High Dynamic Range FET Mixer
HMJ7-1
The Communications Edge TM Product Information
Product Features
x Greater than +34 dBm IIP3 x RF 1000 - 2000 MHz x LO 1000 - 2000 MHz x IF 10 - 1000 MHz x +5V Bias (40 mA) x +24 dBm LO Drive Level x SMT J-Lead Package x 77 dBc 2x1 Spur Rejection in IF Band
Product Description
The HMJ7-1 is a high dynamic range GaAs FET mixer. This active broadband mixer realizes a typical third order intercept point of +34 dBm at an LO drive level of +21 dBm. The HMJ7-1 also provides excellent suppression of spurious intermodulation products, greater than 67 dBc, meeting DOCSIS2 and Euro DOCSIS system requirements. The HMJ7-1 is a specially screened version of the HMJ7 mixer meeting all of the performance requirements of the HMJ7 with 21 dBm LO power, but also meeting the suppression requirements for intermodulation products at a 24 dBm LO power level. The HMJ7-1 comes in a low cost, 22-pin J-Lead package. The combination of high dynamic range and spurious suppression makes the HMJ7-1 an ideal choice for CATV headend transmission equipment and other applications requiring a broadband mixer in the 1000 MHz to 2000 MHz frequency range.
Functional Diagram
RF LO
+5Vdc IF
Applications
x CATV Head-End Equipment
Function IF LO RF +5V Ground
Pin No. 2 13 21 10 All other pins
Specifications (1)
Parameter
RF Frequency Range LO Frequency Range IF Frequency Range SSB Conversion Loss Noise Figure LO-RF Isolation LO-IF Isolation RF-IF Isolation Input IP3 RF Return Loss LO Return Loss IF Return Loss Spurious Rejection (2) Spurious Rejection (2) Input P1dB LO Drive Level DC Current at +5V Bias
Units
MHz MHz MHz dB dB dB dB dB dBm dB dB dB dBc dBc dBm dBm mA
Min
Typ
1000 – 2000 1000 – 2000 10 – 1000 8.5 10.5 24 30 24 34 10 5 14 77 77 +23 +21 40
Max
Condition
9.5
21 24 29
RF = 1018 MHz @ 0 dBm
67 76
LO = +24 dBm, IF freq = 150 – 540 MHz, 640 – 1000 MHz LO = +24 dBm, IF freq = 540 – 640 MHz
60
1. Test conditions unless otherwise noted: 25 ºC, RF = 1018.75 MHz @ 0 dBm, LO = 21 dBm, IF = 50, 650, 860 MHz in a high-side LO configuration. 2. The 2x1 spur is tested where the IM spur = 2 * RF input – LO, where RF input = 1090 MHz @ -14 dBm, LO = 1190 to 2090 MHz @ 24 dBm, IM spur = output frequency. The IM spur level is specified in dBc with respect to the desired IF frequency calculated: IF output = LO - RF input.
Absolute Maximum Rating
Operating Case Temperature Storage Temperature Maximum Input Power
Ordering Information
HMJ7-1 HMJ7-1PCB
Parameters
-40 to +85 qC -65 to +100 qC +25 dBm
Rating
Part No.
High Dynamic Range FET Mixer Fully Assembled Application Circuit
Description
Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
W eb site: www.wj.com
Page 1 of 3 January 2006
High Dynamic Range FET Mixer
HMJ7-1
The Communications Edge TM Product Information
All measurements are shown with a LO drive level = +21 dBm. Improved performance is expected with LO = +24 dBm.
Typical Performance Data
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
W eb site: www.wj.com
Page 2 of 3 January 2006
High Dynamic Range FET Mixer
HMJ7-1
The Communications Edge TM Product Information
Outline Drawing
Product Marking
The component will be marked with an “HMJ7-1” designator with a date code XXYY where XX refers to last two digits of the year and YY refers to week number within that year. Tape and reel specifications for this part are located on the website in the “Application Notes” section.
ESD Information
ESD Rating: Value: Test: Standard:
Dimensions are expressed in Inches. TOLERANCE .XXX [ .015 .XX [ .02 Drawing is illustrated at Max dimensions.
Class 2 Passes at 2000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes at 2000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101
ESD Rating: Value: Test: Standard:
Mounting Config. Notes Land Pattern / Mounting Configuration
1. Ground vias are critical for thermal and RF grounding considerations. 2. A minimum of 36 ground vias are required for 14 mil FR4 boards. 3. If your PCB design rules allow, ground vias should be placed under the land pattern for better RF performance. Otherwise ground vias should be placed as close to the land pattern as possible. 4. Trace width depends on the PCB material.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
W eb site: www.wj.com
Page 3 of 3 January 2006
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