W25X64V

W25X64 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI -1 - Publication Release Date: December 19, 2008 Revision A W25X64 Table of Contents 1 2 3 4 5 6 7 GENERAL DESCRIPTION................................................................................................... 4 FEATURES........................................................................................................................ 4 PIN CONFIGURATION WSON 8X6-MM ................................................................................ 5 PIN CONFIGURATION PDIP 300-MIL ................................................................................... 5 PIN DESCRIPTION PDIP 300-MIL, WSON 8X6...................................................................... 6 PIN CONFIGURATION SOIC 300-MIL ................................................................................... 6 PIN DESCRIPTION SOIC 300-MIL........................................................................................ 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 Package Types ....................................................................................................... 8 Chip Select (/CS) .................................................................................................... 8 Serial Data Output (DO)........................................................................................... 8 W rite Protect (/WP)................................................................................................. 8 HOLD (/HOLD)........................................................................................................ 8 Serial Clock (CLK)................................................................................................... 8 Serial Data Input / Output (DIO) ................................................................................ 8 BLOCK DIAGRAM.............................................................................................................. 9 FUNCTIONAL DESCRIPTION .............................................................................................10 9.1 SPI OPERATIONS .................................................................................................10 9.1.1 9.1.2 9.1.3 SPI Modes ....................................................................................................................................10 Dual Output SPI...........................................................................................................................10 Hold Function ..............................................................................................................................10 9.2 10 W RITE PROTECTION.............................................................................................11 9.2.1 Write Protect Features ...............................................................................................................11 CONTROL AND STATUS REGISTERS ................................................................................12 10.1 STATUS REGISTER...............................................................................................12 10.1.1 10.1.2 10.1.3 10.1.4 10.1.5 10.1.6 10.1.7 BUSY...........................................................................................................................................12 Write Enable Latch (WEL).......................................................................................................12 Block Protect Bits (BP2, BP1, BP0) .......................................................................................12 Top/Bottom Block Protect (TB) ...............................................................................................12 Reserved Bits ............................................................................................................................12 Status Register Protect (SRP)................................................................................................13 Status Register Memory Protection.......................................................................................13 10.2 INSTRUCTIONS .....................................................................................................14 10.2.1 10.2.2 Manufacturer and Device Identification.................................................................................14 Instruction Set............................................................................................................................15 -2 - W25X64 10.2.3 10.2.4 10.2.5 10.2.6 10.2.7 10.2.8 10.2.9 10.2.10 10.2.11 10.2.12 10.2.13 10.2.14 10.2.15 10.2.16 10.2.17 Write Enable (06h)....................................................................................................................16 Write Disable (04h) ..................................................................................................................16 Read Status Register (05h)....................................................................................................17 Write Status Register (01h) ....................................................................................................18 Read Data (03h) .......................................................................................................................19 Fast Read (0Bh)........................................................................................................................20 Fast Read Dual Output (3Bh).................................................................................................21 Page Program (02h)..............................................................................................................22 Sector Erase (20h).................................................................................................................23 Block Erase (D8h)..................................................................................................................24 Chip Erase (C7h) ...................................................................................................................25 Power-down (B9h) .................................................................................................................26 Release Power-down / Device ID (ABh) ............................................................................27 Read Manufacturer / Device ID (90h)..................................................................................29 JEDEC ID (9Fh) ......................................................................................................................30 11 ELECTRICAL CHARACTERISTICS......................................................................................31 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 Absolute Maximum Ratings ....................................................................................31 Operating Ranges ..................................................................................................31 Power-up Timing and Write Inhibit Threshold.............................................................32 DC Electrical Characteristics...................................................................................33 AC Measurement Conditions ...................................................................................35 AC Electrical Characteristics...................................................................................36 AC Electrical Characteristics (cont’d).......................................................................37 Serial Output Timing...............................................................................................38 Input Timing...........................................................................................................38 Hold Timing ..........................................................................................................38 12 PACKAGE SPECIFICATION...............................................................................................39 12.1 12.2 12.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................39 8-Contact 8x6mm WSON (Package Code ZE) ..........................................................40 16-Pin SOIC 300-mil (Winbond Package Code SF)....................................................41 13 14 ORDERING INFORMATION (1) ............................................................................................42 REVISION HISTORY..........................................................................................................44 -3 - Publication Release Date: December 19, 2008 Revision A W25X64 1 GENERAL DESCRIPTION The W25X64 (64M-bit) Serial Flash memory provide a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1 A for power-down. All devices are offered in space-saving packages. The W25X64 array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase). The W25X64 has 2048 erasable sectors and 128 erasable blocks. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25X64 supports the standard Serial Peripheral Interface (SPI), and a high performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial Data Out. SPI clock frequencies of up to 75MHz are supported allowing equivalent clock rates of 150MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification. 2 FEATURES • Family of Serial Flash Memories – W 25X64: 64M-bit / 8M-byte (8,388,608) – 256-bytes per programmable page – Uniform 4K-byte Sectors / 64K-byte Blocks • SPI with Single or Dual Outputs – Clock, Chip Select, Data I/O, Data Out – Optional Hold function for SPI flexibility • Data Transfer up to 150-bits / second – Clock operation to 75MHz – Fast Read Dual Output instruction – Auto-increment Read capability • Flexible Architecture with 4KB sectors – Sector Erase (4K-bytes) – Block Erase (64K-byte) – Page program up to 256 bytes