WJA1505-PCB

WJA1505 Product Features • • • • • • • • 50 – 1000 MHz 19.5 dB Gain +19 dBm P1dB +35 dBm OIP3 +5V Single Voltage Supply Internal Active Bias Supply Internally matched to 50 Ω Lead-free / RoHS-compliant / Green SOT-89 package +5V Active-Bias InGaP HBT Gain Block Product Description The WJA1505 is a high performance amplifier that offers high linearity in a low-cost surface-mount package. At 200 MHz, the WJA1505 typically provides 19.5 dB gain, +35 dBm OIP3, and +19 dBm P1dB. The device is housed in a lead-free/green/RoHS-compliant SOT-89 industry-standard SMT package using a NiPdAu plating to eliminate the possibility of tin whiskering. Functional Diagram GND 4 1 2 GND 3 RF OUT Applications • • • • • IF Amplifier Repeaters, BTS Transceivers VHF/UHF Wireless Infrastructure General Purpose The WJA1505 consists of Darlington pair amplifiers using a high reliability InGaP/GaAs HBT process technology. The MMIC amplifier is internally matched to 50Ω and only requires DC-blocking capacitors and an inductive RF choke for operation. Biased directly from a 5V supply, an internal active bias network enables stable operation over temperature, eliminating the need for the typical dropping bias resistor. The amplifier is targeted for high performance IF applications in existing and next generation wireless technologies. In addition, the WJA1505 will work for various other applications within the 50 to 1000 MHz frequency range. RF IN Function Input Output/Bias Ground Pin No. 1 3 2, 4 Target Specifications Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Target Performance Min 50 200 19.6 18 16 +19 +35 4 5 60 Units MHz MHz dB dB dB dBm dBm dB V mA Typ Max 1000 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB 50 20 -19 -17 +19 +36 3.9 Typical 100 19.7 -19 -18 +19 +36 4 200 19.6 -18 -16 +19 +35 4 500 18.9 -14 -11 +19 +34 4.1 1. Test conditions: 25 ºC, Supply Voltage = +5 V, 50 Ω System. 2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature -40 to +85 °C -55 to +150 °C Ordering Information Part No. WJA1505 WJA1505-PCB Rating Description +5V Active Bias InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 Package) 50 – 1000 MHz Fully Assembled Eval. Board Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 1 of 3 May 2007 WJA1505 Vcc=+5V Icc = 60 mA R4 0Ω +5V Active-Bias InGaP HBT Gain Block Application Circuit C3 Bypass Capacitor RF IN R1 0Ω L1 RF Choke RF OUT WJA1505 C1 Blocking Capacitor R2 0Ω C2 Blocking Capacitor Recommended Component Values(1) Ref. Name Value / Type L1 470 nH wire wound inductor C1, C2 1000 pF chip capacitor C3 0.018 μF chip capacitor R1, R2, R4 0 Ω(2) C4, C5, C6, Do Not Place(2) R3, R5, R6, R7, R8 Size 1008 0603 0603 0603 1. The listed values are contained on the evaluation board to achieve optimal broadband performance 2. Place holders for the 0Ω resistors and “Do Not Place” references are not needed for final design. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 2 of 3 May 2007 WJA1505 +5V Active-Bias InGaP HBT Gain Block This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Mechanical Information Outline Drawing Product Marking The WJA1505 will be marked with an “A1505” designator with an alphanumeric lot code marked below the part designator. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1C Passes ≥ 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes ≥ 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • W eb site: www.wj.com Page 3 of 3 May 2007