AG403-86PCB

AG403-86 InGaP HBT Gain Block Product Information Product Features • • • • • • • DC – 6000 MHz +18 dBm P1dB at 900 MHz +31.5 dBm OIP3 at 900 MHz 20.5 dB Gain at 900 MHz Single Voltage Supply Green SOT-86 SMT Package Internally matched to 50 Ω Product Description The AG403-86 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 900 MHz, the AG403-86 typically provides 20.5 dB gain, +31.5 dBm OIP3, and +18 dBm P1dB. The device combines dependable performance with consistent quality to maintain MTTF values exceeding 100 years at mounting temperatures of +85 °C & is housed in a SOT-86 industry-standard SMT lead-free/green/RoHS-compliant package. The AG403-86 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG403-86 will work for other various applications within the DC to 6 GHz frequency range such as CATV and fixed wireless. Functional Diagram GND 4 RF In 1 3 RF Out 2 GND Applications • • • • • • Mobile Infrastructure CATV / DBS W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless Function Input Output/Bias Ground Pin No. 1 3 2, 4 Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output IP3 (2) Output IP2 Output P1dB Noise Figure Test Frequency Gain Output IP3 (2) Output P1dB Device Voltage Device Current Typical Performance (1) Units MHz MHz dB dB dB dBm dBm dBm dB MHz dB dBm dBm V mA Min DC Typ 900 20.3 19 21 +31.4 +44 +17.8 3.0 1900 18.1 +28.5 +16.0 4.91 60 Max 6000 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure Units MHz dB dB dB dBm dBm dB 500 21.0 -18 -25 +17.8 +32.6 3.0 Typical 900 20.3 -19 -21 +17.8 +31.4 3.0 1900 18.1 -19 -15 +16.0 +28.5 3.1 2140 17.5 -19 -13 +15.2 +27.7 3.2 17.1 19.1 1. Test conditions: T = 25º C, Supply Voltage = +6 V, Rbias = 18.2 Ω, 50 Ω System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. The junction temperature ensures a minimum MTTF rating of 1 million hours of usage. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage RF Input Power (continuous) Junction Temperature Ordering Information Part No. AG403-86* AG403-86G AG403-86PCB * Rating -40 to +85 °C -55 to +125 °C +6.2 V +10 dBm +250° C Description InGaP HBT Gain Block (lead-tin SOT-86 Pkg) InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-86 Pkg) 700 – 2400 MHz Fully Assembled Eval. Board Operation of this device above any of these parameters may cause permanent damage. This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 1 of 6 June 2005 AG403-86 InGaP HBT Gain Block Product Information Typical Device RF Performance Supply Bias = 6 V, Rbias = 18.2 Ω, Icc = 60 mA Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 21.3 -20 -21 +17.8 +33.0 2.9 500 21.0 -18 -25 +17.8 +32.6 3.0 900 20.3 -19 -21 +17.8 +31.4 3.0 1900 18.1 -19 -15 +16.0 +28.5 3.1 2140 17.5 -19 -13 +15.2 +27.7 3.2 2400 16.9 -19 -13 +14.6 +26.9 3.3 3500 15.0 -19 -16 +11.5 5800 11.6 -21 -13 1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.91 V, Rbias = 18.2 Ω, Icc = 60 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Gain vs. Frequency 22 20 Return Loss 0 Device Current (mA) I-V Curve 100 80 60 40 20 0 3.0 Optimal operating point 18 16 14 12 0 -40 C 1 +25 C +85 C 3 4 S11, S22 (dB) -10 -20 -30 S11 S22 Gain (dB) -40 2 Frequency (GHz) 0 1 2 3 4 5 6 3.4 3.8 4.2 4.6 5.0 5.4 Frequency (GHz) Output IP2 vs. Frequency Device Voltage (V) Noise Figure vs. Frequency Output IP3 vs. Frequency 35 30 OIP3 (dBm) 25 20 50 45 40 35 -40c +25c +85c 5 4 NF (dB) 3 2 1 -40 C +25 C +85 C -40 C 15 +25 C 1.5 2 +85 C OIP2 (dBm) 30 0 0.5 1 2.5 3 3.5 0 0 200 400 600 800 1000 0 0.5 1 1.5 2 2.5 3 Frequency (GHz) Frequency (MHz) Output Power / Gain vs. Input Power 22 20 Gain (dB) frequency = 900 MHz Frequency (GHz) Output Power / Gain vs. Input Power 20 Output Power (dBm) frequency = 2000 MHz P1dB vs. Frequency 20 15 10 5 -40 C +25 C +85 C 18 16 Gain (dB) 20 Output Power (dBm) P1dB (dBm) Gain 16 12 8 Gain 16 12 8 18 16 14 Output Power 14 12 10 8 -12 -8 -4 0 Input Power (dBm) 4 8 Output Power 4 0 4 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 12 -12 -8 -4 0 Input Power (dBm) 4 8 Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 2 of 6 June 2005 AG403-86 InGaP HBT Gain Block Product Information Typical Device RF Performance (cont’d) Supply Bias = +8 V, Rbias = 51 Ω, Icc = 60 mA Gain vs. Frequency 22 20 18 16 14 12 0 -40 C 1 +25 C +85 C 3 4 Output IP3 vs. Frequency Output IP2 vs. Frequency 35 30 25 20 -40 C +25 C +85 C 50 45 40 35 -40c +25c +85c OIP3 (dBm) 15 OIP2 (dBm) Gain (dB) 30 2 Frequency (GHz) 0 0.5 1 1.5 2 2.5 3 3.5 0 200 400 600 800 1000 Frequency (GHz) P1dB vs. Frequency Noise Figure vs. Frequency Frequency (MHz) 20 15 10 5 -40 C +25 C +85 C 5 4 NF (dB) 3 2 1 -40 C +25 C +85 C P1dB (dBm) 0 0 0.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) 0 0 0.5 1 1.5 2 2.5 3 Frequency (GHz) Vcc Icc = 60 mA Application Circuit R1 Bias Resistor C4 Bypass Capacitor C3 0.018 µF L1 RF Choke RF IN AG403-86 C1 Blocking Capacitor C2 Blocking Capacitor RF OUT Recommended Component Values Reference Designator 50 500 L1 820 nH 220 nH C1, C2, C4 .018 µF 1000 pF Ref. Desig. L1 C1, C2 C3 C4 R1 Frequency (MHz) 900 1900 2200 68 nH 27 nH 22 nH 100 pF 68 pF 68 pF Size 0603 0603 0603 0805 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 µF chip capacitor Do Not Place 18.2 Ω 1% tolerance Recommended Bias Resistor Values S upply R1 value S ize Voltage 6V 18.2 ohms 0805 7V 34.8 ohms 1206 8V 52 ohms 1210 9V 68 ohms 1210 10 V 85 ohms 2010 12 V 118 ohms 2010 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 3 of 6 June 2005 AG403-86 InGaP HBT Gain Block Product Information Typical Device Data S-Parameters (Vdevice = +4.91 V, ICC = 60 mA, T = 25° C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 3250 3500 3750 4000 4250 4500 4750 5000 5250 5500 5750 6000 -19.96 -20.03 -18.29 -18.69 -19.75 -19.49 -19.96 -19.67 -19.19 -16.47 -16.76 -17.06 -17.44 -18.26 -19.67 -21.24 -23.74 -26.07 -28.72 -30.07 -30.66 -26.93 -24.53 -21.76 -20.29 178.96 161.79 144.41 125.75 103.57 85.86 65.61 44.52 25.46 9.39 -2.54 -12.50 -20.94 -28.52 -36.75 -39.96 -40.60 -43.48 -35.53 -39.18 -46.11 -62.38 -76.41 -89.71 -92.71 21.80 21.67 21.43 21.04 20.57 20.05 19.46 18.86 18.23 17.63 17.22 16.73 16.26 15.82 15.40 14.96 14.54 14.15 13.71 13.29 12.94 12.57 12.21 11.99 11.73 177.11 166.40 153.03 140.39 128.52 117.01 106.46 96.58 87.12 78.94 72.76 64.27 56.10 48.49 40.73 33.05 25.39 18.04 10.72 3.34 -3.45 -10.07 -16.59 -23.09 -29.36 -24.27 -24.86 -24.84 -24.79 -25.10 -24.53 -24.66 -24.31 -24.23 -23.83 -24.03 -23.16 -23.28 -22.60 -22.73 -22.14 -21.60 -21.30 -20.86 -20.83 -20.32 -20.17 -19.91 -19.75 -19.15 1.37 2.67 0.41 -1.97 -3.56 -2.87 -1.05 -3.28 -1.86 -5.82 -9.32 -8.40 -7.63 -9.15 -9.59 -14.85 -16.87 -19.30 -23.27 -24.94 -28.30 -31.73 -33.92 -37.97 -42.19 -21.87 -22.38 -25.34 -22.92 -20.80 -18.46 -16.81 -15.57 -14.70 -13.06 -13.34 -13.64 -14.45 -15.52 -16.75 -17.04 -16.55 -15.11 -13.98 -13.01 -12.36 -12.34 -12.35 -12.98 -13.43 -8.56 -23.27 -67.32 -96.88 -115.67 -127.17 -135.05 -140.07 -145.08 -133.83 -139.51 -145.79 -155.77 -165.77 176.91 153.24 133.43 117.23 107.90 104.62 104.65 104.43 107.24 112.15 113.78 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 4 of 6 June 2005 AG403-86 InGaP HBT Gain Block Product Information AG403-86 (SOT-86 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with a “G” designator followed by a two-digit numeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 0 Passes at 150 V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class II Passes at 250 V Charged Device Model (CDM) JEDEC Standard JESD22-C101 Land Pattern ESD Rating: Value: Test: Standard: MSL Rating: Level 1 Standard: JEDEC Standard J-STD-020A Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) Rating -40 to +85 °C 233 °C/W 143 °C 1. The thermal resistance is referenced from the hottest part of the junction to the ground lead (pin 2 or 4). 2. This corresponds to the typical biasing condition of +4.91V, 60 mA at an 85 °C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 °C. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 5 of 6 June 2005 AG403-86 InGaP HBT Gain Block Product Information AG403-86G (Green / Lead-free Sot-86 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Outline Drawing Product Marking The component will be marked with an “R” designator followed by a two-digit numeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1C Passes at 1000 V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes at 1000 V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 Land Pattern MSL Rating: Level 3 at +260° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85 °C 233 °C/W 154 °C MTTF (million hrs) Rating 1000 MTTF vs. GND Lead Temperature 100 10 1. The thermal resistance is referenced from the hottest part of the junction to the ground lead (pin 2 or 4). 2. This corresponds to the typical biasing condition of +4.91V, 60 mA at an 85 °C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 °C. 1 60 70 80 90 100 110 Ground Lead Temperature (°C) 120 Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 6 of 6 June 2005