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W55412A

W55412A

  • 厂商:

    WINBOND(华邦)

  • 封装:

  • 描述:

    W55412A - VOICE PROM (256K OTP) - Winbond

  • 数据手册
  • 价格&库存
W55412A 数据手册
W55412A VOICE PROM (256K OTP) GENERAL DESCRIPTION The W55412A is a 256K × 1 bit one-time programmable (OTP) ROM. The W55412A is designed for easy cascading with Winbond speech ICs to emulate sounds and functions. The W55412A data ROM allows synthesis of messages of up to 12 seconds in duration (not including repetition or silence). FEATURES • Provides RDP, WRP, and DATA pins to cascade with Winbond speech ICs • Data and address are processed in serial form • Suitable for low pin count applications (8-pin DIP) • Low power consumption: − Operating: 3 mA (max.) − Standby: 1µA (max.) • Programming voltage (VPP): 12 to 12.5V • Operating voltage range: 3 to 5V • Organized as 256K × 1 bit • Data access time: 500 nS (max.) PIN CONFIGURATION V PP MCLK/PREDATA VSS WRP 1 2 3 4 8 7 6 5 MODE/PGM/CLK VDD RDP DATA -1- Publication Release Date: May 1996 Revision A2 W55412A PIN DESCRIPTION NO. PIN NAME I/O Read 1 2 3 4 5 6 7 8 VPP MCLK/PREDATA VSS WRP DATA RDP VDD MODE/PGM/CLK I I/O I I/O I/O I I I NC NC Negative power supply Write clock pulse line Bidirectional data line Read clock pulse line Positive voltage supply NC DESCRIPTION Program/Erase/Repair Logic input Logic input Negative power supply No use No use No use Positive voltage supply Logic input BLOCK DIAGRAM MCLK/PREDATA VPP MODE/PGM/CLK VDD VSS RDP WRP DATA 9 8 I/O Control/Address Counter/Register Input Buffer 8 Redundant Array 9 8 Mux 512 X-DEC Core Array Y-DEC/ Mux SenAMP 8 8 1 to 8 DeMux Decoder DeMux/Output Buffer Mux SenAMP FUNCTIONAL DESCRIPTION Voice data are written to the W55412A using the Winbond writer and the Winbond Coding System. The voice data must be converted to *.obj form before being written to the W55412A. -2- W55412A The W55412A's read function allows data stored on the chip to be accessed by an OTP demo board cascaded with a Winbond PowerSpeech™ body. The DATA pin is a bidirectional pin used for address input and data output. The MODE/PGM/CLK, VPP, and MCLK/PREDATA pins are used to program or erase the chip, not used in the normal read mode. ABSOLUTE MAXIMUM RATINGS SYMBOL VDD VIN VOUT TOPR PD Notes: 1. Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. 2. All voltages are referenced to VSS. 3. VIN and VOUT refer to pins WRP, RDP, DATA, and MCLK/PREDATA. 4. TOPR: Operating temperature for commercial market. 5. PD: Maximum power dissipation without output load. RATING -0.5 to +7.0 VSS -0.5 to VDD +0.5 VSS -0.5 to VDD +0.5 0 to 70 200 UNIT V V V °C mW NOTES 1, 2 3, 2 3, 2 4 5 DC CHARACTERISTICS (VDD = 4.5 V, VSS = 0 V, TA = 0 to 70° C) PARAMETER Power Supply Voltage Standby Current Operating Current Input Current (WRP, RDP) Output Current (DATA) Drive Sink SYMBOL VDD ISB IDD II IO MIN. 2.4V -250 µA 250 µA TYP. 4.5V - MAX. 5.0V 1 µA 3 mA 0.2 µA - CONDITIONS VDD = 4.5V No Load VDATA = 4.2 V VDATA = 0.3 V -3- Publication Release Date: May 1996 Revision A2 W55412A AC CHARACTERISTICS (VDD = 4.5 V, TA = 0 to 70° C) PARAMETER Data Setup Time Data Hold Time Output Enable to Data Valid Output Data Hold Time Write End to Read Setup Time SYMBOL TDS TDH TOE TOH TWRS MIN. 0 100 2 TYP. - MAX. 1 500 - UNIT µS µS nS nS µS Note: TDS, TDH, TOE, TOH, and TWRS are shown below: 1 2 TDS T DH 17 TWRS 18 WRP 1 2 TOH D0 D1 RDP TOE N DATA A17 A16 A1 A0 DN-1 TYPICAL APPLICATION CIRCUIT VDD W528X TG1 TG2 TG3 TG4 LED1 STPB STPA NC SPK VSS WRP DATA RDP NC NC NC NC NC OSC VDD W55412A VPP MD/P/CLK VDD MC/PDATA VSS RDP 1.2M ohm WRP DATA VDD VDD -4- W55412A Headquarters No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792697 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006 Winbond Electronics (H.K.) Ltd. Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27516023 FAX: 852-27552064 Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 Note: All data and specifications are subject to change without notice. -5- Publication Release Date: May 1996 Revision A2
W55412A 价格&库存

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