programmable pages of 256bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (block erase) or the entire chip (chip erase). The W25X10BL/20BL/40BL has 32/64/128 erasable sectors and 2/4/8 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25X10BL/20BL/40BL supports the standard Serial Peripheral Interface (SPI), and a high performance dual output as well as Dual I/O SPI: Serial Clock, Chip Select, Serial Data DI (I/O0), DO (I/O1). SPI clock frequencies of up to 50MHz are supported allowing equivalent clock rates of 100MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification. 2. FEATURES • Family of Serial Flash Memories – W 25X10BL: 1M-bit/128K-byte (131,072) – W25X20BL: 2M-bit/256K-byte (262,144) – W25X40BL: 4M-bit/512K-byte (524,288) – 256-bytes per programmable page – Uniform 4KB Sectors, 32KB & 64KB Blocks • SPI with Single / Dual Outputs / Dual I/O – Clock, Chip Select, Data I/O, Data Out – Optional Hold function for SPI flexibility • Data Transfer up to 100M-bits / second – Clock operation to 50MHz – Fast Read Dual Output instruction – Auto-increment Read capability • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation • Software and Hardware Write Protection – W rite-Protect all or portion of memory – Enable/Disable protection with /WP pin – Top or bottom array protection – Volatile & Non-volatile Status Register Bits • Flexible Architecture with 4KB sectors – Sector Erase (4K-bytes) – Block Erase (32K and 64K-byte) – Page program up to 256 bytes
W25X40BL
### 物料型号 - W25X10BL:1M-bit - W25X20BL:2M-bit - W25X40BL:4M-bit

### 器件简介 Winbond的W25X10BL、W25X20BL和W25X40BL系列串行闪存提供有限空间、引脚和功耗的存储解决方案。这些设备适用于代码下载应用以及存储语音、文本和数据。它们在2.3V至3.6V的单电源供电下工作,活动时电流消耗低至4mA,断电时为1µA。所有设备都提供节省空间的封装。

### 引脚分配 - SOIC 150-MIL / 208-MIL:8引脚封装 - WSON 6X5-MM:8接触点封装 - PDIP 300-MIL:8引脚双列直插封装

### 参数特性 - 存储容量:1M-bit(128K-byte)、2M-bit(256K-byte)、4M-bit(512K-byte) - 页编程:每页256字节,可一次性编程256字节 - 块擦除:16个扇区(4KB)、128个(32KB)、256个(64KB)或整个芯片(芯片擦除) - 支持标准SPI、双输出SPI和双I/O SPI - SPI时钟频率高达50MHz,双输出快速读取时相当于100MHz - 具有保持引脚、写保护引脚和可编程写保护功能

### 功能详解 - 支持标准SPI指令和双SPI指令,包括快速读取、页编程、扇区擦除、块擦除和芯片擦除等。 - 具有写保护功能,可通过硬件和软件控制保护内存的某一部分或全部。 - 提供连续读取模式,减少指令开销,允许真正的XIP(现场执行)操作。

### 应用信息 适用于需要数据和参数存储的应用,如代码下载、语音、文本和数据存储等。

### 封装信息 - SOIC 150-mil(SN)、SOIC 208-mil(SS)、WSON 6x5mm(ZP)和PDIP 300-mil(DA)封装。
W25X40BL 价格&库存

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