W25X40CLSNIG

厂商：
WINBOND(华邦)
封装：
SOIC8_150MIL
描述：
4位串行闪存，带4KB扇区和双I/O SPI SOIC8_150MIL 2.3V~3.6V

数据手册：

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数据手册
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W25X40CLSNIG 数据手册

W25X40CL 2.5/3/3.3 V 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI -1- Publication Release Date: March 25, 2014 Revision F W25X40CL Table of Contents 1. 2. 3. 4. 5. 6. 7. GENERAL DESCRIPTION ......................................................................................................... 4 FEATURES ................................................................................................................................. 4 PIN CONFIGURATION SOIC 208-MIL, SOIC 150-MIL AND VSOP 150-MIL ............................ 5 PAD CONFIGURATION WSON 6X5-MM AND USON 2X3-MM ................................................ 5 PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 PIN DESCRIPTION SOIC, VSOP, WSON, USON AND PDIP ................................................... 6 6.1 Package Types ............................................................................................................... 7 6.2 Chip Select (/CS) ............................................................................................................ 7 6.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7 6.4 Write Protect (/WP) ......................................................................................................... 7 6.5 HOLD (/HOLD)................................................................................................................ 7 6.6 Serial Clock (CLK) .......................................................................................................... 7 BLOCK DIAGRAM ...................................................................................................................... 8 7.1 SPI OPERATIONS.......................................................................................................... 9 7.1.1 7.1.2 7.1.3 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 8. Standard SPI Instructions ................................................................................................. 9 Dual SPI Instructions ........................................................................................................ 9 Hold Function ................................................................................................................... 9 Write Protect Features.................................................................................................... 10 CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.1.6 8.1.7 8.2 BUSY.............................................................................................................................. 11 Write Enable Latch (WEL) .............................................................................................. 11 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 Top/Bottom Block Protect (TB) ....................................................................................... 11 Reserved Bits ................................................................................................................. 12 Status Register Protect (SRP) ........................................................................................ 12 Status Register Memory Protection ................................................................................ 13 INSTRUCTIONS ........................................................................................................... 14 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 8.2.6 8.2.7 8.2.8 8.2.9 8.2.10 8.2.11 8.2.12 8.2.13 8.2.14 8.2.15 Manufacturer and Device Identification .......................................................................... 14 Instruction Set (1)............................................................................................................. 15 Write Enable (06h).......................................................................................................... 16 Write Enable for Volatile Status Register (50h) .............................................................. 16 Write Disable (04h) ......................................................................................................... 17 Read Status Register (05h) ............................................................................................ 17 Write Status Register (01h) ............................................................................................ 18 Read Data (03h) ............................................................................................................. 19 Fast Read (0Bh) ............................................................................................................. 20 Fast Read Dual Output (3Bh) ....................................................................................... 21 Fast Read Dual I/O (BBh) ............................................................................................. 22 Continuous Read Mode Bits (M7-0) ............................................................................. 24 Continuous Read Mode Reset (FFFFh) ....................................................................... 24 Page Program (02h) ..................................................................................................... 25 Sector Erase (20h) ....................................................................................................... 26 -2- Publication Release Date: March 25, 2014 Revision F W25X40CL 8.2.16 8.2.17 8.2.18 8.2.19 8.2.20 8.2.21 8.2.22 8.2.23 8.2.24 9. 10. 11. 12. 32KB Block Erase (52h) ............................................................................................... 27 Block Erase (D8h) ........................................................................................................ 28 Chip Erase (C7h or 60h) ............................................................................................... 29 Power-down (B9h) ........................................................................................................ 30 Release Power-down / Device ID (ABh) ....................................................................... 31 Read Manufacturer / Device ID (90h) ........................................................................... 33 Read Manufacturer / Device ID Dual I/O (92h) ............................................................. 34 Read Unique ID Number (4Bh) .................................................................................... 35 JEDEC ID (9Fh)............................................................................................................ 36 ELECTRICAL CHARACTERISTICS ......................................................................................... 37 9.1 Absolute Maximum Rating (1) ...................................................................................... 37 9.2 Operating Ranges ......................................................................................................... 37 9.3 Power-up Timing and Write Inhibit Threshold .............................................................. 38 9.4 DC Electrical Characteristics ........................................................................................ 39 9.5 AC Measurement Conditions ........................................................................................ 40 9.6 AC Electrical Characteristics ........................................................................................ 41 AC Electrical Characteristics (cont’d) ........................................................................................ 42 9.7 Serial Output Timing ..................................................................................................... 43 9.8 Serial Input Timing ........................................................................................................ 43 9.9 HOLD Timing ................................................................................................................ 43 9.10 WP Timing .................................................................................................................... 43 PACKAGE SPECIFICATION .................................................................................................... 44 10.1 8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 44 10.2 8-Pin VSOP8 150-mil (Package Code SV) ................................................................... 45 10.3 8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 46 10.4 8-Pad 6x5mm WSON (Package Code ZP) .................................................................. 47 10.5 8-Pad WSON 6x5mm Cont’d. ....................................................................................... 48 10.6 8-Pad USON 2x3-mm (Package Code UX) .................................................................. 49 10.7 8-pin PDIP 300-mil (Package Code DA) ...................................................................... 50 ORDERING INFORMATION(1) .................................................................................................. 51 11.1 Valid Part Numbers and Top Side Marking .................................................................. 52 REVISION HISTORY ................................................................................................................ 53 -3- Publication Release Date: March 25, 2014 Revision F W25X40CL 1. GENERAL DESCRIPTION The W25X40CL (4M-bit) Serial Flash memories provides a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.3V to 3.6V power supply with current consumption as low as 1mA active and 1µA for power-down. All devices are offered in space-saving packages. The W25X40CL arrays are organized into 2048 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. The W25X40CL have 128 erasable sectors, 16 erasable 32KB blocks and 8 erasable 64KB blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25X40CL support the standard Serial Peripheral Interface (SPI), and a high performance dual output as well as Dual I/O SPI: Serial Clock, Chip Select, Serial Data DI (I/O0), DO (I/O1). SPI clock frequencies up to 104MHz are supported allowing equivalent clock rates of 208MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 16-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation. A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number. 2. FEATURES  Family of Serial Flash Memories – W25X40CL: 4M-bit/512K-byte (524,288) – 256-bytes per programmable page – Uniform erasable 4KB, 32KB & 64KB regions.  SPI with Single / Dual Outputs / I/O – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold  Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4/32/64-kbytes) – Page program up to 256 bytes

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W25X40CLSNIG

物料型号：W25X40CL

器件简介：W25X40CL是Winbond生产的4M位串行闪存，具有4KB的扇区和双I/O SPI。它适用于空间、引脚和功率有限的系统，提供灵活性和性能，适用于代码下载、存储语音、文本和数据等应用。

引脚分配：W25X40CL有多种封装类型，包括SOIC 208-MIL、SOIC 150-MIL、VSOP 150-MIL、WSON 6X5-MM、USON 2X3-MM和PDIP 300-MIL。每种封装类型的引脚分配略有不同，但主要包括Chip Select (/CS)、Data Input/Output (DI, DO, IO0, IO1)、Write Protect (/WP)、HOLD (/HOLD)、Serial Clock (CLK)和电源(VCC, GND)。

参数特性：该设备在2.3V至3.6V的单电源下工作，活动时电流消耗低至1mA，掉电模式下小于1µA。它支持高达104MHz的SPI时钟频率，等效的双SPI传输速率可达208MHz。具有高效的连续读取模式，可实现真正的XIP（现场执行）操作。

功能详解：W25X40CL支持标准SPI指令集，包括读写、块擦除、芯片擦除等。它还具有写保护功能，包括硬件写保护引脚(/WP)和软件写保护，通过状态寄存器控制。此外，它还支持JEDEC标准的制造商和设备识别。

应用信息：W25X40CL适用于需要数据和参数存储的应用，如系统代码下载、语音和文本存储等。

封装信息：提供多种封装选项，以适应不同的空间和设计要求，包括SOIC、VSOP、WSON、USON和PDIP封装。

电气特性：文档详细列出了W25X40CL的电气特性，包括绝对最大额定值、工作范围、电源上升时间、写入禁止阈值电压等。

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