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W25X40BLSVIG

W25X40BLSVIG

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W25X40BLSVIG - 2.5V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI - Winbond

  • 数据手册
  • 价格&库存
W25X40BLSVIG 数据手册
W25X40BL 2.5V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI - 1- Publication Release Date: April 21, 2011 Preliminary - Revision B W25X40BL Table of Contents 1. 2. 3. GENERAL DESCRIPTION.......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PACKAGE TYPES AND PIN CONFIGURATIONS ..................................................................... 5 3.1 3.2 3.3 3.4 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pin Configuration SOIC 150 / 208-mil, VSOP 150-mil .................................................... 5 Pad Configuration WSON 6x5-mm, USON 2x3-mm ...................................................... 5 Pin Configuration PDIP 300-mil ...................................................................................... 6 Pin/Pad Descriptions ....................................................................................................... 6 Chip Select (/CS) ............................................................................................................ 7 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) ............................................... 7 W rite Protect (/WP) ......................................................................................................... 7 HOLD (/HOLD)................................................................................................................ 7 Serial Clock (CLK) .......................................................................................................... 7 SIGNAL DESCRIPTIONS ........................................................................................................... 7 BLOCK DIAGRAM ...................................................................................................................... 8 FUNCTIONAL DESCRIPTIONS ................................................................................................. 9 6.1 SPI OPERATIONS.......................................................................................................... 9 6.1.1 6.1.2 6.1.3 Standard SPI Instructions ................................................................................................. 9 Dual SPI Instructions ........................................................................................................ 9 Hold Function ................................................................................................................... 9 W rite Protect Features ................................................................................................... 10 6.2 7. W RITE PROTECTION ................................................................................................. 10 6.2.1 STATUS REGISTER AND INSTRUCTIONS ............................................................................ 11 7.1 STATUS REGISTER .................................................................................................... 11 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 7.1.7 BUSY Status (BUSY) ...................................................................................................... 11 W rite Enable Latch Status (WEL)................................................................................... 11 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 Top/Bottom Block Protect Bit (TB) .................................................................................. 11 Reserved Bit ................................................................................................................... 11 Status Register Protect (SRP) ........................................................................................ 12 Status Register Memory Protection ................................................................................ 12 Manufacturer and Device Identification .......................................................................... 13 Instruction Set................................................................................................................. 14 W rite Enable (06h) ......................................................................................................... 15 W rite Enable for Volatile Status Register (50h) .............................................................. 15 W rite Disable (04h) ......................................................................................................... 16 Read Status Register (05h) ............................................................................................ 17 W rite Status Register (01h) ............................................................................................ 17 7.2 INSTRUCTIONS ........................................................................................................... 13 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 -2- W25X40BL 7.2.8 7.2.9 7.2.10 7.2.11 7.2.12 7.2.13 7.2.14 7.2.15 7.2.16 7.2.17 7.2.18 7.2.19 7.2.20 7.2.21 7.2.22 7.2.23 7.2.24 Read Data (03h) ............................................................................................................. 19 Fast Read (0Bh) ............................................................................................................. 20 Fast Read Dual Output (3Bh) ....................................................................................... 21 Fast Read Dual I/O (BBh) ............................................................................................. 22 Continuous Read Mode Bits (M7-0) ............................................................................. 24 Continuous Read Mode Reset (FFFFh) ....................................................................... 24 Page Program (02h) ..................................................................................................... 25 4KB Sector Erase (20h) ................................................................................................ 26 32KB Block Erase (52h) ............................................................................................... 27 64KB Block Erase (D8h) ............................................................................................... 28 Chip Erase (C7h or 60h) ............................................................................................... 29 Power-down (B9h) ........................................................................................................ 30 Release Power-down / Device ID (ABh) ....................................................................... 31 Read Manufacturer / Device ID (90h) ........................................................................... 33 Read Manufacturer / Device ID Dual I/O (92h) ............................................................. 34 Read Unique ID Number (4Bh)..................................................................................... 35 JEDEC ID (9Fh) ............................................................................................................ 36 8. ELECTRICAL CHARACTERISTICS ......................................................................................... 37 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 Absolute Maximum Ratings .......................................................................................... 37 Operating Ranges ......................................................................................................... 37 Power-up Timing and Write Inhibit Threshold............................................................... 38 DC Electrical Characteristics ........................................................................................ 39 AC Measurement Conditions ........................................................................................ 40 AC Electrical Characteristics (2.3~3.6V) ....................................................................... 41 AC Electrical Characteristics (2.7~3.6V) ....................................................................... 43 Serial Output Timing ..................................................................................................... 45 Serial Input Timing ........................................................................................................ 45 Hold Timing ................................................................................................................... 45 W rite Protect Timing ..................................................................................................... 45 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 46 8-Pin VSOP 150-mil (Package Code SV) ..................................................................... 47 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 48 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 49 8-Pad USON 2x3-mm (Package Code UX) .................................................................. 50 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 51 Valid Part Numbers and Top Side Marking .................................................................. 54 9. PACKAGE SPECIFICATION .................................................................................................... 46 9.1 9.2 9.3 9.4 9.5 9.6 10. 11. ORDERING INFORMATION ..................................................................................................... 53 10.1 REVISION HISTORY ................................................................................................................ 55 Publication Release Date: April 21, 2011 Preliminary - Revision B -3- W25X40BL 1. GENERAL DESCRIPTION The W25X40BL (4M-bit) Serial Flash memories provides a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.3V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X40BL arrays are organized into 2,048 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25X40BL has 128 erasable 4KB sectors and 8 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25X40BL supports the standard Serial Peripheral Interface (SPI), and a high performance dual output as well as Dual I/O SPI: Serial Clock, Chip Select, Serial Data DI (I/O0), DO (I/O1). SPI clock frequencies of up to 50MHz (2.3-3.6V) and 80MHz (2.7-3.6V) are supported allowing equivalent clock rates of 100MHz (2.3-3.6V) and 160MHz (2.7-3.6V) when using the Fast Read Dual I/O instruction. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification. 2. FEATURES • Family of Serial Flash Memories – W 25X40BL: 4M-bit/512K-byte (524,288) – 256-bytes per programmable page – Uniform 4KB Sectors, 32KB & 64KB Blocks • SPI with Single / Dual Outputs / Dual I/O – Clock, Chip Select, Data I/O, Data Out – Optional Hold function for SPI flexibility • Data Transfer up to 160M-bits / second – Clock operation to 80MHz – Fast Read Dual I/O instruction – Auto-increment Read capability • Efficient “Continuous Read Mode” – Low Instruction overhead – Continuous Read – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation • Software and Hardware Write Protection – W rite-Protect all or portion of memory – Enable/Disable protection with /WP pin – Top or bottom array protection – Volatile & Non-volatile Status Register Bits • Flexible Architecture with 4KB sectors – Sector Erase (4K-byte) – Block Erase (32K and 64K-byte) – Page program up to 256 bytes
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