W632GG6MB-12

W632GG6MB 16M  8 BANKS  16 BIT DDR3 SDRAM Table of Contents1. GENERAL DESCRIPTION ................................................................................................................... 5 2. FEATURES ........................................................................................................................................... 5 3. ORDER INFORMATION ....................................................................................................................... 6 4. KEY PARAMETERS ............................................................................................................................. 7 5. BALL CONFIGURATION ...................................................................................................................... 8 6. BALL DESCRIPTION ............................................................................................................................ 9 7. BLOCK DIAGRAM .............................................................................................................................. 11 8. 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 FUNCTIONAL DESCRIPTION ............................................................................................................ 12 Basic Functionality .............................................................................................................................. 12 RESET and Initialization Procedure .................................................................................................... 12 8.2.1 Power-up Initialization Sequence ..................................................................................... 12 8.2.2 Reset Initialization with Stable Power .............................................................................. 14 Programming the Mode Registers....................................................................................................... 15 8.3.1 Mode Register MR0 ......................................................................................................... 17 8.3.1.1 Burst Length, Type and Order ................................................................................ 18 8.3.1.2 CAS Latency........................................................................................................... 18 8.3.1.3 Test Mode............................................................................................................... 19 8.3.1.4 DLL Reset............................................................................................................... 19 8.3.1.5 Write Recovery ....................................................................................................... 19 8.3.1.6 Precharge PD DLL ................................................................................................. 19 8.3.2 Mode Register MR1 ......................................................................................................... 20 8.3.2.1 DLL Enable/Disable ................................................................................................ 20 8.3.2.2 Output Driver Impedance Control ........................................................................... 21 8.3.2.3 ODT RTT Values .................................................................................................... 21 8.3.2.4 Additive Latency (AL) ............................................................................................. 21 8.3.2.5 Write leveling .......................................................................................................... 21 8.3.2.6 Output Disable ........................................................................................................ 21 8.3.3 Mode Register MR2 ......................................................................................................... 22 8.3.3.1 Partial Array Self Refresh (PASR) .......................................................................... 23 8.3.3.2 CAS Write Latency (CWL) ...................................................................................... 23 8.3.3.3 Auto Self Refresh (ASR) and Self Refresh Temperature (SRT) ............................. 23 8.3.3.4 Dynamic ODT (Rtt_WR) ......................................................................................... 23 8.3.4 Mode Register MR3 ......................................................................................................... 24 8.3.4.1 Multi Purpose Register (MPR) ................................................................................ 24 No OPeration (NOP) Command .......................................................................................................... 25 Deselect Command............................................................................................................................. 25 DLL-off Mode ...................................................................................................................................... 25 DLL on/off switching procedure ........................................................................................................... 26 8.7.1 DLL “on” to DLL “off” Procedure ....................................................................................... 26 8.7.2 DLL “off” to DLL “on” Procedure ....................................................................................... 27 Input clock frequency change ............................................................................................................. 28 8.8.1 Frequency change during Self-Refresh............................................................................ 28 8.8.2 Frequency change during Precharge Power-down .......................................................... 28 Write Leveling ..................................................................................................................................... 30 8.9.1 DRAM setting for write leveling & DRAM termination function in that mode .................... 31 Publication Release Date: Nov. 22, 2017 Revision: A02 -1- W632GG6MB 8.10 8.11 8.12 8.13 8.14 8.15 8.16 8.17 8.18 8.19 8.9.2 Write Leveling Procedure ................................................................................................. 31 8.9.3 Write Leveling Mode Exit ................................................................................................. 33 Multi Purpose Register ........................................................................................................................ 34 8.10.1 MPR Functional Description ............................................................................................. 35 8.10.2 MPR Register Address Definition ..................................................................................... 36 8.10.3 Relevant Timing Parameters ............................................................................................ 36 8.10.4 Protocol Example ............................................................................................................. 36 ACTIVE Command.............................................................................................................................. 42 PRECHARGE Command .................................................................................................................... 42 READ Operation ................................................................................................................................. 43 8.13.1 READ Burst Operation ..................................................................................................... 43 8.13.2 READ Timing Definitions .................................................................................................. 44 8.13.2.1 READ Timing; Clock to Data Strobe relationship.................................................... 45 8.13.2.2 READ Timing; Data Strobe to Data relationship ..................................................... 46 8.13.2.3 tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Calculation ............................................. 47 8.13.2.4 tRPRE Calculation .................................................................................................. 48 8.13.2.5 tRPST Calculation .................................................................................................. 48 8.13.2.6 Burst Read Operation followed by a Precharge...................................................... 54 WRITE Operation ................................................................................................................................ 56 8.14.1 DDR3 Burst Operation ..................................................................................................... 56 8.14.2 WRITE Timing Violations ................................................................................................. 56 8.14.2.1 Motivation ............................................................................................................... 56 8.14.2.2 Data Setup and Hold Violations .............................................................................. 56 8.14.2.3 Strobe to Strobe and Strobe to Clock Violations..................................................... 56 8.14.2.4 Write Timing Parameters ........................................................................................ 56 8.14.3 Write Data Mask............................................................................................................... 57 8.14.4 tWPRE Calculation........................................................................................................... 58 8.14.5 tWPST Calculation ........................................................................................................... 58 Refresh Command .............................................................................................................................. 65 Self-Refresh Operation ....................................................................................................................... 67 Power-Down Modes ............................................................................................................................ 69 8.17.1 Power-Down Entry and Exit ............................................................................................. 69 8.17.2 Power-Down clarifications - Case 1 ................................................................................. 75 8.17.3 Power-Down clarifications - Case 2 ................................................................................. 75 8.17.4 Power-Down clarifications - Case 3 ................................................................................. 76 ZQ Calibration Commands .................................................................................................................. 77 8.18.1 ZQ Calibration Description ............................................................................................... 77 8.18.2 ZQ Calibration Timing ...................................................................................................... 78 8.18.3 ZQ External Resistor Value, Tolerance, and Capacitive loading ...................................... 78 On-Die Termination (ODT) .................................................................................................................. 79 8.19.1 ODT Mode Register and ODT Truth Table ...................................................................... 79 8.19.2 Synchronous ODT Mode .................................................................................................. 80 8.19.2.1 ODT Latency and Posted ODT ............................................................................... 80 8.19.2.2 Timing Parameters ................................................................................................. 80 8.19.2.3 ODT during Reads .................................................................................................. 82 8.19.3 Dynamic ODT .................................................................................................................. 83 8.19.3.1 Functional Description: ........................................................................................... 83 8.19.3.2 ODT Timing Diagrams ............................................................................................ 84 8.19.4 Asynchronous ODT Mode ................................................................................................ 88 Publication Release Date: Nov. 22, 2017 Revision: A02 -2- W632GG6MB 8.19.4.1 8.19.4.2 8.19.4.3 8.19.4.4 low periods 9. 9.1 9.2 9.3 10. Synchronous to Asynchronous ODT Mode Transitions .......................................... 89 Synchronous to Asynchronous ODT Mode Transition during Power-Down Entry .. 89 Asynchronous to Synchronous ODT Mode Transition during Power-Down Exit..... 92 Asynchronous to Synchronous ODT Mode during short CKE high and short CKE 93 OPERATION MODE ........................................................................................................................... 94 Command Truth Table ........................................................................................................................ 94 CKE Truth Table ................................................................................................................................. 96 Simplified State Diagram ..................................................................................................................... 97 ELECTRICAL CHARACTERISTICS ................................................................................................... 98 Absolute Maximum Ratings ................................................................................................................ 98 Operating Temperature Condition ....................................................................................................... 98 DC & AC Operating Conditions ........................................................................................................... 98 10.3.1 Recommended DC Operating Conditions ........................................................................ 98 10.4 Input and Output Leakage Currents .................................................................................................... 99 10.5 Interface Test Conditions .................................................................................................................... 99 10.6 DC and AC Input Measurement Levels ............................................................................................. 100 10.6.1 DC and AC Input Levels for Single-Ended Command and Address Signals .................. 100 10.6.2 DC and AC Input Levels for Single-Ended Data Signals ................................................ 101 10.6.3 Differential swing requirements for clock (CK - CK#) and strobe (DQS - DQS#) ........... 103 10.6.4 Single-ended requirements for differential signals ......................................................... 104 10.6.5 Differential Input Cross Point Voltage ............................................................................ 105 10.6.6 Slew Rate Definitions for Single-Ended Input Signals .................................................... 106 10.6.7 Slew Rate Definitions for Differential Input Signals ........................................................ 106 10.7 DC and AC Output Measurement Levels .......................................................................................... 107 10.7.1 Output Slew Rate Definition and Requirements ............................................................. 107 10.7.1.1 Single Ended Output Slew Rate ........................................................................... 108 10.7.1.2 Differential Output Slew Rate ............................................................................... 109 10.8 34 ohm Output Driver DC Electrical Characteristics.......................................................................... 110 10.8.1 Output Driver Temperature and Voltage sensitivity ........................................................ 112 10.9 On-Die Termination (ODT) Levels and Characteristics ..................................................................... 113 10.9.1 ODT Levels and I-V Characteristics ............................................................................... 113 10.9.2 ODT DC Electrical Characteristics ................................................................................. 114 10.9.3 ODT Temperature and Voltage sensitivity ..................................................................... 114 10.9.4 Design guide lines for RTTPU and RTTPD ....................................................................... 115 10.10 ODT Timing Definitions............................................................................................................ 116 10.10.1 Test Load for ODT Timings ............................................................................................ 116 10.10.2 ODT Timing Definitions .................................................................................................. 116 10.11 Input/Output Capacitance ........................................................................................................ 120 10.12 Overshoot and Undershoot Specifications............................................................................... 121 10.12.1 AC Overshoot /Undershoot Specification for Address and Control Pins: ....................... 121 10.12.2 AC Overshoot /Undershoot Specification for Clock, Data, Strobe and Mask Pins: ........ 121 10.13 IDD and IDDQ Specification Parameters and Test Conditions ................................................ 122 10.13.1 IDD and IDDQ Measurement Conditions ....................................................................... 122 10.13.2 IDD Current Specifications ............................................................................................. 132 10.14 Clock Specification .................................................................................................................. 133 10.15 Speed Bins .............................................................................................................................. 134 10.15.1 DDR3-1333 Speed Bin and Operating Conditions ......................................................... 134 10.15.2 DDR3-1600 Speed Bin and Operating Conditions ......................................................... 135 10.15.3 DDR3-1866 Speed Bin and Operating Conditions ......................................................... 136 10.1 10.2 10.3 Publication Release Date: Nov. 22, 2017 Revision: A02 -3- W632GG6MB 10.15.4 10.15.5 DDR3-2133 Speed Bin and Operating Conditions ......................................................... 137 Speed Bin General Notes .............................................................................................. 138 10.16 AC Characteristics ................................................................................................................... 139 10.16.1 AC Timing and Operating Condition for -09/09I/09J/-11/11I/11J speed grades ............. 139 10.16.2 AC Timing and Operating Condition for -12/12I/12J/-15/15I/15J speed grades ............. 143 10.16.3 Timing Parameter Notes ................................................................................................ 147 10.16.4 Address / Command Setup, Hold and Derating ............................................................. 150 10.16.5 Data Setup, Hold and Slew Rate Derating ..................................................................... 157 11. PACKAGE SPECIFICATION ............................................................................................................ 159 12. REVISION HISTORY ........................................................................................................................ 160 Publication Release Date: Nov. 22, 2017 Revision: A02 -4- W632GG6MB 1. GENERAL DESCRIPTION The W632GG6MB is a 2G bits DDR3 SDRAM, organized as 16,777,216 words  8 banks  16 bits. This device achieves high speed transfer rates up to 2133 MT/s (DDR3-2133) for various applications. This device is sorted into the following speed grades: -09, -11, -12, -15, 09I, 11I, 12I, 15I, 09J, 11J, 12J and 15J. The -09 ,09I and 09J speed grades are compliant to the DDR3-2133 (14-14-14) specification (The 09I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 09J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C). The -11 ,11I and 11J speed grades are compliant to the DDR3-1866 (13-13-13) specification (The 11I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 11J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C). The -12, 12I and 12J speed grades are compliant to the DDR3-1600 (11-11-11) specification (The 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 12J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C). The -15, 15I and 15J speed grades are compliant to the DDR3-1333 (9-9-9) specification (The 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C, the 15J industrial plus grade which is guaranteed to support -40°C ≤ TCASE ≤ 105°C). The W632GG6MB is designed to comply with the following key DDR3 SDRAM features such as posted CAS#, programmable CAS# Write Latency (CWL), ZQ calibration, on die termination and asynchronous reset. All of the control and address inputs are synchronized with a pair of e xternally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a differential DQS-DQS# pair in a source synchronous fashion. 2. FEATURES  Power Supply: VDD, VDDQ = 1.5V ± 0.075V  Double Data Rate architecture: two data transfers per clock cycle  Eight internal banks for concurrent operation  8 bit prefetch architecture  CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14  Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF)  Programmable read burst ordering: interleaved or nibble sequential  Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data  Edge-aligned with read data and center-aligned with write data  DLL aligns DQ and DQS transitions with clock  Differential clock inputs (CK and CK#)  Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)  Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency  Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)  Auto-precharge operation for read and write bursts Publication Release Date: Nov. 22, 2017 Revision: A02 -5- W632GG6MB  Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)  Precharged Power Down and Active Power Down  Data masks (DM) for write data  Programmable CAS Write Latency (CWL) per operating frequency  Write Latency WL = AL + CWL  Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence  System level timing calibration support via write leveling and MPR read pattern  ZQ Calibration for output driver and ODT using external reference resistor to ground  Asynchronous RESET# pin for Power-up initialization sequence and reset function  Programmable on-die termination (ODT) for data, data mask and differential strobe pairs  Dynamic ODT mode for improved signal integrity and preselectable termination impedances during writes  2K Byte page size  Interface: SSTL_15  Packaged in VFBGA 96 Ball (7.5x13 mm2 with thickness of 1.0 mm), using lead free materials with RoHS compliant 3. ORDER INFORMATION PART NUMBER SPEED GRADE OPERATING TEMPERATURE W632GG6MB-09 DDR3-2133 (14-14-14) 0°C ≤ TCASE ≤ 95°C W632GG6MB09I DDR3-2133 (14-14-14) -40°C ≤ TCASE ≤ 95°C W632GG6MB09J DDR3-2133 (14-14-14) -40°C ≤ TCASE ≤ 105°C W632GG6MB-11 DDR3-1866 (13-13-13) 0°C ≤ TCASE ≤ 95°C W632GG6MB11I DDR3-1866 (13-13-13) -40°C ≤ TCASE ≤ 95°C W632GG6MB11J DDR3-1866 (13-13-13) -40°C ≤ TCASE ≤ 105°C W632GG6MB-12 DDR3-1600 (11-11-11) 0°C ≤ TCASE ≤ 95°C W632GG6MB12I DDR3-1600 (11-11-11) -40°C ≤ TCASE ≤ 95°C W632GG6MB12J DDR3-1600 (11-11-11) -40°C ≤ TCASE ≤ 105°C W632GG6MB-15 DDR3-1333 (9-9-9) 0°C ≤ TCASE ≤ 95°C W632GG6MB15I DDR3-1333 (9-9-9) -40°C ≤ TCASE ≤ 95°C W632GG6MB15J DDR3-1333 (9-9-9) -40°C ≤ TCASE ≤ 105°C Publication Release Date: Nov. 22, 2017 Revision: A02 -6- W632GG6MB 4. KEY PARAMETERS Speed Bin CL-nRCD-nRP Part Number Extension Parameter Maximum operating frequency using maximum allowed settings for Sup_CL and Sup_CWL Internal read command to first data ACT to internal read or write delay time PRE command period Sym. DDR3-2133 14-14-14 -09/09I/09J Min. Max. DDR3-1866 13-13-13 -11/11I/11J Min. Max. fCKMAX  1066  933 tAA 13.09 20 13.91 20 tRCD 13.09  13.91  tRP 13.09  13.91  DDR3-1600 11-11-11 -12/12I/12J Min. Max.  13.75 (13.125)*5 13.75 (13.125)*5 13.75 (13.125)*5 48.75 800 DDR3-1333 9-9-9 -15/15I/15J Min. Max.  13.5 20 (13.125)*5 13.5  (13.125)*5 13.5  (13.125)*5 49.5 667 MHz 20 nS  nS  nS ACT to ACT or REF command period tRC 46.09  47.91   nS ACT to PRE command period tRAS 33 9 * tREFI 34 9 * tREFI 35 9 * tREFI 36 9 * tREFI nS 3.0 3.3 3.0 3.3 3.0 3.3 3.0 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3 nS nS 1.875 < 2.5 1.875 < 2.5 1.875 < 2.5 1.875 < 2.5 1.875 < 2.5 1.875 < 2.5 1.5 < 1.875 1.5 < 1.875 1.5 < 1.875 1.5 < 1.875 1.5 < 1.875 1.5 < 1.875 1.25 < 1.5 1.25 < 1.5 1.07 < 1.25 0.938 < 1.07 CL = 5 CL = 6 CL = 7 CL = 8 CL = 9 CL = 10 CL = 11 CL = 13 CL = 14 tCK(AVG) tCK(AVG) CWL = 6 tCK(AVG) CWL = 6 tCK(AVG) CWL = 7 tCK(AVG) CWL = 7 tCK(AVG) CWL = 8 tCK(AVG) CWL = 9 tCK(AVG) CWL = 10 tCK(AVG) CWL = 5 CWL = 5 Supported CL Settings Sup_CL Sup_CWL Supported CWL Settings -40°C ≤ TCASE ≤ 85°C Average 0°C ≤ TCASE ≤ 85°C periodic tREFI refresh 85°C < TCASE ≤ 95°C Interval 95°C < TCASE ≤ 105°C Operating One Bank Active-Precharge IDD0 Current Operating One Bank Active-ReadIDD1 Precharge Current Operating Burst Read Current IDD4R Operating Burst Write Current IDD4W Burst Refresh Current Normal Temperature Self-Refresh Current Operating Bank Interleave Current 5, 6, 7, 8, 9, 10, 11, 13, 14 5, 6, 7, 8, 9, 10 (48.125)*5 Reserved 1.875 < 2.5 Reserved 1.5 < 1.875 Reserved 1.07 < 1.25 Reserved  Unit (49.125)*5 nS nS Reserved Reserved Reserved Reserved nS nS 5, 6, (7), 8, 9, 10 nCK 5, 6, 7 5, 6, (7), 8, (9), 10, 11 5, 6, 7, 8 5, 6, 8, 10, 13 Reserved nS nS nS  7.8*2, 3  7.8*2, 3  7.8*2, 3  7.8*2, 3  7.8*1  7.8*1  7.8*1  7.8*1  3.9*4  3.9*4  3.9*4  3.9*4  3.9* 4  3.9* 4  3.9* 4  3.9*4 nCK μS μS μS μS  140  135  120  110 mA  175  160  145  130 mA  230  210  190  165  260  235  210  185 mA mA IDD5B  195  190  180  175 mA IDD6  11  11  11  11 mA IDD7  290  260  235  205 mA 5, 6, 7, 9 Notes: (Field value contents in blue font or parentheses are optional AC parameter and CL setting) 1. All speed grades support 0°C ≤ TCASE ≤ 85°C with full JEDEC AC and DC specifications. 2. The -09, -11, -12 and -15 speed grades, -40°C ≤ TCASE < 0°C is not available. 3. The 09I, 09J, 11I, 11J, 12I, 12J, 15I and 15J speed grades support -40°C ≤ TCASE ≤ 85°C with full JEDEC AC and DC specifications. 4. The -09, 09I, -11, 11I, -12, 12I, -15 and 15I speed grades, TCASE is able to extend to 95°C. The 09J, 11J, 12J and 15J speed grades, TCASE is able to extend to 105°C. They are with doubling Auto Refresh commands in frequency to a 32 mS period ( tREFI = 3.9 µS), it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the Auto Self-Refresh mode (ASR) (MR2 A6 = 1b, MR2 A7 is don't care). 5. For devices supporting optional down binning to CL=7 and CL=9, tAA/tRCD/tRP min must be 13.125 nS or lower. SPD settings must be programmed to match. For example, DDR3-1333 (9-9-9) devices supporting down binning to DDR3-1066 (7-7-7) should program 13.125 nS in SPD bytes for tAAmin (Byte 16), tRCDmin (Byte 18), and tRPmin (Byte 20). DDR3-1600 (11-11-11) devices supporting down binning to DDR3-1333 (9-9-9) or DDR3-1066 (7-7-7) should program 13.125 nS in SPD bytes for tAAmin (Byte16), tRCDmin (Byte 18), and tRPmin (Byte 20). Once tRP (Byte 20) is programmed to 13.125 nS, tRCmin (Byte 21, 23) also should be programmed accordingly. For example, 49.125nS (tRASmin + tRPmin = 36 nS + 13.125 nS) for DDR3-1333 (9-9-9) and 48.125 nS (tRASmin + tRPmin = 35 nS + 13.125 nS) for DDR3-1600 (11-11-11). Publication Release Date: Nov. 22, 2017 Revision: A02 -7- W632GG6MB 5. BALL CONFIGURATION 1 2 3 VDDQ DQU5 DQU7 VSSQ VDD VDDQ 4 5 6 7 8 9 A DQU4 VDDQ VSS VSS B DQSU# DQU6 VSSQ DQU3 DQU1 C DQSU DQU2 VDDQ VSSQ VDDQ DMU D DQU0 VSSQ VDD VSS VSSQ DQL0 E DML VSSQ VDDQ VDDQ DQL2 DQSL F DQL1 DQL3 VSSQ VSSQ DQL6 DQSL# G VDD VSS VSSQ VREFDQ VDDQ DQL4 H DQL7 DQL5 VDDQ NC VSS RAS# J CK VSS NC ODT VDD CAS# K CK# VDD CKE NC CS# WE# L A10/AP ZQ NC VSS BA0 BA2 M NC VREFCA VSS VDD A3 A0 N A12/BC# BA1 VDD VSS A5 A2 P A1 A4 VSS VDD A7 A9 R A11 A6 VDD VSS RESET# A13 T NC A8 VSS Publication Release Date: Nov. 22, 2017 Revision: A02 -8- W632GG6MB 6. BALL DESCRIPTION BALL NUMBER SYMBOL TYPE DESCRIPTION J7, K7 CK, CK# Input Clock: CK and CK# are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK#. K9 CKE Input Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power Down and Self-Refresh operation (all banks idle), or Active Power Down (row Active in any bank). CKE is asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable during the power on and initialization sequence, they must be maintained during all operations (including Self-Refresh). CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK#, ODT and CKE, are disabled during power down. Input buffers, excluding CKE, are disabled during Self-Refresh. L2 CS# Input Chip Select: All commands are masked when CS# is registered HIGH. CS# provides for external Rank selection on systems with multiple Ranks. CS# is considered part of the command code. K1 ODT Input On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR3 SDRAM. When enabled, ODT is applied to each DQ, DQSU, DQSU#, DQSL, DQSL#, DMU, and DML signal. The ODT signal will be ignored if Mode Registers MR1 and MR2 are programmed to disable ODT and during Self Refresh. J3, K3, L3 RAS#, CAS#, WE# Input Command Inputs: RAS#, CAS# and WE# (along with CS#) define the command being entered. D3, E7 DMU, DML Input Input Data Mask: DMU and DML are the input mask signals control the lower or upper bytes for write data. Input data is masked when DMU/DML is sampled HIGH coincident with that input data during a Write access. DM is sampled on both edges of DQS. M2, N8, M3 BA0−BA2 Input Bank Address Inputs: BA0−BA2 define to which bank an Active, Read, Write, or Precharge command is being applied. Bank address also determines which mode register is to be accessed during a MRS cycle. N3, P7, P3, N2, P8, P2, R8, R2, T8, R3, L7, R7, N7, T3 A0−A13 Input Address Inputs: Provide the row address for Active commands and the column address for Read/Write commands to select one location out of the memory array in the respective bank. (A10/AP and A12/BC# have additional functions; see below). The address inputs also provide the op-code during Mode Register Set command. Row address: A0−A13. Column address: A0−A9. Auto-precharge: A10 is sampled during Read/Write commands to determine whether Auto-precharge should be performed to the accessed bank after the Read/Write operation. L7 N7 T2 A10/AP A12/BC# RESET# Input Input Input (HIGH: Auto-precharge; LOW: no Auto-precharge). A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank addresses. Burst Chop: A12/BC# is sampled during Read and Write commands to determine if burst chop (on-the-fly) will be performed. (HIGH, no burst chop; LOW: burst chopped). See section 9.1 “Command Truth Table” on page 94 for details. Active Low Asynchronous Reset: Reset is active when RESET# is LOW, and inactive when RESET# is HIGH. RESET# must be HIGH during normal operation. RESET# is a CMOS rail to rail signal with DC high and low at 80% and 20% of VDD, RESET# active is destructive to data contents. Publication Release Date: Nov. 22, 2017 Revision: A02 -9- W632GG6MB E3, F7, F2, F8, H3, H8, G2, H7 DQL0−DQL7 Input/Output Data Input/Output: Lower byte of Bi-directional data bus. D7, C3, C8, C2, A7, A2, B8, A3 DQU0−DQU7 Input/Output Data Input/Output: Upper byte of Bi-directional data bus. Input/Output Lower byte data Strobe: Data Strobe output with read data, input with write data of DQL[7:0]. Edge-aligned with read data, centered in write data. DQSL is paired with DQSL# to provide differential pair signaling to the system during read and write data transfer. DDR3 SDRAM supports differential data strobe only and does not support singleended. Upper byte data Strobe: Data Strobe output with read data, input with write data of DQU[7:0]. Edge-aligned with read data, centered in write data. DQSU is paired with DQSU# to provide differential pair signaling to the system during read and write data transfer. DDR3 SDRAM supports differential data strobe only and does not support singleended. F3, G3 DQSL, DQSL# C7, B7 DQSU, DQSU# Input/Output B2, D9, G7, K2, K8, N1, N9, R1, R9 VDD Supply Power Supply: 1.5V ± 0.075V. A9, B3, E1, G8, J2, J8, M1, M9, P1, P9, T1, T9 VSS Supply Ground. A1, A8, C1, C9, D2, E9, F1, H2, H9 VDDQ Supply DQ Power Supply: 1.5V ± 0.075V. B1, B9, D1, D8, E2, E8, F9, G1, G9 VSSQ Supply DQ Ground. H1 VREFDQ Supply Reference voltage for DQ. M8 VREFCA Supply Reference voltage for Control, Command and Address inputs. L8 ZQ Supply External reference ball for output drive and On-Die Termination Impedance calibration: This ball needs an external 240 Ω ± 1% external resistor (RZQ), connected from this ball to ground to perform ZQ calibration. J1, J9, L1, L9, M7, T7 NC No Connect: No internal electrical connection is present. Note: Input only balls (BA0-BA2, A0-A13, RAS#, CAS#, WE#, CS#, CKE, ODT and RESET#) do not supply termination. Publication Release Date: Nov. 22, 2017 Revision: A02 - 10 - W632GG6MB 7. BLOCK DIAGRAM CK, CK# CLOCK BUFFER CKE CONTROL CS# SIGNAL RAS# COMMAND GENERATOR DECODER A0 MODE REGISTER SENSE AMPLIFIER ADDRESS BUFFER A9 A11 A12 A13 BA2 BA1 BA0 CELL ARRAY BANK #0 ROW DECODER ROW DECODER A10 COLUMN DECODER COLUMN DECODER CELL ARRAY BANK #1 CELL ARRAY BANK #4 COLUMN DECODER ROW DECODER COLUMN DECODER WE# ROW DECODER CAS# CELL ARRAY BANK #5 SENSE AMPLIFIER CK, CK# ODT DLL PREFETCH REGISTER DATA CONTROL CIRCUIT DM MASK LOGIC REFRESH COLUMN COUNTER COUNTER DQL0−DQL7 DQL0−DQL7 READ drivers DQU0−DQU7 DQU0−DQU7 LDQS, LDQS# ODT LDQS, LDQS# WRITE drivers LDQS, LDQS# CONTROL UDQS, UDQS# DQ BUFFER LDM, UDM LDM, UDM ZQCL, ZQCS ZQ CAL CELL ARRAY BANK #2 SENSE AMPLIFIER COLUMN DECODER CELL ARRAY BANK #3 SENSE AMPLIFIER CELL ARRAY BANK #6 SENSE AMPLIFIER COLUMN DECODER ROW DECODER Note: RZQ and VSSQ are external component COLUMN DECODER ROW DECODER To ODT/output drivers VSSQ ROW DECODER COLUMN DECODER RZQ ROW DECODER ZQ CELL ARRAY BANK #7 SENSE AMPLIFIER NOTE: The cell array configuration is 16384 * 1024 * 16 Publication Release Date: Nov. 22, 2017 Revision: A02 - 11 - W632GG6MB 8. FUNCTIONAL DESCRIPTION 8.1 Basic Functionality The DDR3 SDRAM is a high-speed dynamic random-access memory internally configured as an eight-bank DRAM. The DDR3 SDRAM uses an 8n prefetch architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR3 SDRAM consists of a single 8n-bit wide, four clock data transfer at the internal DRAM core and eight corresponding nbit wide, one-half clock cycle data transfers at the I/O pins. Read and write operation to the DDR3 SDRAM are burst oriented, start at a selected location, and continue for a burst length of eight or a ‘chopped’ burst of four in a programmed sequence. Operation begins with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be activated (BA0-BA2 select the bank; A0-A13 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst operation, determine if the auto precharge command is to be issued (via A10), and select BC4 or BL8 mode ‘on the fly’ (via A12) if enabled in the mode register. Prior to normal operation, the DDR3 SDRAM must be powered up and initialized in a predefined manner. The following sections provide detailed information covering device reset and initialization, register definition, command descriptions, and device operation. 8.2 8.2.1 RESET and Initialization Procedure Power-up Initialization Sequence The following sequence is required for POWER UP and Initialization. 1. Apply power (RESET# is recommended to be maintained below 0.2 * VDD; all other inputs may be undefined). RESET# needs to be maintained for minimum 200 µS with stable power. CKE is pulled “Low” anytime before RESET# being de-asserted (min. time 10 nS). The power voltage ramp time between 300 mV to VDD min. must be no greater than 200 mS; and during the ramp, VDD ≥ VDDQ and (VDD - VDDQ) < 0.3 Volts.    VDD and VDDQ are driven from a single power converter output, AND The voltage levels on all pins other than VDD, VDDQ, VSS, VSSQ must be less than or equal to VDDQ and VDD on one side and must be larger than or equal to VSSQ and VSS on the other side. In addition, VTT is limited to 0.95 V max once power ramp is finished, AND VREF tracks VDDQ/2. OR  Apply VDD without any slope reversal before or at the same time as VDDQ.  Apply VDDQ without any slope reversal before or at the same time as VTT & VREF.  The voltage levels on all pins other than VDD, VDDQ, VSS, VSSQ must be less than or equal to VDDQ and VDD on one side and must be larger than or equal to VSSQ and VSS on the other side. 2. After RESET# is de-asserted, wait for another 500 µS until CKE becomes active. During this time, the DRAM will start internal state initialization; this will be done independently of external clocks. 3. Clocks (CK, CK#) need to be started and stabilized for at least 10 nS or 5 tCK (which is larger) before CKE goes active. Since CKE is a synchronous signal, the corresponding set up time to clock (tIS) must be met. Also, a NOP or Deselect command must be registered (with t IS set up time to clock) before CKE goes active. Once the CKE is registered “High” after Reset, CKE needs to be continuously registered “High” until the initialization sequence is finished, including expiration of tDLLK and tZQinit. Publication Release Date: Nov. 22, 2017 Revision: A02 - 12 - W632GG6MB 4. The DDR3 SDRAM keeps its on-die termination in high-impedance state as long as RESET# is asserted. Further, the SDRAM keeps its on-die termination in high impedance state after RESET# deassertion until CKE is registered HIGH. The ODT input signal may be in undefined state until tIS before CKE is registered HIGH. When CKE is registered HIGH, the ODT input signal may be statically held at either LOW or HIGH. If Rtt_Nom is to be enabled in MR1, the ODT input signal must be statically held LOW. In all cases, the ODT input signal remains static until the power up initialization sequence is finished, including the expiration of tDLLK and tZQinit. 5. After CKE is being registered high, wait minimum of Reset CKE Exit time, t XPR, before issuing the first MRS command to load mode register. (tXPR=max (tXS ; 5 * tCK) 6. Issue MRS Command to load MR2 with all application settings. (To issue MRS command for MR2, provide “Low” to BA0 and BA2, “High” to BA1.) 7. Issue MRS Command to load MR3 with all application settings. (To issue MRS command for MR3, provide “Low” to BA2, “High” to BA0 and BA1.) 8. Issue MRS Command to load MR1 with all application settings and DLL enabled. (To issue “DLL Enable” command, provide “Low” to A0, “High” to BA0 and “Low” to BA1-BA2). 9. Issue MRS Command to load MR0 with all application settings and “DLL reset”. (To issue DLL reset command, provide “High” to A8 and “Low” to BA0-2). 10. Issue ZQCL command to starting ZQ calibration. 11. Wait for both tDLLK and tZQinit completed. 12. The DDR3 SDRAM is now ready for normal operation. Ta Tb Tc Td Te Tf Tg Th Ti Tj Tk CK, CK# tCKSRX VDD, VDDQ T = 200 µs T = 500 µs RESET# Tmin 10 ns tIS CKE VALID tDLLK tXPR tMRD tMRD tMRD tMOD tZQinit tIS Command *1 BA MRS MRS MRS MRS MR2 MR3 MR1 MR0 ZQCL *1 VALID tIS ODT VALID tIS Static LOW in case Rtt_Nom is enabled at time Tg, Otherwise static HIGH or LOW VALID RTT TIME BREAK DON'T CARE Note: 1. From time point “Td” until “Tk” NOP or DES commands must be applied between MRS and ZQCL commands. Figure 1 – Reset and Initialization Sequence at Power-on Ramping Publication Release Date: Nov. 22, 2017 Revision: A02 - 13 - W632GG6MB 8.2.2 Reset Initialization with Stable Power The following sequence is required for RESET at no power interruption initialization. 1. Asserted RESET below 0.2 * VDD anytime when reset is needed (all other inputs may be undefined). RESET needs to be maintained for minimum 100 nS. CKE is pulled “LOW” before RESET being de-asserted (min. time 10 nS). 2. Follow Power-up Initialization Sequence steps 2 to 11. 3. The Reset sequence is now completed; DDR3 SDRAM is ready for normal operation. Ta Tb Tc Td Te Tf Tg Th Ti Tj Tk CK, CK# tCKSRX VDD, VDDQ T = 100 ns T = 500 µs RESET# Tmin = 10 ns tIS CKE VALID tDLLK tXPR tMRD tMRD tMRD tMOD tZQinit tIS Command *1 BA MRS MRS MRS MRS MR2 MR3 MR1 MR0 ZQCL *1 VALID tIS ODT VALID tIS Static LOW in case Rtt_Nom is enabled at time Tg, Otherwise static HIGH or LOW VALID RTT TIME BREAK DON'T CARE Note: 1. From time point “Td” until “Tk” NOP or DES commands must be applied between MRS and ZQCL commands. Figure 2 – Reset Procedure at Power Stable Condition Publication Release Date: Nov. 22, 2017 Revision: A02 - 14 - W632GG6MB 8.3 Programming the Mode Registers For application flexibility, various functions, features, and modes are programmable in four Mode Registers, provided by the DDR3 SDRAM, as user defined variables and they must be programmed via a Mode Register Set (MRS) command. As the default values of the Mode Registers (MR#) are not defined, contents of Mode Registers must be fully initialized and/or re-initialized, i.e., written, after power up and/or reset for proper operation. Also the contents of the Mode Registers can be altered by re-executing the MRS command during normal operation. When programming the mode registers, even if the user chooses to modify only a sub-set of the MRS fields, all address fields within the accessed mode register must be redefined when the MRS command is issued. MRS command and DLL Reset do not affect array contents, which mean these commands can be executed any time after power-up without affecting the array contents. The mode register set command cycle time, tMRD is required to complete the write operation to the mode register and is the minimum time required between two MRS commands shown in Figure 3. T0 T1 Command VALID VALID Address VALID VALID T2 Ta0 Ta1 Tb0 Tb1 Tb2 Tc0 Tc1 Tc2 VALID MRS NOP/DES NOP/DES MRS NOP/DES NOP/DES VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID CK# CK CKE Settings Old settings Updating Settings ODT tMOD tMRD Rtt_Nom ENABLED prior and/or after MRS command New Settings ODTLoff+1 VALID VALID VALID Rtt_Nom DISABLED prior and/or after MRS command ODT VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID TIME BREAK VALID DON'T CARE Figure 3 – tMRD Timing Publication Release Date: Nov. 22, 2017 Revision: A02 - 15 - W632GG6MB The MRS command to Non-MRS command delay, tMOD is required for the DRAM to update the features, except DLL reset, and is the minimum time required from a MRS command to a non-MRS command excluding NOP and DES shown in Figure 4. T0 T1 Command VALID VALID Address VALID VALID T2 Ta0 Ta1 Ta2 Ta3 Ta4 Tb0 Tb1 Tb2 VALID MRS NOP/DES NOP/DES NOP/DES NOP/DES NOP/DES VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID CK# CK CKE Settings Old settings Updating Settings tMOD Rtt_Nom ENABLED prior and/or after MRS command ODT VALID VALID New Settings VALID ODTLoff+1 Rtt_Nom DISABLED prior and/or after MRS command ODT VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID TIME BREAK VALID DON'T CARE Figure 4 – tMOD Timing The mode register contents can be changed using the same command and timing requirements during normal operation as long as the DRAM is in idle state, i.e., all banks are in the precharged state with tRP satisfied, all data bursts are completed and CKE is high prior to writing into the mode register. If the Rtt_Nom Feature is enabled in the Mode Register prior and/or after a MRS command, the ODT signal must continuously be registered LOW ensuring RTT is in an off state prior to the MRS command. The ODT signal may be registered high after tMOD has expired. If the Rtt_Nom feature is disabled in the Mode Register prior and after a MRS command, the ODT signal can be registered either LOW or HIGH before, during and after the MRS command. The mode registers are divided into various fields depending on the functionality and/or modes. Publication Release Date: Nov. 22, 2017 Revision: A02 - 16 - W632GG6MB 8.3.1 Mode Register MR0 The mode register MR0 stores the data for controlling various operating modes of DDR3 SDRAM. It controls burst length, read burst type, CAS latency, test mode, DLL reset, WR and DLL control for precharge Power Down, which include various vendor specific options to make DDR3 SDRAM useful for various applications. The mode register is written by asserting low on CS#, RAS#, CAS#, WE#, BA0, BA1 and BA2, while controlling the states of address pins according to the Figure 5 below. BA2 BA1 BA0 A13 A12 0*1 0 0 0*1 PPD A8 0 1 BA1 0 0 1 1 BA0 0 1 0 1 A11 A10 A9 WR DLL Reset No A12 DLL Control for Precharge PD 0 Slow exit (DLL off) 1 Fast exit (DLL on) A7 DLL TM A6 A5 A4 CL A3 A2 RBT CL A1 A0 Address Field BL Mode Register 0 Burst Length A7 Yes MRS mode MR0 MR1 MR2 MR3 A8 0 1 Mode Normal A3 Read Burst Type 0 Nibble Sequential Test 1 Interleave A10 0 0 1 1 0 0 1 1 A9 0 1 0 1 0 1 0 1 WR(cycles) 16*2 5*2 6*2 7*2 8*2 10*2 12*2 14*2 A0 BL 8 (Fixed) 0 1 BC4 or 8 (on the fly) 0 BC4 (Fixed) 1 Reserved CAS Latency Write recovery for Auto precharge A11 0 0 0 0 1 1 1 1 A1 0 0 1 1 A6 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A5 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A4 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 A2 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Latency Reserved 5 6 7 8 9 10 11 Reserved 13 14 Reserved Reserved Reserved Reserved Reserved Notes: 1. BA2 and A13 are reserved for future use and must be programmed to “0” during MRS. 2. WR (write recovery for Auto precharge)min in clock cycles is calculated by dividing tWR (in nS) by tCK (in nS) and rounding up to the next integer: WRmin[cycles] = Roundup(tWR[nS] / tCK(avg)[nS]). The WR value in the mode register must be programmed to be equal or larger than WRmin. The programmed WR value is used with tRP to determine tDAL. 3. The table only shows the encodings for a given Cas Latency. For actual supported CAS Latency, please refer to “Speed Bins” tables for each frequency. 4. The table only shows the encodings for Write Recovery. For actual Write recovery timing, please refer to AC timing table. Figure 5 – MR0 Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 17 - W632GG6MB 8.3.1.1 Burst Length, Type and Order Accesses within a given burst may be programmed to sequential or interleaved order. The burst type is selected via bit A3 as shown in Figure 5. The ordering of accesses within a burst is determined by the burst length, burst type, and the starting column address as shown in Table 1. The burst length is defined by bits A0-A1. Burst length options include fixed BC4, fixed BL8 and ‘on the fly’ which allows BC4 or BL8 to be selected coincident with the registration of a Read or Write command via A12/BC#. Table 1 – Burst Type and Burst Order Burst Length READ/ WRITE READ 4 Chop WRITE 8 READ WRITE Starting Column Address (A2, A1, A0) Burst type = Sequential (decimal) A3 = 0 Burst type = Interleaved (decimal) A3 = 1 NOTES 000 0,1,2,3,T,T,T,T 0,1,2,3,T,T,T,T 1, 2, 3 001 1,2,3,0,T,T,T,T 1,0,3,2,T,T,T,T 1, 2, 3 010 2,3,0,1,T,T,T,T 2,3,0,1,T,T,T,T 1, 2, 3 011 3,0,1,2,T,T,T,T 3,2,1,0,T,T,T,T 1, 2, 3 100 4,5,6,7,T,T,T,T 4,5,6,7,T,T,T,T 1, 2, 3 101 5,6,7,4,T,T,T,T 5,4,7,6,T,T,T,T 1, 2, 3 110 6,7,4,5,T,T,T,T 6,7,4,5,T,T,T,T 1, 2, 3 111 7,4,5,6,T,T,T,T 7,6,5,4,T,T,T,T 1, 2, 3 0,V,V 0,1,2,3,X,X,X,X 0,1,2,3,X,X,X,X 1, 2, 4, 5 1,V,V 4,5,6,7,X,X,X,X 4,5,6,7,X,X,X,X 1, 2, 4, 5 000 0,1,2,3,4,5,6,7 0,1,2,3,4,5,6,7 2 001 1,2,3,0,5,6,7,4 1,0,3,2,5,4,7,6 2 010 2,3,0,1,6,7,4,5 2,3,0,1,6,7,4,5 2 011 3,0,1,2,7,4,5,6 3,2,1,0,7,6,5,4 2 100 4,5,6,7,0,1,2,3 4,5,6,7,0,1,2,3 2 101 5,6,7,4,1,2,3,0 5,4,7,6,1,0,3,2 2 110 6,7,4,5,2,3,0,1 6,7,4,5,2,3,0,1 2 111 7,4,5,6,3,0,1,2 7,6,5,4,3,2,1,0 2 V,V,V 0,1,2,3,4,5,6,7 0,1,2,3,4,5,6,7 2, 4 Notes: 1. In case of burst length being fixed to 4 by MR0 setting, the internal write operation starts two clock cycles earlier than for the BL8 mode. This means that the starting point for tWR and tWTR will be pulled in by two clocks. In case of burst length being selected on-the-fly via A12/BC#, the internal write operation starts at the same point in time like a burst of 8 write operation. This means that during on-the-fly control, the starting point for tWR and tWTR will not be pulled in by two clocks. 2. 0...7 bit number is value of CA[2:0] that causes this bit to be the first read during a burst. 3. T: Output driver for data and strobes are in high impedance. 4. V: a valid logic level (0 or 1), but respective buffer input ignores level on input pins. 5. X: Don't Care. 8.3.1.2 CAS Latency The CAS Latency is defined by MR0 (bits A2, A4, A5 and A6) as shown in Figure 5. CAS Latency is the delay, in clock cycles, between the internal Read command and the availability of the first bit of output data. DDR3 SDRAM does not support any half-clock latencies. The overall Read Latency (RL) is defined as Additive Latency (AL) + CAS Latency (CL); RL = AL + CL. For more information on the supported CL and AL settings based on the operating clock frequency, refer to section 10.15 “Speed Bins” on page 134. For detailed Read operation refer to section 8.13 “READ Operation” on page 43. Publication Release Date: Nov. 22, 2017 Revision: A02 - 18 - W632GG6MB 8.3.1.3 Test Mode The normal operating mode is selected by MR0 (bit A7 = 0) and all other bits set to the desired values shown in Figure 5. Programming bit A7 to a ‘1’ places the DDR3 SDRAM into a test mode that is only used by the DRAM Manufacturer and should NOT be used. No operations or functionality is specified if A7 = 1. 8.3.1.4 DLL Reset The DLL Reset bit is self-clearing, meaning that it returns back to the value of ‘0’ after the DLL reset function has been issued. Once the DLL is enabled, a subsequent DLL Reset should be applied. Any time that the DLL reset function is used, tDLLK must be met before any functions that require the DLL can be used (i.e., Read commands or ODT synchronous operations). 8.3.1.5 Write Recovery The programmed WR value MR0 (bits A9, A10 and A11) is used for the auto precharge feature along with tRP to determine tDAL. WR (write recovery for auto-precharge) min in clock cycles is calculated by dividing tWR (in nS) by tCK(avg) (in nS) and rounding up to the next integer: WRmin[cycles] = Roundup(tWR[nS]/tCK(avg)[nS]). The WR must be programmed to be equal to or larger than tWR(min). 8.3.1.6 Precharge PD DLL MR0 (bit A12) is used to select the DLL usage during precharge power down mode. When MR0 (A12 = 0), or ‘slow-exit’, the DLL is frozen after entering precharge power down (for potential power savings) and upon exit requires tXPDLL to be met prior to the next valid command. When MR0 (A12 = 1), or ‘fast-exit’, the DLL is maintained after entering precharge power down and upon exiting power down requires tXP to be met prior to the next valid command. Publication Release Date: Nov. 22, 2017 Revision: A02 - 19 - W632GG6MB 8.3.2 Mode Register MR1 The Mode Register MR1 stores the data for enabling or disabling the DLL, output driver strength, Rtt_Nom impedance, additive latency, Write leveling enable and Qoff. The Mode Register 1 is written by asserting low on CS#, RAS#, CAS#, WE#, high on BA0 and low on BA1 and BA2, while controlling the states of address pins according to the Figure 6 below. BA2 BA1 BA0 A13 A12 A11 A10 0*1 0 1 0*1 Qoff 0*1 0*1 BA1 BA0 0 0 MR Select MR0 A9 Rtt_Nom A9 0 A6 0 A8 A7 A6 A5 0*1 Level Rtt_Nom D.I.C A2 0 A2 A1 A0 Address Field Rtt_Nom D.I.C DLL Mode Register 1 Rtt_Nom*3 A0 DLL Enable Rtt_Nom disabled 0 Enable 1 Disable 0 1 MR1 0 0 1 RZQ/4 1 0 MR2 0 1 0 RZQ/2 1 1 MR3 0 1 1 RZQ/6 A7 Write leveling enable 0 Disabled 1 Enabled 1 0 0 RZQ/12*4 1 0 1 RZQ/8*4 1 1 0 Reserved 1 1 1 Reserved A4 A3 WR AL BT Note: RZQ = 240 ohms A12 Qoff*2 0 Output buffer enabled 1 A5 A1 Output Driver Impedance Control 0 0 RZQ/6 0 1 RZQ/7 1 0 Reserved 1 1 Reserved Note: RZQ = 240 ohms A4 A3 Additive Latency 0 0 0 (AL disabled) 0 1 CL-1 1 0 CL-2 1 1 Reserved Output buffer disabled*2 Notes: 1. BA2, A8, A10, A11 and A13 are reserved for future use and must be programmed to “0” during MRS. 2. Outputs disabled - DQs, DQSs, DQS#s. 3. In Write leveling Mode (MR1 A[7] = 1) with MR1 A[12]=1, all Rtt_Nom settings are allowed; in Write Leveling Mode (MR1 A[7] = 1) with MR1 A[12]=0, only Rtt_Nom settings of RZQ/2, RZQ/4 and RZQ/6 are allowed. 4. If Rtt_Nom is used during Writes, only the values RZQ/2, RZQ/4 and RZQ/6 are allowed. Figure 6 – MR1 Definition 8.3.2.1 DLL Enable/Disable The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon returning to normal operation after having the DLL disabled. During normal operation (DLL-on) with MR1 (A0 = 0), the DLL is automatically disabled when entering Self Refresh operation and is automatically re-enabled upon exit of Self Refresh operation. Any time the DLL is enabled and subsequently reset, tDLLK clock cycles must occur before a Read or synchronous ODT command can be issued to allow time for the internal clock to be synchronized with the external clock. Failing to wait for synchronization to occur may result in a violation of the tDQSCK, tAON or tAOF parameters. During tDLLK, CKE must continuously be registered high. DDR3 SDRAM does not require DLL for any Write operation, except when Rtt_WR is enabled and the DLL is required for proper ODT operation. For more detailed information on DLL Disable operation refer to section 8.6 “DLL-off Mode” on page 25. The direct ODT feature is not supported during DLL-off mode. The on-die termination resistors must be disabled by continuously registering the ODT pin low and/or by programming the Rtt_Nom bits MR1{A9,A6,A2} to {0,0,0} via a mode register set command during DLL-off mode. Publication Release Date: Nov. 22, 2017 Revision: A02 - 20 - W632GG6MB The dynamic ODT feature is not supported at DLL-off mode. User must use MRS command to set Rtt_WR, MR2 {A10, A9} = {0,0}, to disable Dynamic ODT externally. 8.3.2.2 Output Driver Impedance Control The output driver impedance of the DDR3 SDRAM device is selected by MR1 (bits A1 and A5) as shown in Figure 6. 8.3.2.3 ODT RTT Values DDR3 SDRAM is capable of providing two different termination values (Rtt_Nom and Rtt_WR). The nominal termination value Rtt_Nom is programmed in MR1. A separate value (Rtt_WR) may be programmed in MR2 to enable a unique R TT value when ODT is enabled during writes. The Rtt_WR value can be applied during writes even when Rtt_Nom is disabled. 8.3.2.4 Additive Latency (AL) Additive Latency (AL) operation is supported to make command and data bus efficient for sustainable bandwidths in DDR3 SDRAM. In this operation, the DDR3 SDRAM allows a read or write command (either with or without auto-precharge) to be issued immediately after the active command. The command is held for the time of the Additive Latency (AL) before it is issued inside the device. The Read Latency (RL) is controlled by the sum of the AL and CAS Latency (CL) register settings. Write Latency (WL) is controlled by the sum of the AL and CAS Write Latency (CWL) register settings. A summary of the AL register options are shown in Table 2. Table 2 – Additive Latency (AL) Settings A4 A3 AL 0 0 0 (AL Disabled) 0 1 CL - 1 1 0 CL - 2 1 1 Reserved Note: AL has a value of CL - 1 or CL - 2 as per the CL values programmed in the MR0 register. 8.3.2.5 Write leveling For better signal integrity, DDR3 memory module adopted fly-by topology for the commands, addresses, control signals, and clocks. The fly-by topology has the benefit of reducing the number of stubs and their length, but it also causes flight time skew between clock and strobe at every DRAM on the DIMM. This makes it difficult for the controller to maintain tDQSS, tDSS, and tDSH specification. Therefore, the DDR3 SDRAM supports a ‘write leveling’ feature to allow the controller to compensate for skew. See section 8.9 “Write Leveling” on page 30 for more details. 8.3.2.6 Output Disable The DDR3 SDRAM outputs may be enabled/disabled by MR1 (bit A12) as shown in Figure 6. When this feature is enabled (A12 = 1), all output pins (DQs, DQS, DQS#, etc.) are disconnected from the device, thus removing any loading of the output drivers. This feature may be useful when measuring module power, for example. For normal operation, A12 should be set to ‘0’. Publication Release Date: Nov. 22, 2017 Revision: A02 - 21 - W632GG6MB 8.3.3 Mode Register MR2 The Mode Register MR2 stores the data for controlling refresh related features, Rtt_WR impedance, and CAS write latency. The Mode Register 2 is written by asserting low on CS#, RAS#, CAS#, WE#, high on BA1 and low on BA0 and BA2, while controlling the states of address pins according to the Figure 7 below. BA2 BA1 BA0 0*1 1 0 A13 A12 A11 0*1 BA1 BA0 MR Select 0 0 MR0 0 1 MR1 1 0 MR2 1 1 MR3 A10 A9 Rtt_WR A8 A7 A6 0*1 SRT ASR A5 A4 A3 A2 A1 CWL A0 PASR Address Field Mode Register 2 A2 A1 A0 Partial Array Self Refresh for 8 Banks 0 0 0 Full array 0 0 1 Half Array (BA[2:0]=000,001,010 & 011) 0 1 0 Quarter Array (BA[2:0]=000 & 001) 0 1 1 1/8th Array (BA[2:0]=000) A6 Auto Self Refresh (ASR) 0 Manual SR Reference (SRT) 1 0 0 3/4 Array (BA[2:0]=010,011,100,101,110 & 111) 1 ASR enable 1 0 1 Half Array (BA[2:0]=100,101,110 & 111) Quarter Array (BA[2:0]=110 & 111) A7 Self Refresh Temperature (SRT) Range 1 1 0 0 Normal operating temperature range 1 1 1 1 Extended operating temperature range 1/8th Array (BA[2:0]=111) CAS write Latency (CWL) A5 A4 A3 0 0 0 0 0 1 RZQ/4 0 1 0 RZQ/2 0 1 1 8 (1.5nS > tCK(avg) ≥ 1.25nS) Reserved 1 0 0 9 (1.25nS > tCK(avg) ≥ 1.07nS) 1 0 1 10 (1.07nS > tCK(avg) ≥ 0.938nS) 1 1 0 Reserved 1 1 1 Reserved A10 A9 Rtt_WR*2 0 0 Dynamic ODT off (Write does not affect Rtt value) 0 1 1 0 1 1 5 (tCK(avg) ≥ 2.5nS) 6 (2.5nS > tCK(avg) ≥ 1.875nS) 7 (1.875nS > tCK(avg) ≥ 1.5nS) Notes: 1. BA2, A8, A11~A13 are reserved for future use and must be programmed to “0” during MRS. 2. The Rtt_WR value can be applied during writes even when Rtt_Nom is disabled. During write leveling, Dynamic ODT is not available. Figure 7 – MR2 Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 22 - W632GG6MB 8.3.3.1 Partial Array Self Refresh (PASR) If PASR (Partial Array Self Refresh) is enabled, data located in areas of the array beyond the specified address range shown in Figure 7 will be lost if Self Refresh is entered. Data integrity will be maintained if tREFI conditions are met and no Self Refresh command is issued. 8.3.3.2 CAS Write Latency (CWL) The CAS Write Latency is defined by MR2 (bits A3-A5), as shown in Figure 7. CAS Write Latency is the delay, in clock cycles, between the internal Write command and the availability of the first bit of input data. DDR3 SDRAM does not support any half-clock latencies. The overall Write Latency (WL) is defined as Additive Latency (AL) + CAS Write Latency (CWL); WL = AL + CWL. For more information on the supported CWL and AL settings based on the operating clock frequency, refer to section 10.15 “Speed Bins” on page 134. For detailed Write operation refer to section 8.14 “WRITE Operation” on page 56. 8.3.3.3 Auto Self Refresh (ASR) and Self Refresh Temperature (SRT) DDR3 SDRAM must support Self Refresh operation at all supported temperatures. Applications requiring Self Refresh operation in the Extended Temperature Range must use the ASR function or program the SRT bit appropriately. When ASR enabled, DDR3 SDRAM automatically provides Self Refresh power management functions for all supported operating temperature values. If not enabled, the SRT bit must be programmed to indicate TOPER during subsequent Self Refresh operation. ASR = 0, Self Refresh rate is determined by SRT bit A7 in MR2. ASR = 1, Self Refresh rate is determined by on-die thermal sensor. SRT bit A7 in MR2 is don't care. 8.3.3.4 Dynamic ODT (Rtt_WR) DDR3 SDRAM introduces a new feature “Dynamic ODT”. In certain application cases and to further enhance signal integrity on the data bus, it is desirable that the termination strength of the DDR3 SDRAM can be changed without issuing an MRS command. MR2 Register locations A9 and A10 configure the Dynamic ODT settings. In Write leveling mode, only Rtt_Nom is available. For details on Dynamic ODT operation, refer to section 8.19.3 “Dynamic ODT” on page 83. Publication Release Date: Nov. 22, 2017 Revision: A02 - 23 - W632GG6MB 8.3.4 Mode Register MR3 The Mode Register MR3 controls Multi purpose registers. The Mode Register 3 is written by asserting low on CS#, RAS#, CAS#, WE#, high on BA1 and BA0, and low on BA2 while controlling the states of address pins according to the Figure 8 below. BA2 BA1 BA0 0*1 1 1 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 0*1 A2 MPR A1 A0 MPR Loc Address Field Mode Register 3 MR Select MPR Address MPR Operation BA1 BA0 MR Select 0 0 MR0 0 1 MR1 0 Normal operation*3 1 Dataflow from MPR 1 0 MR2 1 1 MR3 A2 MPR A1 A0 MPR location 0 0 Predefined pattern*2 0 1 RFU 1 0 RFU 1 1 RFU Notes: 1. BA2, A3~A13 are reserved for future use and must be programmed to “0” during MRS. 2. The predefined pattern will be used for read synchronization. 3. When MPR control is set for normal operation (MR3 A[2] = 0) then MR3 A[1:0] will be ignored. Figure 8 – MR3 Definition 8.3.4.1 Multi Purpose Register (MPR) The Multi Purpose Register (MPR) function is used to Read out a predefined system timing calibration bit sequence. To enable the MPR, a MODE Register Set (MRS) command must be issued to MR3 Register with bit A2 = 1. Prior to issuing the MRS command, all banks must be in the idle state (all banks precharged and tRP met). Once the MPR is enabled, any subsequent RD or RDA commands will be redirected to the Multi Purpose Register. When the MPR is enabled, only RD or RDA commands are allowed until a subsequent MRS command is issued with the MPR disabled (MR3 bit A2 = 0). Power Down mode, Self Refresh, and any other non-RD/RDA command is not allowed during MPR enable mode. The RESET function is supported during MPR enable mode. For detailed MPR operation refer to section 8.10 “Multi Purpose Register” on page 34. Publication Release Date: Nov. 22, 2017 Revision: A02 - 24 - W632GG6MB 8.4 No OPeration (NOP) Command The No OPeration (NOP) command is used to instruct the selected DDR3 SDRAM to perform a NOP (CS# LOW and RAS#, CAS#, and WE# HIGH). This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected. 8.5 Deselect Command The DESELECT function (CS# HIGH) prevents new commands from being executed by the DDR3 SDRAM. The DDR3 SDRAM is effectively deselected. Operations already in progress are not affected. 8.6 DLL-off Mode DDR3 DLL-off mode is entered by setting MR1 bit A0 to “1”; this will disable the DLL for subsequent operations until A0 bit is set back to “0”. The MR1 A0 bit for DLL control can be switched either during initialization or later. Refer to section 8.8 “Input clock frequency change” on page 28. The DLL-off Mode operations listed below are an optional feature for DDR3. The maximum clock frequency for DLL-off Mode is specified by the parameter tCK(DLL_OFF). There is no minimum frequency limit besides the need to satisfy the refresh interval, t REFI. Due to latency counter and timing restrictions, only one value of CAS Latency (CL) in MR0 and CAS Write Latency (CWL) in MR2 are supported. The DLL-off mode is only required to support setting of both CL=6 and CWL=6. DLL-off mode will affect the Read data Clock to Data Strobe relationship (t DQSCK), but not the Data Strobe to Data relationship (tDQSQ, tQH). Special attention is needed to line up Read data to controller time domain. Comparing with DLL-on mode, where tDQSCK starts from the rising clock edge (AL+CL) cycles after the Read command, the DLL-off mode tDQSCK starts (AL+CL - 1) cycles after the read command. Another difference is that tDQSCK may not be small compared to t CK (it might even be larger than tCK) and the difference between tDQSCK min and tDQSCK max is significantly larger than in DLL-on mode. The timing relations on DLL-off mode READ operation is shown in the following Timing Diagram (CL=6, BL=8): T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command Address Bank Col b RL (DLL_on) = AL + CL = 6 (CL = 6, AL = 0) CL = 6 DQS,DQS# (DLL_on) DQ (DLL_on) Dout b RL (DLL_off) = AL + ( CL – 1 ) = 5 Dout b+1 Dout b+3 Dout b+2 Dout b+4 Dout b+5 Dout b+6 Dout b+7 tDQSCK(DLL_off)_min DQS,DQS# (DLL_off) Dout b DQ (DLL_off) Dout b+1 Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 Dout b+7 tDQSCK(DLL_on)_max DQS,DQS# (DLL_off) Dout b DQ (DLL_off) Dout b+1 Note: The tDQSCK is used here for DQS, DQS# and DQ to have a simplified diagram; the DLL_off shift will affect both timings in the same way and the skew between all DQ, and DQS, DQS# signals will still be tDQSQ. Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 TRANSITIONING DATA Dout b+7 DON'T CARE Figure 9 – DLL-off mode READ Timing Operation Publication Release Date: Nov. 22, 2017 Revision: A02 - 25 - W632GG6MB 8.7 DLL on/off switching procedure DDR3 DLL-off mode is entered by setting MR1 bit A0 to “1”; this will disable the DLL for subsequent operations until A0 bit is set back to “0”. 8.7.1 DLL “on” to DLL “off” Procedure To switch from DLL “on” to DLL “off” requires the frequency to be changed during Self-Refresh, as outlined in the following procedure: 1. Starting from Idle state (All banks pre-charged, all timings fulfilled, and DRAMs On-die Termination resistors, RTT, must be in high impedance state before MRS to MR1 to disable the DLL.) 2. Set MR1 bit A0 to “1” to disable the DLL. 3. Wait tMOD. 4. Enter Self Refresh Mode; wait until (tCKSRE) is satisfied. 5. Change frequency, in guidance with section 8.8 “Input clock frequency change” on page 28. 6. Wait until a stable clock is available for at least (tCKSRX) at DRAM inputs. 7. Starting with the Self Refresh Exit command, CKE must continuously be registered HIGH until all tMOD timings from any MRS command are satisfied. In addition, if any ODT features were enabled in the mode registers when Self Refresh mode was entered, the ODT signal must continuously be registered LOW until all tMOD timings from any MRS command are satisfied. If both ODT features were disabled in the mode registers when Self Refresh mode was entered, ODT signal can be registered LOW or HIGH. 8. Wait tXS, then set Mode Registers with appropriate values (especially an update of CL, CWL and WR may be necessary. A ZQCL command may also be issued after t XS). 9. Wait for tMOD, then DRAM is ready for next command. T0 T1 Ta0 Ta1 Tb0 Tc0 Td0 Td1 Te0 Te1 Tf0 CK# CK CKE VALID*8 Command MRS*2 *1 NOP tMOD SRE*3 SRX*6 NOP tCKSRE *4 tCKSRX*5 NOP tXS MRS*7 NOP VALID*8 tMOD tCKESR ODT VALID8 ODT: Static LOW in case Rtt_Nom and Rtt_WR is enabled, otherwise static Low or High Notes: 1. Starting with Idle state, RTT in Hi-Z state 2. Disable DLL by setting MR1 Bit A0 to 1 3. Enter SR 4. Change Frequency 5. Clock must be stable tCKSRX 6. Exit SR 7. Update Mode register with DLL off parameters setting 8. Any valid command TIME BREAK DON'T CARE Figure 10 – DLL Switch Sequence from DLL-on to DLL-off Publication Release Date: Nov. 22, 2017 Revision: A02 - 26 - W632GG6MB 8.7.2 DLL “off” to DLL “on” Procedure To switch from DLL “off” to DLL “on” (with required frequency change) during Self-Refresh: 1. Starting from Idle state (All banks pre-charged, all timings fulfilled and DRAMs On-die Termination resistors (RTT) must be in high impedance state before Self-Refresh mode is entered.) 2. Enter Self Refresh Mode, wait until tCKSRE satisfied. 3. Change frequency, in guidance with section 8.8 “Input clock frequency change” on page 28. 4. Wait until a stable clock is available for at least (tCKSRX) at DRAM inputs. 5. Starting with the Self Refresh Exit command, CKE must continuously be registered HIGH until t DLLK timing from subsequent DLL Reset command is satisfied. In addition, if any ODT features were enabled in the mode registers when Self Refresh mode was entered, the ODT signal must continuously be registered LOW until tDLLK timings from subsequent DLL Reset command is satisfied. If both ODT features are disabled in the mode registers when Self Refresh mode was entered, ODT signal can be registered LOW or HIGH. 6. Wait tXS, then set MR1 bit A0 to “0” to enable the DLL. 7. Wait tMRD, then set MR0 bit A8 to “1” to start DLL Reset. 8. Wait tMRD, then set Mode Registers with appropriate values (especially an update of CL, CWL and WR may be necessary. After tMOD satisfied from any proceeding MRS command, a ZQCL command may also be issued during or after tDLLK.) 9. Wait for tMOD, then DRAM is ready for next command (Remember to wait t DLLK after DLL Reset before applying command requiring a locked DLL!). In addition, wait also for t ZQoper in case a ZQCL command was issued. T0 Ta0 Ta1 Tb0 Tc0 Tc1 Td0 Te0 Tf1 Tg0 Th0 CK# CK CKE VALID tDLLK Command NOP *1 SRE*2 ODTLoff + 1 x tCK SRX*5 NOP tCKSRE tCKSRX*4 *3 MRS*6 tXS MRS*7 tMRD MRS*8 VALID*9 tMRD tCKESR ODT ODT: Static LOW in case Rtt_Nom and Rtt_WR is enabled, otherwise static Low or High Notes: 1. Starting with idle state 2. Enter SR 3. Change Frequency 4. Clock must be stable tCKSRX 5. Exit SR 6. Set DLL on by MR1 A0 = 0 7. Update Mode registers 8. Any valid command TIME BREAK DON'T CARE Figure 11 – DLL Switch Sequence from DLL Off to DLL On Publication Release Date: Nov. 22, 2017 Revision: A02 - 27 - W632GG6MB 8.8 Input clock frequency change Once the DDR3 SDRAM is initialized, the DDR3 SDRAM requires the clock to be “stable” during almost all states of normal operation. This means that, once the clock frequency has been set and is to be in the “stable state”, the clock period is not allowed to deviate except for what is allowed for by the clock jitter and SSC (spread spectrum clocking) specifications. The input clock frequency can be changed from one stable clock rate to another stable clock rate under two conditions: (1) Self-Refresh mode and (2) Precharge Power-down mode. Outside of these two modes, it is illegal to change the clock frequency. 8.8.1 Frequency change during Self-Refresh For the first condition, once the DDR3 SDRAM has been successfully placed in to Self-Refresh mode and tCKSRE has been satisfied, the state of the clock becomes a don't care. Once a don't care, changing the clock frequency is permissible, provided the new clock frequency is stable prior to tCKSRX. When entering and exiting Self-Refresh mode for the sole purpose of changing the clock frequency, the Self-Refresh entry and exit specifications must still be met as outlined in see section 8.16 “Self-Refresh Operation” on page 67. The DDR3 SDRAM input clock frequency is allowed to change only within the minimum and maximum operating frequency specified for the particular speed grade. Any frequency change below the minimum operating frequency would require the use of DLL_on mode -> DLL_off mode transition sequence; refer to section 8.7 “DLL on/off switching procedure” on page 26. 8.8.2 Frequency change during Precharge Power-down The second condition is when the DDR3 SDRAM is in Precharge Power-down mode (either fast exit mode or slow exit mode). If the Rtt_Nom feature was enabled in the mode register prior to entering Precharge power down mode, the ODT signal must continuously be registered LOW ensuring R TT is in an off state. If the Rtt_Nom feature was disabled in the mode register prior to entering Precharge power down mode, RTT will remain in the off state. The ODT signal can be registered either LOW or HIGH in this case. A minimum of tCKSRE must occur after CKE goes LOW before the clock frequency may change. The DDR3 SDRAM input clock frequency is allowed to change only within the minimum and maximum operating frequency specified for the particular speed grade. During the input clock frequency change, ODT and CKE must be held at stable LOW levels. Once the input clock frequency is changed, stable new clocks must be provided to the DRAM tCKSRX before Precharge Power-down may be exited; after Precharge Power-down is exited and tXP has expired, the DLL must be RESET via MRS. Depending on the new clock frequency, additional MRS commands may need to be issued to appropriately set the WR, CL, and CWL with CKE continuously registered high. During DLL re-lock period, ODT must remain LOW and CKE must remain HIGH. After the DLL lock time, the DRAM is ready to operate with new clock frequency. This process is depicted in Figure 12 on page 29. Publication Release Date: Nov. 22, 2017 Revision: A02 - 28 - W632GG6MB Previous clock frequency T0 CK# CK T1 T2 New clock frequency Ta0 Tb0 Tc1 tCK Td0 tCLb tCHb tCL tCH Tc0 Te0 tCLb tCHb tCKb tCKSRE Td1 Te1 tCLb tCHb tCKb tCKb tCKSRX tCKE tIH tIS tIH CKE tIS tCPDED Command NOP NOP NOP NOP NOP Address MRS NOP VALID DLL Reset tXP tAOFPD / tAOF VALID tIH tIS ODT DQS, DQS# High-Z DQ High-Z DM tDLLK Enter PRECHARGE Power-Down Mode Frequency Change Exit PRECHARGE Power-Down Mode TIME BREAK DON'T CARE Notes: 1. Applicable for both SLOW EXIT and FAST EXIT Precharge Power-down. 2. tAOFPD and tAOF must be satisfied and outputs High-Z prior to T1; refer to ODT timing section for exact requirements. 3. If the Rtt_Nom feature was enabled in the mode register prior to entering Precharge power down mode, the ODT signal must continuously be registered LOW ensuring RTT is in an off state, as shown in Figure 9. If the Rtt_Nom feature was disabled in the mode register prior to entering Precharge power down mode, RTT will remain in the off state. The ODT signal can be registered either LOW or HIGH in this case. Figure 12 – Change Frequency during Precharge Power-down Publication Release Date: Nov. 22, 2017 Revision: A02 - 29 - W632GG6MB 8.9 Write Leveling For better signal integrity, the DDR3 memory module adopted fly-by topology for the commands, addresses, control signals, and clocks. The fly-by topology has benefits from reducing number of stubs and their length, but it also causes flight time skew between clock and strobe at every DRAM on the DIMM. This makes it difficult for the Controller to maintain tDQSS, tDSS, and tDSH specification. Therefore, the DDR3 SDRAM supports a ‘write leveling’ feature to allow the controller to compensate for skew. The memory controller can use the ‘write leveling’ feature and feedback from the DDR3 SDRAM to adjust the DQS - DQS# to CK - CK# relationship. The memory controller involved in the leveling must have adjustable delay setting on DQS - DQS# to align the rising edge of DQS - DQS# with that of the clock at the DRAM pin. The DRAM asynchronously feeds back CK - CK#, sampled with the rising edge of DQS - DQS#, through the DQ bus. The controller repeatedly delays DQS - DQS# until a transition from 0 to 1 is detected. The DQS - DQS# delay established though this exercise would ensure tDQSS specification. Besides tDQSS, tDSS and tDSH specification also needs to be fulfilled. One way to achieve this is to combine the actual tDQSS in the application with an appropriate duty cycle and jitter on the DQS DQS# signals. Depending on the actual tDQSS in the application, the actual values for tDQSL and tDQSH may have to be better than the absolute limits provided in section 10.16 “AC Characteristics” in order to satisfy tDSS and tDSH specification. A conceptual timing of this scheme is shown in Figure 13. T0 Source T1 T2 T3 T4 T5 T6 T7 CK# CK Diff_DQS Tn Destination T0 CK# CK T2 T1 T3 T4 T5 T6 Diff_DQS DQ Diff_DQS DQ 0 or 1 0 0 0 Push DQS to capture 0-1 transition 0 or 1 1 1 1 Figure 13 – Write Leveling Concept DQS - DQS# driven by the controller during leveling mode must be terminated by the DRAM based on ranks populated. Similarly, the DQ bus driven by the DRAM must also be terminated at the controller. One or more data bits should carry the leveling feedback to the controller across the DRAM configurations x4, x8 and x16. On a x16 device, both byte lanes should be leveled independently. Therefore, a separate feedback mechanism should be available for each byte lane. The upper data bits should provide the feedback of the upper Diff_DQS(Diff_UDQS) to clock relationship whereas the lower data bits would indicate the lower Diff_DQS(Diff_LDQS) to clock relationship. Publication Release Date: Nov. 22, 2017 Revision: A02 - 30 - W632GG6MB 8.9.1 DRAM setting for write leveling & DRAM termination function in that mode DRAM enters into Write leveling mode if A7 in MR1 set ‘High’ and after finishing leveling, DRAM exits from write leveling mode if A7 in MR1 set ‘Low’ (Table 3). Note that in write leveling mode, only DQS/DQS# terminations are activated and deactivated via ODT pin, unlike normal operation (Table 4). Table 3 – MR setting involved in the leveling procedure Function MR1 Enable Disable Write leveling enable A7 1 0 Output buffer mode (Qoff) A12 0 1 Table 4 – DRAM termination function in the leveling mode ODT pin @DRAM DQS/DQS# termination DQs termination De-asserted Off Off Asserted On Off Note: In Write Leveling Mode with its output buffer disabled (MR1 A[7] = 1 with MR1 A[12] = 1) all Rtt_Nom settings are allowed; in Write Leveling Mode with its output buffer enabled (MR1 A[7] = 1 with MR1 A[12] = 0) only Rtt_Nom settings of RZQ/2, RZQ/4 and RZQ/6 are allowed. 8.9.2 Write Leveling Procedure The Memory controller initiates Leveling mode of all DRAMs by setting bit 7 of MR1 to 1. When entering write leveling mode, the DQ pins are in undefined driving mode. During write leveling mode, only NOP or DESELECT commands are allowed, as well as an MRS command to change Qoff bit (MR1[A12]) and an MRS command to exit write leveling (MR1[A7]). Upon exiting write leveling mode, the MRS command performing the exit (MR1[A7]=0) may also change MR1 bits of A12, A9, A6-A5, and A2-A1. Since the controller levels one rank at a time, the output of other ranks must be disabled by setting MR1 bit A12 to 1. The Controller may assert ODT after tMOD, at which time the DRAM is ready to accept the ODT signal. The Controller may drive DQS low and DQS# high after a delay of t WLDQSEN, at which time the DRAM has applied on-die termination on these signals. After tDQSL and tWLMRD, the controller provides a single DQS, DQS# edge which is used by the DRAM to sample CK - CK# driven from controller. tWLMRD(max) timing is controller dependent. DRAM samples CK - CK# status with rising edge of DQS - DQS# and provides feedback on all the DQ bits asynchronously after tWLO timing. Either one or all data bits ("prime DQ bit(s)") provide the leveling feedback. The DRAM's remaining DQ bits are driven Low statically after the first sampling procedure. There is a DQ output uncertainty of tWLOE defined to allow mismatch on DQ bits. The tWLOE period is defined from the transition of the earliest DQ bit to the corresponding transition of the latest DQ bit. There are no read strobes (DQS/DQS#) needed for these DQs. Controller samples incoming DQ and decides to increment or decrement DQS - DQS# delay setting and launches the next DQS/DQS# pulse after some time, which is controller dependent. Once a 0 to 1 transition is detected, the controller locks DQS - DQS# delay setting and write leveling is achieved for the device. Figure 14 describes the timing diagram and parameters for the overall Write Leveling procedure. Publication Release Date: Nov. 22, 2017 Revision: A02 - 31 - W632GG6MB T1 T2 tWLH tWLH tWLS tWLS CK#*5 CK Command MRS*2 NOP*3 NOP NOP NOP NOP tDQSL*6 tDQSH*6 NOP NOP NOP NOP NOP NOP tMOD ODT tWLDQSEN Diff_DQS tDQSL*6 tDQSH*6 *4 One Prime DQ: tWLMRD tWLO tWLO Prime DQ*1 tWLO Late Remaining DQs Early Remaining DQs tWLO All DQs are Prime: tWLMRD tWLOE tWLO tWLO Late Prime DQs*1 tWLOE Early Prime DQs*1 tWLO tWLOE UNDEFINED DRIVING MODE tWLO TIME BREAK DON'T CARE Notes: 1. DRAM has the option to drive leveling feedback on a prime DQ or all DQs. If feedback is driven only on one DQ, the remaining DQs must be driven low, as shown in above Figure, and maintained at this state throughout the leveling procedure. 2. MRS: Load MR1 to enter write leveling mode. 3. NOP: NOP or Deselect. 4. Diff_DQS is the differential data strobe (DQS, DQS#). Timing reference points are the zero crossings. DQS is shown with solid line, DQS# is shown with dotted line. 5. CK, CK#: CK is shown with solid dark line, where as CK# is drawn with dotted line. 6. DQS, DQS# needs to fulfill minimum pulse width requirements tDQSH(min) and tDQSL(min) as defined for regular Writes; the max pulse width is system dependent. Figure 14 – Timing details of Write leveling sequence [DQS - DQS# is capturing CK - CK# low at T1 and CK - CK# high at T2] Publication Release Date: Nov. 22, 2017 Revision: A02 - 32 - W632GG6MB 8.9.3 Write Leveling Mode Exit The following sequence describes how the Write Leveling Mode should be exited: 1. After the last rising strobe edge (see ~T0), stop driving the strobe signals (see ~Tc0). Note: From now on, DQ pins are in undefined driving mode, and will remain undefined, until t MOD after the respective MR command (Te1). 2. Drive ODT pin low (tIS must be satisfied) and continue registering low. (see Tb0). 3. After the RTT is switched off, disable Write Level Mode via MRS command (see Tc2). 4. After tMOD is satisfied (Te1), any valid command may be registered. (MR commands may be issued after tMRD (Td1). T0 T1 T2 Ta0 Tb0 Tc0 Tc1 Tc2 Td0 Td1 Te0 Te1 NOP NOP NOP NOP NOP NOP NOP MRS NOP VALID NOP VALID CK# CK Command tMRD Address MR1 VALID tIS VALID tMOD ODT ODTLoff RTT_DQS_DQS# tAOFmin Rtt_Nom tAOFmax DQS_DQS# RTT_DQ DQ*1 tWLO + tWLOE result = 1 UNDEFINED DRIVING MODE TRANSITIONING TIME BREAK DON'T CARE Note: 1. The DQ result = 1 between Ta0 and Tc0 is a result of the DQS, DQS# signals capturing CK high just after the T0 state. Figure 15 – Timing details of Write leveling exit Publication Release Date: Nov. 22, 2017 Revision: A02 - 33 - W632GG6MB 8.10 Multi Purpose Register The Multi Purpose Register (MPR) function is used to Read out a predefined system timing calibration bit sequence. The basic concept of the MPR is shown in Figure 16. Memory Core (all banks precharged) MR3 [A2] Multipurpose register Pre-defined data for Reads DQ, DM, DQS, DQS# Figure 16 – MPR Block Diagram To enable the MPR, a Mode Register Set (MRS) command must be issued to MR3 Register with bit A2 = 1, as shown in Table 5. Prior to issuing the MRS command, all banks must be in the idle state (all banks precharged and tRP met). Once the MPR is enabled, any subsequent RD or RDA commands will be redirected to the Multi Purpose Register. The resulting operation, when a RD or RDA command is issued, is defined by MR3 bits A[1:0] when the MPR is enabled as shown in Table 6. When the MPR is enabled, only RD or RDA commands are allowed until a subsequent MRS command is issued with the MPR disabled (MR3 bit A2 = 0). Note that in MPR mode RDA has the same functionality as a READ command which means the auto precharge part of RDA is ignored. Power-Down mode, SelfRefresh, and any other non-RD/RDA command is not allowed during MPR enable mode. The RESET function is supported during MPR enable mode. Table 5 – MPR Functional Description of MR3 Bits MR3 A[2] MR3 A[1:0] Function MPR MPR-Loc 0b don't care (0b or 1b) Normal operation, no MPR transaction All subsequent Reads will come from DRAM array All subsequent Write will go to DRAM array 1b See Table 6 Enable MPR mode, subsequent RD/RDA commands defined by MR3 A[1:0] Publication Release Date: Nov. 22, 2017 Revision: A02 - 34 - W632GG6MB 8.10.1 MPR Functional Description  One bit wide logical interface via all DQ pins during READ operation.  Register Read: — DQL[0] and DQU[0] drive information from MPR. — DQL[7:1] and DQU[7:1] either drive the same information as DQL[0], or they drive 0b.  Addressing during for Multi Purpose Register reads for all MPR agents: — BA[2:0]: Don't care — A[1:0]: A[1:0] must be equal to ‘00’b. Data read burst order in nibble is fixed — A[2]: A[2] selects the burst order For BL=8, A[2] must be equal to 0b, burst order is fixed to [0,1,2,3,4,5,6,7], *) For Burst Chop 4 cases, the burst order is switched on nibble base A[2]=0b, Burst order: 0,1,2,3 *) A[2]=1b, Burst order: 4,5,6,7 *) — A[9:3]: Don't care — A10/AP: Don't care — A12/BC#: Selects burst chop mode on-the-fly, if enabled within MR0 — A11, A13: Don't care  Regular interface functionality during register reads: — Support two Burst Ordering which are switched with A2 and A[1:0]=00b. — Support of read burst chop (MRS and on-the-fly via A12/BC#) — All other address bits (remaining column address bits including A10, all bank address bits) will be ignored by the DDR3 SDRAM. — Regular read latencies and AC timings apply. — DLL must be locked prior to MPR Reads. Note: *) Burst order bit 0 is assigned to LSB and burst order bit 7 is assigned to MSB of the selected MPR agent. Publication Release Date: Nov. 22, 2017 Revision: A02 - 35 - W632GG6MB 8.10.2 MPR Register Address Definition Table 6 provides an overview of the available data locations, how they are addressed by MR3 A[1:0] during a MRS to MR3, and how their individual bits are mapped into the burst order bits during a Multi Purpose Register Read. Table 6 – MPR Readouts and Burst Order Bit Mapping MR3 A[2] 1b 1b 1b 1b MR3 A[1:0] 00b Function Read Pre-defined Pattern for System Calibration 01b 10b 11b RFU RFU RFU Burst Length Read Address A[2:0] Burst Order and Data Pattern BL8 000b Burst order 0,1,2,3,4,5,6,7 Pre-defined Data Pattern [0,1,0,1,0,1,0,1] BC4 000b Burst order 0,1,2,3 Pre-defined Data Pattern [0,1,0,1] BC4 100b Burst order 4,5,6,7 Pre-defined Data Pattern [0,1,0,1] BL8 000b Burst order 0,1,2,3,4,5,6,7 BC4 000b Burst order 0,1,2,3 BC4 100b Burst order 4,5,6,7 BL8 000b Burst order 0,1,2,3,4,5,6,7 BC4 000b Burst order 0,1,2,3 BC4 100b Burst order 4,5,6,7 BL8 000b Burst order 0,1,2,3,4,5,6,7 BC4 000b Burst order 0,1,2,3 BC4 100b Burst order 4,5,6,7 Note: Burst order bit 0 is assigned to LSB and the burst order bit 7 is assigned to MSB of the selected MPR agent. 8.10.3 Relevant Timing Parameters The following AC timing parameters are important for operating the Multi Purpose Register: t RP, tMRD, tMOD, and tMPRR. For more details refer to section 10.16 “AC Characteristics” on page 139. 8.10.4 Protocol Example Protocol Example (This is one example): Read out pre-determined read-calibration pattern. Description: Multiple reads from Multi Purpose Register, in order to do system level read timing calibration based on pre-determined and standardized pattern. Protocol Steps:  Precharge All.  Wait until tRP is satisfied.  Set MRS, “MR3 A[2] = 1b” and “MR3 A[1:0] = 00b”. This redirects all subsequent reads and load pre-defined pattern into Multi Purpose Register.  Wait until tMRD and tMOD are satisfied (Multi Purpose Register is then ready to be read). During the period MR3 A[2] =1, no data write operation is allowed. Publication Release Date: Nov. 22, 2017 Revision: A02 - 36 - W632GG6MB  Read: A[1:0] = ‘00’b (Data burst order is fixed starting at nibble, always 00b here) A[2] = ‘0’b (For BL=8, burst order is fixed as 0,1,2,3,4,5,6,7) A12/BC# = 1 (use regular burst length of 8) All other address pins (including BA[2:0] and A10/AP): don't care   After RL = AL + CL, DRAM bursts out the pre-defined Read Calibration Pattern. Memory controller repeats these calibration reads until read data capture at memory controller is optimized.  After end of last MPR read burst, wait until tMPRR is satisfied.  Set MRS, “MR3 A[2] = 0b” and “MR3 A[1:0] = don't care” to the normal DRAM state. All subsequent read and write accesses will be regular reads and writes from/to the DRAM array.   Wait until tMRD and tMOD are satisfied. Continue with “regular” DRAM commands, like activate a memory bank for regular read or write access,... Publication Release Date: Nov. 22, 2017 Revision: A02 - 37 - W632GG6MB T0 Ta Tb0 Tb1 Tc0 Tc1 Tc2 Tc3 Tc4 Tc5 Tc6 Tc7 Tc8 Tc9 PREA MRS READ*1 NOP NOP NOP NOP NOP NOP NOP NOP MRS NOP NOP Td CK# CK Command tMPRR tMOD tRP tMOD BA 3 VALID 3 A[1:0] 0 0*2 VALID A[2] 1 0*2 0 A[9:3] 00 VALID 00 0 VALID 0 A[11] 0 VALID 0 A12/BC# 0 VALID*1 0 A10/AP 1 VALID RL DQS, DQS# DQ NOTES: TIME BREAK 1. RD with BL8 either by MRS or on the fly. 2. Memory Controller must drive 0 on A[2:0]. DON'T CARE Figure 17 – MPR Readout of pre-defined pattern, BL8 fixed burst order, single readout Publication Release Date: Nov. 22, 2017 Revision: A02 - 38 - W632GG6MB T0 Ta Tb0 Tc0 Tc1 Tc2 Tc3 Tc4 Tc5 Tc6 Tc7 Tc8 Tc9 T10 PREA MRS READ*1 READ*1 NOP NOP NOP NOP NOP NOP NOP NOP NOP MRS Td CK# CK Command tRP tMOD tCCD tMPRR tMOD BA 3 VALID VALID 3 A[1:0] 0 0*2 0*2 VALID A[2] 1 0*2 0*2 0 A[9:3] 00 VALID VALID 00 0 VALID VALID 0 A[11] 0 VALID VALID 0 A12/BC# 0 VALID*1 VALID*1 0 A10/AP 1 VALID RL DQS, DQS# RL DQ NOTES: TIME BREAK 1. RD with BL8 either by MRS or on the fly. 2. Memory Controller must drive 0 on A[2:0]. DON'T CARE Figure 18 – MPR Readout of pre-defined pattern, BL8 fixed burst order, back-to-back readout Publication Release Date: Nov. 22, 2017 Revision: A02 - 39 - W632GG6MB T0 Ta Tb0 Tc0 Tc1 Tc2 Tc3 Tc4 Tc5 Tc6 Tc7 Tc8 Tc9 T10 PREA MRS READ*1 READ*1 NOP NOP NOP NOP NOP NOP NOP MRS NOP NOP Td CK# CK Command tMPRR tCCD tMOD tRP tMOD BA 3 VALID VALID 3 A[1:0] 0 0*2 0*2 VALID A[2] 1 0*3 1*4 0 A[9:3] 00 VALID VALID 00 0 VALID VALID 0 A[11] 0 VALID VALID 0 A12/BC# 0 VALID*1 VALID*1 0 A10/AP 1 VALID RL DQS, DQS# RL DQ TIME BREAK NOTES: DON'T CARE 1. RD with BC4 either by MRS or on the fly. 2. Memory Controller must drive 0 on A[1:0]. 3. A[2]=0 selects lower 4 nibble bits 0....3. 4. A[2]=1 selects upper 4 nibble bits 4....7. Figure 19 – MPR Readout pre-defined pattern, BC4, lower nibble then upper nibble Publication Release Date: Nov. 22, 2017 Revision: A02 - 40 - W632GG6MB T0 Ta Tb0 Tc0 Tc1 Tc2 Tc3 Tc4 Tc5 Tc6 Tc7 Tc8 Tc9 T10 PREA MRS READ*1 READ*1 NOP NOP NOP NOP NOP NOP NOP MRS NOP NOP Td CK# CK Command tMPRR tCCD tMOD tRP tMOD BA 3 VALID VALID 3 A[1:0] 0 0*2 0*2 VALID A[2] 1 1*4 0*3 0 A[9:3] 00 VALID VALID 00 0 VALID VALID 0 A[11] 0 VALID VALID 0 A12/BC# 0 VALID*1 VALID*1 0 A10/AP 1 VALID RL DQS, DQS# RL DQ TIME BREAK NOTES: DON'T CARE 1. RD with BC4 either by MRS or on the fly. 2. Memory Controller must drive 0 on A[1:0]. 3. A[2]=0 selects lower 4 nibble bits 0....3. 4. A[2]=1 selects upper 4 nibble bits 4....7. Figure 20 – MPR Readout of pre-defined pattern, BC4, upper nibble then lower nibble Publication Release Date: Nov. 22, 2017 Revision: A02 - 41 - W632GG6MB 8.11 ACTIVE Command The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0-BA2 inputs selects the bank, and the address provided on inputs A0A13 selects the row. This row remains active (or opens) for accesses until a precharge command is issued to that bank. A PRECHARGE command must be issued before opening a different row in the same bank. 8.12 PRECHARGE Command The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row activation a specified time (tRP) after the PRECHARGE command is issued, except in the case of concurrent auto precharge, where a READ or WRITE command to a different bank is allowed as long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters. Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank. A PRECHARGE command is allowed if there is no open row in that bank (idle state) or if the previously open row is already in the process of precharging. However, the precharge period will be determined by the last PRECHARGE command issued to the bank. Publication Release Date: Nov. 22, 2017 Revision: A02 - 42 - W632GG6MB 8.13 READ Operation 8.13.1 READ Burst Operation During a READ or WRITE command, DDR3 will support BC4 and BL8 on the fly using address A12 during the READ or WRITE (AUTO PRECHARGE can be enabled or disabled). A12 = 0, BC4 (BC4 = burst chop, tCCD = 4) A12 = 1, BL8 A12 is used only for burst length control, not as a column address. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 Address*4 Bank Col n tRPST tRPRE DQS, DQS# DQ*2 Dout n Dout n+1 Dout n+2 Dout n+3 Dout n+4 Dout n+5 Dout n+6 Dout n+7 CL = 6 RL = AL + CL TRANSITIONING DATA DON'T CARE Notes: 1. BL8, RL = 6, AL = 0, CL = 6. 2. Dout n = data-out from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during READ command at T0. Figure 21 – READ Burst Operation RL = 6 (AL = 0, CL = 6, BL8) T0 T1 T5 T6 T10 T11 T12 T13 T14 T15 T16 READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 Address*4 Bank Col n tRPST tRPRE DQS, DQS# DQ*2 Dout n AL = 5 Dout n+1 Dout n+2 Dout n+3 Dout n+4 Dout n+5 Dout n+6 Dout n+7 CL = 6 RL = AL + CL TIME BREAK TRANSITIONING DATA DON'T CARE Notes: 1. BL8, RL = 11, AL = (CL - 1), CL = 6. 2. Dout n = data-out from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during READ command at T0. Figure 22 – READ Burst Operation RL = 11 (AL = 5, CL = 6, BL8) Publication Release Date: Nov. 22, 2017 Revision: A02 - 43 - W632GG6MB 8.13.2 READ Timing Definitions Read timing is shown in Figure 23 and is applied when the DLL is enabled and locked. Rising data strobe edge parameters:  tDQSCK min/max describes the allowed range for a rising data strobe edge relative to CK, CK#.  tDQSCK is the actual position of a rising strobe edge relative to CK, CK#.  tQSH describes the DQS, DQS# differential output high time.  tDQSQ describes the latest valid transition of the associated DQ pins.  tQH describes the earliest invalid transition of the associated DQ pins. Falling data strobe edge parameters:  tQSL describes the DQS, DQS# differential output low time.  tDQSQ describes the latest valid transition of the associated DQ pins.  tQH describes the earliest invalid transition of the associated DQ pins. tDQSQ; both rising/falling edges of DQS, no tAC defined. CK# CK tDQSCK(min) tDQSCK(min) tDQSCK(max) tDQSCK(max) Rising Strobe Region Rising Strobe Region tDQSCK tDQSCK tQSH tQSL tQH tQH tDQSQ DQS# DQS tDQSQ Associated DQ Pins Figure 23 – READ Timing Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 44 - W632GG6MB 8.13.2.1 READ Timing; Clock to Data Strobe relationship Clock to Data Strobe relationship is shown in Figure 24 and is applied when the DLL is enabled and locked. Rising data strobe edge parameters:  tDQSCK min/max describes the allowed range for a rising data strobe edge relative to CK, CK#.  tDQSCK is the actual position of a rising strobe edge relative to CK, CK#.  tQSH describes the data strobe high pulse width. Falling data strobe edge parameters:  tQSL describes the data strobe low pulse width. tLZ(DQS), tHZ(DQS) for preamble/postamble (see section 8.13.2.3 and Figure 26). RL Measured to this point CK/CK# tDQSCK(min) tDQSCK(min) tDQSCK(min) tDQSCK(min) tHZ(DQS)min tQSH tLZ(DQS)min tQSL tQSH tQSL tQSH tQSL DQS, DQS# Erly Strobe tRPST tRPRE Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 tHZ(DQS)max tDQSCK(max) tDQSCK(max) tDQSCK(max) tDQSCK(max) tLZ(DQS)max tRPST DQS, DQS# Late Strobe tQSH tQSL tQSH tQSH tQSL tQSL tRPRE Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Notes: 1. Within a burst, rising strobe edge is not necessarily fixed to be always at t DQSCK(min) or tDQSCK(max). Instead, rising strobe edge can vary between tDQSCK(min) and tDQSCK(max). 2. Not with standing note 1, a rising strobe edge with tDQSCK(max) at T(n) can not be immediately followed by a rising strobe edge with tDQSCK(min) at T(n+1). This is because other timing relationships (tQSH, tQSL) exist: if tDQSCK(n+1) < 0: tDQSCK(n) < 1.0 tCK - (tQSHmin + tQSLmin) - | tDQSCK(n+1) | 3. The DQS, DQS# differential output high time is defined by tQSH and the DQS, DQS# differential output low time is defined by tQSL. 4. Likewise, tLZ(DQS)min and tHZ(DQS)min are not tied to tDQSCK,min (early strobe case) and tLZ(DQS)max and tHZ(DQS)max are not tied to tDQSCK,max (late strobe case). 5. The minimum pulse width of read preamble is defined by tRPRE(min). 6. The maximum read postamble is bound by tDQSCK(min) plus tQSH(min) on the left side and tHZDSQ(max) on the right side. 7. The minimum pulse width of read postamble is defined by tRPST(min). 8. The maximum read preamble is bound by tLZDQS(min) on the left side and tDQSCK(max) on the right side. Figure 24 – Clock to Data Strobe Relationship Publication Release Date: Nov. 22, 2017 Revision: A02 - 45 - W632GG6MB 8.13.2.2 READ Timing; Data Strobe to Data relationship The Data Strobe to Data relationship is shown in Figure 25 and is applied when the DLL is enabled and locked. Rising data strobe edge parameters:  tDQSQ describes the latest valid transition of the associated DQ pins.  tQH describes the earliest invalid transition of the associated DQ pins. Falling data strobe edge parameters:  tDQSQ describes the latest valid transition of the associated DQ pins.  tQH describes the earliest invalid transition of the associated DQ pins. tDQSQ; both rising/falling edges of DQS, no tAC defined. T0 T1 READ NOP T2 T3 T4 T5 T6 T7 T8 T9 T10 NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 NOP RL = AL + CL Address*4 Bank Col n tDQSQ(max) tDQSQ(max) tRPST DQS, DQS# tRPRE tQH tQH Dout n DQ*2 (Last data valid) Dout n DQ*2 (first data no longer valid) Dout n All DQs collectively Dout n+1 Dout n+1 Dout n+1 Dout n+2 Dout n+2 Dout n+2 Dout n+3 Dout n+3 Dout n+3 Dout n+4 Dout n+4 Dout n+4 Dout n+5 Dout n+5 Dout n+5 TRANSITIONING DATA Dout n+6 Dout n+6 Dout n+6 Dout n+7 Dout n+7 Dout n+7 DON'T CARE Notes: 1. BL = 8, RL = 6 (AL = 0, CL = 6). 2. Dout n = data-out from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during READ command at T0. 5. Output timings are referenced to VDDQ/2, and DLL on for locking. 6. tDQSQ defines the skew between DQS, DQS# to Data and does not define DQS, DQS# to Clock. 7. Early Data transitions may not always happen at the same DQ. Data transitions of a DQ can vary (either early or late) within a burst. Figure 25 – Data Strobe to Data Relationship Publication Release Date: Nov. 22, 2017 Revision: A02 - 46 - W632GG6MB 8.13.2.3 tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Calculation tHZ and tLZ transitions occur in the same time window as valid data transitions. These parameters are referenced to a specific voltage level that specifies when the device output is no longer driving t HZ(DQS) and tHZ(DQ), or begins driving tLZ(DQS), tLZ(DQ). Figure 26 shows a method to calculate the point when the device is no longer driving tHZ(DQS) and tHZ(DQ), or begins driving tLZ(DQS), tLZ(DQ), by measuring the signal at two different voltages. The actual voltage measurement points are not critical as long as the calculation is consistent. The parameters tLZ(DQS), tLZ(DQ), tHZ(DQS), and tHZ(DQ) are defined as singled ended. tLZ(DQS): CK – CK# rising crossing at RL - 1 tLZ(DQ): CK – CK# rising crossing at RL tHZ(DQS), tHZ(DQ) with BL8: CK – CK# rising crossing at RL + 4 nCK tHZ(DQS), tHZ(DQ) with BC4: CK – CK# rising crossing at RL + 2 nCK CK CK CK# CK# tLZ tHZ VOH - x mV VTT + 2x mV VTT + x mV VOH - 2x mV tLZ(DQS), tLZ(DQ) VTT - x mV tHZ(DQS), tHZ(DQ) T1 VTT - 2x mV T2 T2 T1 tLZ(DQS), tLZ(DQ) begin point = 2 * T1 - T2 VOL + 2x mV VOL + x mV tHZ(DQS), tHZ(DQ) end point = 2 * T1 - T2 Figure 26 – tLZ and tHZ method for calculating transitions and endpoints Publication Release Date: Nov. 22, 2017 Revision: A02 - 47 - W632GG6MB 8.13.2.4 tRPRE Calculation The method for calculating differential pulse widths for tRPRE is shown in Figure 27. CK VTT CK# tA tB VTT DQS Single ended signal, provided as background information tC tD DQS# VTT Single ended signal, provided as background information t1 tRPRE_begin tRPRE DQS - DQS# 0 Resulting differential signal, relevant for tRPRE specification t2 tRPRE_end Figure 27 – Method for calculating tRPRE transitions and endpoints 8.13.2.5 tRPST Calculation The method for calculating differential pulse widths for tRPST is shown in Figure 28. CK VTT CK# tA DQS Single ended signal, provided as background information VTT tB tC tD DQS# VTT Single ended signal, provided as background information tRPST DQS - DQS# Resulting differential signal, relevant for tRPST specification 0 t1 tRPST_begin t2 tRPST_end Figure 28 – Method for calculating tRPST transitions and endpoints Publication Release Date: Nov. 22, 2017 Revision: A02 - 48 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 READ NOP NOP NOP READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 tCCD Address*4 Bank Col b Bank Col n tRPST tRPRE DQS, DQS# DQ*2 Dout n RL = 6 Dout n+1 Dout n+2 Dout n+3 Dout n+4 Dout n+5 Dout n+6 Dout n+7 Dout b Dout b+1 Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 Dout b+7 RL = 6 NOTES: 1. BL8, RL = 6 (CL = 6, AL = 0). 2. Dout n (or b) = data-out from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during READ commands at T0 and T4. DON'T CARE TRANSITIONING DATA Figure 29 – READ (BL8) to READ (BL8) T0 T1 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 READ NOP NOP NOP READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 tCCD = 5 Address*4 Bank Col b Bank Col n tRPST tRPRE DQS, DQS#*5 DQ*2 RL = 6 Dout n Dout n+1 Dout n+2 Dout n+3 Dout n+4 Dout n+5 Dout n+6 Dout b Dout n+7 Dout b+1 Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 Dout b+7 RL = 6 NOTES: 1. BL8, RL = 6 (CL = 6, AL = 0), tCCD = 5. 2. Dout n (or b) = data-out from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during READ commands at T0 and T5. 5. DQS-DQS# is held logic low at T10. TIME BREAK TRANSITIONING DATA DON'T CARE Figure 30 – Nonconsecutive READ (BL8) to READ (BL8), tCCD=5 Publication Release Date: Nov. 22, 2017 Revision: A02 - 49 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 READ NOP NOP NOP READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 tCCD Address*4 Bank Col n Bank Col b tRPRE tRPST tRPRE tRPST DQS, DQS# Dout n DQ*2 RL = 6 Dout n+1 Dout n+2 Dout n+3 Dout b Dout b+1 Dout b+2 Dout b+3 RL = 6 NOTES: 1. BC4, RL = 6 (CL = 6, AL = 0) 2. Dout n (or b) = data-out from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by either MR0 A[1:0] = 10 or MR0 A[1:0] = 01 and A12 = 0 during READ commands at T0 and T4. TRANSITIONING DATA DON'T CARE Figure 31 – READ (BC4) to READ (BC4) T0 T1 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 NOP NOP NOP NOP NOP WRITE NOP NOP NOP NOP NOP NOP T14 T15 T16 NOP NOP NOP CK# CK Command*3 READ Address*4 tWR tWTR 4 clocks READ to WRITE Command Delay = RL + tCCD + 2tCK - WL Bank Col n Bank Col b tRPST tRPRE tWPST tWPRE DQS, DQS# DQ*2 Dout n Dout n+1 Dout n+2 Dout n+3 Dout n+4 RL = 6 Dout n+5 Dout n+6 Dout n+7 Din b Din b+1 Din b+2 Din b+3 Din b+4 Din b+5 Din b+6 Din b+7 WL = 5 NOTES: 1. BL8, RL = 6 (CL = 6, AL = 0), WL = 5 (CWL = 5, AL = 0) 2. Dout n = data-out from column, Din b = data-in from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during READ command at T0 and WRITE command at T7. TIME BREAK TRANSITIONING DATA DON'T CARE Figure 32 – READ (BL8) to WRITE (BL8) Publication Release Date: Nov. 22, 2017 Revision: A02 - 50 - W632GG6MB T0 T1 T3 T4 T5 T6 T7 T8 T9 T10 T11 NOP NOP NOP WRITE NOP NOP NOP NOP NOP NOP T12 T13 T14 T15 T16 NOP NOP NOP NOP NOP CK# CK Command*3 READ tWR 4 clocks READ to WRITE Command Delay = RL + tCCD / 2 + 2tCK - WL tWTR *4 Address Bank Col b Bank Col n tRPST tRPRE tWPST tWPRE DQS, DQS# DQ*2 Dout n RL = 6 Dout n+1 Dout n+2 Din b Dout n+3 Din b+1 Din b+2 Din b+3 WL = 5 NOTES: 1. BC4, RL = 6 (CL = 6, AL = 0), WL = 5 (CWL = 5, AL = 0) 2. Dout n = data-out from column, DIN b = data-in from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during READ command at T0 and WRITE command at T5. TIME BREAK TRANSITIONING DATA DON'T CARE Figure 33 – READ (BC4) to WRITE (BC4) OTF T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 READ NOP NOP NOP READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 tCCD Address*4 Bank Col b Bank Col n tRPRE tRPST DQS, DQS# DQ*2 RL = 6 Dout n Dout n+1 Dout n+2 Dout n+3 Dout n+4 Dout n+5 Dout n+6 Dout n+7 Dout b Dout b+1 Dout b+2 Dout b+3 RL = 6 NOTES: 1. RL = 6 (CL = 6, AL = 0). 2. Dout n (or b) = data-out from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by MR0 A[1:0] = 01 and A12 = 1 during READ command at T0. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during READ command at T4. TRANSITIONING DATA DON'T CARE Figure 34 – READ (BL8) to READ (BC4) OTF Publication Release Date: Nov. 22, 2017 Revision: A02 - 51 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 READ NOP NOP NOP READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 tCCD Address*4 Bank Col b Bank Col n tRPRE tRPST tRPST tRPRE DQS, DQS# Dout n DQ*2 RL = 6 Dout n+1 Dout n+2 Dout n+3 Dout b Dout b+1 Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 Dout b+7 RL = 6 NOTES: 1. RL = 6 (CL = 6, AL = 0) 2. Dout n (or b) = data-out from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during READ command at T0. BL8 setting activated by MR0 A[1:0] = 01 and A12 = 1 during READ command at T4. DON'T CARE TRANSITIONING DATA Figure 35 – READ (BC4) to READ (BL8) OTF T0 T1 T3 T4 T5 T6 T7 T8 T9 T10 T11 NOP NOP NOP WRITE NOP NOP NOP NOP NOP NOP T12 T13 T14 T15 T16 NOP NOP NOP NOP NOP CK# CK Command*3 READ tWR 4 clocks READ to WRITE Command Delay = RL + tCCD / 2 + 2tCK - WL tWTR Address*4 Bank Col b Bank Col n tRPST tRPRE tWPST tWPRE DQS, DQS# DQ*2 RL = 6 Dout n Dout n+1 Dout n+2 Dout n+3 Din b Din b+1 Din b+2 Din b+3 Din b+4 Din b+5 Din b+6 Din b+7 WL = 5 NOTES: 1. RL = 6 (CL = 6, AL = 0), WL = 5 (CWL = 5, AL = 0) 2. Dout n = data-out from column, Din b = data-in from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during READ command at T0. BL8 setting activated by MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T5. TIME BREAK TRANSITIONING DATA DON'T CARE Figure 36 – READ (BC4) to WRITE (BL8) OTF Publication Release Date: Nov. 22, 2017 Revision: A02 - 52 - W632GG6MB T0 T1 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 NOP NOP NOP READ NOP WRITE NOP NOP NOP NOP NOP NOP T14 T15 T16 NOP NOP NOP CK# CK Command*3 READ 4 clocks READ to WRITE Command Delay = RL + tCCD + 2tCK - WL Address*4 Bank Col n tWR tWTR Bank Col b tRPST tRPRE tWPST tWPRE DQS, DQS# DQ*2 RL = 6 Dout n Dout n+1 Dout n+2 Dout n+3 Dout n+4 Dout n+5 Dout n+6 Dout n+7 Din b Din b+1 Din b+2 Din b+7 WL = 5 NOTES: 1. RL = 6 (CL = 6, AL = 0), WL = 5 (CWL = 5, AL = 0) 2. Dout n = data-out from column, Din b = data-in from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by MR0 A[1:0] = 01 and A12 = 1 during READ command at T0. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during WRITE command at T7. TIME BREAK TRANSITIONING DATA DON'T CARE Figure 37 – READ (BL8) to WRITE (BC4) OTF Publication Release Date: Nov. 22, 2017 Revision: A02 - 53 - W632GG6MB 8.13.2.6 Burst Read Operation followed by a Precharge The minimum external Read command to Precharge command spacing to the same bank is equal to AL + t RTP with tRTP being the Internal Read Command to Precharge Command Delay. Note that the minimum ACT to PRE timing, tRAS.MIN must be satisfied as well. The minimum value for the Internal Read Command to Precharge Command Delay is given by t RTP.MIN = max(4 × nCK, 7.5 nS). A new bank active command may be issued to the same bank if the following two conditions are satisfied simultaneously: 1. The minimum RAS precharge time (tRP.MIN) has been satisfied from the clock at which the precharge begins. 2. The minimum RAS cycle time (tRC.MIN) from the previous bank activation has been satisfied. Examples of Read commands followed by Precharge are show in Figure 38 and Figure 39. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 NOP READ NOP NOP NOP PRE NOP NOP NOP NOP NOP NOP NOP NOP ACT NOP CK# CK Command Bank a, (or all) Bank a, Col n Address Bank a, Row b tRTP tRP RL = AL + CL = 9 DQS, DQS# BL4 Operation: DQ DQS, DQS# Dout n Dout n+1 Dout n+2 Dout n+3 Dout n Dout n+1 Dout n+2 Dout n+3 BL8 Operation: DQ NOTES: 1. RL = 9 (CL = 9, AL = 0) 2. Dout n = data-out from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. The example assumes tRAS.MIN is satisfied at Precharge command time (T5) and that tRC.MIN is satisfied at the next Active command time (T14). Dout n+4 Dout n+5 Dout n+6 Dout n+7 TRANSITIONING DATA DON'T CARE Figure 38 – READ to PRECHARGE (RL = 9, AL = 0, CL = 9, tRTP = 4, tRP = 9) Publication Release Date: Nov. 22, 2017 Revision: A02 - 54 - W632GG6MB T0 T1 T2 T13 T14 T21 T24 T25 T26 T27 T28 T29 T30 T31 T34 T35 NOP READ NOP NOP NOP PRE NOP NOP NOP NOP NOP NOP NOP NOP NOP ACT CK# CK Command Bank a, (or all) Bank a, Col n Address Bank a, Row b tRTP tRP AL = CL - 2 =12 CL = 14 RL = 26 DQS, DQS# BL4 Operation: DQ DQS, DQS# Dout n Dout n+1 Dout n+2 Dout n+3 Dout n Dout n+1 Dout n+2 Dout n+3 BL8 Operation: DQ NOTES: 1. RL = 26 (CL = 14, AL = CL - 2) 2. Dout n = data-out from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. The example assumes tRAS.MIN is satisfied at Precharge command time (T21) and that tRC.MIN is satisfied at the next Active command time (T35). Dout n+4 Dout n+5 TIME BREAK Dout n+6 Dout n+7 TRANSITIONING DATA DON'T CARE Figure 39 – READ to PRECHARGE (RL = 26, AL = CL-2, CL = 14, tRTP = 8, tRP = 14) Publication Release Date: Nov. 22, 2017 Revision: A02 - 55 - W632GG6MB 8.14 WRITE Operation 8.14.1 DDR3 Burst Operation During a READ or WRITE command, DDR3 will support BC4 and BL8 on the fly using address A12 during the READ or WRITE (AUTO PRECHARGE can be enabled or disabled). A12 = 0, BC4 (BC4 = burst chop, tCCD = 4) A12 = 1, BL8 A12 is used only for burst length control, not as a column address. 8.14.2 WRITE Timing Violations 8.14.2.1 Motivation Generally, if timing parameters are violated, a complete reset/initialization procedure has to be initiated to make sure that the DRAM works properly. However, it is desirable; for certain minor violations, that the DRAM is guaranteed not to “hang up”, and that errors are limited to that particular operation. For the following, it will be assumed that there are no timing violations with regards to the Write command itself (including ODT, etc.) and that it does satisfy all timing requirements not mentioned below. 8.14.2.2 Data Setup and Hold Violations Should the data to strobe timing requirements (tDS, tDH) be violated, for any of the strobe edges associated with a write burst, and then wrong data might be written to the memory location addressed with this WRITE command. In the example (Figure 40 on page 57), the relevant strobe edges for write burst A are associated with the clock edges: T5, T5.5, T6, T6.5, T7, T7.5, T8, T8.5. Subsequent reads from that location might result in unpredictable read data, however the DRAM will work properly otherwise. 8.14.2.3 Strobe to Strobe and Strobe to Clock Violations Should the strobe timing requirements (tDQSH, tDQSL, tWPRE, tWPST) or the strobe to clock timing requirements (tDSS, tDSH, tDQSS) be violated, for any of the strobe edges associated with a Write burst, then wrong data might be written to the memory location addressed with the offending WRITE command. Subsequent reads from that location might result in unpredictable read data, however the DRAM will work properly otherwise. In the example (Figure 48 on page 61) the relevant strobe edges for Write burst n are associated with the clock edges: T4, T4.5, T5, T5.5, T6, T6.5, T7, T7.5, T8, T8.5 and T9. Any timing requirements starting or ending on one of these strobe edges need to be fulfilled for a valid burst. For Write burst b the relevant edges are T8, T8.5, T9, T9.5, T10, T10.5, T11, T11.5, T12, T12.5 and T13. Some edges are associated with both bursts. 8.14.2.4 Write Timing Parameters This drawing is for example only to enumerate the strobe edges that “belong” to a Write burst. No actual timing violations are shown here. For a valid burst all timing parameters for each edge of a burst need to be satisfied (not only for one edge - as shown). Publication Release Date: Nov. 22, 2017 Revision: A02 - 56 - W632GG6MB T0 T1 WRITE NOP T2 T3 T4 T5 T6 T7 T8 T9 T10 NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 NOP WL = AL + CWL Address*4 Bank Col n tDQSS tDSH tDSH tDSH tDSH tWPRE(min) tDQSS (min) tWPST(min) DQS, DQS# tDQSH(min) tDQSL tDQSH tDQSL tDSS *2 Din n DQ tDQSH tDQSL tDSS tDQSH tDQSL Din n+2 Din n+3 tDQSH tDQSL(min) tDSS tDSS Din n+4 tDSS Din n+6 Din n+7 DM tDSH tWPRE(min) tDQSS (nominal) tDSH tDSH tDSH tWPST(min) DQS, DQS# tDQSH(min) tDQSL tDQSH tDQSL tDSS *2 Din n DQ tDQSH tDQSL tDSS tDQSH tDSS Din n+2 Din n+3 tDQSL tDQSH tDQSL(min) tDSS Din n+4 tDSS Din n+6 Din n+7 DM tDQSS tWPRE(min) tDQSS (max) tDSH tDSH tDSH tDSH tWPST(min) DQS, DQS# tDQSH(min) tDQSL tDQSH tDSS Din n DQ tDQSL tDQSH tDSS tDQSL tDQSH tDSS Din n+2 Din n+3 tDQSL tDQSH tDSS Din n+4 tDQSL(min) tDSS Din n+6 Din n+7 DM TRANSITIONING DATA DON'T CARE Notes: 1. BL8, WL = 5 (AL = 0, CWL = 5) 2. Din n = data-in from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T0. 5. tDQSS must be met at each rising clock edge. Figure 40 – Write Timing Definition and Parameters 8.14.3 Write Data Mask One write data mask (DM) pin for each 8 data bits (DQ) will be supported on DDR3 SDRAMs, consistent with the implementation on DDR2 SDRAMs. It has identical timings on write operations as the data bits as shown in Figure 40, and though used in a unidirectional manner, is internally loaded identically to data bits to ensure matched system timing. DM is not used during read cycles. Publication Release Date: Nov. 22, 2017 Revision: A02 - 57 - W632GG6MB 8.14.4 tWPRE Calculation The method for calculating differential pulse widths for tWPRE is shown in Figure 41. CK VTT CK# t1 tWPRE_begin DQS - DQS# 0V tWPRE Resulting differential signal, relevant for tWPRE specification t2 tWPRE_end Figure 41 – Method for calculating tWPRE transitions and endpoints 8.14.5 tWPST Calculation The method for calculating differential pulse widths for tWPST is shown in Figure 42. CK VTT CK# tWPST DQS - DQS# Resulting differential signal, relevant for tWPST specification 0V t1 tWPST_begin t2 tWPST_end Figure 42 – Method for calculating tWPST transitions and endpoints Publication Release Date: Nov. 22, 2017 Revision: A02 - 58 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 WL = AL + CWL Address*4 Bank Col n tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 Din n+4 Din n+5 Din n+6 Din n+7 TRANSITIONING DATA DON'T CARE Notes: 1. BL8, WL = 5; AL = 0, CWL = 5. 2. Din n = data-in from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T0. Figure 43 – WRITE Burst Operation WL = 5 (AL = 0, CWL = 5, BL8) T0 T1 T5 NOP NOP T6 T9 T10 T11 T12 T13 T14 T15 NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command*3 WRITE AL = 5 Address*4 CWL = 5 Bank Col n tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 Din n+4 Din n+5 Din n+6 Din n+7 WL = AL + CWL TIME BREAK TRANSITIONING DATA DON'T CARE Notes: 1. BL8, WL = 10; AL = CL - 1, CL = 6, CWL = 5. 2. Din n = data-in from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T0. Figure 44 – WRITE Burst Operation WL = 10 (AL = CL-1, CWL = 5, BL8) Publication Release Date: Nov. 22, 2017 Revision: A02 - 59 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 Tn WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP READ CK# CK Command*3 tWTR*5 Address*4 Bank Col n Bank Col b tWPRE tWPST DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 WL = 5 RL = 6 DON'T CARE TRANSITIONING DATA TIME BREAK Notes: 1. BC4, WL = 5, RL = 6. 2. Din n = data-in from column n; Dout b = data-out from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 10 during WRITE command at T0 and READ command at Tn. 5. tWTR controls the write to read delay to the same device and starts with the first rising clock edge after the last write data shown at T7. Figure 45 – WRITE (BC4) to READ (BC4) Operation T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 Tn WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP PRE CK# CK Command*3 tWR*5 Address*4 Bank Col n tWPRE tWPST DQS, DQS# DQ*2 Din n Din n+1 Din n+2 Din n+3 WL = 5 TIME BREAK TRANSITIONING DATA DON'T CARE Notes: 1. BC4, WL = 5, RL = 6. 2. Din n = data-in from column n; Dout b = data-out from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 10 during WRITE command at T0. 5. The write recovery time (tWR) referenced from the first rising clock edge after the last write data shown at T7. tWR specifies the last burst write cycle until the precharge command can be issued to the same bank. Figure 46 – WRITE (BC4) to PRECHARGE Operation Publication Release Date: Nov. 22, 2017 Revision: A02 - 60 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 WRITE NOP NOP NOP NOP NOP NOP T7 T8 T9 T10 NOP NOP NOP NOP T11 Ta0 Ta1 T14 NOP PRE NOP NOP CK# CK Command*3 4 clocks Address*4 tWR*5 Bank Col n VALID tWPRE tWPST DQS, DQS# Din n DQ*2 WL = 5 NOTES: Din n+1 Din n+2 Din n+3 1. BC4 on the fly, WL = 5 (CWL = 5, AL = 0) 2. Din n (or b) = data-in from column n. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 on the fly setting activated by MR0 A[1:0] = 01 and A12 = 0 during WRITE command at T0. 5. The write recovery time (tWR) starts at the rising clock edge T9 (4 clocks from T5). TIME BREAK TRANSITIONING DATA DON'T CARE Figure 47 – WRITE (BC4) OTF to PRECHARGE Operation T0 T1 WRITE NOP T2 T3 T4 T5 T6 T7 T8 T9 T10 NOP NOP WRITE NOP NOP NOP NOP NOP NOP T11 T12 T13 T14 NOP NOP NOP NOP CK# CK Command*3 tWR 4 clocks tCCD tWTR Address*4 Bank Col n Bank Col b tWPST tWPRE DQS, DQS# DQ*2 WL = 5 Din n Din n+1 Din n+2 Din n+3 Din n+4 Din n+5 Din n+6 Din n+7 Din b Din b+1 Din b+2 Din b+3 Din b+4 Din b+5 Din b+6 Din b+7 WL = 5 NOTES: 1. BL8, WL = 5 (CWL = 5, AL = 0) 2. Din n (or b) = data-in from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T0 and T4. 5. The write recovery time (tWR) and write timing parameter (tWTR) are referenced from the first rising clock edge after the last write data shown at T13. TRANSITIONING DATA DON'T CARE Figure 48 – WRITE (BL8) to WRITE (BL8) Publication Release Date: Nov. 22, 2017 Revision: A02 - 61 - W632GG6MB T0 T1 WRITE NOP T2 T3 T4 T5 T6 T7 T8 T9 T10 NOP NOP WRITE NOP NOP NOP NOP NOP NOP T11 T12 T13 NOP NOP NOP T14 CK# CK Command*3 tWTR Bank Col b Bank Col n Address*4 NOP tWR 4 clocks tCCD tWPST tWPRE tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 Din b Din b+1 Din b+2 Din b+3 WL = 5 WL = 5 1. BC4, WL = 5 (CWL = 5, AL = 0) 2. Din n (or b) = data-in from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during WRITE command at T0 and T4. 5. The write recovery time (tWR) and write timing parameter (tWTR) are referenced from the first rising clock edge at T13 (4 clocks from T9). NOTES: TRANSITIONING DATA DON'T CARE Figure 49 – WRITE (BC4) to WRITE (BC4) OTF T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP READ NOP CK# CK Command*3 tWTR Address*4 Bank Col b Bank Col n tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 Din n+4 Din n+5 Din n+6 Din n+7 WL = 5 NOTES: RL = 6 1. RL = 6 (CL = 6, AL = 0), WL = 5 (CWL = 5, AL = 0) 2. Din n = data-in from column n; Dout b = data-out from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by either MR0 A[1:0] = 00 or MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T0. READ command at T13 can be either BC4 or BL8 depending on MR0 A[1:0] and A12 status at T13. TRANSITIONING DATA DON'T CARE Figure 50 – WRITE (BL8) to READ (BC4/BL8) OTF Publication Release Date: Nov. 22, 2017 Revision: A02 - 62 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 WRITE NOP NOP NOP NOP NOP NOP T7 T8 T9 T10 T11 T12 T13 T14 NOP NOP NOP NOP NOP NOP READ NOP CK# CK Command*3 tWTR 4 clocks Address*4 Bank Col b Bank Col n tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 WL = 5 NOTES: RL = 6 1. RL = 6 (CL = 6, AL = 0), WL = 5 (CWL = 5, AL = 0) 2. Din n = data-in from column n; Dout b = data-out from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during WRITE command at T0. READ command at T13 can be either BC4 or BL8 depending on MR0 A[1:0] and A12 status at T13. TRANSITIONING DATA DON'T CARE Figure 51 – WRITE (BC4) to READ (BC4/BL8) OTF T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP READ NOP NOP NOP CK# CK Command*3 tWTR Address*4 Bank Col b Bank Col n tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 WL = 5 NOTES: RL = 6 1. RL = 6 (CL = 6, AL = 0), WL = 5 (CWL =5, AL = 0) 2. Din n = data-in from column n; Dout b = data-out from column b. 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 10. TRANSITIONING DATA DON'T CARE Figure 52 – WRITE (BC4) to READ (BC4) Publication Release Date: Nov. 22, 2017 Revision: A02 - 63 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 WRITE NOP NOP NOP WRITE NOP NOP NOP NOP NOP NOP T11 T12 T13 NOP NOP NOP T14 CK# CK Command*3 NOP tWR 4 clocks tCCD tWTR Address*4 Bank Col b Bank Col n tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 Din n+4 Din n+5 Din n+6 Din n+7 Din b Din b+1 Din b+2 Din b+3 WL = 5 WL = 5 NOTES: 1. WL = 5 (CWL = 5, AL = 0) 2. Din n (or b) = data-in from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BL8 setting activated by MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T0. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during WRITE command at T4. TRANSITIONING DATA DON'T CARE Figure 53 – WRITE (BL8) to WRITE (BC4) OTF T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 WRITE NOP NOP NOP WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP T14 CK# CK Command*3 4 clocks tCCD NOP tWR tWTR Address*4 Bank Col b Bank Col n tWPST tWPRE tWPST tWPRE DQS, DQS# Din n DQ*2 Din n+1 Din n+2 Din n+3 Din b Din b+1 Din b+2 Din b+3 Din B+4 Din b+5 Din b+6 Din b+7 WL = 5 WL = 5 NOTES: 1. WL = 5 (CWL = 5, AL = 0) 2. Din n (or b) = data-in from column n (or column b). 3. NOP commands are shown for ease of illustration; other commands may be valid at these times. 4. BC4 setting activated by MR0 A[1:0] = 01 and A12 = 0 during WRITE command at T0. BL8 setting activated by MR0 A[1:0] = 01 and A12 = 1 during WRITE command at T4. TRANSITIONING DATA DON'T CARE Figure 54 – WRITE (BC4) to WRITE (BL8) OTF Publication Release Date: Nov. 22, 2017 Revision: A02 - 64 - W632GG6MB 8.15 Refresh Command The Refresh command (REF) is used during normal operation of the DDR3 SDRAMs. This command is non persistent, so it must be issued each time a refresh is required. The DDR3 SDRAM requires Refresh cycles at an average periodic interval of tREFI. When CS#, RAS# and CAS# are held Low and WE# High at the rising edge of the clock, the chip enters a Refresh cycle. All banks of the SDRAM must be precharged and idle for a minimum of the precharge time tRP(min) before the Refresh Command can be applied. The refresh addressing is generated by the internal refresh controller. This makes the address bits “Don't Care” during a Refresh command. An internal address counter supplies the addresses during the refresh cycle. No control of the external address bus is required once this cycle has started. When the refresh cycle has completed, all banks of the SDRAM will be in the precharged (idle) state. A delay between the Refresh Command and the next valid command, except NOP or DES, must be greater than or equal to the minimum Refresh cycle time tRFC(min) as shown in Figure 55. Note that the tRFC timing parameter depends on memory density. In general, a Refresh command needs to be issued to the DDR3 SDRAM regularly every tREFI interval. To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh interval is provided. A maximum of 8 Refresh commands can be postponed during operation of the DDR3 SDRAM, meaning that at no point in time more than a total of 8 Refresh commands are allowed to be postponed. In case that 8 Refresh commands are postponed in a row, the resulting maximum interval between the surrounding Refresh commands is limited to 9 × t REFI (see Figure 56). A maximum of 8 additional Refresh commands can be issued in advance (“pulled in”), with each one reducing the number of regular Refresh commands required later by one. Note that pulling in more than 8 Refresh commands in advance does not further reduce the number of regular Refresh commands required later, so that the resulting maximum interval between two surrounding Refresh commands is limited to 9 × tREFI (see Figure 57). At any given time, a maximum of 16 REF commands can be issued within 2 x tREFI. Self-Refresh Mode may be entered with a maximum of eight Refresh commands being postponed. After exiting Self-Refresh Mode with one or more Refresh commands postponed, additional Refresh commands may be postponed to the extent that the total number of postponed Refresh commands (before and after the Self-Refresh) will never exceed eight. During Self-Refresh Mode, the number of postponed or pulled-in REF commands does not change. T0 T1 REF NOP Ta0 Ta1 REF NOP Tb0 Tb1 Tb2 Tb3 VALID NOP VALID VALID VALID Tc0 Tc1 Tc2 Tc3 REF VALID VALID VALID CK# CK Command NOP tRFC NOP VALID tRFC(min) tREFI (max. 9 x tREFI) DRAM must be idle DRAM must be idle NOTES: 1. Only NOP/DES commands allowed after Refresh command registered until tRFC(min) expires. 2. Time interval between two Refresh commands may be extended to a maximum of 9 x tREFI. TIME BREAK DON'T CARE Figure 55 – Refresh Command Timing Publication Release Date: Nov. 22, 2017 Revision: A02 - 65 - W632GG6MB tREFI 9 x tREFI t tRFC 8 REF-Commands postponed Figure 56 – Postponing Refresh Commands (Example) tREFI 9 x tREFI t tRFC 8 REF-Commands pulled-in Figure 57 – Pulling-in Refresh Commands (Example) Publication Release Date: Nov. 22, 2017 Revision: A02 - 66 - W632GG6MB 8.16 Self-Refresh Operation The Self-Refresh command can be used to retain data in the DDR3 SDRAM, even if the rest of the system is powered down. When in the Self-Refresh mode, the DDR3 SDRAM retains data without external clocking. The DDR3 SDRAM device has a built-in timer to accommodate Self-Refresh operation. The Self-Refresh-Entry (SRE) Command is defined by having CS#, RAS#, CAS#, and CKE held low with WE# high at the rising edge of the clock. Before issuing the Self-Refresh-Entry command, the DDR3 SDRAM must be idle with all bank precharge state with tRP satisfied. ‘Idle state’ is defined as all banks are closed (t RP, tDAL, etc. satisfied), no data bursts are in progress, CKE is high, and all timings from previous operations are satisfied (tMRD, tMOD, tRFC, tZQinit, tZQoper, tZQCS, etc.) Also, on-die termination must be turned off before issuing Self-Refresh-Entry command, by either registering ODT pin low “ODTL + 0.5tCK” prior to the Self-Refresh Entry command or using MRS to MR1 command. Once the Self-Refresh Entry command is registered, CKE must be held low to keep the device in Self-Refresh mode. During normal operation (DLL on), MR1 (A0 = 0), the DLL is automatically disabled upon entering SelfRefresh and is automatically enabled (including a DLL-Reset) upon exiting Self-Refresh. When the DDR3 SDRAM has entered Self-Refresh mode, all of the external control signals, except CKE and RESET#, are “don't care.” For proper Self-Refresh operation, all power supply and reference pins (VDD, VDDQ, VSS, VSSQ, VREFCA and VREFDQ) must be at valid levels. VREFDQ supply may be turned OFF and VREFDQ may take any value between VSS and VDD during Self Refresh operation, provided that VREFDQ is valid and stable prior to CKE going back High and that first Write operation or first Write Leveling Activity may not occur earlier than 512 nCK after exit from Self Refresh. The DRAM initiates a minimum of one Refresh command internally within tCKE period once it enters SelfRefresh mode. The clock is internally disabled during Self-Refresh Operation to save power. The minimum time that the DDR3 SDRAM must remain in Self-Refresh mode is tCKESR. The user may change the external clock frequency or halt the external clock tCKSRE after Self-Refresh entry is registered, however, the clock must be restarted and stable tCKSRX before the device can exit Self-Refresh operation. The procedure for exiting Self-Refresh requires a sequence of events. First, the clock must be stable prior to CKE going back HIGH. Once a Self-Refresh Exit command (SRX, combination of CKE going high and either NOP or Deselect on command bus) is registered, a delay of at least t XS must be satisfied before a valid command not requiring a locked DLL can be issued to the device to allow for any internal refresh in progress. Before a command that requires a locked DLL can be applied, a delay of at least tXSDLL must be satisfied. Depending on the system environment and the amount of time spent in Self-Refresh, ZQ calibration commands may be required to compensate for the voltage and temperature drift as described in section 8.18 “ZQ Calibration Commands” on page 77. To issue ZQ calibration commands, applicable timing requirements must be satisfied (See Figure 72 - “ZQ Calibration Timing” on page 78). CKE must remain HIGH for the entire Self-Refresh exit period tXSDLL for proper operation except for Self-Refresh re-entry. Upon exit from Self-Refresh, the DDR3 SDRAM can be put back into SelfRefresh mode after waiting at least tXS period and issuing one refresh command (refresh period of tRFC). NOP or deselect commands must be registered on each positive clock edge during the SelfRefresh exit interval tXS. ODT must be turned off during tXSDLL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 67 - W632GG6MB The use of Self-Refresh mode introduces the possibility that an internally timed refresh event can be missed when CKE is raised for exit from Self-Refresh mode. Upon exit from Self-Refresh, the DDR3 SDRAM requires a minimum of one extra refresh command before it is put back into Self-Refresh Mode. T0 T1 T2 Ta0 Tb0 Tc0 Tc1 Td0 Te0 Tf0 VALID VALID CK# CK tIS tCKSRX tCKSRE tCPDED CKE tCKESR tIS ODT VALID ODTL Command NOP SRE NOP SRX NOP*1 Address tRP VALID*2 VALID*3 VALID VALID tXS tXSDLL Enter Self Refresh Exit Self Refresh TIME BREAK DON'T CARE Notes: 1. Only NOP or DES command. 2. Valid commands not requiring a locked DLL. 3. Valid commands requiring a locked DLL. Figure 58 – Self-Refresh Entry/Exit Timing Publication Release Date: Nov. 22, 2017 Revision: A02 - 68 - W632GG6MB 8.17 Power-Down Modes 8.17.1 Power-Down Entry and Exit Power-down is synchronously entered when CKE is registered low (along with NOP or Deselect command). CKE is not allowed to go low while mode register set command, MPR operations, ZQCAL operations, DLL locking or read / write operation are in progress. CKE is allowed to go low while any of other operations such as row activation, precharge or auto-precharge and refresh are in progress, but power-down IDD spec will not be applied until finishing those operations. Timing diagrams are shown in Figure 59 through Figure 71 with details for entry and exit of Power-Down. The DLL should be in a locked state when power-down is entered for fastest power-down exit timing. If the DLL is not locked during power-down entry, the DLL must be reset after exiting power-down mode for proper read operation and synchronous ODT operation. DRAM design provides all AC and DC timing and voltage specification as well as proper DLL operation with any CKE intensive operations as long as DRAM controller complies with DRAM specifications. During Power-Down, if all banks are closed after any in-progress commands are completed, the device will be in precharge Power-Down mode; if any bank is open after in-progress commands are completed, the device will be in active Power-Down mode. Entering power-down deactivates the input and output buffers, excluding CK, CK#, ODT, CKE and RESET#. To protect DRAM internal delay on CKE line to block the input signals, multiple NOP or Deselect commands are needed during the CKE switch off and cycle(s) after, this timing period are defined as tCPDED. CKE_low will result in deactivation of command and address receivers after tCPDED has expired. Table 7 – Power-Down Entry Definitions Status of DRAM MRS bit A12 DLL PD Exit Relevant Parameters Active (A bank or more Open) Don't Care On Fast tXP to any valid command Precharged (All banks Precharged) 0 Off Slow tXP to any valid command. Since it is in precharge state, commands here will be ACT, REF, MRS, PRE or PREA. tXPDLL to commands that need the DLL to operate, such as RD, RDA or ODT control line. Precharged (All banks Precharged) 1 On Fast tXP to any valid command Also, the DLL is disabled upon entering precharge power-down (Slow Exit Mode), but the DLL is kept enabled during precharge power-down (Fast Exit Mode) or active power-down. In power-down mode, CKE low, RESET# high, and a stable clock signal must be maintained at the inputs of the DDR3 SDRAM, and ODT should be in a valid state, but all other input signals are “Don't Care.” (If RESET# goes low during Power-Down, the DRAM will be out of PD mode and into reset state.) CKE low must be maintained until tCKE has been satisfied. Power-down duration is limited by 9 times tREFI of the device. The power-down state is synchronously exited when CKE is registered high (along with a NOP or Deselect command). CKE high must be maintained until tCKE has been satisfied. A valid, executable command can be applied with power-down exit latency, tXP and/or tXPDLL after CKE goes high. Powerdown exit latency is defined in section 10.16 “AC Characteristics” on page 139. Active Power Down Entry and Exit timing diagram example is shown in Figure 59. Timing Diagrams for CKE with PD Entry, PD Exit with Read and Read with Auto Precharge, Write, Write with Auto Precharge, Activate, Precharge, Refresh, and MRS are shown in Figure 60 through Figure 68. Additional clarifications are shown in Figure 69 through Figure 71. Publication Release Date: Nov. 22, 2017 Revision: A02 - 69 - W632GG6MB T0 T1 T2 VALID NOP NOP Ta0 Ta1 Tb0 Tb1 Tc0 NOP NOP NOP VALID VALID VALID CK# CK Command tPD CKE tIS tIH tIH Address tIS tCKE VALID VALID tCPDED tXP Enter Power-Down Mode Exit Power-Down Mode TIME BREAK DON'T CARE Note: 1. VALID command at T0 is ACT, NOP, DES or PRE with still one bank remaining open after completion of the precharge command. Figure 59 – Active Power-Down Entry and Exit Timing Diagram T0 T1 Ta0 Ta1 Ta2 Ta3 Ta4 Ta5 Ta6 Ta7 RD or RDA NOP NOP NOP NOP NOP NOP NOP NOP NOP Ta8 Tb0 Tb1 NOP NOP VALID CK# CK Command tCPDED tIS CKE Address VALID VALID VALID RL = AL + CL tPD DQS, DQS# DQ BL8 Dout b Dout b+1 Dout b+2 Dout b+3 DQ BC4 Dout b Dout b+1 Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 Dout b+7 tRDPDEN Power-Down Entery TIME BREAK TRANSITIONING DATA DON'T CARE Figure 60 – Power-Down Entry after Read and Read with Auto Precharge Publication Release Date: Nov. 22, 2017 Revision: A02 - 70 - W632GG6MB T0 T1 Ta0 Ta1 Ta2 Ta3 Ta4 Ta5 Ta6 Ta7 Tb0 WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP Tb1 Tb2 Tc0 Tc1 NOP NOP VALID CK# CK Command NOP tCPDED tIS CKE Address VALID Bank Col n VALID A10 tPD WR*1 WL = AL + CWL DQS, DQS# DQ BL8 Din b Din b+1 Din b+2 Din b+3 DQ BC4 Din b Din b+1 Din b+2 Din b+3 Din b+4 Din b+5 Din b+6 Din b+7 Start Internal Precharge tWRAPDEN Power-Down Entery TRANSITIONING DATA TIME BREAK DON'T CARE Note: 1. tWR is programmed through MR0. Figure 61 – Power-Down Entry after Write with Auto Precharge T0 T1 Ta0 Ta1 Ta2 Ta3 Ta4 Ta5 Ta6 Ta7 Tb0 Tb1 WRITE NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP Tb2 Tc0 Tc1 NOP NOP VALID CK# CK Command tCPDED tIS CKE Address VALID Bank Col n VALID A10 WL = AL + CWL tPD tWR DQS, DQS# DQ BL8 Din b Din b+1 Din b+2 Din b+3 DQ BC4 Din b Din b+1 Din b+2 Din b+3 Din b+4 Din b+5 Din b+6 Din b+7 tWRPDEN Power-Down Entery TIME BREAK TRANSITIONING DATA DON'T CARE Figure 62 – Power-Down Entry after Write Publication Release Date: Nov. 22, 2017 Revision: A02 - 71 - W632GG6MB T0 T1 T2 VALID NOP NOP Ta0 Ta1 Tb0 Tb1 Tc0 NOP NOP NOP VALID VALID VALID CK# CK Command tCPDED tCKE tIH tIS CKE tXP tIS tPD Enter Power-Down Mode Exit Power-Down Mode DON'T CARE TIME BREAK Figure 63 – Precharge Power-Down (Fast Exit Mode) Entry and Exit T0 T1 T2 VALID NOP NOP Ta0 Ta1 Tb0 Tb1 Tc0 Td0 NOP NOP NOP VALID VALID VALID VALID VALID CK# CK Command tCKE tCPDED CKE tIS tIH tIS tXP tPD tXPDLL Enter Power-Down Mode Exit Power-Down Mode TIME BREAK DON'T CARE Figure 64 – Precharge Power-Down (Slow Exit Mode) Entry and Exit Publication Release Date: Nov. 22, 2017 Revision: A02 - 72 - W632GG6MB T0 T1 T2 T3 Ta0 Ta1 Command VALID REF NOP NOP NOP VALID Address VALID VALID CK# CK VALID tCPDED tIS tPD CKE VALID tREFPDEN TIME BREAK DON'T CARE Figure 65 – Refresh Command to Power-Down Entry T0 T1 T2 T3 Ta0 Ta1 Command VALID ACTIVE NOP NOP NOP VALID Address VALID VALID CK# CK VALID tCPDED tIS tPD CKE VALID tACTPDEN TIME BREAK DON'T CARE Figure 66 – Active Command to Power-Down Entry Publication Release Date: Nov. 22, 2017 Revision: A02 - 73 - W632GG6MB T0 T1 T2 T3 Ta0 Ta1 Command VALID PRE or PREA NOP NOP NOP VALID Address VALID VALID CK# CK VALID tCPDED tIS tPD CKE VALID tPREPDEN TIME BREAK DON'T CARE Figure 67 – Precharge / Precharge all Command to Power-Down Entry T0 T1 MRS NOP Ta0 Ta1 Tb0 Tb1 CK# CK Command Address NOP NOP VALID VALID VALID tCPDED tIS tPD CKE VALID tMRSPDEN TIME BREAK DON'T CARE Figure 68 – MRS Command to Power-Down Entry Publication Release Date: Nov. 22, 2017 Revision: A02 - 74 - W632GG6MB 8.17.2 Power-Down clarifications - Case 1 When CKE is registered low for power-down entry, tPD(min) must be satisfied before CKE can be registered high for power-down exit. The minimum value of parameter tPD(min) is equal to the minimum value of parameter tCKE(min) as shown in section 10.16 “AC Characteristics” on page 139. A detailed example of Case 1 is shown in Figure 69. T0 T1 T2 VALID NOP NOP Ta0 Ta1 Tb0 Tb1 Tb2 NOP NOP NOP VALID CK# CK Command tPD CKE tIS tIH tIH Address tIS tIS tCKE VALID tCPDED tCPDED Enter Power-Down Mode Exit Power-Down Mode Enter Power-Down Mode DON'T CARE TIME BREAK Figure 69 – Power-Down Entry/Exit Clarifications - Case 1 8.17.3 Power-Down clarifications - Case 2 For certain CKE intensive operations, for example, repeated ‘PD Exit - Refresh - PD Entry’ sequences, the number of clock cycles between PD Exit and PD Entry may be insufficient to keep the DLL updated. Therefore, the following conditions must be met in addition to tCKE in order to maintain proper DRAM operation when the Refresh command is issued between PD Exit and PD Entry. Powerdown mode can be used in conjunction with the Refresh command if the following conditions are met: 1) tXP must be satisfied before issuing the command. 2) tXPDLL must be satisfied (referenced to the registration of PD Exit) before the next power-down can be entered. A detailed example of Case 2 is shown in Figure 70. T0 T1 T2 VALID NOP NOP Ta0 Ta1 Tb0 Tb1 Tc0 Tc1 Td0 NOP NOP NOP REF NOP NOP CK# CK Command tIS CKE tPD tIS tIH Address tIH tCKE VALID tXP tXPDLL tCPDED Enter Power-Down Mode Exit Power-Down Mode Enter Power-Down Mode TIME BREAK DON'T CARE Figure 70 – Power-Down Entry/Exit Clarifications - Case 2 Publication Release Date: Nov. 22, 2017 Revision: A02 - 75 - W632GG6MB 8.17.4 Power-Down clarifications - Case 3 If an early PD Entry is issued after a Refresh command, once PD Exit is issued, NOP or DES with CKE High must be issued until tRFC(min) from the Refresh command is satisfied. This means CKE can not be registered low twice within a tRFC(min) window. A detailed example of Case 3 is shown in Figure 71. T0 T1 T2 REF NOP NOP Ta0 Ta1 Tb0 Tb1 Tc0 Tc1 Td0 NOP NOP NOP NOP NOP NOP CK# CK Command tIS CKE tPD tIH tIS tIH tCKE Address tXP tRFC(min) tCPDED Enter Power-Down Mode Exit Power-Down Mode Enter Power-Down Mode TIME BREAK DON'T CARE Figure 71 – Power-Down Entry/Exit Clarifications - Case 3 Publication Release Date: Nov. 22, 2017 Revision: A02 - 76 - W632GG6MB 8.18 ZQ Calibration Commands 8.18.1 ZQ Calibration Description ZQ Calibration command is used to calibrate DRAM RON & ODT values over PVT (process, voltage and temperature). An external resistor (RZQ) between the DRAM ZQ pin and ground is used as a calibration reference. DDR3 SDRAM needs longer time to calibrate output driver and on-die termination circuits after power-up and/or any reset, medium time for a full calibration during normal operation (e.g. after self-refresh exit) and relatively smaller time to perform periodic update calibrations. ZQCL (ZQ Calibration Long) command is used to perform the initial calibration during power-up initialization sequence. This command may be issued at any time by the controller depending on the system environment. ZQCL command triggers the calibration engine inside the DRAM and, once calibration is achieved, the calibrated values are transferred from the calibration engine to DRAM IO, which gets reflected as updated output driver and on-die termination values. The first ZQCL command issued after reset is allowed a timing period of tZQinit to perform the full calibration and the transfer of values. All other ZQCL commands except the first ZQCL command issued after RESET are allowed a timing period of tZQoper. ZQCS (ZQ Calibration Short) command is used to perform periodic calibrations to account for voltage and temperature variations. A shorter timing window is provided to perform the calibration and transfer of values as defined by timing parameter tZQCS. One ZQCS command can effectively correct a minimum of 0.5 % (ZQ Correction) of RON and RTT impedance error within 64 nCK for all speed bins assuming the maximum sensitivities specified in the ‘Output Driver Voltage and Temperature Sensitivity’ and ‘ODT Voltage and Temperature Sensitivity’ tables. The appropriate interval between ZQCS commands can be determined from these tables and other application-specific parameters. One method for calculating the interval between ZQCS commands, given the temperature (Tdriftrate) and voltage (Vdriftrate) drift rates that the SDRAM is subject to in the application, is illustrated. The interval could be defined by the following formula: ZQCorrection (TSens × Tdriftrate) + (VSens × Vdriftrate) where TSens = max(dRTTdT, dRONdTM) and VSens = max(dRTTdV, dRONdVM) define the SDRAM temperature and voltage sensitivities. For example, if TSens = 1.5%/C, VSens = 0.15%/mV, Tdriftrate = 1 C/sec and Vdriftrate = 15 mV/sec, then the interval between ZQCS commands is calculated as: 0.5 = 0.133 ≈ 128mS (1.5 × 1) + (0.15 × 15) No other activities should be performed on the DRAM channel by the controller for the duration of tZQinit, tZQoper, or tZQCS. The quiet time on the DRAM channel allows accurate calibration of output driver and on-die termination values. Once DRAM calibration is achieved, the DRAM should disable ZQ current consumption path to reduce power. All banks must be precharged and tRP met before ZQCL or ZQCS commands are issued by the controller. See section 9.1 “Command Truth Table” on page 94 for a description of the ZQCL and ZQCS commands. ZQ calibration commands can also be issued in parallel to DLL lock time when coming out of self refresh. Upon Self-Refresh exit, DDR3 SDRAM will not perform an IO calibration without an explicit ZQ calibration command. The earliest possible time for ZQ Calibration command (ZQCS or ZQCL) after self refresh exit is tXS. In systems that share the ZQ resistor between devices, the controller must not allow any overlap of tZQoper, tZQinit, or tZQCS between the devices. Publication Release Date: Nov. 22, 2017 Revision: A02 - 77 - W632GG6MB 8.18.2 ZQ Calibration Timing T0 T1 Ta0 Ta1 Ta2 Ta3 Tb0 Tb1 Tc0 Tc1 Tc2 ZQCL NOP NOP NOP VALID VALID ZQCS NOP NOP NOP VALID Address VALID VALID VALID A10 VALID VALID VALID CK# CK Command CKE *1 VALID VALID *1 VALID ODT *2 VALID VALID *2 VALID DQ Bus *3 ACTIVITIES *3 Hi-Z Hi-Z ACTIVITIES tZQCS tZQinit or tZQoper TIME BREAK DON'T CARE Notes: 1. CKE must be continuously registered high during the calibration procedure. 2. On-die termination must be disabled via the ODT signal or MRS during the calibration procedure. 3. All devices connected to the DQ bus should be high impedance during the calibration procedure. Figure 72 – ZQ Calibration Timing 8.18.3 ZQ External Resistor Value, Tolerance, and Capacitive loading In order to use the ZQ Calibration function, a 240 ohm ± 1% tolerance external resistor must be connected between the ZQ pin and ground. The single resistor can be used for each SDRAM or one resistor can be shared between two SDRAMs if the ZQ calibration timings for each SDRAM do not overlap. The total capacitive loading on the ZQ pin must be limited (See section 10.11 “Input/Output Capacitance” on page 120). Publication Release Date: Nov. 22, 2017 Revision: A02 - 78 - W632GG6MB 8.19 On-Die Termination (ODT) ODT (On-Die Termination) is a feature of the DDR3 SDRAM that allows the DRAM to turn on/off termination resistance for each DQU, DQL, DQSU, DQSU#, DQSL, DQSL#, DMU and DML signal via the ODT control pin. The ODT feature is designed to improve signal integrity of the memory channel by allowing the DRAM controller to independently turn on/off termination resistance for any or all DRAM devices. More details about ODT control modes and ODT timing modes can be found further down in this document:  The ODT control modes are described in section 8.19.1  The ODT synchronous mode is described in section 8.19.2  The dynamic ODT feature is described in section 8.19.3  The ODT asynchronous mode is described in section 8.19.4  The transitions between ODT synchronous and asynchronous are described in section 8.19.4.1 through section 8.19.4.4 The ODT feature is turned off and not supported in Self-Refresh mode. A simple functional representation of the DRAM ODT feature is shown in Figure 73. ODT To other circuitry like RCV,… VDDQ / 2 RTT Swtich DQ, DQS, DM Figure 73 – Functional Representation of ODT The switch is enabled by the internal ODT control logic, which uses the external ODT pin and other control information, see below. The value of RTT is determined by the settings of Mode Register bits (see Figure 6 - MR1 Definition on page 20 and Figure 7 - MR2 Definition on page 22). The ODT pin will be ignored if the Mode Registers MR1 and MR2 are programmed to disable ODT, and in selfrefresh mode. 8.19.1 ODT Mode Register and ODT Truth Table The ODT Mode is enabled if any of MR1 {A9, A6, A2} or MR2 {A10, A9} are non zero. In this case, the value of RTT is determined by the settings of those bits (see Figure 6 - MR1 Definition on page 20). Application: Controller sends WR command together with ODT asserted.  One possible application: The rank that is being written to provides termination.  DRAM turns ON termination if it sees ODT asserted (unless ODT is disabled by MR).  DRAM does not use any write or read command decode information.  The Termination Truth Table is shown in Table 8. Table 8 – Termination Truth Table ODT pin DRAM Termination State 0 OFF 1 ON, (OFF, if disabled by MR1 {A9, A6, A2} and MR2 {A10, A9} in general) Publication Release Date: Nov. 22, 2017 Revision: A02 - 79 - W632GG6MB 8.19.2 Synchronous ODT Mode Synchronous ODT mode is selected whenever the DLL is turned on and locked. Based on the powerdown definition, these modes are:  Any bank active with CKE high  Refresh with CKE high  Idle mode with CKE high  Active power down mode (regardless of MR0 bit A12)  Precharge power down mode if DLL is enabled during precharge power down by MR0 bit A12. The direct ODT feature is not supported during DLL-off mode. The on-die termination resistors must be disabled by continuously registering the ODT pin low and/or by programming the Rtt_Nom bits MR1{A9,A6,A2} to {0,0,0} via a mode register set command during DLL-off mode. In synchronous ODT mode, RTT will be turned on ODTLon clock cycles after ODT is sampled high by a rising clock edge and turned off ODTLoff clock cycles after ODT is registered low by a rising clock edge. The ODT latency is tied to the write latency (WL) by: ODTLon = WL - 2; ODTLoff = WL - 2. 8.19.2.1 ODT Latency and Posted ODT In Synchronous ODT Mode, the Additive Latency (AL) programmed into the Mode Register (MR1) also applies to the ODT signal. The DRAM internal ODT signal is delayed for a number of clock cycles defined by the Additive Latency (AL) relative to the external ODT signal. ODTLon = CWL + AL - 2; ODTLoff = CWL + AL - 2. For more details refer to the ODT timing parameters in section 10.16 “AC Characteristics” on page 139. Table 9 – ODT Latency Symbol Parameter DDR3-1333/1600/1866/2133 ODTLon ODT turn on Latency WL - 2 = CWL + AL - 2 ODTLoff ODT turn off Latency WL - 2 = CWL + AL - 2 Unit nCK 8.19.2.2 Timing Parameters In synchronous ODT mode, the following timing parameters apply (see also Figures 74): ODTLon, ODTLoff, tAON,min,max, tAOF,min,max. Minimum RTT turn-on time (tAONmin) is the point in time when the device leaves high impedance and ODT resistance begins to turn on. Maximum RTT turn on time (tAONmax) is the point in time when the ODT resistance is fully on. Both are measured from ODTLon. Minimum RTT turn-off time (tAOFmin) is the point in time when the device starts to turn off the ODT resistance. Maximum RTT turn off time (tAOFmax) is the point in time when the on-die termination has reached high impedance. Both are measured from ODTLoff. When ODT is asserted, it must remain high until ODTH4 is satisfied. If a Write command is registered by the SDRAM with ODT high, then ODT must remain high until ODTH4 (BL = 4) or ODTH8 (BL = 8) after the Write command (see Figure 75). ODTH4 and ODTH8 are measured from ODT registered high to ODT registered low or from the registration of a Write command until ODT is registered low. ODT must be held high for at least ODTH4 after assertion (T1); ODT must be kept high ODTH4 (BL = 4) or ODTH8 (BL = 8) after Write command (T7). ODTH is measured from ODT first registered high to ODT first registered low, or from registration of Write command with ODT high to ODT registered low. Note that although ODTH4 is satisfied from ODT registered high at T6, ODT must not go low before T11 as ODTH4 must also be satisfied from the registration of the Write command at T7. Publication Release Date: Nov. 22, 2017 Revision: A02 - 80 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 CK# CK CKE AL = 3 AL = 3 CWL - 2 ODT ODTH4min ODTLoff = CWL + AL - 2 ODTLon = CWL + AL - 2 tAOFmin tAONmin DRAM_RTT Rtt_Nom tAONmax tAOFmax DON'T CARE TRANSITIONING Figure 74 – Synchronous ODT Timing (AL = 3; CWL = 5; ODTLon = AL + CWL - 2 = 6; ODTLoff = AL + CWL - 2 = 6) T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 NOP NOP NOP NOP NOP NOP NOP WRS4 NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK CKE Command ODTH4min ODTH4 ODTH4 ODT ODTLoff = WL - 2 ODTLoff = WL - 2 ODTLon = WL - 2 ODTLon = WL - 2 tAONmin tAOFmin tAONmax tAOFmin DRAM_RTT Rtt_Nom tAONmax tAONmin tAOFmax tAOFmax TRANSITIONING DON'T CARE Figure 75 – Synchronous ODT (BL = 4, WL = 7) Publication Release Date: Nov. 22, 2017 Revision: A02 - 81 - W632GG6MB 8.19.2.3 ODT during Reads As the DDR3 SDRAM can not terminate and drive at the same time, R TT must be disabled at least half a clock cycle before the read preamble by driving the ODT pin low appropriately. RTT may not be enabled until the end of the post-amble as shown in the example below. As shown in Figure 76 below, at cycle T15, DRAM turns on the termination when it stops driving, which is determined by t HZ. If DRAM stops driving early (i.e., tHZ is early), then tAONmin timing may apply. If DRAM stops driving late (i.e., t HZ is late), then DRAM complies with tAONmax timing. Note that ODT may be disabled earlier before the Read and enabled later after the Read than shown in this example in Figure 76. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 Command READ NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP Address VALID CK# CK ODTLon = CWL + AL - 2 ODTTLoff = CWL + AL - 2 ODT tAOFmin RTT Rtt_Nom Rtt_Nom tAONmax tAOFmax RL = AL + CL DQS, DQS# Dout b DQ Dout b+1 Dout b+2 Dout b+3 Dout b+4 Dout b+5 Dout b+6 Dout b+7 TRANSITIONING DON'T CARE Figure 76 – ODT must be disabled externally during Reads by driving ODT low. (CL = 6; AL = CL - 1 = 5; RL = AL + CL = 11; CWL = 5; ODTLon = CWL + AL - 2 = 8; ODTLoff = CWL + AL - 2 = 8) Publication Release Date: Nov. 22, 2017 Revision: A02 - 82 - W632GG6MB 8.19.3 Dynamic ODT In certain application cases and to further enhance signal integrity on the data bus, it is desirable that the termination strength of the DDR3 SDRAM can be changed without issuing an MRS command. This requirement is supported by the “Dynamic ODT” feature as described as follows: 8.19.3.1 Functional Description: The Dynamic ODT Mode is enabled if bit (A9) or (A10) of MR2 is set to ‘1’. The function is described as follows:  Two RTT values are available: Rtt_Nom and Rtt_WR. − The value for Rtt_Nom is preselected via bits A[9,6,2] in MR1. − The value for Rtt_WR is preselected via bits A[10,9] in MR2.  During operation without write commands, the termination is controlled as follows: − Nominal termination strength Rtt_Nom is selected. − Termination on/off timing is controlled via ODT pin and latencies ODTLon and ODTLoff.  When a write command (WR, WRA, WRS4, WRS8, WRAS4, WRAS8) is registered, and if Dynamic ODT is enabled, the termination is controlled as follows: − A latency ODTLcnw after the write command, termination strength Rtt_WR is selected. − A latency ODTLcwn8 (for BL8, fixed by MRS or selected OTF) or ODTLcwn4 (for BC4, fixed by MRS or selected OTF) after the write command, termination strength Rtt_Nom is selected. − Termination on/off timing is controlled via ODT pin and ODTLon, ODTLoff. Table 10 shows latencies and timing parameters which are relevant for the on-die termination control in Dynamic ODT mode. The dynamic ODT feature is not supported at DLL-off mode. User must use MRS command to set Rtt_WR, MR2{A10, A9}={0,0}, to disable Dynamic ODT externally. When ODT is asserted, it must remain high until ODTH4 is satisfied. If a Write command is registered by the SDRAM with ODT high, then ODT must remain high until ODTH4 (BL = 4) or ODTH8 (BL = 8) after the Write command (see Figure 77). ODTH4 and ODTH8 are measured from ODT registered high to ODT registered low or from the registration of a Write command until ODT is registered low. Publication Release Date: Nov. 22, 2017 Revision: A02 - 83 - W632GG6MB Table 10 – Latencies and timing parameters relevant for Dynamic ODT Name and Description Abbr. Defined from Defined to Definition for all DDR3 speed bins Unit ODT turn-on Latency ODTLon Registering external ODT signal high Turning termination on ODTLon = WL - 2 tCK ODT turn-off Latency ODTLoff Registering external ODT signal low Turning termination off ODTLoff = WL - 2 tCK ODT Latency for changing from Rtt_Nom to Rtt_WR ODTLcnw Registering external write command Change RTT strength from Rtt_Nom to Rtt_WR ODTLcnw = WL - 2 tCK ODT Latency for change from Rtt_WR to Rtt_Nom (BL = 4) ODTLcwn4 Registering external write command Change RTT strength from Rtt_WR to Rtt_Nom ODTLcwn4 = 4 + ODTLoff tCK ODT Latency for change from Rtt_WR to Rtt_Nom (BL = 8) ODTLcwn8 Registering external write command Change RTT strength from Rtt_WR to Rtt_Nom ODTLcwn8 = 6 + ODTLoff tCK(avg) Minimum ODT high time after ODT assertion ODTH4 Registering ODT high ODT registered low ODTH4 = 4 tCK(avg) Minimum ODT high time after Write (BL = 4) ODTH4 Registering Write with ODT high ODT registered low ODTH4 = 4 tCK(avg) Minimum ODT high time after Write (BL =8) ODTH8 Registering Write with ODT high ODT registered low ODTH4 = 6 tCK(avg) RTT change skew tADC ODTLcnw ODTLcwn RTT valid tADC(min) = 0.3 * tCK(avg) tADC(max) = 0.7 * tCK(avg) tCK(avg) Note: tAOFnom and tADCnom are 0.5 tCK (effectively adding half a clock cycle to ODTLoff, ODTcnw and ODTLcwn) 8.19.3.2 ODT Timing Diagrams The following pages provide exemplary timing diagrams as described in Table 11: Table 11 – Timing Diagrams for “Dynamic ODT” Figure and Page Description Figure 77 on page 85 Figure 77, Dynamic ODT: Behavior with ODT being asserted before and after the write Figure 78 on page 86 Figure 78, Dynamic ODT: Behavior without write command, AL = 0, CWL = 5 Figure 79 on page 86 Figure 79, Dynamic ODT: Behavior with ODT pin being asserted together with write command for a duration of 6 clock cycles Figure 80 on page 87 Figure 80, Dynamic ODT: Behavior with ODT pin being asserted together with write command for a duration of 6 clock cycles, example for BC4 (via MRS or OTF), AL = 0, CWL = 5 Figure 81 on page 87 Figure 81, Dynamic ODT: Behavior with ODT pin being asserted together with write command for a duration of 4 clock cycles Publication Release Date: Nov. 22, 2017 Revision: A02 - 84 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 NOP NOP NOP NOP WRS4 NOP NOP T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Address NOP VALID ODTH4 ODTLoff ODTH4 ODT ODTLon ODTLcwn4 tADCmin tADCmin tAONmin RTT Rtt_Nom tAONmax Rtt_WR ODTLcnw tAOFmin Rtt_Nom tADCmax tADCmax tAOFmax DQS, DQS# Din b DQ WL NOTES: Din b+1 Din b+2 Din b+3 TRANSITIONING Example for BC4 (via MRS or OTF), AL = 0, CWL = 5. ODTH4 applies to first registering ODT high and to the registration of the Write command. In this example, ODTH4 would be satisfied if ODT went low at T8 (4 clocks after the Write command). DON'T CARE Figure 77 – Dynamic ODT: Behavior with ODT being asserted before and after the write Publication Release Date: Nov. 22, 2017 Revision: A02 - 85 - W632GG6MB CK# CK Command T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID VALID Address ODTH4 ODTLon ODTLoff ODT tAOFmin tAONmin Rtt_Nom RTT tAONmax tAOFmax DQS, DQS# DQ DON'T CARE TRANSITIONING Notes: 1. ODTH4 is defined from ODT registered high to ODT registered low, so in this example, ODTH4 is satisfied. 2. ODT registered low at T5 would also be legal. Figure 78 – Dynamic ODT: Behavior without write command, AL = 0, CWL = 5 CK# CK Command Address T0 T1 T2 NOP WRS8 NOP T3 T4 T5 T6 T7 T8 T9 T10 T11 NOP NOP NOP NOP NOP NOP NOP NOP NOP ODTLcnw VALID ODTH8 ODTLoff ODTLon ODT tAONmin tAOFmin Rtt_WR RTT ODTLcwn8 tADCmax tAOFmax DQS, DQS# WL Din b DQ Din b+1 Din b+2 Din b+3 Din b+4 Din b+5 Din b+6 Din b+7 TRANSITIONING DON'T CARE Note: 1. Example for BL8 (via MRS or OTF), AL = 0, CWL = 5. In this example, ODTH8 = 6 is exactly satisfied. Figure 79 – Dynamic ODT: Behavior with ODT pin being asserted together with write command for a duration of 6 clock cycles Publication Release Date: Nov. 22, 2017 Revision: A02 - 86 - W632GG6MB CK# CK Command T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 NOP NOP NOP NOP NOP NOP NOP NOP NOP ODTLcnw NOP Address WRS4 NOP VALID ODTH4 ODTLoff ODT ODTLon tAOFmin tADCmin tAONmin Rtt_Nom Rtt_WR RTT tADCmax ODTLcwn4 tAOFmax tADCmax DQS, DQS# WL Din b DQ Din b+1 Din b+2 Din b+3 TRANSITIONING DON'T CARE Notes: 1. ODTH4 is defined from ODT registered high to ODT registered low, so in this example, ODTH4 is satisfied. 2. ODT registered low at T5 would also be legal. Figure 80 – Dynamic ODT: Behavior with ODT pin being asserted together with write command for a duration of 6 clock cycles, example for BC4 (via MRS or OTF), AL = 0, CWL = 5 CK# CK Command Address T0 T1 T2 NOP WRS4 NOP T3 T4 T5 T6 T7 T8 T9 T10 T11 NOP NOP NOP NOP NOP NOP NOP NOP NOP ODTLcnw VALID ODTH4 ODTLoff ODT ODTLon tAOFmin tAONmin Rtt_WR RTT tADCmax ODTLcwn4 tAOFmax DQS, DQS# WL Din b DQ Din b+1 Din b+2 Din b+3 TRANSITIONING DON'T CARE Note: 1. Example for BC4 (via MRS or OTF), AL = 0, CWL = 5. In this example, ODTH4 = 4 is exactly satisfied. Figure 81 – Dynamic ODT: Behavior with ODT pin being asserted together with write command for a duration of 4 clock cycles Publication Release Date: Nov. 22, 2017 Revision: A02 - 87 - W632GG6MB 8.19.4 Asynchronous ODT Mode Asynchronous ODT mode is selected when DRAM runs in DLLon mode, but DLL is temporarily disabled (i.e. frozen) in precharge power-down (by MR0 bit A12). Based on the power down mode definitions, this is currently Precharge power down mode if DLL is disabled during precharge power down by MR0 bit A12. In asynchronous ODT timing mode, internal ODT command is NOT delayed by Additive Latency (AL) relative to the external ODT command. In asynchronous ODT mode, the following timing parameters apply (see Figure 82): tAONPD,min,max, tAOFPD,min,max. Minimum RTT turn-on time (tAONPDmin) is the point in time when the device termination circuit leaves high impedance state and ODT resistance begins to turn on. Maximum RTT turn on time (tAONPDmax) is the point in time when the ODT resistance is fully on. tAONPDmin and tAONPDmax are measured from ODT being sampled high. Minimum RTT turn-off time (tAOFPDmin) is the point in time when the devices termination circuit starts to turn off the ODT resistance. Maximum ODT turn off time (tAOFPDmax) is the point in time when the on-die termination has reached high impedance. tAOFPDmin and tAOFPDmax are measured from ODT being sampled low. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 CK# CK CKE tIH tIH tIS tIS ODT tAOFPDmin tAONPDmin RTT RTT tAONPDmax tAOFPDmax DON'T CARE TRANSITIONING Figure 82 – Asynchronous ODT Timings on DDR3 SDRAM with fast ODT transition: AL is ignored In Precharge Power Down, ODT receiver remains active, however no Read or Write command can be issued, as the respective ADD/CMD receivers may be disabled. Table 12 – Asynchronous ODT Timing Parameters for all Speed Bins Symbol Description Min. Max. Unit tAONPD Asynchronous RTT turn-on delay (Power-Down with DLL frozen) 2 8.5 nS tAOFPD Asynchronous RTT turn-off delay (Power-Down with DLL frozen) 2 8.5 nS Publication Release Date: Nov. 22, 2017 Revision: A02 - 88 - W632GG6MB 8.19.4.1 Synchronous to Asynchronous ODT Mode Transitions Table 13 – ODT timing parameters for Power Down (with DLL frozen) entry and exit transition period Description Min. Max. ODT to RTT turnon delay min{ ODTLon * tCK(avg) + tAONmin; tAONPDmin } max{ ODTLon * tCK(avg) + tAONmax; tAONPDmax } min{ (WL - 2) * tCK(avg) + tAONmin; tAONPDmin } max{ (WL - 2) * tCK(avg) + tAONmax; tAONPDmax } ODT to RTT turnoff delay min{ ODTLoff * tCK(avg) +tAOFmin; tAOFPDmin } max{ ODTLoff * tCK(avg) + tAOFmax; tAOFPDmax } min{ (WL - 2) * tCK(avg) +tAOFmin; tAOFPDmin } tANPD max{ (WL - 2) * tCK(avg) + tAOFmax; tAOFPDmax } WL -1 8.19.4.2 Synchronous to Asynchronous ODT Mode Transition during Power-Down Entry If DLL is selected to be frozen in Precharge Power Down Mode by the setting of bit A12 in MR0 to “0”, there is a transition period around power down entry, where the DDR3 SDRAM may show either synchronous or asynchronous ODT behavior. The transition period is defined by the parameters tANPD and tCPDED(min). tANPD is equal to (WL -1) and is counted backwards in time from the clock cycle where CKE is first registered low. t CPDED(min) starts with the clock cycle where CKE is first registered low. The transition period begins with the starting point of tANPD and terminates at the end point of tCPDED(min), as shown in Figure 83. If there is a Refresh command in progress while CKE goes low, then the transition period ends at the later one of tRFC(min) after the Refresh command and the end point of tCPDED(min), as shown in Figure 84. Please note that the actual starting point at tANPD is excluded from the transition period, and the actual end points at tCPDED(min) and tRFC(min), respectively, are included in the transition period. ODT assertion during the transition period may result in an R TT change as early as the smaller of tAONPDmin and (ODTLon*tCK(avg) + tAONmin) and as late as the larger of tAONPDmax and (ODTLon* tCK(avg) + tAONmax). ODT de-assertion during the transition period may result in an R TT change as early as the smaller of tAOFPDmin and (ODTLoff* tCK(avg) + tAOFmin) and as late as the larger of tAOFPDmax and (ODTLoff* tCK(avg) + tAOFmax). See Table 13. Note that, if AL has a large value, the range where RTT is uncertain becomes quite large. Figure 83 shows the three different cases: ODT_A, synchronous behavior before tANPD; ODT_B has a state change during the transition period; ODT_C shows a state change after the transition period. Publication Release Date: Nov. 22, 2017 Revision: A02 - 89 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 NOP NOP NOP NOP NOP NOP NOP NOP NOP T9 T10 T11 NOP NOP T12 CK# CK CKE Command tCPDED tCPDEDmin tANPD PD entry transition period Last sync, ODT tAOFmin RTT RTT ODTLoff tAOFmax tAOFPDmax ODTLoff + tAOFmin Sync or async, ODT tAOFPDmin RTT RTT ODTLoff + tAOFmax First async, ODT tAOFPDmin RTT RTT PD entry transition period tAOFPDmax TRANSITIONING DATA DON'T CARE Figure 83 – Synchronous to asynchronous transition during Precharge Power Down (with DLL frozen) entry (AL = 0; CWL = 5; t ANPD = WL - 1 = 4) Publication Release Date: Nov. 22, 2017 Revision: A02 - 90 - W632GG6MB T0 T1 T2 T3 T4 T5 T6 T7 T8 NOP REF NOP NOP NOP NOP NOP NOP NOP T9 T10 T11 T12 T13 Ta0 Ta1 Ta2 Ta3 CK# CK CKE Command tRFC(min) tANPD tCPDEDmin PD entry transition period Last sync, ODT tAOFmin RTT RTT tAOFPDmax ODTLoff tAOFmax ODTLoff + tAOFPDmin Sync or async, ODT tAOFPDmin RTT RTT ODTLoff + tAOFPDmax First async, ODT tAOFPDmin RTT RTT tAOFPDmax TIME BREAK TRANSITIONING DON'T CARE Figure 84 – Synchronous to asynchronous transition after Refresh command (AL = 0; CWL = 5; t ANPD = WL - 1 = 4) Publication Release Date: Nov. 22, 2017 Revision: A02 - 91 - W632GG6MB 8.19.4.3 Asynchronous to Synchronous ODT Mode Transition during Power-Down Exit If DLL is selected to be frozen in Precharge Power Down Mode by the setting of bit A12 in MR0 to “0”, there is also a transition period around power down exit, where either synchronous or asynchronous response to a change in ODT must be expected from the DDR3 SDRAM. This transition period starts tANPD before CKE is first registered high, and ends t XPDLL after CKE is first registered high. tANPD is equal to (WL - 1) and is counted (backwards) from the clock cycle where CKE is first registered high. ODT assertion during the transition period may result in an RTT change as early as the smaller of tAONPDmin and (ODTLon*tCK(avg) + tAONmin) and as late as the larger of tAONPDmax and (ODTLon*tCK(avg) + tAONmax). ODT de-assertion during the transition period may result in an RTT change as early as the smaller of tAOFPDmin and (ODTLoff*tCK(avg) + tAOFmin) and as late as the larger of tAOFPDmax and (ODTLoff*tCK(avg) + tAOFmax). See Table 13. Note that, if AL has a large value, the range where R TT is uncertain becomes quite large. Figure 85 shows the three different cases: ODT_C, asynchronous response before tANPD; ODT_B has a state change of ODT during the transition period; ODT_A shows a state change of ODT after the transition period with synchronous response. T0 T1 T2 Ta0 Ta1 Ta2 Ta3 Ta4 Ta5 Ta6 NOP NOP NOP NOP NOP NOP Tb0 Tb1 Tb2 Tc0 Tc1 Tc2 Td0 Td1 NOP NOP NOP NOP NOP NOP NOP NOP CK# CK CKE Command tANPD tXPDLL PD exit transition period Last sync, ODT tAOFPDmin RTT RTT ODTLoff + tAOFmin tAOFPDmax tAOFPDmax Sync or async, ODT tAOFPDmin RTT RTT ODTLoff + tAOFmax ODTLoff tAOFmax First async, ODT tAOFmin RTT RTT TIME BREAK TRANSITIONING DON'T CARE Figure 85 – Asynchronous to synchronous transition during Precharge Power Down (with DLL frozen) exit (CL = 6; AL = CL - 1; CWL = 5; t ANPD = WL - 1 = 9) Publication Release Date: Nov. 22, 2017 Revision: A02 - 92 - W632GG6MB 8.19.4.4 Asynchronous to Synchronous ODT Mode during short CKE high and short CKE low periods If the total time in Precharge Power Down state or Idle state is very short, the transition periods for PD entry and PD exit may overlap (see Figure 86). In this case, the response of the DDR3 SDRAMs RTT to a change in ODT state at the input may be synchronous OR asynchronous from the start of the PD entry transition period to the end of the PD exit transition period (even if the entry period ends later than the exit period). If the total time in Idle state is very short, the transition periods for PD exit and PD entry may overlap. In this case the response of the DDR3 SDRAMs RTT to a change in ODT state at the input may be synchronous OR asynchronous from the start of the PD exit transition period to the end of the PD entry transition period. Note that in the bottom part of Figure 86 it is assumed that there was no Refresh command in progress when Idle state was entered. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 REF NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP NOP CK# CK Command CKE tANPD tRFC(min) PD entry transition period PD exit transition period tANPD tXPDLL short CKE low transition period CKE tANPD short CKE high transition period tXPDLL TIME BREAK TRANSITIONING DON'T CARE Figure 86 – Transition period for short CKE cycles, entry and exit period overlapping (AL = 0, WL = 5, t ANPD = WL - 1 = 4) Publication Release Date: Nov. 22, 2017 Revision: A02 - 93 - W632GG6MB 9. OPERATION MODE 9.1 Command Truth Table Notes 1, 2, 3 and 4 apply to the entire Command Truth Table. Note 5 Applies to all Read/Write commands. [BA=Bank Address, RA=Row Address, CA=Column Address, BC#=Burst Chop, X=Don't Care, V=Valid] Table 14 – Command Truth Table CKE BA0Previous Current CS# RAS# CAS# WE# BA2 Cycle Cycle A10/ AP A0A9, A11 Abbr. Mode Register Set MRS H H L L L L BA Refresh REF H H L L L H V V V V V Self Refresh Entry SRE H L Self Refresh Exit A13 A12/ BC# COMMAND NOTES OP Code L L L H V V V V V H X X X X X X X X L H H H V V V V V SRX L H Single Bank Precharge PRE H H L L H L BA V V L V Precharge all Banks PREA H H L L H L V V V H V 7,9,12 7,8,9,12 Bank Activate ACT H H L L H H BA Write (Fixed BL8 or BC4) WR H H L H L L BA RFU Row Address (RA) V L CA 5 Write (BC4, on the Fly) WRS4 H H L H L L BA RFU L L CA 5 Write (BL8, on the Fly) WRS8 H H L H L L BA RFU H L CA 5 Write with Auto Precharge (Fixed BL8 or BC4) WRA H H L H L L BA RFU V H CA 5 Write with Auto Precharge (BC4, on the Fly) WRAS4 H H L H L L BA RFU L H CA 5 Write with Auto Precharge (BL8, on the Fly) WRAS8 H H L H L L BA RFU H H CA 5 Read (Fixed BL8 or BC4) RD H H L H L H BA RFU V L CA 5 Read (BC4, on the Fly) RDS4 H H L H L H BA RFU L L CA 5 Read (BL8, on the Fly) RDS8 H H L H L H BA RFU H L CA 5 Read with Auto Precharge (Fixed BL8 or BC4) RDA H H L H L H BA RFU V H CA 5 Read with Auto Precharge (BC4, on the Fly) RDAS4 H H L H L H BA RFU L H CA 5 Read with Auto Precharge (BL8, on the Fly) RDAS8 H H L H L H BA RFU H H CA 5 No Operation NOP H H L H H H V V V V V 10 Device Deselected DES H H H X X X X X X X X 11 Power Down Entry PDE H L Power Down Exit PDX L H ZQ Calibration Long ZQCL H ZQ Calibration Short ZQCS H L H H H V V V V V H X X X X X X X X L H H H V V V V V H X X X X X X X X H L H H L X X X H X H L H H L X X X L X 6,12 6,12 Publication Release Date: Nov. 22, 2017 Revision: A02 - 94 - W632GG6MB Notes: 1. All DDR3 SDRAM commands are defined by states of CS#, RAS#, CAS#, WE# and CKE at the rising edge of the clock. The MSB of BA, RA and CA are device density and configuration dependent. 2. RESET# is Low enable command which will be used only for asynchronous reset so must be maintained HIGH during any function. 3. Bank addresses (BA) determine which bank is to be operated upon. For (E)MRS BA selects an (Extended) Mode Register. 4. “V” means “H or L (but a defined logic level)” and “X” means either “defined or undefined (like floating) logic level”. 5. Burst reads or writes cannot be terminated or interrupted and Fixed/on-the-fly BL will be defined by MRS. 6. The Power Down Mode does not perform any refresh operation. 7. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh. 8. Self Refresh Exit is asynchronous. 9. VREF (Both VREFDQ and VREFCA) must be maintained during Self Refresh operation. VREFDQ supply may be turned OFF and VREFDQ may take any value between VSS and VDD during Self Refresh operation, provided that VREFDQ is valid and stable prior to CKE going back High and that first Write operation or first Write Leveling Activity may not occur earlier than 512 nCK after exit from Self Refresh. 10. The No Operation command should be used in cases when the DDR3 SDRAM is in an idle or wait state. The purpose of the No Operation command (NOP) is to prevent the DDR3 SDRAM from registering any unwanted commands between operations. A No Operation command will not terminate a pervious operation that is still executing, such as a burst read or write cycle. 11. The Deselect command performs the same function as No Operation command. 12. Refer to the CKE Truth Table for more detail with CKE transition. Publication Release Date: Nov. 22, 2017 Revision: A02 - 95 - W632GG6MB 9.2 CKE Truth Table Notes 1-7 apply to the entire CKE Truth Table. For Power-down entry and exit parameters See 8.17 “Power-Down Modes” on page 69. CKE low is allowed only if tMRD and tMOD are satisfied. Table 15 – CKE Truth Table CURRENT STATE2 Power Down CKE Previous Cycle 1 (N-1) Current Cycle 1 (N) COMMAND (N) 3 RAS#, CAS#, WE#, CS# ACTION (N) 3 NOTES L L X Maintain Power Down 14,15 L H DESELECT or NOP Power Down Exit 11,14 L L X Maintain Self Refresh 15,16 L H DESELECT or NOP Self Refresh Exit 8,12,16 Bank(s) Active H L DESELECT or NOP Active Power Down Entry 11,13,14 Reading H L DESELECT or NOP Power Down Entry 11,13,14,17 Writing H L DESELECT or NOP Power Down Entry 11,13,14,17 Precharging H L DESELECT or NOP Power Down Entry 11,13,14,17 Refreshing H L DESELECT or NOP Precharge Power Down Entry 11 H L DESELECT or NOP Precharge Power Down Entry 11,13,14,18 H L REFRESH Self Refresh 9,13,18 Self Refresh All Banks Idle Any other state Refer to section 9.1 “Command Truth Table” on page 94 for more detail with all command signals 10 Notes: 1. CKE (N) is the logic state of CKE at clock edge N; CKE (N-1) was the state of CKE at the previous clock edge. 2. Current state is defined as the state of the DDR3 SDRAM immediately prior to clock edge N. 3. COMMAND (N) is the command registered at clock edge N, and ACTION (N) is a result of COMMAND (N), ODT is not included here. 4. All states and sequences not shown are illegal or reserved unless explicitly described elsewhere in this document. 5. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh. 6. During any CKE transition (registration of CKE H->L or CKE L->H) the CKE level must be maintained until 1nCK prior to tCKEmin being satisfied (at which time CKE may transition again). 7. DESELECT and NOP are defined in the Command Truth Table. 8. On Self Refresh Exit DESELECT or NOP commands must be issued on every clock edge occurring during the tXS period. Read or ODT commands may be issued only after tXSDLL is satisfied. 9. Self Refresh mode can only be entered from the All Banks Idle state. 10. Must be a legal command as defined in the Command Truth Table. 11. Valid commands for Power Down Entry and Exit are NOP and DESELECT only. 12. Valid commands for Self Refresh Exit are NOP and DESELECT only. 13. Self Refresh can not be entered during Read or Write operations. For a detailed list of restrictions See section 8.16 “SelfRefresh Operation” on page 67 and See section 8.17 “Power-Down Modes” on page 69. 14. The Power Down does not perform any refresh operations. 15. “X” means “don't care” (including floating around VREF) in Self Refresh and Power Down. It also applies to Address pins. 16. VREF (Both VREFDQ and VREFCA) must be maintained during Self Refresh operation. VREFDQ supply may be turned OFF and VREFDQ may take any value between VSS and VDD during Self Refresh operation, provided that VREFDQ is valid and stable prior to CKE going back High and that first Write operation or first Write Leveling Activity may not occur earlier than 512 nCK after exit from Self Refresh. 17. If all banks are closed at the conclusion of the read, write or precharge command, then Precharge Power Down is entered, otherwise Active Power Down is entered. 18. ‘Idle state’ is defined as all banks are closed (tRP, tDAL, etc. satisfied), no data bursts are in progress, CKE is high, and all timings from previous operations are satisfied (tMRD, tMOD, tRFC, tZQinit, tZQoper, tZQCS, etc.) as well as all Self Refresh exit and Power Down Exit parameters are satisfied (tXS, tXP, tXPDLL, etc). Publication Release Date: Nov. 22, 2017 Revision: A02 - 96 - W632GG6MB 9.3 Simplified State Diagram This simplified State Diagram is intended to provide an overview of the possible state transitions and the commands to control them. In particular, situations involving more than one bank, the enabling or disabling of on-die termination, and some other events are not captured in full detail. CKE_ L Power Applied Power on Reset Procedure MRS, MPR, Write Leveling Initialization Self Refresh SRE ZQCL MRS From any state RESET SRX ZQCL, ZQCS REF ZQ Calibration Idle Refreshing PDE ACT PDX Active Power Down Precharge Power Down Activating PDX CKE_L CKE_L PDE Bank Active Write Read Write A Write Writing Read A Read Read Reading Write Write A Read A Write A PRE, PREA Writing PRE, PREA PRE, PREA Reading Precharging Automatic sequence Command sequence Figure 87 – Simplified State Diagram Table 16 – State Diagram Command Definitions Abbreviation Function Abbreviation Function Abbreviation Function ACT Active Read RD, RDS4, RDS8 PDE Enter Power-down PRE Precharge Read A RDA, RDAS4, RDAS8 PDX Exit Power-down PREA Precharge All Write WR, WRS4, WRS8 SRE Self-Refresh entry MRS Mode Register Set Write A WRA, WRAS4, WRAS8 SRX Self-Refresh exit REF Refresh RESET Start RESET Procedure MPR Multi-Purpose Register ZQCL ZQ Calibration Long ZQCS ZQ Calibration Short - - NOTE: See “Command Truth Table” on page 94 for more details Publication Release Date: Nov. 22, 2017 Revision: A02 - 97 - W632GG6MB 10. ELECTRICAL CHARACTERISTICS 10.1 Absolute Maximum Ratings PARAMETER SYMBOL RATING UNIT NOTES VDD -0.4 ~ 1.975 V 1, 3 Voltage on VDD pin relative to VSS Voltage on VDDQ pin relative to VSS Voltage on any pin relative to VSS VDDQ -0.4 ~ 1.975 V 1, 3 VIN, VOUT -0.4 ~ 1.975 V 1 TSTG -55 ~ 150 °C 1, 2 Storage Temperature Notes: 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard. 3. VDD and VDDQ must be within 300 mV of each other at all times. VREFDQ and VREFCA must not greater than 0.6 x VDDQ. When VDD and VDDQ are less than 500 mV, VREFDQ and VREFCA may be equal to or less than 300 mV. 10.2 Operating Temperature Condition PARAMETER SYMBOL Commercial operating temperature range (for -09/-11/-12/-15) TOPER Industrial operating temperature range (for 09I/11I/12I/15I) TOPER Industrial Plus operating temperature range (for 09J/11J/12J/15J) TOPER RATING UNIT NOTES 0 ~ 85 °C 1, 2 0 ~95 °C 1, 2, 4 -40 ~ 85 °C 1, 3 -40 ~ 95 °C 1, 3, 4 -40 ~ 85 °C 1, 3 -40 ~ 105 °C 1, 3, 4 Notes: 1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measurement conditions, please refer to the JEDEC document JESD51-2. 2. During operation, the DRAM case temperature must be maintained between 0 to 95°C for Commercial parts under all specification parameters. 3. During operation, the DRAM case temperature must be maintained between -40 to 95°C for Industrial parts and -40 to 105°C for Industrial Plus parts under all specification parameters. 4. Some applications require operation of the 85°C < TCASE ≤ 105°C operating temperature. Full specifications are provided in this range, but the following additional conditions apply: (a) Refresh commands have to be doubled in frequency, therefore reducing the Refresh interval t REFI to 3.9 µS. (b) If Self-Refresh operation is required in 85°C < TCASE ≤ 105°C operating temperature range, than it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the Auto Self-Refresh mode (ASR) (MR2 A6 = 1b, MR2 A7 is don't care). 10.3 DC & AC Operating Conditions 10.3.1 Recommended DC Operating Conditions SYM. VDD VDDQ RZQ PARAMETER MIN. TYP. MAX. UNIT NOTES Supply Voltage 1.425 1.5 1.575 V 1, 2 Supply Voltage for Output 1.425 1.5 1.575 V 1, 2 External Calibration Resistor connected from ZQ ball to ground 237.6 240.0 242.4 Ω 3 Notes: 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together. 3. The external calibration resistor RZQ can be time-shared among DRAMs in special applications. Publication Release Date: Nov. 22, 2017 Revision: A02 - 98 - W632GG6MB 10.4 Input and Output Leakage Currents SYMBOL IIL IOL PARAMETER Input Leakage Current (0V ≤ VIN ≤ VDD) Output Leakage Current (Output disabled, 0V ≤ VOUT ≤ VDDQ) MIN. MAX. UNIT NOTES -2 2 µA 1 -5 5 µA 2 Notes: 1. All other balls not under test = 0 V. 2. All DQ, DQS and DQS# are in high-impedance mode. 10.5 Interface Test Conditions Figure 88 represents the effective reference load of 25 ohms used in defining the relevant AC timing parameters of the device as well as output slew rate measurements. It is not intended as a precise representation of any particular system environment or a depiction of the actual load presented by a production tester. System designers should use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers correlate to their production test conditions, generally one or more coaxial transmission lines terminated at the tester electronics. VDDQ CK, CK# DUT DQ DQS DQS# VTT = VDDQ/2 25Ω Timing reference point Figure 88 – Reference Load for AC Timings and Output Slew Rates The Timing Reference Points are the idealized input and output nodes / terminals on the outside of the packaged SDRAM device as they would appear in a schematic or an IBIS model. The output timing reference voltage level for single ended signals is the cross point with VTT. The output timing reference voltage level for differential signals is the cross point of the true (e.g. DQSL, DQSU) and the complement (e.g. DQSL#, DQSU#) signal. Publication Release Date: Nov. 22, 2017 Revision: A02 - 99 - W632GG6MB 10.6 DC and AC Input Measurement Levels 10.6.1 DC and AC Input Levels for Single-Ended Command and Address Signals Table 17 – Single-Ended DC and AC Input Levels for Command and Address PARAMETER SYMBOL DC input logic high DDR3-1333/1600 DDR3-1866/2133 UNIT NOTES VDD V 1, 5 VSS VREF - 0.100 V 1, 6 Note 2 - - V 1, 2, 7 Note 2 VREF - 0.175 - - V 1, 2, 8 VIH.CA(AC150) VREF + 0.150 Note 2 - - V 1, 2, 7 AC input logic low VIL.CA(AC150) Note 2 VREF - 0.150 - - V 1, 2, 8 AC input logic high VIH.CA(AC135) - - VREF + 0.135 Note 2 V 1, 2, 7 AC input logic low VIL.CA(AC135) - - Note 2 VREF - 0.135 V 1, 2, 8 AC input logic high VIH.CA(AC125) - - VREF + 0.125 Note 2 V 1, 2, 7 AC input logic low VIL.CA(AC125) - - Note 2 VREF - 0.125 V 1, 2, 8 0.49 x VDD 0.51 x VDD 0.49 x VDD 0.51 x VDD V 3, 4, 9 MIN. MAX. MIN. MAX. VIH.CA(DC100) VREF + 0.100 VDD VREF + 0.100 DC input logic low VIL.CA(DC100) VSS VREF - 0.100 AC input logic high VIH.CA(AC175) VREF + 0.175 AC input logic low VIL.CA(AC175) AC input logic high Reference Voltage VREFCA(DC) for ADD, CMD inputs Notes: 1. For input only pins except RESET#. VREF = VREFCA(DC). 2. See section 10.12 “Overshoot and Undershoot Specifications” on page 121. 3. The AC peak noise on VREF may not allow VREF to deviate from VREFCA(DC) by more than ± 1% VDD (for reference: approx. ± 15 mV). 4. For reference: approx. VDD/2 ± 15 mV. 5. VIH(DC) is used as a simplified symbol for VIH.CA(DC100). 6. VIL(DC) is used as a simplified symbol for VIL.CA(DC100). 7. VIH(AC) is used as a simplified symbol for VIH.CA(AC175), VIH.CA(AC150), VIH.CA(AC135), and VIH.CA(AC125); VIH.CA(AC175) value is used when VREF + 0.175V is referenced, VIH.CA(AC150) value is used when VREF + 0.15V is referenced, VIH.CA(AC135) value is used when VREF + 0.135V is referenced, and VIH.CA(AC125) value is used when VREF + 0.125V is referenced. 8. VIL(AC) is used as a simplified symbol for VIL.CA(AC175), VIL.CA(AC150), VIL.CA(AC135) and VIL.CA(AC125); VIL.CA(AC175) value is used when VREF - 0.175V is referenced, VIL.CA(AC150) value is used when VREF - 0.15V is referenced, VIL.CA(AC135) value is used when VREF - 0.135V is referenced, and VIL.CA(AC125) value is used when VREF - 0.125V is referenced. 9. VREFCA(DC) is measured relative to VDD at the same point in time on the same device. Publication Release Date: Nov. 22, 2017 Revision: A02 - 100 - W632GG6MB 10.6.2 DC and AC Input Levels for Single-Ended Data Signals Table 18 – Single-Ended DC and AC Input Levels for DQ and DM PARAMETER SYMBOL DC input logic high VIH.DQ(DC100) DDR3-1333/1600 DDR3-1866/2133 UNIT NOTES VDD V 1, 5 MIN. MAX. MIN. MAX. VREF + 0.100 VDD VREF + 0.100 DC input logic low VIL.DQ(DC100) VSS VREF - 0.100 VSS VREF - 0.100 V 1, 6 AC input logic high VIH.DQ(AC150) VREF + 0.150 Note 2 - - V 1, 2, 7 AC input logic low VIL.DQ(AC150) Note 2 VREF - 0.150 - - V 1, 2, 8 AC input logic high VIH.DQ(AC135) - - VREF + 0.135 Note 2 V 1, 2, 7 AC input logic low VIL.DQ(AC135) - - Note 2 VREF - 0.135 V 1, 2, 8 Reference Voltage for DQ, DM inputs VREFDQ(DC) 0.49 x VDD 0.51 x VDD 0.49 x VDD 0.51 x VDD V 3, 4, 9 Notes: 1. VREF = VREFDQ(DC). 2. See section 10.12 “Overshoot and Undershoot Specifications” on page 121. 3. The AC peak noise on VREF may not allow VREF to deviate from VREFDQ(DC) by more than ± 1% VDD (for reference: approx. ± 15 mV). 4. For reference: approx. VDD/2 ± 15 mV. 5. VIH(DC) is used as a simplified symbol for VIH.DQ(DC100). 6. VIL(DC) is used as a simplified symbol for VIL.DQ(DC100). 7. VIH(AC) is used as a simplified symbol for VIH.DQ(AC150), and VIH.DQ(AC135); VIH.DQ(AC150) value is used when VREF + 0.15V is referenced, and VIH.DQ(AC135) value is used when VREF + 0.135V is referenced. 8. VIL(AC) is used as a simplified symbol for VIL.DQ(AC150), and VIL.DQ(AC135); VIL.DQ(AC150) value is used when VREF - 0.15V is referenced, and VIL.DQ(AC135) value is used when VREF - 0.135V is referenced. 9. VREFDQ(DC) is measured relative to VDD at the same point in time on the same device. Publication Release Date: Nov. 22, 2017 Revision: A02 - 101 - W632GG6MB The DC-tolerance limits and AC-noise limits for the reference voltages VREFCA and VREFDQ are illustrated in Figure 89. It shows a valid reference voltage VREF(t) as a function of time. (VREF stands for VREFCA and VREFDQ likewise). VREF(DC) is the linear average of VREF(t) over a very long period of time (e.g., 1 sec). This average has to meet the min/max requirements in Table 17. Furthermore VREF(t) may temporarily deviate from VREF(DC) by no more than ± 1% VDD. voltage VDD VREF(t) VREF AC-noise VREF(DC)max VREF(DC) VDD/2 VREF(DC)min VSS time Figure 89 – Illustration of VREF(DC) tolerance and VREF AC-noise limits The voltage levels for setup and hold time measurements VIH(AC), VIH(DC), VIL(AC), and VIL(DC) are dependent on VREF. “VREF” shall be understood as VREF(DC), as defined in Figure 89. This clarifies that DC-variations of VREF affect the absolute voltage a signal has to reach to achieve a valid high or low level and therefore the time to which setup and hold is measured. System timing and voltage budgets need to account for VREF(DC) deviations from the optimum position within the dataeye of the input signals. This also clarifies that the DRAM setup/hold specification and derating values need to include time and voltage associated with VREF AC-noise. Timing and voltage effects due to AC-noise on VREF up to the specified limit (± 1% of VDD) are included in DRAM timings and their associated deratings. Publication Release Date: Nov. 22, 2017 Revision: A02 - 102 - W632GG6MB 10.6.3 Differential swing requirements for clock (CK - CK#) and strobe (DQS - DQS#) Table 19 – Differential DC and AC Input Level PARAMETER SYMBOL Differential input high DDR3-1333/1600/1866/2133 UNIT NOTES Note 3 V 1 Note 3 -0.200 V 1 VIHDIFF(AC) 2 x (VIH(AC) - VREF) Note 3 V 2 VILDIFF(AC) Note 3 2 x (VIL(AC) - VREF) V 2 MIN. MAX. VIHDIFF +0.200 Differential input low VILDIFF Differential input high AC Differential input low AC Notes: 1. Used to define a differential signal slew-rate. 2. For CK - CK# use VIH.CA(AC)/VIL.CA(AC) of ADD/CMD and VREFCA; for DQSL, DQSL#, DQSU , DQSU# use VIH.DQ(AC)/VIL.DQ(AC) of DQs and VREFDQ; if a reduced AC-high or AC-low level is used for a signal group, then the reduced level applies also here. 3. These values are not defined; however, the single-ended signals CK, CK#, DQSL, DQSL#, DQSU, DQSU# need to be within the respective limits (VIH(DC) max, VIL(DC)min) for single-ended signals as well as the limitations for overshoot and undershoot. Refer to section 10.12 “Overshoot and Undershoot Specifications” on page 121. tDVAC Differential Input Voltage (i.e. DQS – DQS#, CK - CK# ) VIHDIFF(AC)min VIHDIFFmin 0 Half cycle VILDIFFmax VILDIFF(AC)max tDVAC time Figure 90 – Definition of differential ac-swing and “time above AC-level” tDVAC Publication Release Date: Nov. 22, 2017 Revision: A02 - 103 - W632GG6MB Table 20 – Allowed time before ringback (tDVAC) for CK - CK# and DQS - DQS# DDR3-1333/1600 Slew Rate [V/nS] tDVAC [pS] @ VIH/LDIFF(AC) = 350mV DDR3-1866/2133 tDVAC [pS] @ VIH/LDIFF(AC) = 300mV tDVAC [pS] @ VIH/LDIFF(AC) = 300mV tDVAC [pS] @ VIH/LDIFF(AC) = (CK - CK#) only Min. Max. Min. Max. Min. Max. Min. Max. > 4.0 75 - 175 - 134 - 139 - 4.0 57 - 170 - 134 - 139 - 3.0 50 - 167 - 112 - 118 - 2.0 38 - 119 - 67 - 77 - 1.8 34 - 102 - 52 - 63 - 1.6 29 - 81 - 33 - 45 - 1.4 22 - 54 - 9 - 23 - 1.2 Note - 19 - Note - Note - 1.0 Note - Note - Note - Note - < 1.0 Note - Note Note - Note - Note: Rising input differential signal shall become equal to or greater than V IHDIFF(AC) level and Falling input differential signal shall become equal to or less than VILDIFF(AC) level. 10.6.4 Single-ended requirements for differential signals Each individual component of a differential signal (CK, DQSL, DQSU, CK#, DQSL#, DQSU#) has also to comply with certain requirements for single-ended signals. CK and CK# have to approximately reach VSEHmin / VSELmax (approximately equal to the AC-levels (VIH.CA(AC) / VIL.CA(AC) ) for ADD/CMD signals) in every half-cycle. DQSL, DQSU, DQSL#, DQSU# have to reach VSEHmin / VSELmax (approximately the AC-levels (VIH.DQ(AC) / VIL.DQ(AC) ) for DQ signals) in every half-cycle preceding and following a valid transition. Note that the applicable ac-levels for ADD/CMD and DQ’s might be different per speed-bin etc. E.g., if VIH.CA(AC150)/VIL.CA(AC150) is used for ADD/CMD signals, then these AC-levels apply also for the single-ended signals CK and CK#. Table 21 – Single-ended levels for CK, DQSL, DQSU, CK#, DQSL# or DQSU# PARAMETER Single-ended high level for strobes Single-ended high level for CK, CK# Single-ended low level for strobes Single-ended low level for CK, CK# SYM. VSEH VSEL DDR3-1333/1600/1866/2133 UNIT NOTES Note 3 V 1, 2 (VDD/2) + 0.175 Note 3 V 1, 2 Note 3 (VDD/2) - 0.175 V 1, 2 Note 3 (VDD/2) - 0.175 V 1, 2 MIN. MAX. (VDD/2) + 0.175 Notes: 1. For CK, CK# use VIH.CA(AC) / VIL..CA(AC) of ADD/CMD; for strobes (DQSL, DQSL#, DQSU, DQSU#) use VIH.DQ(AC) / VIL.DQ(AC) of DQs. 2. VIH.DQ(AC) / VIL.DQ(AC) for DQs is based on VREFDQ; VIH.CA(AC) / VIL.CA(AC) for ADD/CMD is based on VREFCA; if a reduced AC-high or AC-low level is used for a signal group, then the reduced level applies also here. 3. These values are not defined; however, the single-ended signals CK, CK#, DQSL, DQSL#, DQSU, DQSU# need to be within the respective limits (VIH(DC) max, VIL(DC)min) for single-ended signals as well as the limitations for overshoot and undershoot. Refer to section 10.12 “Overshoot and Undershoot Specifications” on page 121. Publication Release Date: Nov. 22, 2017 Revision: A02 - 104 - W632GG6MB VDD or VDDQ VSEHmin VSEH VDD/2 or VDDQ/2 CK or DQS VSELmax VSEL VSS or VSSQ time Figure 91 – Single-ended requirement for differential signals Note that, while ADD/CMD and DQ signal requirements are with respect to V REF, the single-ended components of differential signals have a requirement with respect to VDD/2; this is nominally the same. The transition of single-ended signals through the AC-levels is used to measure setup time. For single-ended components of differential signals the requirement to reach V SELmax, VSEHmin has no bearing on timing, but adds a restriction on the common mode characteristics of these signals. 10.6.5 Differential Input Cross Point Voltage To guarantee tight setup and hold times as well as output skew parameters with respect to clock and strobe, each cross point voltage of differential input signals (CK, CK# and DQS, DQS#) must meet the requirements in Table 22. The differential input cross point voltage VIX is measured from the actual cross point of true and complement signals to the midlevel between of VDD and VSS. VDD CK#, DQS# VIX VDD/2 VIX VIX CK, DQS VSEH VSEL VSS Figure 92 – VIX Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 105 - W632GG6MB Table 22 – Cross point voltage for differential input signals (CK, DQS) PARAMETER DDR3-1333/1600/1866/2133 MIN. MAX. - 150 150 - 175 175 SYMBOL Differential Input Cross Point Voltage relative to VDD/2 for CK, CK# Differential Input Cross Point Voltage relative to VDD/2 for DQS, DQS# VIX(CK) VIX(DQS) -150 150 UNIT NOTES mV mV 2 1 mV 2 Note: 1. Extended range for VIX is only allowed for clock and if single-ended clock input signals CK and CK# are monotonic with a single-ended swing VSEL/VSEH of at least VDD/2 ± 250 mV, and when the differential slew rate of CK - CK# is larger than 3 V/nS. Refer to Table 21 for VSEL and VSEH standard values. 2. The relation between VIX Min/Max and VSEL/VSEH should satisfy following. (VDD/2) + VIX (Min) - VSEL ≥ 25mV VSEH - ((VDD/2) + VIX (Max)) ≥ 25mV 10.6.6 Slew Rate Definitions for Single-Ended Input Signals See section 10.16.4 “Address / Command Setup, Hold and Derating” on page 150 for singleended slew rate definitions for address and command signals. See section 10.16.5 “Data Setup, Hold and Slew Rate Derating” on page 157 for single-ended slew rate definitions for data signals. 10.6.7 Slew Rate Definitions for Differential Input Signals Input slew rate for differential signals (CK, CK# and DQS, DQS#) are defined and measured as shown in Table 23 and Figure 93. Table 23 – Differential Input Slew Rate Definition Measured from to Description Differential input slew rate for rising edge (CK - CK# and DQS - DQS#) Differential input slew rate for falling edge (CK - CK# and DQS - DQS#) Defined by VIL.DIFFmax VIH.DIFFmin [VIH.DIFFmin - VIL.DIFFmax] / ΔTR.DIFF VIH.DIFFmin VIL.DIFFmax [VIH.DIFFmin - VIL.DIFFmax] / ΔTF.DIFF Note: The differential signal (i.e., CK - CK# and DQS - DQS#) must be linear between these thresholds Differential input voltage (DQS - DQS#; CK - CK#) ΔTR.DIFF VIH.DIFFmin 0 VIL.DIFFmax ΔTF.DIFF Figure 93 – Differential Input Slew Rate Definition for DQS, DQS# and CK, CK# Publication Release Date: Nov. 22, 2017 Revision: A02 - 106 - W632GG6MB 10.7 DC and AC Output Measurement Levels Table 24 – Single-ended DC and AC Output Levels PARAMETER SYMBOL VALUE UNIT NOTES DC output high measurement level (for IV curve linearity) VOH(DC) 0.8 x VDDQ V DC output mid measurement level (for IV curve linearity) VOM(DC) 0.5 x VDDQ V DC output low measurement level (for IV curve linearity) VOL(DC) 0.2 x VDDQ V AC output high measurement level (for output slew rate) VOH(AC) VTT + 0.1 x VDDQ V 1 AC output low measurement level (for output slew rate) VOL(AC) VTT - 0.1 x VDDQ V 1 Note: 1. The swing of ± 0.1 × VDDQ is based on approximately 50% of the static single-ended output high or low swing with a driver impedance of 34 Ω and an effective test load of 25 Ω to VTT = VDDQ/2. Table 25 – Differential DC and AC Output Levels VALUE PARAMETER SYMBOL AC differential output high measurement level (for output slew rate) VOH.DIFF(AC) AC differential output low measurement level (for output slew rate) VOL.DIFF(AC) UNIT NOTES +0.2 x VDDQ V 1 -0.2 x VDDQ V 1 MIN. MAX. Note: 1. The swing of ± 0.2 × VDDQ is based on approximately 50% of the static single-ended output high or low swing with a driver impedance of 34 Ω and an effective test load of 25 Ω to VTT = VDDQ/2 at each of the differential outputs. 10.7.1 Output Slew Rate Definition and Requirements The slew rate definition depends if the signal is single-ended or differential. For the relevant AC output reference levels see above Table 24 and Table 25. Table 26 – Output Slew Rate PARAMETER SYMBOL Single-ended Output Slew Rate Differential Output Slew Rate DDR3-1333/1600 DDR3-1866/2133 UNIT NOTES 5*1 V/nS 1, 2, 3 12 V/nS 2, 3 MIN. MAX. MIN. MAX. SRQse 2.5 5 2.5 SRQdiff 5 10 5 Notes: 1. In two cases, a maximum slew rate of 6 V/nS applies for a single DQ signal within a byte lane. - Case 1 is defined for a single DQ signal within a byte lane which is switching into a certain direction (either from high to low or low to high) while all remaining DQ signals in the same byte lane are static (i.e they stay at either high or low). - Case 2 is defined for a single DQ signal within a byte lane which is switching into a certain direction (either from high to low or low to high) while all remaining DQ signals in the same byte lane are switching into the opposite direction (i.e. from low to high or high to low respectively). For the remaining DQ signal switching into the opposite direction, the regular maximum limit of 5 V/nS applies. 2. Background for Symbol Nomenclature: SR: Slew Rate; Q: Query Output (like in DQ, which stands for Data-in, QueryOutput); se: Single-ended Signals; diff: Differential Signals. 3. For RON = RZQ/7 settings only. Publication Release Date: Nov. 22, 2017 Revision: A02 - 107 - W632GG6MB 10.7.1.1 Single Ended Output Slew Rate With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOL(AC) and VOH(AC) for single ended signals as shown in Table 27 and Figure 94. Table 27 – Single-ended Output Slew Rate Definition Measured Description Defined by from to Single-ended output slew rate for rising edge VOL(AC) VOH(AC) [VOH(AC) - VOL(AC)] / ΔTRse Single-ended output slew rate for falling edge VOH(AC) VOL(AC) [VOH(AC) - VOL(AC)] / ΔTFse Note: Output slew rate is verified by design and characterization, and may not be subject to production test. Single-ended Output Voltage (i.e. DQ) ΔTRse VOH(AC) VTT VOL(AC) ΔTFse Figure 94 –Single-ended Output Slew Rate Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 108 - W632GG6MB 10.7.1.2 Differential Output Slew Rate With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOL.DIFFAC) and VOH.DIFF(AC) for differential signals as shown in Table 28 and Figure 95. Table 28 – Differential Output Slew Rate Definition Measured Description Defined by from to Differential output slew rate for rising edge VOL.DIFF(AC) VOH.DIFF(AC) [VOH.DIFF(AC) - VOL.DIFF(AC)] / ΔTRdiff Differential output slew rate for falling edge VOH.DIFF(AC) VOL.DIFF(AC) [VOH.DIFF(AC) - VOL.DIFF(AC)] / ΔTFdiff Note: Output slew rate is verified by design and characterization, and may not be subject to production test. Differential Outut Voltage (DQS - DQS#) ΔTRdiff VOH.DIFF(AC) 0 VOL.DIFF(AC) ΔTFdiff Figure 95 – Differential Output Slew Rate Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 109 - W632GG6MB 10.8 34 ohm Output Driver DC Electrical Characteristics A functional representation of the output buffer is shown in Figure 96. Output driver impedance RON is selected by bits “D.I.C” A1 and A5 in the MR1 Register. Two different values can be selected via MR1 settings: RON34 = RZQ / 7 (nominal 34.3 Ω ±10% with nominal RZQ = 240 Ω) RON40 = RZQ / 6 (nominal 40.0 Ω ±10% with nominal RZQ = 240 Ω) The individual pull-up and pull-down resistors (RONPu and RONPd) are defined as follows: RONPu = RONPd = VDDQ - VOut I Out VOut I Out under the condition that RONPd is turned off under the condition that RONPu is turned off Chip in Drive Mode Output Driver VDDQ Ipu RONpu To other circuitry like RCV, ... DQ Iout RONpd Vout Ipd VSSQ Figure 96 – Output Driver: Definition of Voltages and Currents Publication Release Date: Nov. 22, 2017 Revision: A02 - 110 - W632GG6MB Table 29 – Output Driver DC Electrical Characteristics, assuming RZQ = 240 Ω; entire operating temperature range; after proper ZQ calibration RONNom Resistor RON34Pd 34 Ω RON34Pu RON40Pd 40 Ω RON40Pu Mismatch between pull-up and pull-down, MMPuPd VOUT MIN. NOM. MAX. UNIT NOTES VOLDC = 0.2 × VDDQ 0.6 1.0 1.1 RZQ/7 1, 2, 3 VOMDC = 0.5 × VDDQ 0.9 1.0 1.1 RZQ/7 1, 2, 3 VOHDC = 0.8 × VDDQ 0.9 1.0 1.4 RZQ/7 1, 2, 3 VOLDC = 0.2 × VDDQ 0.9 1.0 1.4 RZQ/7 1, 2, 3 VOMDC = 0.5 × VDDQ 0.9 1.0 1.1 RZQ/7 1, 2, 3 VOHDC = 0.8 × VDDQ 0.6 1.0 1.1 RZQ/7 1, 2, 3 VOLDC = 0.2 × VDDQ 0.6 1.0 1.1 RZQ/6 1, 2, 3 VOMDC = 0.5 × VDDQ 0.9 1.0 1.1 RZQ/6 1, 2, 3 VOHDC = 0.8 × VDDQ 0.9 1.0 1.4 RZQ/6 1, 2, 3 VOLDC = 0.2 × VDDQ 0.9 1.0 1.4 RZQ/6 1, 2, 3 VOMDC = 0.5 × VDDQ 0.9 1.0 1.1 RZQ/6 1, 2, 3 VOHDC = 0.8 × VDDQ 0.6 1.0 1.1 RZQ/6 1, 2, 3 VOMDC = 0.5 × VDDQ -10 +10 % 1, 2, 4 Notes: 1. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibration, see following section on voltage and temperature sensitivity. 2. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS. 3. Pull-down and pull-up output driver impedances are recommended to be calibrated at 0.5 × V DDQ. Other calibration schemes may be used to achieve the linearity spec shown above, e.g. calibration at 0.2 × V DDQ and 0.8 × VDDQ. 4. Measurement definition for mismatch between pull-up and pull-down, MMPuPd: Measure RONPu and RONPd, both at 0.5 * VDDQ: MMPuPd = RON Pu - RON Pd x 100% RON Nom Publication Release Date: Nov. 22, 2017 Revision: A02 - 111 - W632GG6MB 10.8.1 Output Driver Temperature and Voltage sensitivity If temperature and/or voltage change after calibration, the tolerance limits widen according to Table 30 and Table 31. ΔT = T - T(@calibration); ΔV= VDDQ - VDDQ(@calibration); VDD = VDDQ Note: dRONdT and dRONdV are not subject to production test but are verified by design and characterization. Table 30 – Output Driver Sensitivity Definition MIN. MAX. UNIT RONPU@ VOHDC 0.6 - dRONdTH*|ΔT| - dRONdVH*|ΔV| 1.1 + dRONdTH*|ΔT| + dRONdVH*|ΔV| RZQ/7 RON@ VOMDC 0.9 - dRONdTM*|ΔT| - dRONdVM*|ΔV| 1.1 + dRONdTM*|ΔT| + dRONdVM*|ΔV| RZQ/7 RONPD@ VOLDC 0.6 - dRONdTL*|ΔT| - dRONdVL*|ΔV| 1.1 + dRONdTL*|ΔT| + dRONdVL*|ΔV| RZQ/7 Table 31 – Output Driver Voltage and Temperature Sensitivity Speed Bin DDR3-1333 DDR3-1600/1866/2133 UNIT MIN. MAX. MIN. MAX. dRONdTM 0 1.5 0 1.5 %/°C dRONdVM 0 0.15 0 0.13 %/mV dRONdTL 0 1.5 0 1.5 %/°C dRONdVL 0 0.15 0 0.13 %/mV dRONdTH 0 1.5 0 1.5 %/°C dRONdVH 0 0.15 0 0.13 %/mV Note: These parameters may not be subject to production test. They are verified by design and characterization. Publication Release Date: Nov. 22, 2017 Revision: A02 - 112 - W632GG6MB 10.9 On-Die Termination (ODT) Levels and Characteristics 10.9.1 ODT Levels and I-V Characteristics On-Die Termination effective resistance RTT is defined by bits A9, A6 and A2 of the MR1 Register. ODT is applied to the DQ, DM and DQS/DQS# pins. A functional representation of the on-die termination is shown in Figure 97. The individual pull-up and pull-down resistors (RTTPu and RTTPd) are defined as follows: RTTPu = RTTPd = VDDQ - VOut I Out VOut I Out under the condition that RTTPd is turned off under the condition that RTTPu is turned off Chip in Termination Mode ODT VDDQ Ipu RTTpu Iout = IPd - IPu To other circuitry like RCV, ... DQ Iout Vout RTTpd Ipd VSSQ Figure 97 – On-Die Termination: Definition of Voltages and Currents Publication Release Date: Nov. 22, 2017 Revision: A02 - 113 - W632GG6MB 10.9.2 ODT DC Electrical Characteristics An overview about the specification requirements for RTT and ΔVM is provided in Table 32. Table 32 – ODT DC Impedance and Mid-Level Requirements MR1 A9, A6, A2 RTT Resistor 0, 1, 0 120 Ω 0, 0, 1 Vout Min. Nom. Max. Unit Notes RTT120 0.9 1.0 1.6 RZQ/2 1, 2, 3, 4 60 Ω RTT60 0.9 1.0 1.6 RZQ/4 1, 2, 3, 4 0, 1, 1 40 Ω RTT40 0.9 1.0 1.6 RZQ/6 1, 2, 3, 4 1, 0, 1 30 Ω RTT30 0.9 1.0 1.6 RZQ/8 1, 2, 3, 4 1, 0, 0 20 Ω RTT20 0.9 1.0 1.6 RZQ/12 1, 2, 3, 4 +5 % 1, 2, 3, 4, 5 VIL(AC) to VIH(AC) Deviation of VM with respect to VDDQ/2, ΔVM -5 Notes: 1. With RZQ = 240 Ω. 2. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibration, see the following section ODT temperature and voltage sensitivity. 3. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS. 4. Measurement definition for RTT : Apply VIH(AC) to pin under test and measure current I(VIH(AC)), then apply VIL(AC) to pin under test and measure current I(VIL(AC)) respectively. Calculate RTT as follows: RTT = [VIH(AC) - VIL(AC)] / [I (VIH(AC)) - I (VIL(AC))] 5. Measurement definition for VM and ΔVM: Measure voltage (VM) at test pin (midpoint) with no load. Calculate ΔVM as follows: ΔVM = (2 × VM / VDDQ - 1) × 100%. 10.9.3 ODT Temperature and Voltage sensitivity If temperature and/or voltage change after calibration, the tolerance limits widen according to Table 33 and Table 34. The following definitions are used: ΔT = T - T (@calibration);ΔV = VDDQ- VDDQ (@calibration); VDD = VDDQ Table 33 – ODT Sensitivity Definition SYMBOL MIN. MAX. UNIT RTT 0.9 - dRTTdT × |ΔT| - dRTTdV × |ΔV| 1.6 + dRTTdT × |ΔT| + dRTTdV × |ΔV| RZQ/2,4,6,8,12 Table 34 – ODT Voltage and Temperature Sensitivity SYMBOL MIN. MAX. UNIT dRTTdT 0 1.5 %/°C dRTTdV 0 0.15 %/mV Note: These parameters may not be subject to production test. They are verified by design and characterization Publication Release Date: Nov. 22, 2017 Revision: A02 - 114 - W632GG6MB 10.9.4 Design guide lines for RTTPU and RTTPD Table 35 provides an overview of the ODT DC electrical pull-up and pull-down characteristics. The values are not specification requirements, but can be used as design guide lines. Table 35 – ODT DC Electrical Pull-Down and Pull-Up Characteristics, assuming RZQ = 240 Ω ± 1% entire operating temperature range; after proper ZQ calibration MR1 A9, A6, A2 RTT Resistor Vout Min. Nom. Max. Unit Notes 0, 1, 0 120 Ω, RTT120PD240, VOLDC = 0.2 × VDDQ 0.6 1.0 1.1 RZQ/TISFPUPD 1, 2, 3, 4, 5 0, 0, 1 60 Ω, RTT60PD120, VOMDC = 0.5 × VDDQ 0.9 1.0 1.1 RZQ/TISFPUPD 1, 2, 3, 4, 5 0, 1, 1 40 Ω, RTT40PD80, VOHDC = 0.8 × VDDQ 0.9 1.0 1.4 RZQ/TISFPUPD 1, 2, 3, 4, 5 1, 0, 1 30 Ω, RTT30PD60, 1, 0, 0 20 Ω RTT20PD40 RTT120PU240, VOLDC = 0.2 × VDDQ 0.9 1.0 1.4 RZQ/TISFPUPD 1, 2, 3, 4, 5 RTT60PU120, VOMDC = 0.5 × VDDQ 0.9 1.0 1.1 RZQ/TISFPUPD 1, 2, 3, 4, 5 RTT40PU80, VOHDC = 0.8 × VDDQ 0.6 1.0 1.1 RZQ/TISFPUPD 1, 2, 3, 4, 5 RTT30PU60, RTT20PU40 Notes: 1. TISFPUPD: Termination Impedance Scaling Factor for Pull-Up and Pull-Down path: TISFPUPD = 1 for RTT120PU/PD240 TISFPUPD = 2 for RTT60PU/PD120 TISFPUPD = 3 for RTT40PU/PD80 TISFPUPD = 4 for RTT30PU/PD60 TISFPUPD = 6 for RTT20PU/PD40 2. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibration, see the above section ODT temperature and voltage sensitivity. 3. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS. 4. Pull-down and pull-up ODT resistors are recommended to be calibrated at 0.5 × V DDQ. Other calibration schemes may be used to achieve the linearity spec shown above, e.g. calibration at 0.2 × V DDQ and 0.8 × VDDQ. 5. Not a specification requirement, but a design guide line. Publication Release Date: Nov. 22, 2017 Revision: A02 - 115 - W632GG6MB 10.10 ODT Timing Definitions 10.10.1 Test Load for ODT Timings Different than for timing measurements, the reference load for ODT timings is defined in Figure 98. VDDQ CK, CK# DUT DQ, DM VTT = VSSQ DQS, DQS# RTT = 25Ω VSSQ Timing reference point Figure 98 – ODT Timing Reference Load 10.10.2 ODT Timing Definitions Definitions for tAON, tAONPD, tAOF, tAOFPD and tADC are provided in Table 36 and subsequent figures. Measurement reference settings are provided in Table 37. Table 36 – ODT Timing Definitions Symbol Begin Point Definition End Point Definition Figure tAON Rising edge of CK - CK# defined by the end point of ODTLon Extrapolated point at VSSQ Figure 99 tAONPD Rising edge of CK - CK# with ODT being first registered high Extrapolated point at VSSQ Figure 100 tAOF Rising edge of CK - CK# defined by the end point of ODTLoff End point: Extrapolated point at VRtt_Nom Figure 101 tAOFPD Rising edge of CK - CK# with ODT being first registered low End point: Extrapolated point at VRtt_Nom Figure 102 tADC Rising edge of CK - CK# defined by the end point of ODTLcnw, ODTLcwn4 or ODTLcwn8 End point: Extrapolated point at VRtt_WR and VRtt_Nom respectively Figure 103 Table 37 – Reference Settings for ODT Timing Measurements Measured Parameter tAON tAONPD tAOF tAOFPD tADC Rtt_Nom Setting Rtt_WR Setting VSW1 [V] VSW2 [V] RZQ/4 NA 0.05 0.10 RZQ/12 NA 0.10 0.20 RZQ/4 NA 0.05 0.10 RZQ/12 NA 0.10 0.20 RZQ/4 NA 0.05 0.10 RZQ/12 NA 0.10 0.20 RZQ/4 NA 0.05 0.10 RZQ/12 NA 0.10 0.20 RZQ/12 RZQ/2 0.20 0.30 Publication Release Date: Nov. 22, 2017 Revision: A02 - 116 - W632GG6MB Begin point: Rising edge of CK – CK# defined by the end point of ODTL on CK VTT CK# tAON TSW2 TSW1 VSW2 DQ, DM DQS, DQS# VSW1 VSSQ VSSQ End point: Extrapolated point at VSSQ Figure 99 – Definition of tAON Begin point: Rising edge of CK - CK# with ODT being first registered high CK VTT CK# tAONPD TSW2 TSW1 VSW2 DQ, DM DQS, DQS# VSSQ VSW1 VSSQ End point: Extrapolated point at VSSQ Figure 100 – Definition of tAONPD Publication Release Date: Nov. 22, 2017 Revision: A02 - 117 - W632GG6MB Begin point: Rising edge of CK - CK# defined by the end point of ODTLoff CK VTT CK# tAOF End point: Extrapolated point at VRtt_Nom VRtt_Nom TSW2 VSW2 DQ, DM DQS, DQS# TSW1 VSW1 VSSQ Figure 101 – Definition of tAOF Begin point: Rising edge of CK – CK# with ODT being first registered low CK VTT CK# tAOFPD End point: Extrapolated point at VRtt_Nom VRtt_Nom TSW2 VSW2 DQ, DM DQS, DQS# TSW1 VSW1 VSSQ Figure 102 – Definition of tAOFPD Publication Release Date: Nov. 22, 2017 Revision: A02 - 118 - W632GG6MB Begin point: Rising edge of CK – CK# defined by the end point of ODTLcnw Begin point: Rising edge of CK – CK# defined by the end point of ODTLcwn4 or ODTLcwn8 CK VTT CK# tADC tADC VRtt_Nom VRtt_Nom TSW21 End point: Extrapolated point at VRtt_Nom TSW1 DQ, DM DQS, DQS# TSW2 VSW2 TSW1 VSW1 VRtt_WR End point: Extrapolated point at VRtt_WR VSSQ Figure 103 – Definition of tADC Publication Release Date: Nov. 22, 2017 Revision: A02 - 119 - W632GG6MB 10.11 Input/Output Capacitance DDR3-1333 DDR3-1600 DDR3-1866 DDR3-2133 MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. CIO 1.4 2.5 1.4 2.3 1.4 2.2 1.4 Input capacitance (CK and CK#) CCK 0.8 1.4 0.8 1.4 0.8 1.3 Delta of input capacitance (CK and CK#) CDCK 0 0.15 0 0.15 0 Delta of Input/Output capacitance (DQS and DQS#) CDDQS 0 0.15 0 0.15 Input capacitance (CTRL, ADD, CMD input-only pins) CI 0.75 1.3 0.75 Delta of input capacitance (All CTRL input-only pins) CDI_CTRL -0.4 0.2 Delta of input capacitance (All ADD/CMD input-only pins) CDI_ADD_CMD -0.4 Delta of Input/output capacitance (DQ, DM, DQS, DQS#) CDIO Input/output capacitance of ZQ signal CZQ PARAMETER SYMBOL Input/output capacitance (DQ, DM, DQS, DQS#) UNIT NOTES 2.1 pF 1, 2, 3 0.8 1.3 pF 2, 3 0.15 0 0.15 pF 2, 3, 4 0 0.15 0 0.15 pF 2, 3, 5 1.3 0.75 1.2 0.75 1.2 pF 2, 3, 6 -0.4 0.2 -0.4 0.2 -0.4 0.2 pF 2, 3, 7, 8 0.4 -0.4 0.4 -0.4 0.4 -0.4 0.4 pF 2, 3, 9, 10 -0.5 0.3 -0.5 0.3 -0.5 0.3 -0.5 0.3 pF 2, 3, 11  3  3  3  3 pF 2, 3, 12 Notes: 1. Although the DM signals have different functions, the loading matches DQ and DQS. 2. This parameter is not subject to production test. It is verified by design and characterization. The capacitance is measured according to JEP147 (Procedure for measuring input capacitance using a vector network analyzer (VNA) with VDD, VDDQ, VSS, VSSQ applied and all other pins floating (except the ball under test, CKE, RESET# and ODT as necessary). VDD=VDDQ=1.5V, VBIAS=VDD/2 and on-die termination off. 3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here. 4. Absolute value of CCK-CCK#. 5. Absolute value of CIO(DQS)-CIO(DQS#). 6. CI applies to ODT, CS#, CKE, A0-A13, BA0-BA2, RAS#, CAS#, WE#. 7. CDI_CTRL applies to ODT, CS# and CKE. 8. CDI_CTRL=CI(CTRL)-0.5*(CI(CLK)+CI(CLK#)). 9. CDI_ADD_CMD applies to A0-A13, BA0-BA2, RAS#, CAS# and WE#. 10. CDI_ADD_CMD=CI(ADD_CMD) - 0.5*(CI(CLK)+CI(CLK#)). 11. CDIO=CIO(DQ,DM) - 0.5*(CIO(DQS)+CIO(DQS#)). 12. Maximum external load capacitance on ZQ signal: 5 pF. Publication Release Date: Nov. 22, 2017 Revision: A02 - 120 - W632GG6MB 10.12 Overshoot and Undershoot Specifications 10.12.1 AC Overshoot /Undershoot Specification for Address and Control Pins: Applies to A0-A13, BA0-BA2, CS#, RAS#, CAS#, WE#, CKE, ODT DDR31333 DDR31600 DDR31866 DDR32133 UNIT Maximum peak amplitude allowed for overshoot area 0.4 0.4 0.4 0.4 V Maximum peak amplitude allowed for undershoot area 0.4 0.4 0.4 0.4 V Maximum overshoot area above VDD 0.4 0.33 0.28 0.25 V-nS Maximum undershoot area below VSS 0.4 0.33 0.28 0.25 V-nS PARAMETER Notes: 1. The sum of applied voltage (VDD) and peak amplitude overshoot voltage is not to exceed absolute maximum DC ratings. 2. The sum of applied voltage (VDD) and peak amplitude undershoot voltage is not to exceed absolute maximum DC ratings. 10.12.2 AC Overshoot /Undershoot Specification for Clock, Data, Strobe and Mask Pins: Applies to CK, CK#, DQ, DQS, DQS#, DM PARAMETER Maximum peak amplitude allowed for overshoot area DDR31333 DDR31600 DDR31866 DDR32133 UNIT 0.4 0.4 0.4 0.4 V Maximum peak amplitude allowed for undershoot area 0.4 0.4 0.4 0.4 V Maximum overshoot area above VDDQ 0.15 0.13 0.11 0.10 V-nS Maximum undershoot area below VSSQ 0.15 0.13 0.11 0.10 V-nS Notes: 1. The sum of applied voltage (VDD) and peak amplitude overshoot voltage is not to exceed absolute maximum DC ratings. 2. The sum of applied voltage (VDD) and peak amplitude undershoot voltage is not to exceed absolute maximum DC ratings. Maximum Amplitude Overshoot Area VDD/VDDQ Volts (V) VSS/VSSQ Maximum Amplitude Undershoot Area Time (nS) Figure 104 – AC Overshoot and Undershoot Definition Publication Release Date: Nov. 22, 2017 Revision: A02 - 121 - W632GG6MB 10.13 IDD and IDDQ Specification Parameters and Test Conditions 10.13.1 IDD and IDDQ Measurement Conditions In this section, IDD and IDDQ measurement conditions such as test load and patterns are defined. Figure 105 shows the setup and test load for IDD and IDDQ measurements.  IDD currents (such as IDD0, IDD1, IDD2N, IDD2NT, IDD2P0, IDD2P1, IDD2Q, IDD3N, IDD3P, IDD4R, IDD4W, IDD5B, IDD6, IDD6ET and IDD7) are measured as time-averaged currents with all VDD balls of the DDR3 SDRAM under test tied together. Any IDDQ current is not included in IDD currents.  IDDQ currents (such as IDDQ2NT and IDDQ4R) are measured as time-averaged currents with all VDDQ balls of the DDR3 SDRAM under test tied together. Any I DD current is not included in IDDQ currents. Attention: IDDQ values cannot be directly used to calculate IO power of the DDR3 SDRAM. They can be used to support correlation of simulated IO power to actual IO power as outlined in Figure 106. In DRAM module application, IDDQ cannot be measured separately since VDD and VDDQ are using one merged-power layer in Module PCB. For IDD and IDDQ measurements, the following definitions apply:  “0” and “LOW” is defined as VIN ≤ VILAC(max).  “1” and “HIGH” is defined as VIN ≥ VIHAC(min).  “MID-LEVEL” is defined as inputs are VREF = VDD / 2.  Timings used for IDD and IDDQ Measurement-Loop Patterns are provided in Table 38.  Basic IDD and IDDQ Measurement Conditions are described in Table 39.  Detailed IDD and IDDQ Measurement-Loop Patterns are described in Table 40 through Table 47.  IDD Measurements are done after properly initializing the DDR3 SDRAM. This includes but is not limited to setting RON = RZQ/7 (34 Ohm in MR1); Qoff = 0b (Output Buffer enabled in MR1); Rtt_Nom = RZQ/6 (40 Ohm in MR1); Rtt_WR = RZQ/2 (120 Ohm in MR2);  Attention: The IDD and IDDQ Measurement-Loop Patterns need to be executed at least one time before actual IDD or IDDQ measurement is started.  Define D = {CS#, RAS#, CAS#, WE# } := {HIGH, LOW, LOW, LOW}  Define D# = {CS#, RAS#, CAS#, WE# } := {HIGH, HIGH, HIGH, HIGH} Table 38 – Timings used for IDD and IDDQ Measurement-Loop Patterns Speed Bin DDR3-1333 DDR3-1600 DDR3-1866 DDR3-2133 CL-nRCD-nRP 9-9-9 11-11-11 13-13-13 14-14-14 Part Number Extension -15/15I/15J -12/12I/12J -11/11I/11J -09/09I/09J tCK 1.5 1.25 1.07 0.938 nS CL 9 11 13 14 nCK nRCD 9 11 13 14 nCK Unit nRC 33 39 45 50 nCK nRAS 24 28 32 36 nCK nRP 9 11 13 14 nCK nFAW 30 32 33 38 nCK nRRD 5 6 6 7 nCK nRFC 2 Gb 107 128 150 172 nCK Publication Release Date: Nov. 22, 2017 Revision: A02 - 122 - W632GG6MB (optional) IDDQ IDD VDD VDDQ DDR3 SDRAM RESET# CK/CK# CKE CS# RAS#, CAS#, WE# RTT = 25 Ω VDDQ / 2 DQS, DQS#, DQ, DM A, BA ODT ZQ VSS VSSQ NOTE: DIMM level Output test load condition may be different from above. Figure 105 – Measurement Setup and Test Load for IDD and IDDQ (optional) Measurements Application specific memory channel environment Channel IO Power simulation IDDQ Test Load IDDQ Simulation IDDQ Measurement Correlation Correlation Channel IO Power Number Figure 106 – Correlation from simulated Channel IO Power to actual Channel IO Power supported by IDDQ Measurement Publication Release Date: Nov. 22, 2017 Revision: A02 - 123 - W632GG6MB Table 39 – Basic IDD and IDDQ Measurement Conditions SYM. DESCRIPTION IDD0 Operating One Bank Active-Precharge Current CKE: High; External clock: On; tCK, nRC, nRAS, CL: see Table 38; BL: 8(1); AL: 0; CS#: High between ACT and PRE; Command, Address, Bank Address Inputs: partially toggling according to Table 40; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,... (see Table 40); Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 40 IDD1 Operating One Bank Active-Read-Precharge Current CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: see Table 38; BL: 8(1,6); AL: 0; CS#: High between ACT, RD and PRE; Command, Address, Bank Address Inputs, Data IO: partially toggling according to Table 41; DM: stable at 0; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,... (see Table 41); Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 41 IDD2N Precharge Standby Current CKE: High; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: partially toggling according to Table 42; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 42 IDD2NT Precharge Standby ODT Current CKE: High; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: partially toggling according to Table 43; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: toggling according to Table 43; Pattern Details: see Table 43 IDDQ2NT Precharge Standby ODT IDDQ Current Same definition like for IDD2NT, however measuring IDDQ current instead of IDD current IDD2P0 Precharge Power-Down Current Slow Exit CKE: Low; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: stable at 0; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Precharge Power Down Mode: Slow Exit(3) IDD2P1 Precharge Power-Down Current Fast Exit CKE: Low; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: stable at 0; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Precharge Power Down Mode: Fast Exit(3) IDD2Q Precharge Quiet Standby Current CKE: High; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: stable at 0; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0 IDD3N Active Standby Current CKE: High; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: partially toggling according to Table 42; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 42 IDD3P Active Power-Down Current CKE: Low; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: stable at 1; Command, Address, Bank Address Inputs: stable at 0; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0 Publication Release Date: Nov. 22, 2017 Revision: A02 - 124 - W632GG6MB Basic IDD and IDDQ Measurement Conditions, continued SYM. IDD4R IDDQ4R IDD4W IDD5B IDD6 IDD6ET IDD7 IDD8 DESCRIPTION Operating Burst Read Current CKE: High; External clock: On; tCK, CL: see Table 38; BL: 8(1,6); AL: 0; CS#: High between RD; Command, Address, Bank Address Inputs: partially toggling according to Table 44; Data IO: seamless read data burst with different data between one burst and the next one according to Table 44; DM: stable at 0; Bank Activity: all banks open, RD commands cycling through banks: 0,0,1,1,2,2,... (see Table 44); Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 44 Operating Burst Read IDDQ Current Same definition like for IDD4R, however measuring IDDQ current instead of IDD current Operating Burst Write Current CKE: High; External clock: On; tCK, CL: see Table 38; BL: 8(1); AL: 0; CS#: High between WR; Command, Address, Bank Address Inputs: partially toggling according to Table 45; Data IO: seamless write data burst with different data between one burst and the next one according to Table 45; DM: stable at 0; Bank Activity: all banks open, WR commands cycling through banks: 0,0,1,1,2,2,... (see Table 45); Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at HIGH; Pattern Details: see Table 45 Burst Refresh Current CKE: High; External clock: On; tCK, CL, nRFC: see Table 38; BL: 8(1); AL: 0; CS#: High between REF; Command, Address, Bank Address Inputs: partially toggling according to Table 46; Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: REF command every nRFC (see Table 46); Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 46 Self Refresh Current: Normal Temperature Range Auto Self-Refresh (ASR): Disabled(4); Self-Refresh Temperature Range (SRT): Normal(5); CKE: Low; External clock: Off; CK and CK#: LOW; CL: see Table 38; BL: 8(1); AL: 0; CS#, Command, Address, Bank Address, Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: MID-LEVEL Self-Refresh Current: Extended Temperature Range Auto Self-Refresh (ASR): Disabled(4); Self-Refresh Temperature Range (SRT): Extended(5); CKE: Low; External clock: Off; CK and CK#: LOW; CL: see Table 38; BL: 8(1); AL: 0; CS#, Command, Address, Bank Address, Data IO: MID-LEVEL; DM: stable at 0; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: MID-LEVEL Operating Bank Interleave Read Current CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, nRRD, nFAW, CL: see Table 38; BL: 8(1,6); AL: CL-1; CS#: High between ACT and RDA; Command, Address, Bank Address Inputs: partially toggling according to Table 47; Data IO: read data bursts with different data between one burst and the next one according to Table 47; DM: stable at 0; Bank Activity: two times interleaved cycling through banks (0, 1, ...7) with different addressing, see Table 47; Output Buffer and RTT: Enabled in Mode Registers(2); ODT Signal: stable at 0; Pattern Details: see Table 47 RESET# Low Current RESET#: Low; External clock: Off; CK and CK#: Low; CKE: FLOATING; CS#, Command, Address, Bank Address, Data IO: FLOATING; ODT Signal: FLOATING RESET# Low current reading is valid once power is stable and RESET has been Low for at least 1mS Notes: 1. Burst Length: BL8 fixed by MRS: set MR0 A[1,0]=00b. 2. Output Buffer Enable: set MR1 A[12] = 0b; set MR1 A[5,1] = 01b; Rtt_Nom enable: set MR1 A[9,6,2] = 011b; Rtt_WR enable: set MR2 A[10,9] = 10b. 3. Precharge Power Down Mode: set MR0 A12=0b for Slow Exit or MR0 A12=1b for Fast Exit. 4. Auto Self-Refresh (ASR): set MR2 A6 = 0b to disable or 1b to enable feature. 5. Self-Refresh Temperature Range (SRT): set MR2 A7=0b for normal or 1b for extended temperature range. 6. Read Burst Type: Nibble Sequential, set MR0 A[3] = 0b. Publication Release Date: Nov. 22, 2017 Revision: A02 - 125 - W632GG6MB CS# RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] ACT 0 0 1 1 0 0 0 0 0 0 0 - D, D 1 0 0 0 0 0 0 0 0 0 0 - 3, 4 D#, D# 1 1 1 1 0 0 0 0 0 0 0 - 0 0 0 - ... nRAS Static High toggling 0 Command 0 1, 2 Cycle Number Sub-Loop CKE CK, CK# Table 40 – IDD0 Measurement-Loop Pattern1 ... Data2 Repeat pattern 1...4 until nRAS - 1, truncate if necessary PRE 0 0 1 0 0 0 0 0 Repeat pattern 1...4 until nRC - 1, truncate if necessary 1*nRC+0 ACT 0 0 1 1 0 0 0 0 0 F 0 - 1*nRC+1, 2 D, D 1 0 0 0 0 0 0 0 0 F 0 - D#, D# 1 1 1 1 0 0 0 0 0 F 0 - 0 - 1*nRC+3, 4 ... 1*nRC+nRAS ... Repeat pattern nRC + 1,...,4 until nRC + nRAS - 1, truncate if necessary PRE 0 0 1 0 0 0 0 0 0 F Repeat pattern nRC + 1,...,4 until 2*nRC - 1, truncate if necessary 1 2*nRC Repeat Sub-Loop 0, use BA[2:0] = 1 instead 2 4*nRC Repeat Sub-Loop 0, use BA[2:0] = 2 instead 3 6*nRC Repeat Sub-Loop 0, use BA[2:0] = 3 instead 4 8*nRC Repeat Sub-Loop 0, use BA[2:0] = 4 instead 5 10*nRC Repeat Sub-Loop 0, use BA[2:0] = 5 instead 6 12*nRC Repeat Sub-Loop 0, use BA[2:0] = 6 instead 7 14*nRC Repeat Sub-Loop 0, use BA[2:0] = 7 instead Notes: 1. DM must be driven LOW all the time. DQS, DQS# are MID-LEVEL. 2. DQ signals are MID-LEVEL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 126 - W632GG6MB CS# RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] ACT 0 0 1 1 0 0 0 0 0 0 0 - D, D 1 0 0 0 0 0 0 0 0 0 0 - 3, 4 D#, D# 1 1 1 1 0 0 0 0 0 0 0 - 0 0 0 00000000 0 0 0 - ... nRCD ... nRAS Static High toggling 0 Command 0 1, 2 Cycle Number Sub-Loop CKE CK, CK# Table 41 – IDD1 Measurement-Loop Pattern1 ... Data2 Repeat pattern 1...4 until nRCD - 1, truncate if necessary RD 0 1 0 1 0 0 0 0 Repeat pattern 1...4 until nRAS - 1, truncate if necessary PRE 0 0 1 0 0 0 0 0 Repeat pattern 1...4 until nRC - 1, truncate if necessary 1*nRC+0 ACT 0 0 1 1 0 0 0 0 0 F 0 - 1*nRC+1, 2 D, D 1 0 0 0 0 0 0 0 0 F 0 - 1*nRC+3, 4 D#, D# 1 1 1 1 0 0 0 0 0 F 0 - 0 00110011 0 - ... 1*nRC+nRCD ... 1*nRC+nRAS ... Repeat pattern nRC + 1,...,4 until nRC + nRCD - 1, truncate if necessary RD 0 1 0 1 0 0 0 0 0 F Repeat pattern nRC + 1,...,4 until nRC + nRAS - 1, truncate if necessary PRE 0 0 1 0 0 0 0 0 0 F Repeat pattern nRC + 1,...,4 until 2*nRC - 1, truncate if necessary 1 2*nRC Repeat Sub-Loop 0, use BA[2:0] = 1 instead 2 4*nRC Repeat Sub-Loop 0, use BA[2:0] = 2 instead 3 6*nRC Repeat Sub-Loop 0, use BA[2:0] = 3 instead 4 8*nRC Repeat Sub-Loop 0, use BA[2:0] = 4 instead 5 10*nRC Repeat Sub-Loop 0, use BA[2:0] = 5 instead 6 12*nRC Repeat Sub-Loop 0, use BA[2:0] = 6 instead 7 14*nRC Repeat Sub-Loop 0, use BA[2:0] = 7 instead Notes: 1. DM must be driven LOW all the time. DQS, DQS# are used according to RD Commands, otherwise MID-LEVEL. 2. Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 127 - W632GG6MB RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] D 1 0 0 0 0 0 0 0 0 0 0 - 1 D 1 0 0 0 0 0 0 0 0 0 0 - 2 D# 1 1 1 1 0 0 0 0 0 F 0 - D# 1 1 1 1 0 0 0 0 0 F 0 - Static High 3 toggling Command CS# 0 0 Cycle Number Sub-Loop CKE CK, CK# Table 42 – IDD2N and IDD3N Measurement-Loop Pattern1 1 4-7 Repeat Sub-Loop 0, use BA[2:0] = 1 instead 2 8-11 Repeat Sub-Loop 0, use BA[2:0] = 2 instead 3 12-15 Repeat Sub-Loop 0, use BA[2:0] = 3 instead 4 16-19 Repeat Sub-Loop 0, use BA[2:0] = 4 instead 5 20-23 Repeat Sub-Loop 0, use BA[2:0] = 5 instead 6 24-27 Repeat Sub-Loop 0, use BA[2:0] = 6 instead 7 28-31 Repeat Sub-Loop 0, use BA[2:0] = 7 instead Data2 Notes: 1. DM must be driven LOW all the time. DQS, DQS# are MID-LEVEL. 2. DQ signals are MID-LEVEL. RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] D 1 0 0 0 0 0 0 0 0 0 0 - 1 D 1 0 0 0 0 0 0 0 0 0 0 - 2 D# 1 1 1 1 0 0 0 0 0 F 0 - 0 0 0 F 0 - Static High 3 toggling Command CS# 0 0 Cycle Number Sub-Loop CKE CK, CK# Table 43 – IDD2NT and IDDQ2NT Measurement-Loop Pattern1 D# 1 1 1 1 0 4-7 Repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 1 2 8-11 Repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 2 3 12-15 Repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 3 4 16-19 Repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 4 5 20-23 Repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 5 6 24-27 Repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 6 7 28-31 Repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 7 1 0 Data2 Notes: 1. DM must be driven LOW all the time. DQS, DQS# are MID-LEVEL. 2. DQ signals are MID-LEVEL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 128 - W632GG6MB CS# RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] RD 0 1 0 1 0 0 0 0 0 0 0 00000000 1 D 1 0 0 0 0 0 0 0 0 0 0 - 2, 3 D#, D# 1 1 1 1 0 0 0 0 0 0 0 - 4 RD 0 1 0 1 0 0 0 0 0 F 0 00110011 5 D 1 0 0 0 0 0 0 0 0 F 0 - 6, 7 D#, D# 1 1 1 1 0 0 0 0 0 F 0 - 1 8-15 Repeat Sub-Loop 0, but BA[2:0] = 1 2 16-23 Repeat Sub-Loop 0, but BA[2:0] = 2 3 24-31 Repeat Sub-Loop 0, but BA[2:0] = 3 4 32-39 Repeat Sub-Loop 0, but BA[2:0] = 4 5 40-47 Repeat Sub-Loop 0, but BA[2:0] = 5 6 48-55 Repeat Sub-Loop 0, but BA[2:0] = 6 7 56-63 Repeat Sub-Loop 0, but BA[2:0] = 7 Static High Cycle Number 0 0 toggling Command Sub-Loop CKE CK, CK# Table 44 – IDD4R and IDDQ4R Measurement-Loop Pattern1 Data2 Notes: 1. DM must be driven LOW all the time. DQS, DQS# are used according to RD Commands, otherwise MID-LEVEL. 2. Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL. RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] Command CS# Static High toggling 0 0 WR 0 1 0 0 1 0 0 0 0 0 0 00000000 1 D 1 0 0 0 1 0 0 0 0 0 0 - 2, 3 D#, D# 1 1 1 1 1 0 0 0 0 0 0 - 4 WR 0 1 0 0 1 0 0 0 0 F 0 00110011 5 D 1 0 0 0 1 0 0 0 0 F 0 - 1 1 1 1 1 0 0 0 0 F 0 - Cycle Number Sub-Loop CKE CK, CK# Table 45 – IDD4W Measurement-Loop Pattern1 6, 7 D#, D# 1 8-15 Repeat Sub-Loop 0, but BA[2:0] = 1 2 16-23 Repeat Sub-Loop 0, but BA[2:0] = 2 3 24-31 Repeat Sub-Loop 0, but BA[2:0] = 3 4 32-39 Repeat Sub-Loop 0, but BA[2:0] = 4 5 40-47 Repeat Sub-Loop 0, but BA[2:0] = 5 6 48-55 Repeat Sub-Loop 0, but BA[2:0] = 6 7 56-63 Repeat Sub-Loop 0, but BA[2:0] = 7 Data2 Notes: 1. DM must be driven LOW all the time. DQS, DQS# are used according to WR Commands, otherwise MID-LEVEL. 2. Burst Sequence driven on each DQ signal by Write Command. Outside burst operation, DQ signals are MID-LEVEL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 129 - W632GG6MB Static High toggling 1 2 RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] Command CS# 0 0 REF 0 0 0 1 0 0 0 0 0 0 0 - 1, 2 D, D 1 0 0 0 0 0 0 0 0 0 0 - 3, 4 D#, D# 1 1 1 1 0 0 0 0 0 F 0 - Cycle Number Sub-Loop CKE CK, CK# Table 46 – IDD5B Measurement-Loop Pattern1 5...8 Repeat cycles 1...4, but BA[2:0] = 1 9...12 Repeat cycles 1...4, but BA[2:0] = 2 13...16 Repeat cycles 1...4, but BA[2:0] = 3 17...20 Repeat cycles 1...4, but BA[2:0] = 4 21...24 Repeat cycles 1...4, but BA[2:0] = 5 25...28 Repeat cycles 1...4, but BA[2:0] = 6 29...32 Repeat cycles 1...4, but BA[2:0] = 7 33...nRFC - 1 Data2 Repeat Sub-Loop 1, until nRFC - 1. Truncate, if necessary Notes: 1. DM must be driven LOW all the time. DQS, DQS# are MID-LEVEL. 2. DQ signals are MID-LEVEL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 130 - W632GG6MB RAS# CAS# WE# ODT BA[2:0] A[13:11] A[10] A[9:7] A[6:3] A[2:0] ACT 0 0 1 1 0 0 0 0 0 0 0 - 1 RDA 0 1 0 1 0 0 0 1 0 0 0 00000000 D 1 0 0 0 0 0 0 0 0 0 0 - 2 ... 1 Static High Repeat above D Command until nRRD - 1 nRRD ACT 0 0 1 1 0 1 0 0 0 F 0 - RDA 0 1 0 1 0 1 0 1 0 F 0 00110011 nRRD+2 D 1 0 0 0 0 1 0 0 0 F 0 - 0 0 0 F 0 - 0 - Repeat above D Command until 2 * nRRD -1 2 2*nRRD Repeat Sub-Loop 0, but BA[2:0] = 2 3 3*nRRD Repeat Sub-Loop 1, but BA[2:0] = 3 4 4*nRRD D 1 0 0 0 0 nFAW Repeat Sub-Loop 0, but BA[2:0] = 4 6 nFAW+nRRD Repeat Sub-Loop 1, but BA[2:0] = 5 7 nFAW+2*nRRD Repeat Sub-Loop 0, but BA[2:0] = 6 8 nFAW+3*nRRD Repeat Sub-Loop 1, but BA[2:0] = 7 9 nFAW+4*nRRD D 1 0 0 0 0 7 0 0 0 F Assert and repeat above D Command until 2 * nFAW - 1, if necessary 2*nFAW+0 ACT 0 0 1 1 0 0 0 0 0 F 0 - 2*nFAW+1 RDA 0 1 0 1 0 0 0 1 0 F 0 00110011 D 1 0 0 0 0 0 0 0 0 F 0 - 2*nFAW+2 11 3 Assert and repeat above D Command until nFAW - 1, if necessary 5 10 Data2 nRRD+1 ... toggling Command CS# 0 0 Cycle Number Sub-Loop CKE CK, CK# Table 47 – IDD7 Measurement-Loop Pattern1 ATTENTION: Sub-Loops 10-19 have inverse A[6:3] Pattern and Data Pattern than Sub-Loops 0-9 Repeat above D Command until 2 * nFAW + nRRD - 1 2*nFAW+nRRD ACT 0 0 1 1 0 1 0 0 0 0 0 - 2*nFAW+nRRD+1 RDA 0 1 0 1 0 1 0 1 0 0 0 00000000 D 1 0 0 0 0 1 0 0 0 0 0 - 0 0 - 2*nFAW+nRRD+2 Repeat above D Command until 2 * nFAW + 2 * nRRD -1 12 2*nFAW+2*nRRD Repeat Sub-Loop 10, but BA[2:0] = 2 13 2*nFAW+3*nRRD Repeat Sub-Loop 11, but BA[2:0] = 3 14 2*nFAW+4*nRRD D 1 0 0 0 0 3 0 0 0 Assert and repeat above D Command until 3 * nFAW - 1, if necessary 15 3*nFAW Repeat Sub-Loop 10, but BA[2:0] = 4 16 3*nFAW+nRRD Repeat Sub-Loop 11, but BA[2:0] = 5 17 3*nFAW+2*nRRD Repeat Sub-Loop 10, but BA[2:0] = 6 18 3*nFAW+3*nRRD Repeat Sub-Loop 11, but BA[2:0] = 7 19 3*nFAW+4*nRRD D 1 0 0 0 0 7 0 0 0 0 0 - Assert and repeat above D Command until 4 * nFAW - 1, if necessary Notes: 1. DM must be driven LOW all the time. DQS, DQS# are used according to RD Commands, otherwise MID-LEVEL. 2. Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL. Publication Release Date: Nov. 22, 2017 Revision: A02 - 131 - W632GG6MB 10.13.2 IDD Current Specifications DDR31333 Speed Bin SYM. DDR31600 DDR31866 DDR32133 -15/15I/15J -12/12I/12J -11/11I/11J -09/09I/09J UNIT Part Number Extension DEFINITION MAX. MAX. MAX. MAX. IDD0 Operating One Bank Active-Precharge Current 110 120 135 140 mA IDD1 Operating One Bank Active-ReadPrecharge Current 130 145 160 175 mA IDD2N Precharge Standby Current 80 85 95 100 mA IDD2NT Precharge Standby ODT Current 95 105 115 130 mA IDD2P0 Precharge Power Down Current Slow Exit 16 16 16 16 mA IDD2P1 Precharge Power Down Current Fast Exit 45 50 55 60 mA IDD2Q Precharge Quiet Standby Current 80 85 95 100 mA IDD3N Active Standby Current 85 95 100 110 mA IDD3P Active Power Down Current 55 60 65 70 mA IDD4R Operating Burst Read Current 165 190 210 230 mA IDD4W Operating Burst Write Current 185 210 235 260 mA IDD5B Burst Refresh Current 175 180 190 195 mA IDD6*3 Normal Temperature Self-Refresh Current 11 11 11 11 mA Extended Temperature Self-Refresh Current 13 13 13 13 mA IDD7 Operating Bank Interleave Read Current 205 235 260 290 mA IDD8 RESET# Low Current 10 10 10 10 mA IDD6ET*4 Notes: 1. Max. values for IDD currents consider worst case conditions of process, temperature and voltage. 2. The IDD values must be derated (increased) when operated outside the range 0°C ≤ TCASE ≤ 85°C: (a) When TCASE < 0°C: IDD2P0, IDD2P1 and IDD3P must be derated by 4%; IDD4R and IDD5W must be derated by 2%; and IDD6, IDD6ET and IDD7 must be derated by 7%. (b) When TCASE > 85°C: IDD0, IDD1, IDD2N, IDD2NT, IDD2Q, IDD3N, IDD3P, IDD4R, IDD4W , and IDD5B must be derated by 2%; and IDD2P0, IDD2P1 must be derated by 30%. 3. Set MR2 A[6] = 0b, Auto Self-Refresh (ASR) disable; Set MR2 A[7] = 0b, Self-Refresh Temperature Range (SRT) disable for normal temperature range. 4. Set MR2 A[6] = 0b, ASR disable; Set MR2 A[7] = 1b, SRT enable for extended temperature range. Publication Release Date: Nov. 22, 2017 Revision: A02 - 132 - W632GG6MB 10.14 Clock Specification The jitter specified is a random jitter meeting a Gaussian distribution. Input clocks violating the min/max values may result in malfunction of the DDR3 SDRAM device. Definition for tCK(avg) tCK(avg) is calculated as the average clock period across any consecutive 200 cycle window, where each clock period is calculated from rising edge to rising edge. N  tCK(avg) =  tCK j  / N  j 1  where N = 200 Definition for tCK(abs) tCK(abs) is defined as the absolute clock period, as measured from one rising edge to the next consecutive rising edge. tCK(abs) is not subject to production test. Definition for tCH(avg) and tCL(avg) tCH(avg) is defined as the average high pulse width, as calculated across any consecutive 200 high pulses. N  tCH(avg) =  tCH j  / (N × tCK(avg))  j 1  where N = 200 tCL(avg) is defined as the average low pulse width, as calculated across any consecutive 200 low pulses. N  tCL(avg) =  tCL j  / (N × tCK(avg))  j 1  where N = 200 Definition for tJIT(per) and tJIT(per,lck) tJIT(per) is defined as the largest deviation of any signal tCK from tCK(avg). tJIT(per) = Min/max of {tCKi - tCK(avg) where i = 1 to 200}. tJIT(per) defines the single period jitter when the DLL is already locked. tJIT(per,lck) uses the same definition for single period jitter, during the DLL locking period only. tJIT(per) and tJIT(per,lck) are not subject to production test. Publication Release Date: Nov. 22, 2017 Revision: A02 - 133 - W632GG6MB Definition for tJIT(cc) and tJIT(cc,lck) tJIT(cc) is defined as the absolute difference in clock period between two consecutive clock cycles. tJIT(cc) = Max of |{tCKi +1 - tCKi}|. tJIT(cc) defines the cycle to cycle jitter when the DLL is already locked. tJIT(cc,lck) uses the same definition for cycle to cycle jitter, during the DLL locking period only. tJIT(cc) and tJIT(cc,lck) are not subject to production test. Definition for tERR(nper) tERR is defined as the cumulative error across n multiple consecutive cycles from t CK(avg). tERR is not subject to production test. 10.15 Speed Bins DDR3 SDRAM Speed Bins include tCK, tRCD, tRP, tRC and tRAS for each corresponding bin. 10.15.1 DDR3-1333 Speed Bin and Operating Conditions Speed Bin CL-nRCD-nRP Part Number Extension Parameter Maximum operating frequency using maximum allowed settings for Sup_CL and Sup_CWL Internal read command to first data ACT to internal read or write delay time Symbol fCKMAX tAA tRCD PRE command period tRP ACT to ACT or REF command period tRC ACT to PRE command period CL = 5 CL = 6 CL = 7 CWL = 5 CWL = 6, 7 CWL = 5 CWL = 6, 7 CWL = 5 tRAS tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) CWL = 6 tCK(AVG) CWL = 7 CWL = 5 CL = 8 CWL = 6 CWL = 7 CWL = 5, 6 CL = 9 CWL = 7 CWL = 5, 6 CL = 10 CWL = 7 Supported CL Settings Supported CWL Settings tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) tCK(AVG) Sup_CL Sup_CWL DDR3-1333 9-9-9 -15/15I/15J Min. Max.  667 13.5 20 (13.125)*10 13.5  (13.125)*10 13.5  (13.125)*10 49.5  (49.125)*10 36 9 * tREFI 3.0 3.3 Reserved 2.5 3.3 Reserved Reserved 1.875 < 2.5 (Optional)*10 Reserved Reserved 1.875 < 2.5 Reserved Reserved 1.5 < 1.875 Reserved 1.5 < 1.875 5, 6, (7), 8, 9, 10 5, 6, 7 UNIT NOTES MHz nS nS nS nS nS nS nS nS nS nS nS nS nS nS nS nS nS nS nS nS nCK nCK 1, 2, 3, 4, 6 5 1, 2, 3, 4, 6 5 5 1, 2, 3, 4, 6 5 5 1, 2, 3, 4, 6 5 5 1, 2, 3, 4 5 1, 2, 3, 4 Note: Field value contents in blue font or parentheses are optional AC parameter and CL setting. Detail descriptions refer to note 10. Publication Release Date: Nov. 22, 2017 Revision: A02 - 134 - W632GG6MB 10.15.2 DDR3-1600 Speed Bin and Operating Conditions Speed Bin DDR3-1600 CL-nRCD-nRP 11-11-11 Part Number Extension -12/12I/12J UNIT NOTES Parameter Symbol Min. Max. Maximum operating frequency using maximum allowed settings for Sup_CL and Sup_CWL fCKMAX  800 MHz tAA 13.75 (13.125)*10 20 nS tRCD 13.75 (13.125)*10  nS PRE command period tRP 13.75 (13.125)*10  nS ACT to ACT or REF command period tRC 48.75 (48.125)*10  nS ACT to PRE command period tRAS 35 9 * tREFI nS CWL = 5 tCK(AVG) 3.0 3.3 nS 1, 2, 3, 4, 7 CWL = 6, 7, 8 tCK(AVG) nS 5 Internal read command to first data ACT to internal read or write delay time CL = 5 CL = 6 CL = 7 CL = 8 CL = 9 CL =10 CL =11 Reserved CWL = 5 tCK(AVG) nS 1, 2, 3, 4, 7 CWL = 6, 7, 8 tCK(AVG) 2.5 Reserved 3.3 nS 5 CWL = 5 tCK(AVG) Reserved nS 5 CWL = 6 tCK(AVG) nS 1, 2, 3, 4, 7 (Optional)* nS 5 CWL = 7, 8 tCK(AVG) Reserved nS 5 CWL = 5 tCK(AVG) Reserved nS 5 CWL = 6 tCK(AVG) nS 1, 2, 3, 4, 7 CWL = 7, 8 tCK(AVG) Reserved nS 5 CWL = 5, 6 tCK(AVG) Reserved nS 5 CWL = 7 tCK(AVG) CWL = 8 1.875 < 2.5 10 1.875 1.5 < 2.5 < 1.875 nS 5 (Optional)*10 nS 1, 2, 3, 4, 7 tCK(AVG) Reserved nS 5 CWL = 5, 6 tCK(AVG) Reserved nS 5 CWL = 7 tCK(AVG) nS 1, 2, 3, 4, 7 CWL = 8 tCK(AVG) Reserved nS 5 CWL = 5, 6, 7 tCK(AVG) Reserved nS 5 CWL = 8 tCK(AVG) nS 1, 2, 3, 4 1.5 < 1.875 1.25 < 1.5 Supported CL Settings Sup_CL 5, 6, (7), 8, (9), 10, 11 nCK Supported CWL Settings Sup_CWL 5, 6, 7, 8 nCK Note: Field value contents in blue font or parentheses are optional AC parameter and CL setting. Detail descriptions refer to note 10. Publication Release Date: Nov. 22, 2017 Revision: A02 - 135 - W632GG6MB 10.15.3 DDR3-1866 Speed Bin and Operating Conditions Speed Bin DDR3-1866 CL-nRCD-nRP 13-13-13 Part Number Extension -11/11I/11J UNIT NOTES Parameter Symbol Min. Max. Maximum operating frequency using maximum allowed settings for Sup_CL and Sup_CWL fCKMAX  933 MHz tAA 13.91 20 nS tRCD 13.91  nS PRE command period tRP 13.91  nS ACT to ACT or REF command period tRC 47.91  nS ACT to PRE command period tRAS 34 9 * tREFI nS CWL = 5 tCK(AVG) 3.0 3.3 nS 1, 2, 3, 4, 8 CWL = 6, 7, 8, 9 tCK(AVG) nS 5 CWL = 5 tCK(AVG) nS 1, 2, 3, 4, 8 CWL = 6, 7, 8, 9 tCK(AVG) Reserved nS 5 CWL = 5 tCK(AVG) Reserved nS 5 CWL = 6 tCK(AVG) nS 1, 2, 3, 4, 8 CWL = 7, 8, 9 tCK(AVG) Reserved nS 5 CWL = 5, 6 tCK(AVG) Reserved nS 5 CWL = 7 tCK(AVG) nS 1, 2, 3, 4, 8 CWL = 8, 9 tCK(AVG) Reserved nS 5 CWL = 5, 6, 7, 8 tCK(AVG) Reserved nS 5 CWL = 9 tCK(AVG) nS 1, 2, 3, 4 Internal read command to first data ACT to internal read or write delay time CL = 5 CL = 6 CL = 8 CL =10 CL =13 Reserved 2.5 3.3 1.875 1.5 < 2.5 < 1.875 1.07 < 1.25 Supported CL Settings Sup_CL 5, 6, 8, 10, 13 nCK Supported CWL Settings Sup_CWL 5, 6, 7, 9 nCK Publication Release Date: Nov. 22, 2017 Revision: A02 - 136 - W632GG6MB 10.15.4 DDR3-2133 Speed Bin and Operating Conditions Speed Bin DDR3-2133 CL-nRCD-nRP 14-14-14 Part Number Extension -09/09I/09J UNIT Parameter Symbol Min. Max. Maximum operating frequency using maximum allowed settings for Sup_CL and Sup_CWL fCKMAX  1067 MHz tAA 13.09 20 nS tRCD 13.09 - nS PRE command period tRP 13.09 - nS ACT to ACT or REF command period tRC 46.09 - nS ACT to PRE command period tRAS 33 9 * tREFI nS CWL = 5 tCK(AVG) 3.0 3.3 nS CWL = 6, 7, 8, 9, 10 tCK(AVG) CWL = 5 tCK(AVG) CWL = 6, 7, 8, 9, 10 tCK(AVG) CWL = 5 tCK(AVG) CWL = 6 tCK(AVG) CWL = 7, 8, 9, 10 tCK(AVG) CWL = 5 tCK(AVG) CWL = 6 tCK(AVG) CWL = 7, 8, 9, 10 tCK(AVG) CWL = 5, 6 tCK(AVG) CWL = 7 tCK(AVG) CWL = 8, 9, 10 tCK(AVG) CWL = 5, 6 tCK(AVG) CWL = 7 tCK(AVG) CWL = 8, 9, 10 tCK(AVG) CWL = 5, 6, 7 tCK(AVG) CWL = 8 tCK(AVG) CWL = 9, 10 tCK(AVG) CWL = 5, 6, 7, 8 tCK(AVG) CWL = 9 tCK(AVG) CWL = 10 tCK(AVG) CWL = 5, 6, 7, 8, 9 tCK(AVG) CWL = 10 tCK(AVG) Internal read command to first data ACT to internal read or write delay time CL = 5 CL = 6 CL = 7 CL = 8 CL = 9 CL = 10 CL = 11 CL = 13 CL = 14 Reserved NOTES 1, 2, 3, 4, 9 nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4, 9 Reserved nS 5 Reserved nS 5 nS 1, 2, 3, 4 2.5 3.3 1.875 1.875 1.5 < 2.5 < 2.5 < 1.875 1.5 < 1.875 1.25 1.07 0.938 < 1.5 < 1.25 < 1.07 Supported CL Settings Sup_CL 5, 6, 7, 8, 9, 10, 11, 13, 14 nCK Supported CWL Settings Sup_CWL 5, 6, 7, 8, 9, 10 nCK Publication Release Date: Nov. 22, 2017 Revision: A02 - 137 - W632GG6MB 10.15.5 Speed Bin General Notes The absolute specification for all speed bins is T OPER and VDD = VDDQ = 1.5V ± 0.075V. In addition the following general notes apply. 1. Max. limits are exclusive. E.g. if tCK(AVG).MAX value is 2.5 nS, tCK(AVG) needs to be < 2.5 nS. 2. The CL setting and CWL setting result in tCK(AVG).MIN and tCK(AVG).MAX requirements. When making a selection of tCK(AVG), both need to be fulfilled: Requirements from CL setting as well as requirements from CWL setting. 3. tCK(AVG).MIN limits: Since CAS Latency is not purely analog - data and strobe output are synchronized by the DLL - all possible intermediate frequencies may not be guaranteed. An application should use the next smaller standard tCK(AVG) value (3.0, 2.5, 1.875, 1.5, 1.25, 1.07, or 0.938 nS) when calculating CL [nCK] = tAA [nS] / tCK(AVG) [nS], rounding up to the next ‘Supported CL’. 4. tCK(AVG).MAX limits: Calculate tCK(AVG) = tAA.MAX / CL SELECTED and round the resulting tCK(AVG) down to the next valid speed bin (i.e. 3.3nS or 2.5nS or 1.875 nS or 1.25 nS or 1.07 nS). This result is tCK(AVG).MAX corresponding to CL SELECTED. 5. ‘Reserved’ settings are not allowed. User must program a different value. 6. Any DDR3-1333 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 7. Any DDR3-1600 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 8. Any DDR3-1866 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 9. Any DDR3-2133 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 10. For devices supporting optional down binning to CL=7 and CL=9, tAA/tRCD/tRP min must be 13.125 nS or lower. SPD settings must be programmed to match. For example, DDR3-1333 (9-9-9) devices supporting down binning to DDR3-1066 (7-7-7) should program 13.125 nS in SPD bytes for tAAmin (Byte 16), tRCDmin (Byte 18), and tRPmin (Byte 20). DDR3-1600 (11-11-11) devices supporting down binning to DDR3-1333 (9-9-9) or DDR3-1066 (7-7-7) should program 13.125 nS in SPD bytes for tAAmin (Byte16), tRCDmin (Byte 18), and tRPmin (Byte 20). Once tRP (Byte 20) is programmed to 13.125 nS, tRCmin (Byte 21, 23) also should be programmed accordingly. For example, 49.125nS (tRASmin + tRPmin = 36 nS + 13.125 nS) for DDR3-1333 (9-9-9) and 48.125 nS (tRASmin + tRPmin = 35 nS + 13.125 nS) for DDR3-1600 (11-11-11). Publication Release Date: Nov. 22, 2017 Revision: A02 - 138 - W632GG6MB 10.16 AC Characteristics 10.16.1 AC Timing and Operating Condition for -09/09I/09J/-11/11I/11J speed grades SPEED GRADE SYMBOL PARAMETER DDR3-2133 (-09/09I/09J) MIN. DDR3-1866 (-11/11I/11J) MAX. MIN. UNITS NOTES MAX. Common Notes 1, 2, 3, 4 Clock Input Timing tCK(DLL-off) Minimum clock cycle time (DLL-off mode)  8  8 See “Speed Bin” on page 137 See “Speed Bin” on page 136 nS tCK(avg) Average Clock Period tCH(avg) Average CK/CK# high pulse width 0.47 0.53 0.47 0.53 tCK(avg) tCL(avg) Average CK/CK# low pulse width 0.47 0.53 0.47 0.53 tCK(avg) tCK(abs) Absolute Clock Period tCH(abs) Absolute CK/CK# high pulse width 0.43  0.43 tCL(abs) Absolute CK/CK# low pulse width 0.43  tJIT(per) Clock Period Jitter -50 -40 tJIT(per,lck) Clock Period Jitter during DLL locking period tJIT(cc) Min.: tCK(avg)min + tJIT(per)min Max.: tCK(avg)max + tJIT(per)max pS pS 37  tCK(avg) 38 0.43  tCK(avg) 39 50 -60 60 pS 40 -50 50 pS Cycle to Cycle Period Jitter 100 120 pS tJIT(cc,lck) Cycle to Cycle Period Jitter during DLL locking period 80 100 pS tJIT(duty) Clock Duty Cycle Jitter Already included in tCH(abs) and tCL(abs) pS tERR(2per) Cumulative error across 2 cycles -74 74 -88 88 pS tERR(3per) Cumulative error across 3 cycles -87 87 -105 105 pS tERR(4per) Cumulative error across 4 cycles -97 97 -117 117 pS tERR(5per) Cumulative error across 5 cycles -105 105 -126 126 pS tERR(6per) Cumulative error across 6 cycles -111 111 -133 133 pS tERR(7per) Cumulative error across 7 cycles -116 116 -139 139 pS tERR(8per) Cumulative error across 8 cycles -121 121 -145 145 pS tERR(9per) Cumulative error across 9 cycles -125 125 -150 150 pS tERR(10per) Cumulative error across 10 cycles -128 128 -154 154 pS tERR(11per) Cumulative error across 11 cycles -132 132 -158 158 pS tERR(12per) Cumulative error across 12 cycles -134 134 -161 161 pS Min.: tJIT(per)min * (1 + 0.68 * ln(n)) Max.: tJIT(per)max * (1 + 0.68 * ln(n)) pS tERR(nper) Cumulative error across n = 13, 14...49, 50 cycles 45 7 Publication Release Date: Nov. 22, 2017 Revision: A02 - 139 - W632GG6MB AC Timing and Operating Condition for -09/09I/09J/-11/11I/11J speed grades, continued DDR3-2133 (-09/09I/09J) SPEED GRADE SYMBOL DDR3-1866 (-11/11I/11J) UNITS NOTES 85 pS 23 PARAMETER MIN. MAX. MIN. MAX. DQS, DQS# to DQ skew, per group, per access  75  Data Timing tDQSQ tQH DQ output hold time from DQS, DQS# 0.38  0.38  tCK(avg) 18, 23 tLZ(DQ) DQ low impedance time from CK, CK# -360 180 -390 195 pS 17, 23, 24 tHZ(DQ) DQ high impedance time from CK, CK#  180  195 pS 17, 23, 24 tDS(AC135) Data setup time to Base specification @ 2V/nS DQS, DQS# VREF @ 2 V/nS tDH(DC100) Data hold time from DQS, DQS# tDIPW 53 68 pS 11, 40 120.5 135.5 pS 11, 40, 42 Base specification @ 2V/nS 55 70 pS 11, 40 VREF @ 2 V/nS 105 pS 11, 40, 42 pS 10 DQ and DM input pulse width for each input 120 280  320  Data Strobe Timing tRPRE DQS,DQS# differential READ Preamble 0.9 Note 21 0.9 Note 21 tCK(avg) 18, 21, 23 tRPST DQS,DQS# differential READ Postamble 0.3 Note 22 0.3 Note 22 tCK(avg) 18, 22, 23 tQSH DQS,DQS# differential output high time 0.4  0.4  tCK(avg) 18, 23 tQSL DQS,DQS# differential output low time 0.4  0.4  tCK(avg) 18, 23 tWPRE DQS,DQS# differential WRITE Preamble 0.9  0.9  tCK(avg) 46 tWPST DQS,DQS# differential WRITE Postamble 0.3  0.3  tCK(avg) 46 tDQSCK DQS,DQS# rising edge output access time from rising CK, CK# -180 180 -195 195 pS 17, 23 tLZ(DQS) DQS and DQS# low-impedance time from CK, CK# (Referenced from RL - 1) -360 180 -390 195 pS 17, 23, 24 tHZ(DQS) DQS and DQS# high-impedance time from CK, CK# (Referenced from RL + BL/2)  180  195 pS 17, 23, 24 tDQSL DQS,DQS# differential input low pulse width 0.45 0.55 0.45 0.55 tCK(avg) 12, 14 tDQSH DQS,DQS# differential input high pulse width 0.45 0.55 0.45 0.55 tCK(avg) 13, 14 tDQSS DQS,DQS# rising edge to CK,CK# rising edge -0.27 0.27 -0.27 0.27 tCK(avg) 16 tDSS DQS,DQS# falling edge setup time to CK,CK# rising edge 0.18  0.18  tCK(avg) 15, 16 tDSH DQS,DQS# falling edge hold time from CK,CK# rising edge 0.18  0.18  tCK(avg) 15, 16 nS 8 nS 8 nS 8 nS 8 nS 8 Command and Address Timing tAA tRCD Internal read command to first data ACT to internal read or write delay time tRP PRE command period tRC ACT to ACT or REF command period See “Speed Bin” on page 137 tRAS ACT to PRE command period tDLLK DLL locking time tRTP Internal READ Command to PRECHARGE Command delay max(4nCK, 7.5nS) tWTR Delay from start of internal write transaction to internal read command max(4nCK, 7.5nS) 512  See “Speed Bin” on page 136 512  nCK  max(4nCK, 7.5nS)  8  max(4nCK, 7.5nS)  8, 26 Publication Release Date: Nov. 22, 2017 Revision: A02 - 140 - W632GG6MB AC Timing and Operating Condition for -09/09I/09J/-11/11I/11J speed grades, continued SPEED GRADE SYMBOL PARAMETER DDR3-2133 (-09/09I/09J) DDR3-1866 (-11/11I/11J) MIN. MAX. MIN. MAX. 15  15  nS 4 nCK UNITS NOTES Command and Address Timing tWR WRITE recovery time tMRD Mode Register Set command cycle time tMOD Mode Register Set command update delay tCCD CAS# to CAS# command delay  4  max(12nCK, 15nS)  max(12nCK, 15nS)  4  4  tDAL(min) Auto precharge write recovery + precharge time tMPRR WR + roundup(tRP(min)/ tCK(avg)) Multi-Purpose Register Recovery Time tRRD ACTIVE to ACTIVE command period for 2KB page size tFAW Four activate window for 2KB page size 1  1  max(4nCK, 6nS)  max(4nCK, 6nS)  35  35  8, 26 nCK nCK 6 nCK 29 8 nS 8 Command and Address setup time to CK, CK# Base specification 60 65 pS 9, 41 VREF @ 1 V/nS 195 200 pS 9, 41, 42 Command and Address tIS(AC125) setup time to CK, CK# Base specification 135 150 pS 9, 41 VREF @ 1 V/nS 260 275 pS 9, 41, 42 Command and Address hold time from CK, CK# Base specification 95 100 pS 9, 41 VREF @ 1 V/nS 195 200 pS 9, 41, 42 pS 10 tIS(AC135) tIH(DC100) tIPW Control, address and control input pulse width for each input 470  535  Calibration Timing tZQinit Power-up and RESET calibration time max(512nCK, 640nS)  max(512nCK, 640nS)  tZQoper Normal operation Full calibration time max(256nCK, 320nS)  max(256nCK, 320nS)  Normal operation Short calibration time max(64nCK, 80nS)  max(64nCK, 80nS)  max(5nCK, 170nS)  max(5nCK, 170nS)  tZQCS 33 Reset Timing tXPR Exit Reset from CKE HIGH to a valid command Self Refresh Timing tXS Exit Self Refresh to commands not requiring a locked DLL max(5nCK, 170nS)  max(5nCK, 170nS)  tXSDLL Exit Self Refresh to commands requiring a locked DLL tDLLK(min)  tDLLK(min)  tCKESR Minimum CKE low width for Self Refresh entry to exit timing tCKE(min) + 1nCK  tCKE(min) + 1nCK  tCKSRE Valid Clock Requirement after Self Refresh Entry (SRE) max(5 nCK, 10nS)  max(5 nCK, 10nS)  tCKSRX Valid Clock Requirement before Self Refresh Exit (SRX) max(5 nCK, 10nS)  max(5 nCK, 10nS)  34 nCK 35 36 Refresh Timing tRFC tREFI 160  160  nS -40°C ≤ TCASE ≤ 85°C*  7.8  7.8 μS 0°C ≤ TCASE ≤ 85°C  7.8  7.8 μS 85°C < TCASE ≤ 95°C  3.9  3.9 μS 95°C < TCASE ≤ 105°C*  3.9  3.9 μS REF command to ACT or REF command time Average periodic refresh Interval * -40°C ≤ TCASE ≤ 85°C is available for 09I, 09J, 11I and 11J grade parts only. 95°C < TCASE ≤ 105°C is available for 09J and 11J grade parts only. Publication Release Date: Nov. 22, 2017 Revision: A02 - 141 - W632GG6MB AC Timing and Operating Condition for -09/09I/09J/-11/11I/11J speed grades, continued DDR3-2133 (-09/09I/09J) SPEED GRADE SYMBOL PARAMETER DDR3-1866 (-11/11I/11J) UNITS NOTES MIN. MAX. MIN. MAX. Exit Power Down with DLL on to any valid command; Exit Precharge Power Down with DLL frozen to commands not requiring a locked DLL max(3nCK, 6nS)  max(3nCK, 6nS)  34 Exit Precharge Power Down with DLL frozen to commands requiring a locked DLL max(10nCK, 24nS)  max(10nCK, 24nS)  35 CKE minimum pulse width max(3nCK, 5nS)  max(3nCK, 5nS)  Power Down Timing tXP tXPDLL tCKE tCPDED tPD 2  2  tCKE(min) 9 * tREFI tCKE(min) 9 * tREFI 2  1  nCK 27 2  1  nCK 27 RL + 4 + 1  RL + 4 + 1  nCK Command pass disable delay Power Down Entry to Exit Timing tACTPDEN Timing of ACT command to Power Down entry tPRPDEN Timing of PRE or PREA command to Power Down entry tRDPDEN Timing of RD/RDA command to Power Down entry Timing of WR command to Power Down entry tWRPDEN (BL8OTF, BL8MRS, BC4OTF) nCK 25 Min.: WL + 4 + roundup (tWR(min)/ tCK(avg)) Max.:  nCK 20 tWRAPDEN Timing of WRA command to Power Down entry (BL8OTF, BL8MRS, BC4OTF) Min.: WL + 4 + WR + 1 Max.:  nCK 19 tWRPDEN Timing of WR command to Power Down entry (BC4MRS) Min.: WL + 2 + roundup (tWR(min)/ tCK(avg)) Max.:  nCK 20 tWRAPDEN Timing of WRA command to Power Down entry (BC4MRS) Min.: WL + 2 + WR + 1 Max.:  nCK 19 nCK 27, 28 tREFPDEN Timing of REF command to Power Down entry 2  1  tMRSPDEN Timing of MRS command to Power Down entry tMOD(min)  tMOD(min)  ODT Timing ODTH4 ODT high time without write command or with write command and burst chop 4 4  4  nCK 30 ODTH8 ODT high time with Write command and burst length 8 6  6  nCK 31 tAONPD Asynchronous RTT turn-on delay (Power Down with DLL frozen) 2 8.5 2 8.5 nS 32 tAOFPD Asynchronous RTT turn-off delay (Power Down with DLL frozen) 2 8.5 2 8.5 nS 32 tAON RTT turn-on -180 180 -195 195 pS 17, 43 tAOF Rtt_Nom and Rtt_WR turn-off time from ODTLoff reference 0.3 0.7 0.3 0.7 tCK(avg) 17, 44 tADC RTT dynamic change skew 0.3 0.7 0.3 0.7 tCK(avg) 17 First DQS/DQS# rising edge after write leveling mode is programmed 40  40  nCK 5 tWLDQSEN DQS/DQS# delay after write leveling mode is programmed 25  25  nCK 5 tWLS Write leveling setup time from (CK, CK#) zero crossing to rising (DQS, DQS#) zero crossing 125  140  pS tWLH Write leveling hold time from rising (DQS, DQS#) zero crossing to (CK, CK#) zero crossing 125  140  pS tWLO Write leveling output delay 0 7.5 0 7.5 nS tWLOE Write leveling output error 0 2 0 2 nS Write Leveling Timing tWLMRD Publication Release Date: Nov. 22, 2017 Revision: A02 - 142 - W632GG6MB 10.16.2 AC Timing and Operating Condition for -12/12I/12J/-15/15I/15J speed grades SPEED GRADE SYMBOL PARAMETER DDR3-1600 (-12/12I/12J) MIN. DDR3-1333 (-15/15I/15J) MAX. MIN. UNITS NOTES MAX. Common Notes 1, 2, 3, 4 Clock Input Timing tCK(DLL-off) Minimum clock cycle time (DLL-off mode) tCK(avg) Average Clock Period tCH(avg) Average CK/CK# high pulse width tCL(avg) Average CK/CK# low pulse width See “Speed Bin” on page 134 nS 0.53 0.47 0.53 tCK(avg) 0.47 0.53 0.47 0.53 tCK(avg) Min.: tCK(avg)min + tJIT(per)min Max.: tCK(avg)max + tJIT(per)max tCH(abs) Absolute CK/CK# high pulse width 0.43 tCL(abs) Absolute CK/CK# low pulse width tJIT(per) Clock Period Jitter pS 37  tCK(avg) 38 39  0.43 0.43  0.43  tCK(avg) -70 70 -80 80 pS -60 60 -70 70 pS Cycle to Cycle Period Jitter 140 160 pS tJIT(cc,lck) Cycle to Cycle Period Jitter during DLL locking period 120 140 pS tJIT(duty) Clock Duty Cycle Jitter Already included in tCH(abs) and tCL(abs) pS tERR(2per) Cumulative error across 2 cycles -103 103 -118 118 pS tERR(3per) Cumulative error across 3 cycles -122 122 -140 140 pS tERR(4per) Cumulative error across 4 cycles -136 136 -155 155 pS tERR(5per) Cumulative error across 5 cycles -147 147 -168 168 pS tERR(6per) Cumulative error across 6 cycles -155 155 -177 177 pS tERR(7per) Cumulative error across 7 cycles -163 163 -186 186 pS tERR(8per) Cumulative error across 8 cycles -169 169 -193 193 pS tERR(9per) Cumulative error across 9 cycles -175 175 -200 200 pS tERR(10per) Cumulative error across 10 cycles -180 180 -205 205 pS tERR(11per) Cumulative error across 11 cycles -184 184 -210 210 pS tERR(12per) Cumulative error across 12 cycles -188 188 -215 215 pS tERR(nper) Cumulative error across n = 13, 14...49, 50 cycles Min.: tJIT(per)min * (1 + 0.68 * ln(n)) Max.: tJIT(per)max * (1 + 0.68 * ln(n)) 45 pS 0.47 Absolute Clock Period tJIT(cc)  8 See “Speed Bin” on page 135 tCK(abs) tJIT(per,lck) Clock Period Jitter during DLL locking period  8 pS 7 Publication Release Date: Nov. 22, 2017 Revision: A02 - 143 - W632GG6MB AC Timing and Operating Condition for -12/12I/12J/-15/15I/15J speed grades, continued DDR3-1600 (-12/12I/12J) SPEED GRADE SYMBOL DDR3-1333 (-15/15I/15J) UNITS NOTES 125 pS 23 PARAMETER MIN. MAX. MIN. MAX. DQS, DQS# to DQ skew, per group, per access  100  Data Timing tDQSQ tQH DQ output hold time from DQS, DQS# 0.38  0.38  tCK(avg) 18, 23 tLZ(DQ) DQ low impedance time from CK, CK# -450 225 -500 250 pS 17, 23, 24 tHZ(DQ) DQ high impedance time from CK, CK#  225  250 pS 17, 23, 24 tDS(AC150) Data setup time to DQS, DQS# Base specification 10 30 pS 11, 40 VREF @ 1 V/nS 160 180 pS 11, 40, 42 tDH(DC100) Data hold time from DQS, DQS# Base specification 45 65 pS 11, 40 VREF @ 1 V/nS 145 165 pS 11, 40, 42 pS 10 tDIPW DQ and DM input pulse width for each input 360  400  Data Strobe Timing tRPRE DQS,DQS# differential READ Preamble 0.9 Note 21 0.9 Note 21 tCK(avg) 18, 21, 23 tRPST DQS,DQS# differential READ Postamble 0.3 Note 22 0.3 Note 22 tCK(avg) 18, 22, 23 tQSH DQS,DQS# differential output high time 0.4  0.4  tCK(avg) 18, 23 tQSL DQS,DQS# differential output low time 0.4  0.4  tCK(avg) 18, 23 tWPRE DQS,DQS# differential WRITE Preamble 0.9  0.9  tCK(avg) 46 tWPST DQS,DQS# differential WRITE Postamble 0.3  0.3  tCK(avg) 46 tDQSCK DQS,DQS# rising edge output access time from rising CK, CK# -225 225 -255 255 pS 17, 23 tLZ(DQS) DQS and DQS# low-impedance time from CK, CK# (Referenced from RL - 1) -450 225 -500 250 pS 17, 23, 24 tHZ(DQS) DQS and DQS# high-impedance time from CK, CK# (Referenced from RL + BL/2)  225  250 pS 17, 23, 24 tDQSL DQS,DQS# differential input low pulse width 0.45 0.55 0.45 0.55 tCK(avg) 12, 14 tDQSH DQS,DQS# differential input high pulse width 0.45 0.55 0.45 0.55 tCK(avg) 13, 14 tDQSS DQS,DQS# rising edge to CK,CK# rising edge -0.27 0.27 -0.25 0.25 tCK(avg) 16 tDSS DQS,DQS# falling edge setup time to CK,CK# rising edge 0.18  0.2  tCK(avg) 15, 16 tDSH DQS,DQS# falling edge hold time from CK,CK# rising edge 0.18  0.2  tCK(avg) 15, 16 nS 8 nS 8 nS 8 Command and Address Timing tAA tRCD Internal read command to first data ACT to internal read or write delay time tRP PRE command period See “Speed Bin” on page 135 See “Speed Bin” on page 134 tRC ACT to ACT or REF command period nS 8 tRAS ACT to PRE command period nS 8 tDLLK DLL locking time tRTP Internal READ Command to PRECHARGE Command delay max(4nCK, 7.5nS) tWTR Delay from start of internal write transaction to internal read command max(4nCK, 7.5nS) 512  512  nCK  max(4nCK, 7.5nS)  8  max(4nCK, 7.5nS)  8, 26 Publication Release Date: Nov. 22, 2017 Revision: A02 - 144 - W632GG6MB AC Timing and Operating Condition for -12/12I/12J/-15/15I/15J speed grades, continued SPEED GRADE SYMBOL PARAMETER DDR3-1600 (-12/12I/12J) MIN. DDR3-1333 (-15/15I/15J) MAX. MIN. UNITS NOTES MAX. Command and Address Timing tWR WRITE recovery time 15  15  nS tMRD Mode Register Set command cycle time 4  4  nCK tMOD Mode Register Set command update delay max(12nCK, 15nS)  max(12nCK, 15nS)  tCCD CAS# to CAS# command delay 4  4  Auto precharge write recovery + precharge tDAL(min) time tMPRR Multi-Purpose Register Recovery Time tRRD ACTIVE to ACTIVE command period for 2KB page size tFAW Four activate window for 2KB page size Command and Address tIS(AC175) setup time to CK, CK# Command and Address tIS(AC150) setup time to CK, CK# tIH(DC100) tIPW Command and Address hold time from CK, CK# WR + roundup(tRP(min)/ tCK(avg)) 1  1  max(4nCK, 7.5nS)  max(4nCK, 7.5nS)  40  45  8, 26 nCK nCK 6 nCK 29 8 nS 8 Base specification 45 65 pS 9, 41 VREF @ 1 V/nS Base specification 220 170 240 190 pS pS 9, 41, 42 9, 41 VREF @ 1 V/nS 320 340 pS 9, 41, 42 Base specification 120 140 pS 9, 41 VREF @ 1 V/nS 220 240 pS 9, 41, 42 pS 10 Control, address and control input pulse width for each input 560  620  Calibration Timing tZQinit Power-up and RESET calibration time max(512nCK, 640nS)  max(512nCK, 640nS)  tZQoper Normal operation Full calibration time max(256nCK, 320nS)  max(256nCK, 320nS)  Normal operation Short calibration time max(64nCK, 80nS)  max(64nCK, 80nS)  max(5nCK, 170nS)  max(5nCK, 170nS)  Exit Self Refresh to commands not requiring a locked DLL max(5nCK, 170nS)  max(5nCK, 170nS)  Exit Self Refresh to commands requiring a locked DLL tDLLK(min)  tDLLK(min)  Minimum CKE low width for Self Refresh entry to exit timing Valid Clock Requirement after Self Refresh Entry (SRE) tCKE(min) + 1nCK max(5 nCK, 10nS)  tCKE(min) + 1nCK max(5 nCK, 10nS)  Valid Clock Requirement before Self Refresh Exit (SRX) max(5 nCK, 10nS)  max(5 nCK, 10nS)  tZQCS 33 Reset Timing tXPR Exit Reset from CKE HIGH to a valid command Self Refresh Timing tXS tXSDLL tCKESR tCKSRE tCKSRX  34 nCK 35 36  Refresh Timing tRFC tREFI 160  160  nS -40°C ≤ TCASE ≤ 85°C*  7.8  7.8 μS 0°C ≤ TCASE ≤ 85°C  7.8  7.8 μS 85°C < TCASE ≤ 95°C  3.9  3.9 μS 95°C < TCASE ≤ 105°C*  3.9  3.9 μS REF command to ACT or REF command time Average periodic refresh Interval * -40°C ≤ TCASE ≤ 85°C is available for 12I, 12J, 15I and 15J grade parts only. 95°C < TCASE ≤ 105°C is available for 12J and 15J grade parts only. Publication Release Date: Nov. 22, 2017 Revision: A02 - 145 - W632GG6MB AC Timing and Operating Condition for -12/12I/12J/-15/15I/15J speed grades, continued DDR3-1600 (-12/12I/12J) SPEED GRADE SYMBOL PARAMETER DDR3-1333 (-15/15I/15J) UNITS NOTES MIN. MAX. MIN. MAX. Exit Power Down with DLL on to any valid command; Exit Precharge Power Down with DLL frozen to commands not requiring a locked DLL max(3nCK, 6nS)  max(3nCK, 6nS)  34 Exit Precharge Power Down with DLL frozen to commands requiring a locked DLL max(10nCK, 24nS)  max(10nCK, 24nS)  35 CKE minimum pulse width max(3nCK, 5nS)  max(3nCK, 5.625nS)  1  1  tCKE(min) 9 * tREFI tCKE(min) 9 * tREFI 1  1  nCK 27 1  1  nCK 27 RL + 4 + 1  RL + 4 + 1  nCK Power Down Timing tXP tXPDLL tCKE tCPDED tPD Command pass disable delay Power Down Entry to Exit Timing tACTPDEN Timing of ACT command to Power Down entry tPRPDEN Timing of PRE or PREA command to Power Down entry tRDPDEN Timing of RD/RDA command to Power Down entry Timing of WR command to Power Down entry tWRPDEN (BL8OTF, BL8MRS, BC4OTF) nCK 25 Min.: WL + 4 + roundup (tWR(min)/ tCK(avg)) Max.:  nCK 20 tWRAPDEN Timing of WRA command to Power Down entry (BL8OTF, BL8MRS, BC4OTF) Min.: WL + 4 + WR + 1 Max.:  nCK 19 tWRPDEN Timing of WR command to Power Down entry (BC4MRS) Min.: WL + 2 + roundup (tWR(min)/ tCK(avg)) Max.:  nCK 20 tWRAPDEN Timing of WRA command to Power Down entry (BC4MRS) Min.: WL + 2 + WR + 1 Max.:  nCK 19 nCK 27, 28 tREFPDEN Timing of REF command to Power Down entry 1  1  tMRSPDEN Timing of MRS command to Power Down entry tMOD(min)  tMOD(min)  ODT Timing ODTH4 ODT high time without write command or with write command and burst chop 4 4  4  nCK 30 ODTH8 ODT high time with Write command and burst length 8 6  6  nCK 31 tAONPD Asynchronous RTT turn-on delay (Power Down with DLL frozen) 2 8.5 2 8.5 nS 32 tAOFPD Asynchronous RTT turn-off delay (Power Down with DLL frozen) 2 8.5 2 8.5 nS 32 tAON RTT turn-on -225 225 -250 250 pS 17, 43 tAOF Rtt_Nom and Rtt_WR turn-off time from ODTLoff reference 0.3 0.7 0.3 0.7 tCK(avg) 17, 44 tADC RTT dynamic change skew 0.3 0.7 0.3 0.7 tCK(avg) 17 First DQS/DQS# rising edge after write leveling mode is programmed 40  40  nCK 5 tWLDQSEN DQS/DQS# delay after write leveling mode is programmed 25  25  nCK 5 tWLS Write leveling setup time from (CK, CK#) zero crossing to rising (DQS, DQS#) zero crossing 165  195  pS tWLH Write leveling hold time from rising (DQS, DQS#) zero crossing to (CK, CK#) zero crossing 165  195  pS tWLO Write leveling output delay 0 7.5 0 9 nS tWLOE Write leveling output error 0 2 0 2 nS Write Leveling Timing tWLMRD Publication Release Date: Nov. 22, 2017 Revision: A02 - 146 - W632GG6MB 10.16.3 Timing Parameter Notes 1. Unit ‘tCK(avg)’ represents the actual tCK(avg) of the input clock under operation. Unit ‘nCK’ represents one clock cycle of the input clock, counting the actual clock edges. For example, tMRD = 4 [nCK] means; if one Mode Register Set command is registered at Tm, another Mode Register Set command may be registered at Tm+4, even if (Tm+4 - Tm) is 4 x tCK(avg) + tERR(4per),min (which is smaller than 4 x tCK(avg)). 2. Timing that is not specified is illegal and after such an event, in order to provide proper operation, the DRAM must be resetted or powered down and then restarted through the specified initialization sequence before normal operation can continue. 3. The CK/CK# input reference level (for timing reference to CK / CK#) is the point at which CK and CK# cross. The DQS/DQS# input reference level is the point at which DQS and DQS# cross; The input reference level for signals other than CK/CK#, DQS/DQS# and RESET# is V REFCA and VREFDQ respectively. 4. Inputs are not recognized as valid until VREFCA stabilizes within specified limits. 5. The max values are system dependent. 6. tCK(avg) refers to the actual application clock period. WR refers to the WR parameter stored in mode register MR0. 7. n = from 13 cycles to 50 cycles. This row defines 38 parameters. 8. For these parameters, the DDR3 SDRAM device supports tnPARAM [nCK] = RU{ tPARAM [nS] / tCK(avg) [nS] }, which is in clock cycles, assuming all input clock jitter specifications are satisfied. For example, the device will support tnRP = RU{tRP / tCK(avg)}, which is in clock cycles, if all input clock jitter specifications are met. This means: For DDR3-1333 (9-9-9), of which tRP = 13.5nS, the device will support tnRP = RU{tRP / tCK(avg)} = 9, as long as the input clock jitter specifications are met, i.e. Precharge command at Tm and Active command at Tm+9 is valid even if (Tm+9 - Tm) is less than 13.5nS due to input clock jitter. 9. These parameters are measured from a command/address signal (CKE, CS#, RAS#, CAS#, WE#, ODT, BA0, A0, A1, etc.) transition edge to its respective clock signal (CK/CK#) crossing. The spec values are not affected by the amount of clock jitter applied (i.e. tJIT(per), tJIT(cc), etc.), as the setup and hold are relative to the clock signal crossing that latches the command/address. That is, these parameters should be met whether clock jitter is present or not. 10. Pulse width of a input signal is defined as the width between the first crossing of VREF(DC) and the consecutive crossing of VREF(DC). 11. These parameters are measured from a data signal (DM(L/U), DQ(L/U)0, DQ(L/U)1, etc.) transition edge to its respective data strobe signal (DQS(L/U), DQS(L/U)#) crossing. 12. tDQSL describes the instantaneous differential input low pulse width on DQS - DQS#, as measured from one falling edge to the next consecutive rising edge. 13. tDQSH describes the instantaneous differential input high pulse width on DQS - DQS#, as measured from one rising edge to the next consecutive falling edge. 14. tDQSH,act + tDQSL,act = 1 tCK,act ; with tXYZ,act being the actual measured value of the respective timing parameter in the application. 15. tDSH,act + tDSS,act = 1 tCK,act ; with tXYZ,act being the actual measured value of the respective timing parameter in the application. 16. These parameters are measured from a data strobe signal (DQS(L/U), DQS(L/U)#) crossing to its respective clock signal (CK, CK#) crossing. The spec values are not affected by the amount of clock jitter applied (i.e. tJIT(per), tJIT(cc), etc.), as these are relative to the clock signal crossing. That is, these parameters should be met whether clock jitter is present or not. Publication Release Date: Nov. 22, 2017 Revision: A02 - 147 - W632GG6MB 17. When the device is operated with input clock jitter, this parameter needs to be derated by the actual tERR(mper),act of the input clock, where 2 ≤ m ≤ 12. (output deratings are relative to the actual SDRAM input clock.) For example, if the measured jitter into a DDR3-1333 SDRAM has tERR(mper),act,min = - 138 pS and tERR(mper),act,max = + 155 pS, then tDQSCK,min(derated) = tDQSCK,min - tERR(mper),act,max = - 255 pS - 155 pS = - 410 pS and tDQSCK,max(derated) = tDQSCK,max - tERR(mper),act,min = 255 pS + 138 pS = + 393 pS. Similarly, tLZ(DQ) for DDR3-1333 derates to tLZ(DQ),min(derated) = - 500 pS - 155 pS = - 655 pS and tLZ(DQ),max(derated) = 250 pS + 138 pS = + 388 pS. (Caution on the min/max usage!) Note that tERR(mper),act,min is the minimum measured value of tERR(nper) where 2 ≤ n ≤ 12, and tERR(mper),act,max is the maximum measured value of tERR(nper) where 2 ≤ n ≤ 12. 18. When the device is operated with input clock jitter, this parameter needs to be derated by the actual tJIT(per),act of the input clock. (output deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR3-1333 SDRAM has tCK(avg),act = 1500 pS, tJIT(per),act,min = - 58 pS and tJIT(per),act,max = + 74 pS, then tRPRE,min(derated) = tRPRE,min + tJIT(per),act,min = 0.9 x tCK(avg),act + tJIT(per),act,min = 0.9 x 1500 pS - 58 pS = + 1292 pS. Similarly, tQH,min(derated) = tQH,min + tJIT(per),act,min = 0.38 x tCK(avg),act + tJIT(per),act,min = 0.38 x 1500 pS - 58 pS = + 512 pS. (Caution on the min/max usage!). 19. WR in clock cycles as programmed in mode register MR0. 20. tWR(min) is defined in nS, for calculation of tWRPDEN it is necessary to round up tWR(min)/tCK(avg) to the next integer value. 21. The maximum read preamble is bound by tLZ(DQS)min on the left side and tDQSCK(max) on the right side. See Figure 24 - “READ Timing; Clock to Data Strobe relationship” on page 45. 22. The maximum read postamble is bound by tDQSCK(min) plus tQSH(min) on the left side and tHZ(DQS)max on the right side. See Figure 24 - “READ Timing; Clock to Data Strobe relationship” on page 45. 23. Value is only valid for RON34. 24. Single ended signal parameter. 25. tREFI depends on TOPER. 26. Start of internal write transaction is defined as follows: For BL8 (fixed by MRS and on- the-fly): Rising clock edge 4 clock cycles after WL. For BC4 (on- the- fly): Rising clock edge 4 clock cycles after WL. For BC4 (fixed by MRS): Rising clock edge 2 clock cycles after WL. 27. CKE is allowed to be registered low while operations such as row activation, precharge, auto-precharge or refresh are in progress, but power down IDD spec will not be applied until finishing those operations. 28. Although CKE is allowed to be registered LOW after a REFRESH command once tREFPDEN(min) is satisfied, there are cases where additional time such as tXPDLL(min) is also required. See section 8.17.3 “Power-Down clarifications - Case 2” on page 75. 29. Defined between end of MPR read burst and MRS which reloads MPR or disables MPR function. 30. ODTH4 is measured from ODT first registered high (without a Write command) to ODT first registered low, or from ODT registered high together with a Write command with burst length 4 to ODT registered low. 31. ODTH8 is measured from ODT registered high together with a Write command with burst length 8 to ODT registered low. 32. This parameter applies upon entry and during precharge power down mode with DLL frozen. Publication Release Date: Nov. 22, 2017 Revision: A02 - 148 - W632GG6MB 33. One ZQCS command can effectively correct a minimum of 0.5 % (ZQ Correction) of RON and R TT impedance error within 64 nCK for all speed bins assuming the maximum sensitivities specified in the ‘Output Driver Voltage and Temperature Sensitivity’ and ‘ODT Voltage and Temperature Sensitivity’ tables. The appropriate interval between ZQCS commands can be determined from these tables and other application-specific parameters. One method for calculating the interval between ZQCS commands, given the temperature (Tdriftrate) and voltage (Vdriftrate) drift rates that the SDRAM is subject to in the application, is illustrated. The interval could be defined by the following formula: ZQCorrection (TSens × Tdriftrate) + (VSens × Vdriftrate) where TSens = max(dRTTdT, dRONdTM) and VSens = max(dRTTdV, dRONdVM) define the SDRAM temperature and voltage sensitivities. For example, if TSens = 1.5% / C, VSens = 0.15% / mV, Tdriftrate = 1 C / sec and Vdriftrate = 15 mV/sec, then the interval between ZQCS commands is calculated as: 0.5 = 0.133 ≈ 128mS (1.5 × 1) + (0.15 × 15) 34. Commands not requiring a locked DLL are all commands except Read, Read with Auto-Precharge and Synchronous ODT. 35. Commands requiring a locked DLL are Read, Read with Auto-Precharge and Synchronous ODT. 36. A maximum of one regular plus eight posted refresh commands can be issued to any given DDR3 SDRAM device meaning that the maximum absolute interval between any refresh command and the next refresh command is 9 ×tREFI. 37. Parameter tCK(avg) is specified per its average value. However, it is understood that the relationship between the average timing tCK(avg) and the respective absolute instantaneous timing tCK(abs) holds all times. 38. tCH(abs) is the absolute instantaneous clock high pulse width, as measured from one rising edge to the following falling edge. 39. tCL(abs) is the absolute instantaneous clock low pulse width, as measured from one falling edge to the following rising edge. 40. tDS(base) and tDH(base) values are for a single-ended 1V/nS slew rate DQs (DQs are at 2V/nS for DDR3-1866 and DDR3-2133) and 2V/nS DQS, DQS# differential slew rate. Note for DQ and DM signals, VREF(DC) = VREFDQ(DC). For input only pins except RESET#, VREF(DC) = VREFCA(DC). See section 10.16.5 “Data Setup, Hold and Slew Rate Derating” on page 157. 41. tIS(base) and tIH(base) values are for 1V/nS CMD/ADD single-ended slew rate and 2V/nS CK, CK# differential slew rate. Note for DQ and DM signals, VREF(DC) = VREFDQ(DC). For input only pins except RESET#, VREF(DC) = VREFCA(DC). See section 10.16.4 “Address / Command Setup, Hold and Derating” on page 150. 42. The setup and hold times are listed converting the base specification values (to which derating tables apply) to VREF when the slew rate is 1 V/nS (DQs are at 2V/nS for DDR3-1866 and DDR3-2133). These values, with a slew rate of 1 V/nS (DQs are at 2V/nS for DDR3-1866 and DDR3-2133), are for reference only. 43. For definition of RTT turn-on time tAON See 8.19.2.2 “Timing Parameters” on page 80. 44. For definition of RTT turn-off time tAOF See 8.19.2.2 “Timing Parameters” on page 80. 45. There is no maximum cycle time limit besides the need to satisfy the refresh interval, tREFI. 46. Actual value dependent upon measurement level definitions See Figure 41 - “Method for calculating tWPRE transitions and endpoints” on page 58 and See Figure 42 - “Method for calculating tWPST transitions and endpoints” on page 58. Publication Release Date: Nov. 22, 2017 Revision: A02 - 149 - W632GG6MB 10.16.4 Address / Command Setup, Hold and Derating For all input signals the total tIS (setup time) and tIH (hold time) required is calculated by adding the datasheet tIS(base) and tIH(base) value (see Table 48) to the ΔtIS and ΔtIH derating value (see Table 49 to Table 52) respectively. Example: tIS (total setup time) = tIS(base) + ΔtIS Setup (tIS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VREF(DC) and the first crossing of VIH(AC)min. Setup (tIS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VREF(DC) and the first crossing of VIL(AC)max. If the actual signal is always earlier than the nominal slew rate line between shaded ‘V REF(DC) to AC region’, use nominal slew rate for derating value (see Figure 107). If the actual signal is later than the nominal slew rate line anywhere between shaded ‘VREF(DC) to AC region’, the slew rate of a tangent line to the actual signal from the AC level to VREF(DC) level is used for derating value (see Figure 109). Hold (tIH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VIL(DC)max and the first crossing of V REF(DC). Hold (tIH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VIH(DC)min and the first crossing of VREF(DC). If the actual signal is always later than the nominal slew rate line between shaded ‘DC to V REF(DC) region’, use nominal slew rate for derating value (see Figure 108). If the actual signal is earlier than the nominal slew rate line anywhere between shaded ‘DC to VREF(DC) region’, the slew rate of a tangent line to the actual signal from the DC level to VREF(DC) level is used for derating value (see Figure 110). For a valid transition the input signal has to remain above/below VIH/IL(AC) for some time tVAC (see Table 53). Although for slow slew rates the total setup time might be negative (i.e. a valid input signal will not have reached VIH/IL(AC) at the time of the rising clock transition, a valid input signal is still required to complete the transition and reach VIH/IL(AC). For slew rates in between the values listed in the tables, the derating values may obtained by linear interpolation. These values are typically not subject to production test. They are verified by design and characterization. Table 48 – ADD/CMD Setup and Hold Base-Values for 1V/nS Symbol Reference tIS(base) AC175 VIH/L(AC) tIS(base) AC150 VIH/L(AC) tIS(base) AC135 VIH/L(AC) tIS(base) AC125 tIH(base) DC100 DDR3-1333 DDR3-1600 DDR3-1866 DDR3-2133 Unit 65 45 - - pS 190 170 - - pS - - 65 60 pS VIH/L(AC) - - 150 135 pS VIH/L(DC) 140 120 100 95 pS Notes: 1. (AC/DC referenced for 1V/nS Address/Command slew rate and 2 V/nS differential CK-CK# slew rate) 2. The tIS(base) AC150 specifications are adjusted from the tIS(base) AC175 specification by adding an additional 100pS for DDR3-1333/1600 of derating to accommodate for the lower alternate threshold of 150 mV and another 25 pS to account for the earlier reference point [(175 mV - 150 mV) / 1 V/nS]. 3. The tIS(base) AC125 specifications are adjusted from the tIS(base) AC135 specification by adding an additional 75pS for DDR31866 or 65pS for DDR3-2133 of derating to accommodate for the lower alternate threshold of 125 mV and another 10 pS to account for the earlier reference point [(135 mV - 125 mV) / 1 V/nS]. Publication Release Date: Nov. 22, 2017 Revision: A02 - 150 - W632GG6MB Table 49 – Derating values DDR3-1333/1600 tIS/tIH - AC/DC based AC175 Threshold CMD/ ADD Slew rate (V/nS) ΔtIS, ΔtIH derating in [pS] AC/DC based AC175 Threshold -> VIH(AC)=VREF(DC)+175mV, VIL(AC)=VREF(DC)-175mV CK, CK# Differential Slew Rate 4.0 V/nS 3.0 V/nS 2.0 V/nS 1.8 V/nS 1.6 V/nS 1.4 V/nS 1.2 V/nS 1.0 V/nS ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH 2.0 88 50 88 50 88 50 96 58 104 66 112 74 120 84 128 100 1.5 59 34 59 34 59 34 67 42 75 50 83 58 91 68 99 84 1.0 0 0 0 0 0 0 8 8 16 16 24 24 32 34 40 50 0.9 -2 -4 -2 -4 -2 -4 6 4 14 12 22 20 30 30 38 46 0.8 -6 -10 -6 -10 -6 -10 2 -2 10 6 18 14 26 24 34 40 0.7 -11 -16 -11 -16 -11 -16 -3 -8 5 0 13 8 21 18 29 34 0.6 -17 -26 -17 -26 -17 -26 -9 -18 -1 -10 7 -2 15 8 23 24 0.5 -35 -40 -35 -40 -35 -40 -27 -32 -19 -24 -11 -16 -2 -6 5 10 0.4 -62 -60 -62 -60 -62 -60 -54 -52 -46 -44 -38 -36 -30 -26 -22 -10 Table 50 – Derating values DDR3-1333/1600 tIS/tIH - AC/DC based - Alternate AC150 Threshold CMD/ ADD Slew rate (V/nS) ΔtIS, ΔtIH derating in [pS] AC/DC based Alternate AC150 Threshold -> VIH(AC)=VREF(DC)+150mV, VIL(AC)=VREF(DC)-150mV CK, CK# Differential Slew Rate 4.0 V/nS 3.0 V/nS 2.0 V/nS 1.8 V/nS 1.6 V/nS 1.4 V/nS 1.2 V/nS 1.0 V/nS ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH 2.0 75 50 75 50 75 50 83 58 91 66 99 74 107 84 115 100 1.5 50 34 50 34 50 34 58 42 66 50 74 58 82 68 90 84 1.0 0 0 0 0 0 0 8 8 16 16 24 24 32 34 40 50 0.9 0 -4 0 -4 0 -4 8 4 16 12 24 20 32 30 40 46 0.8 0 -10 0 -10 0 -10 8 -2 16 6 24 14 32 24 40 40 0.7 0 -16 0 -16 0 -16 8 -8 16 0 24 8 32 18 40 34 0.6 -1 -26 -1 -26 -1 -26 7 -18 15 -10 23 -2 31 8 39 24 0.5 -10 -40 -10 -40 -10 -40 -2 -32 6 -24 14 -16 22 -6 30 10 0.4 -25 -60 -25 -60 -25 -60 -17 -52 -9 -44 -1 -36 7 -26 15 -10 Publication Release Date: Nov. 22, 2017 Revision: A02 - 151 - W632GG6MB Table 51 – Derating values DDR3-1866/2133 tIS/tIH - AC/DC based Alternate AC135 Threshold CMD/ ADD Slew rate (V/nS) ΔtIS, ΔtIH derating in [pS] AC/DC based Alternate AC135 Threshold -> VIH(AC)=VREF(DC)+135mV, VIL(AC)=VREF(DC)-135mV CK, CK# Differential Slew Rate 4.0 V/nS 3.0 V/nS 2.0 V/nS 1.8 V/nS 1.6 V/nS 1.4 V/nS 1.2 V/nS 1.0 V/nS ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH 2.0 68 50 68 50 68 50 76 58 84 66 92 74 100 84 108 100 1.5 45 34 45 34 45 34 53 42 61 50 69 58 77 68 85 84 1.0 0 0 0 0 0 0 8 8 16 16 24 24 32 34 40 50 0.9 2 -4 2 -4 2 -4 10 4 18 12 26 20 34 30 42 46 0.8 3 -10 3 -10 3 -10 11 -2 19 6 27 14 35 24 43 40 0.7 6 -16 6 -16 6 -16 14 -8 22 0 30 8 38 18 46 34 0.6 9 -26 9 -26 9 -26 17 -18 25 -10 33 -2 41 8 49 24 0.5 5 -40 5 -40 5 -40 13 -32 21 -24 29 -16 37 -6 45 10 0.4 -3 -60 -3 -60 -3 -60 6 -52 14 -44 22 -36 30 -26 38 -10 Table 52 – Derating values DDR3-1866/2133 tIS/tIH - AC/DC based Alternate AC125 Threshold CMD/ ADD Slew rate (V/nS) ΔtIS, ΔtIH derating in [pS] AC/DC based Alternate AC125 Threshold -> VIH(AC)=VREF(DC)+125mV, VIL(AC)=VREF(DC)-125mV CK, CK# Differential Slew Rate 4.0 V/nS 3.0 V/nS 2.0 V/nS 1.8 V/nS 1.6 V/nS 1.4 V/nS 1.2 V/nS 1.0 V/nS ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH ΔtIS ΔtIH 2.0 63 50 63 50 63 50 71 58 79 66 87 74 95 84 103 100 1.5 42 34 42 34 42 34 50 42 58 50 66 58 74 68 82 84 1.0 0 0 0 0 0 0 8 8 16 16 24 24 32 34 40 50 0.9 4 -4 4 -4 4 -4 12 4 20 12 28 20 36 30 44 46 0.8 6 -10 6 -10 6 -10 14 -2 22 6 30 14 38 24 46 40 0.7 11 -16 11 -16 11 -16 19 -8 27 0 35 8 43 18 51 34 0.6 16 -26 16 -26 16 -26 24 -18 32 -10 40 -2 48 8 56 24 0.5 15 -40 15 -40 15 -40 23 -32 31 -24 39 -16 47 -6 55 10 0.4 13 -60 13 -60 13 -60 21 -52 29 -44 37 -36 45 -26 53 -10 Table 53 – Required time tVAC above VIH(AC) {below VIL(AC)} for valid ADD/CMD transition DDR3-1333/1600 Slew Rate [V/nS] tVAC @ 175mV [pS] DDR3-1866/2133 tVAC @ 150mV [pS] tVAC @ 135mV [pS] tVAC @ 125mV [pS] Min. Max. Min. Max. Min. Max. Min. Max. > 2.0 75 - 175 - 168 - 173 - 2.0 57 - 170 - 168 - 173 - 1.5 50 - 167 - 145 - 152 - 1.0 38 - 130 - 100 - 110 - 0.9 34 - 113 - 85 - 96 - 0.8 29 - 93 - 66 - 79 - 0.7 22 - 66 - 42 - 56 - 0.6 Note - 30 - 10 - 27 - 0.5 Note - Note - Note - Note - < 0.5 Note - Note Note - Note - Note: Rising input signal shall become equal to or greater than VIH(AC) level and Falling input signal shall become equal to or less than VIL(AC) level. Publication Release Date: Nov. 22, 2017 Revision: A02 - 152 - W632GG6MB Note: Clock and Strobe are drawn on a different time scale. tIS tIH tIS tIH tDS tDH tDS tDH CK CK# DQS# DQS VDDQ tVAC VIH(AC)min VREF to AC region VIH(DC)min nominal slew rate VREF(DC) nominal slew rate VIL(DC)max VREF to AC region VIL(AC)max tVAC VSS ΔTF ΔTR Setup Slew Rate VREF(DC) – VIL(AC)max Falling Signal = ΔTF VIH(AC)min - VREF(DC) Setup Slew Rate = Rising Signal ΔTR Figure 107 – Illustration of nominal slew rate and tVAC for setup time tDS (for DQ with respect to strobe) and tIS (for ADD/CMD with respect to clock) Publication Release Date: Nov. 22, 2017 Revision: A02 - 153 - W632GG6MB Note: Clock and Strobe are drawn on a different time scale. tIS tIH tIS tIH tDS tDH tDS tDH CK CK# DQS# DQS VDDQ VIH(AC)min VIH(DC)min DC to VREF region nominal slew rate VREF(DC) nominal slew rate DC to VREF region VIL(DC)max VIL(AC)max VSS ΔTR ΔTF VIH(DC)min - VREF(DC) Hold Slew Rate = Falling Signal ΔTF VREF(DC) – VIL(DC)max Hold Slew Rate Rising Signal = ΔTR Figure 108 – Illustration of nominal slew rate for hold time tDH (for DQ with respect to strobe) and tIH (for ADD/CMD with respect to clock) Publication Release Date: Nov. 22, 2017 Revision: A02 - 154 - W632GG6MB Note: Clock and Strobe are drawn on a different time scale. tIS tIH tIS tIH tDS tDH tDS tDH CK CK# DQS# DQS VDDQ tVAC nominal line VIH(AC)min VREF to AC region VIH(DC)min tangent line VREF(DC) tangent line VIL(DC)max VREF to AC region VIL(AC)max nominal line tVAC ΔTR VSS ΔTF Setup Slew Rate = Rising Signal Setup Slew Rate Falling Signal = tangent line [VIH(AC)min - VREF(DC)] ΔTR tangent line [VREF(DC) - VIL(AC)max] ΔTF Figure 109 – Illustration of tangent line for setup time tDS (for DQ with respect to strobe) and tIS (for ADD/CMD with respect to clock) Publication Release Date: Nov. 22, 2017 Revision: A02 - 155 - W632GG6MB Note: Clock and Strobe are drawn on a different time scale. tIS tIH tIS tIH tDS tDH tDS tDH CK CK# DQS# DQS VDDQ VIH(AC)min nominal line VIH(DC)min DC to VREF region tangent line VREF(DC) DC to VREF region tangent line nominal line VIL(DC)max VIL(AC)max VSS ΔTR tangent line [V REF(DC) V IL(DC) max] Hold Slew Rate = Rising Signal ΔTR ΔTF Hold Slew Rate tangent line [VIH(DC)min - VREF(DC)] Falling Signal = ΔTF Figure 110 – Illustration of tangent line for hold time tDH (for DQ with respect to strobe) and tIH (for ADD/CMD with respect to clock) Publication Release Date: Nov. 22, 2017 Revision: A02 - 156 - W632GG6MB 10.16.5 Data Setup, Hold and Slew Rate Derating For all input signals the total tDS (setup time) and tDH (hold time) required is calculated by adding the data sheet tDS(base) and tDH(base) value (see Table 54) to the ΔtDS and ΔtDH (see Table 55 and Table 56) derating value respectively. Example: tDS (total setup time) = tDS(base) + ΔtDS. Setup (tDS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VREF(DC) and the first crossing of VIH(AC)min. Setup (tDS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VREF(DC) and the first crossing of VIL(AC)max (see Figure 107). If the actual signal is always earlier than the nominal slew rate line between shaded ‘VREF(DC) to AC region’, use nominal slew rate for derating value. If the actual signal is later than the nominal slew rate line anywhere between shaded ‘VREF(DC) to AC region’, the slew rate of a tangent line to the actual signal from the AC level to VREF(DC) level is used for derating value (see Figure 109). Hold (tDH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VIL(DC)max and the first crossing of VREF(DC). Hold (tDH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VIH(DC)min and the first crossing of VREF(DC) (see Figure 108). If the actual signal is always later than the nominal slew rate line between shaded ‘DC level to VREF(DC) region’, use nominal slew rate for derating value. If the actual signal is earlier than the nominal slew rate line anywhere between shaded ‘DC to VREF(DC) region’, the slew rate of a tangent line to the actual signal from the DC level to VREF(DC) level is used for derating value (see Figure 110). For a valid transition the input signal has to remain above/below VIH/IL(AC) for some time tVAC (see Table 57). Although for slow slew rates the total setup time might be negative (i.e. a valid input signal will not have reached VIH/IL(AC) at the time of the rising clock transition) a valid input signal is still required to complete the transition and reach VIH/IL(AC). For slew rates in between the values listed in the tables the derating values may obtained by linear interpolation. These values are typically not subject to production test. They are verified by design and characterization. Table 54 – Data Setup and Hold Base-Values Symbol Reference DDR3-1333 DDR3-1600 DDR3-1866 DDR3-2133 Unit Notes tDS(base) AC150 VIH/L(AC) SR=1V/nS 30 10 - - pS 2 tDS(base) AC135 VIH/L(AC) SR=2V/nS - - 68 53 pS 1 tDH(base) DC100 VIH/L(DC) SR=1V/nS 65 45 - - pS 2 tDH(base) DC100 VIH/L(DC) SR=2V/nS - - 70 55 pS 1 Notes: 1. (AC/DC referenced for 2V/nS DQ-slew rate and 4 V/nS DQS slew rate). 2. (AC/DC referenced for 1V/nS DQ-slew rate and 2 V/nS DQS slew rate). Publication Release Date: Nov. 22, 2017 Revision: A02 - 157 - W632GG6MB Table 55 – Derating values for DDR3-1333/1600 tDS/tDH - (AC150) DQ Slew rate (V/nS) 4.0 V/nS ΔtDS ΔtDH 75 50 50 34 2.0 1.5 ΔtDS, ΔtDH derating in [pS] AC/DC based* DQS, DQS# Differential Slew Rate 2.0 V/nS 1.8 V/nS 1.6 V/nS 1.4 V/nS ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH 75 50 50 34 58 42 - 3.0 V/nS ΔtDS ΔtDH 75 50 50 34 1.2 V/nS ΔtDS ΔtDH - 1.0 V/nS ΔtDS ΔtDH - 1.0 0 0 0 0 0 0 8 8 16 16 - - - - - - 0.9 0.8 0.7 0.6 0.5 0.4 - - 0 - -4 - 0 0 - -4 -10 - 8 8 8 - 4 -2 -8 - 16 16 16 15 - 12 6 0 -10 - 24 24 24 23 14 - 20 14 8 -2 -16 - 32 32 31 22 7 24 18 8 -6 -26 40 39 30 15 34 24 10 -10 Note: Cell contents ‘-’ are defined as not supported. Table 56 – Derating values for DDR3-1866/2133 tDS/tDH - (AC135) DQ Slew rate (V/nS) 8.0 V/nS 7.0 V/nS ΔtDS, ΔtDH derating in [pS] AC/DC based* Alternate AC135 Threshold -> VIH(AC)=VREF(DC)+135mV, VIL(AC)=VREF(DC)-135mV Alternate DC100 Threshold -> VIH(DC)=VREF(DC)+100mV, VIL(DC)=VREF(DC)-100mV DQS, DQS# Differential Slew Rate 6.0 V/nS 5.0 V/nS 4.0 V/nS 3.0 V/nS 2.0 V/nS 1.8 V/nS 1.6 V/nS 1.4 V/nS 1.2 V/nS 1.0 V/nS ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH ΔtDS ΔtDH 4.0 3.5 3.0 2.5 34 29 23 - 25 21 17 - 34 29 23 14 25 21 17 10 34 29 23 14 25 21 17 10 29 23 14 21 17 10 23 14 17 10 14 10 - - - - - - - - - - - - 2.0 - - - - 0 0 0 0 0 0 0 0 0 0 - - - - - - - - - - 1.5 1.0 0.9 0.8 0.7 0.6 0.5 0.4 - - - - - - -23 - -17 - -23 -68 - -17 -50 - -23 -68 -66 - -17 -50 -54 - -23 -68 -66 -64 - -17 -50 -54 -60 - -15 -60 -58 -56 -53 - -9 -42 -46 -52 -59 - -52 -50 -48 -45 -43 - -34 -38 -44 -51 -61 - -42 -40 -37 -35 -39 - -30 -36 -43 -53 -66 - -32 -29 -27 -31 -38 -26 -33 -43 -56 -76 -21 -19 -23 -30 -17 -27 -40 -60 Note: Cell contents ‘-’ are defined as not supported. Table 57 – Required time tVAC above VIH(AC) {below VIL(AC)} for valid DQ transition Slew Rate [V/nS] > 2.0 2.0 1.5 1.0 0.9 0.8 0.7 0.6 0.5 < 0.5 DDR3-1333/1600 (AC150) tVAC [pS] Min. Max. 105 105 80 30 13 Note Note Note Note Note - DDR3-1866 (AC135) tVAC [pS] Min. Max. DDR3-2133 (AC135) tVAC [pS] Min. Max. 93 93 70 25 Note Note - 73 73 50 5 Note Note - - - Note: Rising input signal shall become equal to or greater than VIH(AC) level and Falling input signal shall become equal to or less than VIL(AC) level. Publication Release Date: Nov. 22, 2017 Revision: A02 - 158 - W632GG6MB 11. PACKAGE SPECIFICATION Package Outline VFBGA96 Ball (7.5x13 mm2, ball pitch: 0.8mm) – (Window BGA Type) aaa C 4X E A B A1 A // E1 bbb C PIN A1 INDEX eE PIN A1 INDEX eD 9 8 6 7 5 4 3 2 1 A B C D E F D D1 G H J K L M N P R T ccc C C SEATING PLANE A A1 b D E D1 E1 eE eD aaa bbb ccc ddd eee MIN. --0.25 0.40 12.90 7.40 ----------- NOM. ------13.00 7.50 12.00 BSC. 6.40 BSC. 0.80 BSC. 0.80 BSC. ----------- ddd M C eee M C A B DIMENSION (INCH) DIMENSION (MM) SYMBOL THE WINDOW-SIDE ENCAPSULANT Φb SOLDER BALL DIAMETER REFERS. TO POST REFLOW CONDITION. MAX. 1.00 0.40 0.50 13.10 7.60 0.15 0.20 0.10 0.15 0.08 MIN. --0.010 0.016 0.508 0.291 ----------- NOM. --- BALL LAND MAX. 0.039 0.016 0.020 0.516 0.299 ----0.512 0.295 0.472 BSC. 0.252 BSC. 0.032 BSC. 0.032 BSC. --0.006 --0.008 --0.004 0.006 ----0.003 1 BALL OPENING Note: 1. Ball land: 0.5mm, Ball opening: 0.4mm, PCB Ball land suggested ≤ 0.4mm Publication Release Date: Nov. 22, 2017 Revision: A02 - 159 - W632GG6MB 12. REVISION HISTORY VERSION DATE PAGE A01 May 16, 2017 All 5, 7, 17, 134~138 A02 Nov. 22, 2017 125, 132 132 DESCRIPTION Initial formally datasheet Add CL = 5 setting Refine IDD6 and IDD6ET parameters definition Add note 3 & 4 measured condition for IDD6 and IDD6ET parameters Publication Release Date: Nov. 22, 2017 Revision: A02 - 160 -