ECG002F-PCB

ECG002 Product Features • • • • • • DC – 6 GHz +15.5 dBm P1dB at 1 GHz +29 dBm OIP3 at 1 GHz 20 dB Gain at 1 GHz 3.8 dB Noise Figure Available in lead-free/green SOT-86, SOT-363, & SOT-89 package styles • Internally matched to 50 Ω The Communications Edge TM Product Information InGaP HBT Gain Block Product Description The ECG002 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG002 typically provides 20 dB of gain, +29 dBm Output IP3, and +15.5 dBm P1dB. Functional Diagram GND 4 1 2 GND 3 RF OUT Applications • • • • • Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro The ECG002 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in low-cost, surface-mountable plastic lead-free/green/RoHS-compliant SOT-363, SOT-86 and SOT-89 packages. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG002 will work for other various applications within the DC to 6 GHz frequency range such as CATV and mobile wireless. RF IN ECG002B-G GND 4 RF In 1 RF Out 3 2 GND ECG002C-G GND 1 6 RF OUT GND 2 5 GND RF IN 3 4 GND ECG002F-G Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Large-signal Gain (3) Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Typical Performance (1) Units MHz MHz dB dBm dBm MHz dB dB dBm dBm dB V mA Min DC Typ 1000 20 +15.5 +29 2000 19 18 +15 +29 3.8 3.9 45 Max 6000 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure Units MHz dB dB dB dBm dBm dB 500 20.6 -17 -18 +15.8 +28 3.8 Typical 900 20 -17 -18 +15.5 +29 3.7 1900 19.5 -15 -21 +15 +29 3.8 2140 18.7 -15 -21 +14.9 +29 3.8 17 16 +13 3.5 4.3 1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +5 V, Rbias = 24 Ω, 50 Ω System. 2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Large-signal gain is tested with an input power level of -3 dBm. Ordering Information Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature -40 to +85 °C -55 to +150 °C 150 mA +12 dBm +250 °C Part No. ECG002B-G ECG002C-G ECG002F-G ECG002B-PCB ECG002C-PCB ECG002F-PCB Description InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 package) Rating InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-86 package) InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-363 package) 700 – 2400 MHz Fully Assembled Eval. Board 700 – 2400 MHz Fully Assembled Eval. Board 700 – 2400 MHz Fully Assembled Eval. Board Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 1 of 7 April 2006 ECG002 Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure The Communications Edge TM Product Information InGaP HBT Gain Block Typical Device RF Performance Supply Bias = +5 V, Rbias = 24 Ω, Icc = 45 mA MHz dB dB dB dBm dBm dB 100 21 -18 -17 +15.4 +28 3.9 500 20.6 -17 -17 +15.6 +28 3.8 900 20 -17 -18 +15.5 +29 3.8 1900 19.5 -15 -20 +15 +29 3.8 2140 18.7 -15 -21 +15 +29 3.8 2400 18.2 -15 -22 +15 +29 3.9 3500 16.4 -16 -35 +14.5 5800 13.3 -19 -16 +11 1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24 Ω, Icc = 45 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of -1 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Gain vs. Frequency 22 20 S11, S22 (dB) S11, S22 vs. Frequency 0 -5 -10 -15 Icc (mA) -20 -25 -30 -35 -40 3000 0 1 2 3 4 Frequency (GHz) 5 6 S22 60 40 20 0 3.00 120 100 Vde vs. Icc Gain (dB) S11 80 +25C 18 16 14 +25C 12 500 1000 -40C +85C 2500 1500 2000 Frequency (MHz) 3.20 3.40 3.60 3.80 4.00 4.20 4.40 Vde (V) OIP3 vs. Frequency 32 Noise Figure vs. Frequency 4.5 4 3.5 3 2.5 P1dB (dBm) NF (dB) 20 18 16 14 12 P1dB vs. Frequency 30 OIP3 (dBm) 28 26 +25C 24 500 1000 1500 -40C 2000 +85C 2500 3000 +25C 2 500 1000 1500 Frequency (MHz) 2000 10 500 1000 -40C +85C 2500 3000 Frequency (MHz) 1500 2000 Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 2 of 7 April 2006 ECG002 Vcc Icc = 45 mA The Communications Edge TM Product Information InGaP HBT Gain Block Recommended Application Circuit ECG002C-PCB R4 Bias Resistor C4 Bypass Capacitor C3 0.018 µF L1 RF Choke RF IN ECG002 C1 Blocking Capacitor C2 Blocking Capacitor RF OUT ECG002B-PCB ECG002F-PCB Reference Designator L1 C1, C2, C4 50 820 nH .018 µF Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. L1 C1, C2 C3 C4 R4 Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 μF chip capacitor Do Not Place 24Ω 1% tolerance Size 0603 0603 0603 0805 Recommended Bias Resistor Values Supply R1 value Size Voltage 5V 24.4 ohms 0805 6V 46.7 ohms 0805 8V 91 ohms 1210 9V 113 ohms 1210 10 V 136 ohms 2010 12 V 180 ohms 2010 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +5 V. A 1% tolerance resistor is recommended. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 3 of 7 April 2006 ECG002 The Communications Edge TM Product Information InGaP HBT Gain Block ECG002B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an “E002G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “E002” designator followed by an alphanumeric lot code; it may also have been marked with a “C” designator followed by a 3digit numeric lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 4 of 7 April 2006 ECG002 The Communications Edge TM Product Information InGaP HBT Gain Block ECG002C-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with a two-digit numeric lot code (shown as “XX”) followed with a “K” designator on the top surface of the package. The obsolete tin-lead package is marked with a two-digit numeric lot code followed with a “J” designator; it may also have been marked with a “J” designator followed by a two-digit lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 5 of 7 April 2006 ECG002 The Communications Edge TM Product Information InGaP HBT Gain Block ECG002F-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with a two-digit numeric lot code (shown as “XX”) followed with a “5” designator on the top surface of the package. The obsolete tin-lead package is marked with a two-digit numeric lot code followed with a “1” designator; it may also have been marked with a “10” designator followed by a letter lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 6 of 7 April 2006 ECG002 Freq (MHz) S11 (dB) The Communications Edge TM Product Information InGaP HBT Gain Block Typical Device S-Parameters – ECG002B-G S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 -17.15 -16.04 -14.81 -13.59 -13.14 -13.40 -13.96 -15.15 -17.07 -19.43 -24.29 -26.31 -21.31 0.33 0.38 -8.39 -21.57 -38.98 -54.87 -68.82 -79.85 -85.86 -86.07 -76.56 -15.89 17.01 21.23 20.84 20.03 19.11 18.50 18.01 17.49 16.95 16.36 15.78 15.19 14.64 14.08 177.70 156.45 135.90 118.25 103.23 87.48 71.83 56.22 41.14 26.53 12.27 -1.79 -16.11 -23.14 -23.06 -22.83 -22.47 -21.81 -21.28 -20.73 -20.34 -19.95 -19.57 -19.34 -19.04 -18.87 -0.19 -1.64 -2.70 -4.36 -7.40 -11.83 -17.30 -22.68 -28.74 -34.89 -42.28 -49.74 -57.89 -15.62 -15.69 -15.79 -15.62 -15.49 -15.86 -16.64 -17.60 -17.11 -15.61 -13.30 -10.79 -8.79 -1.52 -20.22 -38.56 -58.17 -81.71 -107.96 -139.16 -171.00 151.84 119.05 94.72 76.65 61.13 Typical Device S-Parameters – ECG002C-G S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 -37.42 -22.95 -20.13 -19.79 -19.82 -16.54 -15.67 -15.94 -17.24 -19.29 -23.85 -28.00 -22.34 134.67 51.84 57.46 55.23 31.10 -1.82 -7.79 -8.76 -5.83 -2.21 -16.76 -81.95 -134.50 22.11 21.83 21.21 20.35 19.41 18.63 17.69 16.88 15.94 15.15 14.45 13.89 13.34 177.84 159.38 140.39 123.69 108.29 95.93 83.59 71.85 60.22 49.25 39.80 30.92 21.26 -23.75 -23.57 -23.62 -23.56 -23.07 -23.05 -22.20 -21.97 -21.37 -20.84 -20.62 -19.77 -19.58 0.04 1.76 1.39 2.36 2.45 1.89 3.83 1.75 -2.61 -5.08 -6.52 -7.93 -13.03 -36.75 -24.35 -22.33 -17.57 -15.79 -17.22 -15.86 -14.21 -12.04 -10.26 -9.57 -9.86 -10.90 -5.01 -54.15 -124.91 -159.03 -172.54 -173.92 168.33 145.59 128.60 120.09 116.71 118.09 119.18 Typical Device S-Parameters – ECG002F-G S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 -35.58 -25.34 -22.93 -21.74 -22.60 -19.67 -18.00 -17.76 -18.59 -20.60 -27.53 -37.18 -24.38 153.00 51.37 66.15 76.98 53.21 6.41 3.61 4.44 7.79 19.66 28.83 -144.72 -146.24 22.09 21.86 21.29 20.47 19.58 18.83 17.93 17.12 16.21 15.42 14.71 14.08 13.53 177.80 159.87 141.06 124.48 108.93 96.29 83.64 71.47 59.28 48.02 38.32 29.10 19.53 -23.58 -23.60 -23.30 -23.66 -23.31 -22.86 -22.60 -22.02 -21.64 -21.30 -20.52 -20.32 -19.40 1.09 0.02 2.10 2.66 1.22 -0.98 1.33 -1.64 -1.94 -4.58 -9.65 -9.39 -14.12 -41.45 -25.01 -22.43 -16.71 -14.43 -15.12 -13.82 -12.58 -10.90 -9.39 -8.57 -8.88 -9.58 -0.41 -55.13 -134.17 -168.31 179.01 176.50 164.54 145.98 130.27 117.60 112.39 113.57 114.73 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 7 of 7 April 2006