W83176R-735_06

W83176R-735 W83176G-735 Winbond 3 DIMM DDR ZERO DELAY BUFFER Date: Mar/31/2006 Revision: 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET W83176R-735/W83176G-735 Data Sheet Revision History PAGES 1 DATES VERSION VERSION ON WEB MAIN CONTENTS n.a. 3.7 12/18/03 05/03/04 03/31/06 0.5 1.0 1.1 n.a. n.a. 1.0 1.1 All of the versions before 0.50 are for internal use. Correction IC version, add register default value and correction some description and default value Update to web Add lead-free part number W83176G-735 2 3 4 5 6 7 8 9 1 0 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this data sheet belong to their respective owners. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. -I- Publication Release Date: March 31, 2006 Revision 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET Table of Contents1. 2. 3. 4. GENERAL DESCRIPTION ......................................................................................................... 1 PRODUCT FEATURES .............................................................................................................. 1 PIN CONFIGURATION ............................................................................................................... 1 3.1 4.1 4.2 5. 5.1 5.2 6. 6.1 6.2 6.3 6.4 7. 7.1 7.2 7.3 8. 9. 10. Block diagram ................................................................................................................. 2 Clock Outputs ................................................................................................................. 3 Power Pins...................................................................................................................... 3 RESERVED.............................................................................. 4 Register 5 : Output Control ( 1 = Active, 0 = Inactive ) (Default =FFH).......................... 4 Register 6 : Output Control ( 1 = Active, 0 = Inactive ) (Default =FFH).......................... 4 Block Write protocol........................................................................................................ 5 Block Read protocol........................................................................................................ 5 Byte Write protocol ......................................................................................................... 5 Byte Read protocol ......................................................................................................... 5 ABSOLUTE MAXIMUM RATINGS ................................................................................. 6 AC CHARACTERISTICS................................................................................................ 6 DC CHARACTERISTICS................................................................................................ 7 PIN DESCRIPTION..................................................................................................................... 3 REGISTER 0 ~ REGISTER 4 ACCESS INTERFACE ................................................................................................................ 5 SPECIFICATIONS ...................................................................................................................... 6 ORDERING INFORMATION ...................................................................................................... 8 HOW TO READ THE TOP MARKING........................................................................................ 8 PACKAGE DRAWING AND DIMENSIONS................................................................................ 9 - II - W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 1. GENERAL DESCRIPTION The W83176R-735 is a 2.5V Zero-delay D.D.R. Clock buffer designed for SiS system. W83176R-735 can support 3 D.D.R. DRAM DIMMs. The W83176R-735 provides I2C serial bus interface to program the registers to enable or disable each clock outputs. The W83176R-735 accepts a reference clock as its input and runs on 2.5V supply. 2. PRODUCT FEATURES • • • • • • • • Zero-delay clock outputs Feedback pins for synchronous Supports up to 3 D.D.R. DIMMs One pairs of additional outputs for feedback Low Skew outputs (< 100ps) Supports 400MHz D.D.R. SDRAM I2C 2-Wire serial interface and supports Byte or Block Date RW 48-pin SSOP package 3. PIN CONFIGURATION GN CLKC CLKT VD CLKT CLKC GN GN CLKC CLKT VD *SCL L K _ IN N/ VD AVD AGN GN CLKC CLKT VD CLKT CLKC GN D 0 0 D 1 1 D D 2 2 D K T C D D D D 3 3 D 4 4 D 1 2 3 4 5 6 7 8 9 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 4 4 4 4 4 4 4 4 4 3 3 3 3 3 3 3 3 3 3 2 2 2 2 2 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 G C C V C C G G C C V S N F V F N G C C V C C G ND LKC LKT DD LKT LKC ND ND LKC LKT DD DAT /C B _ IN DD B_O C ND LKC LKT DD LKT LKC ND 5 5 6 6 C 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 7 7 A T U TT * 8 8 9 9 *: Internal pull-up resistor 120K to VDD -1- Publication Release Date: March 31, 2006 Revision 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 3.1 Block diagram -2- W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 4. PIN DESCRIPTION IN - Input OUT - Output I/O - Bi-directional Pin *Internal 120kΩ pull-up 4.1 Clock Outputs SYMBOL PIN I/O FUNCTION CLKC[9:0] CLKT[9:0] SDATA * SCLK * CLK_INT NC FB_OUTT 26,30,40,43,4 7,23,19,9,6,2 27,29,39,44,4 6,22,20,10,5,3 37 12 13 14, 32,36 33 OUT OUT I/O IN IN Complementory Clocks of differential pair outputs True Clocks of differential pair outputs Serial data of I2C 2-wire control interface Internal pull-up resistor 120K to Vdd Serial clock of I2C 2-wire control interface Internal pull-up resistor 120K to Vdd True reference clock input, 3.3V tolerant input True Feedback output, dedicated for external feedback. It switches at the same frequency as the CLK. This output must be wired to FB_INT. True Feedback input, provides feedback signal to the internal PLL for synchronization with CLK_INT to eliminate phase error. NONE Not connected OUT FB_INT 35 IN 4.2 Power Pins SYMBOL PIN FUNCTION GND VDD AVDD AGND 1,7,8,18,24,25,31,41,42,48 4,11,15,21,28,34,38,45 16 17 　 Ground Power Supply 2.5V Analog power supply, 2.5V Analog ground -3- Publication Release Date: March 31, 2006 Revision 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 5. REGISTER 0 ~ REGISTER 4 5.1 BIT @POWERUP PIN RESERVED DESCRIPTION Register 5 : Output Control ( 1 = Active, 0 = Inactive ) (Default =FFH) 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 2,3 6,5 9,10 19,20 23,22 26,27 CLKC0,CLKT0 output control CLKC1,CLKT1 output control CLKC2,CLKT2 output control CLKC3,CLKT3 output control CLKC4,CLKT4 output control CLKC9,CLKT9 output control Reserved Reserved 5.2 BIT Register 6 : Output Control ( 1 = Active, 0 = Inactive ) (Default =FFH) @POWERUP PIN DESCRIPTION 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 30,29 40,39 43,44 47,46 - Reserved Reserved Reserved CLKC8,CLKT8 output control CLKC7,CLKT7 output control CLKC6,CLKT6 output control CLKC5,CLKT5 output control Reserved -4- W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 6. ACCESS INTERFACE The W83176R-735 provides I2C Serial Bus for microprocessor to read/write internal registers. In the W83176R-735 is provided Block Read/Block Write and Byte-Data Read/Write protocol. The I2C write address is defined at 0xD4. The I2C read address is defined at 0xD5. Block Read and Block Write Protocol 6.1 Block Write protocol 6.2 Block Read protocol ## In block mode, the command code must filled 00H 6.3 Byte Write protocol 6.4 Byte Read protocol -5- Publication Release Date: March 31, 2006 Revision 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 7. SPECIFICATIONS 7.1 ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed in this table may cause permanent damage to the device. Precautions should be taken to avoid application of any voltage higher than the maximum rated voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused inputs must always be tied to an appropriate logic voltage level (Ground or VDD). SYMBOL PARAMETER RATING VDD , AVDD TSTG TB TA Voltage on any pin with respect to GND Storage Temperature Ambient Temperature Operating Temperature - 0.5 V to + 3.6 V - 65°C to + 150°C - 55°C to + 125°C 0°C to + 70°C 7.2 VDD AC CHARACTERISTICS = AVDD = 2.5V ( 5 % , TA = 0(C to +70(C, Test load = 10 pF PARAMETER SYMBOL MIN TYP MAX UNITS TEST CONDITIONS Operating clock frequency Input Clock Duty Cycle Dynamic Supply Current Cycle to Cycle Jitter Output to Output Skew Output clock Rise time Output clock Fall time Output clock Duty Cycle Output differential-pair crossing voltag FIN Dtin Idd C-Cjitter Tskew Tor Tof Dtot Voc 100 40 200 60 300 200 100 MHz % mA ps ps ps ps % V Fin=100 to 200Mhz Fout=100 to 200Mhz Fout=100 to 200Mhz Fout=100 to 200Mhz Fout=100 to 200Mhz Fout=100 to 200Mhz Fout=100 to 200Mhz 650 650 45 (Vdd/2)0.2 Vdd/ 2 950 950 55 (Vdd/2) + 0.2 -6- W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 7.3 DC CHARACTERISTICS PARAMETER SYMBOL MIN TYP MAX UNITS TEST CONDITIONS Vdd = AVDD= 2.5V ( 5 %, TA = 0(C to +70(C SDATA, SCLK Input Low Voltage SDATA, SCLK Input High Voltage CLKIN, FBIN Input Voltage Low CLKIN, FBIN Input Voltage High Input Pin Capacitance Output Pin Capacitance Input Pin Inductance SVIL SVIH VIL VIH CIN COUT LIN 2.1 2.2 1.0 Vdc Vdc 0.4 Vdc Vdc Fin=100 to 200Mhz Fin=100 to 200Mhz 5 6 7 pF pF nH -7- Publication Release Date: March 31, 2006 Revision 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 8. ORDERING INFORMATION PART NUMBER PACKAGE TYPE PRODUCTION FLOW W83176R-735 W83176G-735 48 PIN SSOP 48 PIN SSOP (Pb-free package) Commercial, 0°C to +70°C Commercial, 0°C to +70°C 9. HOW TO READ THE TOP MARKING W83176R-735 28051234 342GB W83176G-735 28051234 342GB 1st line: Winbond logo and the type number: W83176R-735/W83176G-735. 2nd line: Tracking code 2 8051234 2: wafers manufactured in Winbond FAB 2 8051234: wafer production series lot number 3rd line: Tracking code 342 G B 342: packages made in '2003, week 42 G: assembly house ID; O means OSE, G means GR B: IC revision All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. -8- W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET 10. PACKAGE DRAWING AND DIMENSIONS Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. -9- Publication Release Date: March 31, 2006 Revision 1.1 W83176R-735/W83176G-735 3 DIMM DDR ZERO DELAY BUFFER FOR SIS CHIPSET Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. Headquarters No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ Winbond Electronics Corporation America 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798 Winbond Electronics (Shanghai) Ltd. 27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998 Taipei Office 9F, No.480, Rueiguang Rd., Neihu District, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579 Winbond Electronics Corporation Japan 7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Winbond Electronics (H.K.) Ltd. Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. - 10 -